JP5468262B2 - 磁気抵抗トンネル接合素子およびmramへのその適用 - Google Patents
磁気抵抗トンネル接合素子およびmramへのその適用 Download PDFInfo
- Publication number
- JP5468262B2 JP5468262B2 JP2008535037A JP2008535037A JP5468262B2 JP 5468262 B2 JP5468262 B2 JP 5468262B2 JP 2008535037 A JP2008535037 A JP 2008535037A JP 2008535037 A JP2008535037 A JP 2008535037A JP 5468262 B2 JP5468262 B2 JP 5468262B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- intermediate layer
- memory
- memory cells
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000015654 memory Effects 0.000 claims abstract description 128
- 230000005291 magnetic effect Effects 0.000 claims abstract description 110
- 238000003860 storage Methods 0.000 claims abstract description 58
- 230000005415 magnetization Effects 0.000 claims abstract description 41
- 230000004888 barrier function Effects 0.000 claims abstract description 31
- 230000006870 function Effects 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 230000004044 response Effects 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000000395 magnesium oxide Substances 0.000 claims description 12
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 12
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 230000005294 ferromagnetic effect Effects 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 6
- 230000005290 antiferromagnetic effect Effects 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052707 ruthenium Inorganic materials 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- 229910005335 FePt Inorganic materials 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 230000000737 periodic effect Effects 0.000 claims description 3
- 229910003321 CoFe Inorganic materials 0.000 claims description 2
- 229910002555 FeNi Inorganic materials 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical group [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 description 16
- 239000004020 conductor Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 10
- 230000008901 benefit Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000000151 deposition Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- -1 for example Chemical class 0.000 description 1
- 230000009643 growth defect Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012432 intermediate storage Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/305—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices applying the spacer or adjusting its interface, e.g. in order to enable particular effect different from exchange coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3286—Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Magnetic Heads (AREA)
- Semiconductor Memories (AREA)
Description
磁化の方向が固定された参照磁気層と、
磁化の方向が可変である記憶磁気層と、
本質的に半導体または電気的に絶縁性であるとともに前記参照磁気層を前記記憶磁気層から分離する、トンネル障壁としての機能を果たす中間層と、を含む磁気抵抗トンネル接合を備え、
印加電圧に応じて非対称の電流応答を生成するように、前記中間層のポテンシャルプロファイルが当該層の厚みに渡って非対称である、磁気素子によって達成される。
ビット線とワード線との組でアドレスを指定できるメモリセルのアレーを備えたメモリであって、
各メモリセルが、上述した型式の磁気素子を含み、
各磁気素子が、他の付加的なスイッチ要素を介挿することなく、一のビット線と一のワード線とに接続されている、メモリを提供する。
Ptotal=4×Ri2=4×R(I/4)2=RI2/4
Claims (16)
- 磁化の方向が固定された参照磁気層(120)と、
磁化の方向が可変である記憶磁気層(110)と、
本質的に半導体または電気的に絶縁性であるとともに前記参照磁気層(120)を前記記憶磁気層(110)から分離する、トンネル障壁としての機能を果たす中間層(130)と、を含む磁気抵抗トンネル接合(100)を備え、
前記中間層(130)のポテンシャルプロファイルが当該中間層(130)の厚みに渡って非対称であり、この非対称はトンネル障壁内に局在かつ非対称であるポテンシャル井戸を形成することによって生じており、
この非対称が印加電圧に応じて非対称の電流応答を生成し、
トンネル障壁内に局在かつ非対称である前記ポテンシャル井戸は、第1態様および第2態様のいずれかによって形成されており、
前記第1態様によれば、トンネル障壁としての機能を果たす前記中間層(130)は、前記中間層の残部(131,132)を構成している材料以外の金属または半導体材料でできた極薄層(133,134)を、その厚み内であって、前記記憶磁気層(110)から第1距離(e1)かつ前記参照磁気層(120)から第2距離(e2)において含み、前記第1距離(e1)が第2距離(e2)とは異なる値を示し、前記極薄層(133)は、1〜2原子面の厚みまたは原子面の一部の厚みを示し、
前記第2態様によれば、トンネル障壁としての機能を果たす前記中間層(130)は、その厚み内であって、前記記憶磁気層(110)から第1距離(e1)かつ前記参照磁気層(120)から第2距離(e2)にドープ領域(135,136)を含み、前記第2距離(e2)が、前記第1距離(e1)とは異なる値を示し、前記ドープ領域(135,136)は、前記ポテンシャル井戸を当該ドープ領域に形成するように、前記中間層の残部(131,132)を構成する材料以外の材料の導入によってドーピングされており、
前記第1態様において、前記中間層の残部(131,132)が、前記極薄層(133,134)の各側で、異なる絶縁または半導体材料を含む、磁気素子。 - 前記第2態様において、前記参照磁気層(120)との間および前記記憶磁気層(110)との間における前記中間層(131)の2つの外側界面の一方に前記ドープ領域(136)が接するように、前記第1および第2距離(e1,e2)の一方がゼロである、請求項1に記載の素子。
- 前記第2態様において、前記第1および第2距離(e1,e2)のいずれもゼロでない、請求項1に記載の素子。
- 前記第2態様において、前記ドープ領域(135)は、前記記憶磁気層(110)よりも前記参照磁気層(120)の近くにある、請求項1に記載の素子。
- 前記中間層(130)が、アルミナを含む、請求項1に記載の素子。
- 前記第1態様の前記極薄層(133,134)が、アルミニウム、金、銀、シリコンおよびゲルマニウムから選ばれた材料でできている、請求項5に記載の素子。
- 前記中間層が、酸化マグネシウムを含む、請求項1に記載の素子。
- 前記第1態様の前記極薄層(133,134)が、クロム、ルテニウム、タンタル、金、銀、シリコンおよびゲルマニウムから選ばれた材料でできている、請求項7に記載の素子。
- トンネル障壁としての機能を果たす前記中間層(130)が、1nm〜3nmの範囲の厚みを示す、請求項1に記載の素子。
- 前記第2態様において、トンネル障壁としての機能を果たす前記中間層(130)が、2nm〜3nmの範囲の厚みを示し、前記ドープ領域(136)が、0.5nm〜1nmの範囲の厚みを示す、請求項1に記載の素子。
- 前記第2態様において、
前記中間層(130)が、アルミナまたは酸化マグネシウムでできており、
前記ドープ領域(135,136)が、アルミニウム、金、銀、クロム、ルテニウム、タンタルおよびシリコンからなる材料の少なくとも1つを含む金属または半導体ドーピング元素を含む、請求項1、請求項2および請求項10のいずれか1項に記載の素子。 - 前記参照磁気層(120)は反強磁性層と強磁性層とを含むスタックによって構成されており、
前記反強磁性層は、IrMnであり、
前記強磁性層は、CoFe合金またはFePt合金であり、
前記記憶磁気層(110)は、FeNi合金、FePt合金及び多層プラチナ/コバルト構造のいずれかで構成されている、請求項1に記載の素子。 - ビット線(106)とワード線(108)との組でアドレスを指定できるメモリセルのアレーを備えたメモリであって、
各メモリセルが、請求項1に記載の磁気素子(100)を含み、
各磁気素子(100)が、他の付加的なスイッチ要素を介挿することなく、一のビット線(106)と一のワード線(108)とに接続されている、メモリ。 - 2次元構造に分布したN×Nのメモリセルを含み、Nが整数であり、各ビット線(106)がN個のメモリセルのために機能し、各ワード線(108)がN個のメモリセルのために機能する、請求項13に記載のメモリ。
- 当該メモリは、P層で一組の重ね合わせ層を含む3次元構造を示し、
各層が、一のビット線(106)と一のワード線(108)とに接続されたN×Nのメモリセルをなすものであり、PおよびNが整数であり、
外層のメモリセル以外のメモリセル(100)のために機能する各ビット線(106)および各ワード線(108)が、2つの異なる隣接した層(Pi,Pi+1)に属するメモリセル(100)に共用されている、請求項13に記載のメモリ。 - 当該メモリは、N×NのメモリセルによるP層の重ね合わせ層のスタックを含む3次元構造を示し、各層(Pi,Pi+1)のメモリセル(100)が2次元構造で分布しており、PおよびNが整数であり、一の2次元構造内において各ビット線(106)がN個のメモリセル(100)のために機能するとともに各ワード線(108)がN個のメモリセル(100)のために機能しており、
P層の重ね合わせ層のスタックにおいて周期的な態様で、絶縁分離層(160)が、連続した2次元構造の層(Pi,Pi+1)の間に介挿されている、請求項13に記載のメモリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0510533 | 2005-10-14 | ||
FR0510533A FR2892231B1 (fr) | 2005-10-14 | 2005-10-14 | Dispositif magnetique a jonction tunnel magnetoresistive et memoire magnetique a acces aleatoire |
PCT/EP2006/067374 WO2007042563A1 (en) | 2005-10-14 | 2006-10-13 | A magnetoresistive tunnel junction magnetic device and its application to mram |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009512204A JP2009512204A (ja) | 2009-03-19 |
JP5468262B2 true JP5468262B2 (ja) | 2014-04-09 |
Family
ID=36481516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008535037A Active JP5468262B2 (ja) | 2005-10-14 | 2006-10-13 | 磁気抵抗トンネル接合素子およびmramへのその適用 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7821818B2 (ja) |
EP (1) | EP1949466B1 (ja) |
JP (1) | JP5468262B2 (ja) |
KR (1) | KR20080063767A (ja) |
CN (1) | CN101288186B (ja) |
AT (1) | ATE497259T1 (ja) |
DE (1) | DE602006019897D1 (ja) |
FR (1) | FR2892231B1 (ja) |
TW (1) | TWI459385B (ja) |
WO (1) | WO2007042563A1 (ja) |
Families Citing this family (102)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5040105B2 (ja) | 2005-12-01 | 2012-10-03 | ソニー株式会社 | 記憶素子、メモリ |
EP2065886A1 (en) * | 2007-11-27 | 2009-06-03 | Hitachi Ltd. | Magnetoresistive device |
US7804709B2 (en) | 2008-07-18 | 2010-09-28 | Seagate Technology Llc | Diode assisted switching spin-transfer torque memory unit |
JP5030888B2 (ja) * | 2008-08-08 | 2012-09-19 | 株式会社日立製作所 | 共鳴トンネル磁気抵抗効果素子、磁気メモリセル及び磁気ランダムアクセスメモリ |
US8217478B2 (en) | 2008-10-10 | 2012-07-10 | Seagate Technology Llc | Magnetic stack with oxide to reduce switching current |
JP2011008861A (ja) * | 2009-06-25 | 2011-01-13 | Sony Corp | メモリ |
WO2011036752A1 (ja) * | 2009-09-24 | 2011-03-31 | 株式会社日立製作所 | 共鳴トンネル磁気抵抗効果素子、磁気メモリセル及び磁気ランダムアクセスメモリ |
US8482967B2 (en) * | 2010-11-03 | 2013-07-09 | Seagate Technology Llc | Magnetic memory element with multi-domain storage layer |
US8482968B2 (en) * | 2010-11-13 | 2013-07-09 | International Business Machines Corporation | Non-volatile magnetic tunnel junction transistor |
EP2605246B1 (en) * | 2011-12-12 | 2015-02-11 | Crocus Technology S.A. | Self-referenced magnetic random access memory element comprising a synthetic storage layer |
JP2014090109A (ja) * | 2012-10-31 | 2014-05-15 | Hitachi High-Technologies Corp | 磁気抵抗素子の製造方法 |
EP2741296B1 (en) * | 2012-12-07 | 2019-01-30 | Crocus Technology S.A. | Self-referenced magnetic random access memory (MRAM) and method for writing to the MRAM cell with increased reliability and reduced power consumption |
US9461242B2 (en) | 2013-09-13 | 2016-10-04 | Micron Technology, Inc. | Magnetic memory cells, methods of fabrication, semiconductor devices, memory systems, and electronic systems |
US9608197B2 (en) | 2013-09-18 | 2017-03-28 | Micron Technology, Inc. | Memory cells, methods of fabrication, and semiconductor devices |
US10454024B2 (en) | 2014-02-28 | 2019-10-22 | Micron Technology, Inc. | Memory cells, methods of fabrication, and memory devices |
US9281466B2 (en) | 2014-04-09 | 2016-03-08 | Micron Technology, Inc. | Memory cells, semiconductor structures, semiconductor devices, and methods of fabrication |
US9269888B2 (en) | 2014-04-18 | 2016-02-23 | Micron Technology, Inc. | Memory cells, methods of fabrication, and semiconductor devices |
US9349945B2 (en) | 2014-10-16 | 2016-05-24 | Micron Technology, Inc. | Memory cells, semiconductor devices, and methods of fabrication |
KR102324627B1 (ko) | 2014-10-31 | 2021-11-10 | 삼성전자주식회사 | 자기 저항 소자를 포함하는 반도체 소자 |
US9768377B2 (en) | 2014-12-02 | 2017-09-19 | Micron Technology, Inc. | Magnetic cell structures, and methods of fabrication |
US10439131B2 (en) * | 2015-01-15 | 2019-10-08 | Micron Technology, Inc. | Methods of forming semiconductor devices including tunnel barrier materials |
US10468590B2 (en) | 2015-04-21 | 2019-11-05 | Spin Memory, Inc. | High annealing temperature perpendicular magnetic anisotropy structure for magnetic random access memory |
US9728712B2 (en) * | 2015-04-21 | 2017-08-08 | Spin Transfer Technologies, Inc. | Spin transfer torque structure for MRAM devices having a spin current injection capping layer |
US9853206B2 (en) | 2015-06-16 | 2017-12-26 | Spin Transfer Technologies, Inc. | Precessional spin current structure for MRAM |
US9773974B2 (en) | 2015-07-30 | 2017-09-26 | Spin Transfer Technologies, Inc. | Polishing stop layer(s) for processing arrays of semiconductor elements |
US10163479B2 (en) | 2015-08-14 | 2018-12-25 | Spin Transfer Technologies, Inc. | Method and apparatus for bipolar memory write-verify |
KR102482373B1 (ko) | 2015-11-24 | 2022-12-29 | 삼성전자주식회사 | 자기 저항 메모리 장치 및 그 제조 방법 |
CN105374935B (zh) * | 2015-12-01 | 2018-10-09 | 中电海康集团有限公司 | 一种用于stt-mram的含有不均匀势垒层的磁性隧道结 |
US9741926B1 (en) | 2016-01-28 | 2017-08-22 | Spin Transfer Technologies, Inc. | Memory cell having magnetic tunnel junction and thermal stability enhancement layer |
US10446210B2 (en) | 2016-09-27 | 2019-10-15 | Spin Memory, Inc. | Memory instruction pipeline with a pre-read stage for a write operation for reducing power consumption in a memory device that uses dynamic redundancy registers |
US11119936B2 (en) | 2016-09-27 | 2021-09-14 | Spin Memory, Inc. | Error cache system with coarse and fine segments for power optimization |
US10460781B2 (en) | 2016-09-27 | 2019-10-29 | Spin Memory, Inc. | Memory device with a dual Y-multiplexer structure for performing two simultaneous operations on the same row of a memory bank |
US10628316B2 (en) | 2016-09-27 | 2020-04-21 | Spin Memory, Inc. | Memory device with a plurality of memory banks where each memory bank is associated with a corresponding memory instruction pipeline and a dynamic redundancy register |
US11119910B2 (en) | 2016-09-27 | 2021-09-14 | Spin Memory, Inc. | Heuristics for selecting subsegments for entry in and entry out operations in an error cache system with coarse and fine grain segments |
US11151042B2 (en) | 2016-09-27 | 2021-10-19 | Integrated Silicon Solution, (Cayman) Inc. | Error cache segmentation for power reduction |
US10991410B2 (en) | 2016-09-27 | 2021-04-27 | Spin Memory, Inc. | Bi-polar write scheme |
US10818331B2 (en) | 2016-09-27 | 2020-10-27 | Spin Memory, Inc. | Multi-chip module for MRAM devices with levels of dynamic redundancy registers |
US10366774B2 (en) | 2016-09-27 | 2019-07-30 | Spin Memory, Inc. | Device with dynamic redundancy registers |
US10546625B2 (en) | 2016-09-27 | 2020-01-28 | Spin Memory, Inc. | Method of optimizing write voltage based on error buffer occupancy |
US10437723B2 (en) | 2016-09-27 | 2019-10-08 | Spin Memory, Inc. | Method of flushing the contents of a dynamic redundancy register to a secure storage area during a power down in a memory device |
US10437491B2 (en) | 2016-09-27 | 2019-10-08 | Spin Memory, Inc. | Method of processing incomplete memory operations in a memory device during a power up sequence and a power down sequence using a dynamic redundancy register |
US10360964B2 (en) | 2016-09-27 | 2019-07-23 | Spin Memory, Inc. | Method of writing contents in memory during a power up sequence using a dynamic redundancy register in a memory device |
US10665777B2 (en) | 2017-02-28 | 2020-05-26 | Spin Memory, Inc. | Precessional spin current structure with non-magnetic insertion layer for MRAM |
US10672976B2 (en) | 2017-02-28 | 2020-06-02 | Spin Memory, Inc. | Precessional spin current structure with high in-plane magnetization for MRAM |
JP6616803B2 (ja) * | 2017-06-19 | 2019-12-04 | 株式会社日立ハイテクノロジーズ | 磁気抵抗素子の製造方法、及び磁気抵抗素子 |
US10032978B1 (en) | 2017-06-27 | 2018-07-24 | Spin Transfer Technologies, Inc. | MRAM with reduced stray magnetic fields |
US10489245B2 (en) | 2017-10-24 | 2019-11-26 | Spin Memory, Inc. | Forcing stuck bits, waterfall bits, shunt bits and low TMR bits to short during testing and using on-the-fly bit failure detection and bit redundancy remapping techniques to correct them |
US10529439B2 (en) | 2017-10-24 | 2020-01-07 | Spin Memory, Inc. | On-the-fly bit failure detection and bit redundancy remapping techniques to correct for fixed bit defects |
US10656994B2 (en) | 2017-10-24 | 2020-05-19 | Spin Memory, Inc. | Over-voltage write operation of tunnel magnet-resistance (“TMR”) memory device and correcting failure bits therefrom by using on-the-fly bit failure detection and bit redundancy remapping techniques |
US10481976B2 (en) | 2017-10-24 | 2019-11-19 | Spin Memory, Inc. | Forcing bits as bad to widen the window between the distributions of acceptable high and low resistive bits thereby lowering the margin and increasing the speed of the sense amplifiers |
US10679685B2 (en) | 2017-12-27 | 2020-06-09 | Spin Memory, Inc. | Shared bit line array architecture for magnetoresistive memory |
US10424726B2 (en) | 2017-12-28 | 2019-09-24 | Spin Memory, Inc. | Process for improving photoresist pillar adhesion during MRAM fabrication |
US10360962B1 (en) | 2017-12-28 | 2019-07-23 | Spin Memory, Inc. | Memory array with individually trimmable sense amplifiers |
US10516094B2 (en) | 2017-12-28 | 2019-12-24 | Spin Memory, Inc. | Process for creating dense pillars using multiple exposures for MRAM fabrication |
US10395712B2 (en) | 2017-12-28 | 2019-08-27 | Spin Memory, Inc. | Memory array with horizontal source line and sacrificial bitline per virtual source |
US10891997B2 (en) | 2017-12-28 | 2021-01-12 | Spin Memory, Inc. | Memory array with horizontal source line and a virtual source line |
US10395711B2 (en) | 2017-12-28 | 2019-08-27 | Spin Memory, Inc. | Perpendicular source and bit lines for an MRAM array |
US10811594B2 (en) | 2017-12-28 | 2020-10-20 | Spin Memory, Inc. | Process for hard mask development for MRAM pillar formation using photolithography |
US10840439B2 (en) | 2017-12-29 | 2020-11-17 | Spin Memory, Inc. | Magnetic tunnel junction (MTJ) fabrication methods and systems |
US10236047B1 (en) | 2017-12-29 | 2019-03-19 | Spin Memory, Inc. | Shared oscillator (STNO) for MRAM array write-assist in orthogonal STT-MRAM |
US10270027B1 (en) | 2017-12-29 | 2019-04-23 | Spin Memory, Inc. | Self-generating AC current assist in orthogonal STT-MRAM |
US10840436B2 (en) | 2017-12-29 | 2020-11-17 | Spin Memory, Inc. | Perpendicular magnetic anisotropy interface tunnel junction devices and methods of manufacture |
US10199083B1 (en) | 2017-12-29 | 2019-02-05 | Spin Transfer Technologies, Inc. | Three-terminal MRAM with ac write-assist for low read disturb |
US10236048B1 (en) | 2017-12-29 | 2019-03-19 | Spin Memory, Inc. | AC current write-assist in orthogonal STT-MRAM |
US10546624B2 (en) | 2017-12-29 | 2020-01-28 | Spin Memory, Inc. | Multi-port random access memory |
US10360961B1 (en) | 2017-12-29 | 2019-07-23 | Spin Memory, Inc. | AC current pre-charge write-assist in orthogonal STT-MRAM |
US10784439B2 (en) | 2017-12-29 | 2020-09-22 | Spin Memory, Inc. | Precessional spin current magnetic tunnel junction devices and methods of manufacture |
US10367139B2 (en) | 2017-12-29 | 2019-07-30 | Spin Memory, Inc. | Methods of manufacturing magnetic tunnel junction devices |
US10424723B2 (en) | 2017-12-29 | 2019-09-24 | Spin Memory, Inc. | Magnetic tunnel junction devices including an optimization layer |
US10886330B2 (en) | 2017-12-29 | 2021-01-05 | Spin Memory, Inc. | Memory device having overlapping magnetic tunnel junctions in compliance with a reference pitch |
US10141499B1 (en) | 2017-12-30 | 2018-11-27 | Spin Transfer Technologies, Inc. | Perpendicular magnetic tunnel junction device with offset precessional spin current layer |
US10339993B1 (en) | 2017-12-30 | 2019-07-02 | Spin Memory, Inc. | Perpendicular magnetic tunnel junction device with skyrmionic assist layers for free layer switching |
US10255962B1 (en) | 2017-12-30 | 2019-04-09 | Spin Memory, Inc. | Microwave write-assist in orthogonal STT-MRAM |
US10319900B1 (en) | 2017-12-30 | 2019-06-11 | Spin Memory, Inc. | Perpendicular magnetic tunnel junction device with precessional spin current layer having a modulated moment density |
US10229724B1 (en) | 2017-12-30 | 2019-03-12 | Spin Memory, Inc. | Microwave write-assist in series-interconnected orthogonal STT-MRAM devices |
US10236439B1 (en) | 2017-12-30 | 2019-03-19 | Spin Memory, Inc. | Switching and stability control for perpendicular magnetic tunnel junction device |
US10468588B2 (en) | 2018-01-05 | 2019-11-05 | Spin Memory, Inc. | Perpendicular magnetic tunnel junction device with skyrmionic enhancement layers for the precessional spin current magnetic layer |
US10438996B2 (en) | 2018-01-08 | 2019-10-08 | Spin Memory, Inc. | Methods of fabricating magnetic tunnel junctions integrated with selectors |
US10438995B2 (en) | 2018-01-08 | 2019-10-08 | Spin Memory, Inc. | Devices including magnetic tunnel junctions integrated with selectors |
WO2019147602A1 (en) | 2018-01-29 | 2019-08-01 | Northwestern University | Amphoteric p-type and n-type doping of group iii-vi semiconductors with group-iv atoms |
US10388861B1 (en) | 2018-03-08 | 2019-08-20 | Spin Memory, Inc. | Magnetic tunnel junction wafer adaptor used in magnetic annealing furnace and method of using the same |
US10446744B2 (en) | 2018-03-08 | 2019-10-15 | Spin Memory, Inc. | Magnetic tunnel junction wafer adaptor used in magnetic annealing furnace and method of using the same |
US11107974B2 (en) | 2018-03-23 | 2021-08-31 | Spin Memory, Inc. | Magnetic tunnel junction devices including a free magnetic trench layer and a planar reference magnetic layer |
US10784437B2 (en) | 2018-03-23 | 2020-09-22 | Spin Memory, Inc. | Three-dimensional arrays with MTJ devices including a free magnetic trench layer and a planar reference magnetic layer |
US11107978B2 (en) | 2018-03-23 | 2021-08-31 | Spin Memory, Inc. | Methods of manufacturing three-dimensional arrays with MTJ devices including a free magnetic trench layer and a planar reference magnetic layer |
US10734573B2 (en) | 2018-03-23 | 2020-08-04 | Spin Memory, Inc. | Three-dimensional arrays with magnetic tunnel junction devices including an annular discontinued free magnetic layer and a planar reference magnetic layer |
US10411185B1 (en) | 2018-05-30 | 2019-09-10 | Spin Memory, Inc. | Process for creating a high density magnetic tunnel junction array test platform |
US10692569B2 (en) | 2018-07-06 | 2020-06-23 | Spin Memory, Inc. | Read-out techniques for multi-bit cells |
US10593396B2 (en) | 2018-07-06 | 2020-03-17 | Spin Memory, Inc. | Multi-bit cell read-out techniques for MRAM cells with mixed pinned magnetization orientations |
US10600478B2 (en) | 2018-07-06 | 2020-03-24 | Spin Memory, Inc. | Multi-bit cell read-out techniques for MRAM cells with mixed pinned magnetization orientations |
US10559338B2 (en) | 2018-07-06 | 2020-02-11 | Spin Memory, Inc. | Multi-bit cell read-out techniques |
US10650875B2 (en) | 2018-08-21 | 2020-05-12 | Spin Memory, Inc. | System for a wide temperature range nonvolatile memory |
US11094361B2 (en) | 2018-09-05 | 2021-08-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistorless memory cell |
US10699761B2 (en) | 2018-09-18 | 2020-06-30 | Spin Memory, Inc. | Word line decoder memory architecture |
US10971680B2 (en) | 2018-10-01 | 2021-04-06 | Spin Memory, Inc. | Multi terminal device stack formation methods |
US11621293B2 (en) | 2018-10-01 | 2023-04-04 | Integrated Silicon Solution, (Cayman) Inc. | Multi terminal device stack systems and methods |
US10580827B1 (en) | 2018-11-16 | 2020-03-03 | Spin Memory, Inc. | Adjustable stabilizer/polarizer method for MRAM with enhanced stability and efficient switching |
CN111293138A (zh) * | 2018-12-07 | 2020-06-16 | 中国科学院上海微***与信息技术研究所 | 三维mram存储结构及其制作方法 |
US11107979B2 (en) | 2018-12-28 | 2021-08-31 | Spin Memory, Inc. | Patterned silicide structures and methods of manufacture |
US11930719B2 (en) | 2019-01-31 | 2024-03-12 | Northwestern University | Magnetic memory device using doped semiconductor layer |
CN112736190B (zh) * | 2019-10-14 | 2023-04-18 | 上海磁宇信息科技有限公司 | 磁性隧道结结构及磁性随机存储器 |
US11968907B2 (en) | 2022-07-05 | 2024-04-23 | Western Digital Technologies, Inc. | Magnetoresistive memory device including a magnetoresistance amplification layer |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3217703B2 (ja) * | 1995-09-01 | 2001-10-15 | 株式会社東芝 | 磁性体デバイス及びそれを用いた磁気センサ |
JP4124533B2 (ja) * | 1999-03-02 | 2008-07-23 | 富士通株式会社 | 強磁性トンネル接合素子及びその製造方法 |
US6295225B1 (en) * | 1999-05-14 | 2001-09-25 | U.S. Philips Corporation | Magnetic tunnel junction device having an intermediate layer |
JP4076197B2 (ja) * | 1999-05-19 | 2008-04-16 | 株式会社東芝 | 磁性素子、記憶装置、磁気再生ヘッド、3端子素子、及び磁気ディスク装置 |
FR2817998B1 (fr) * | 2000-12-07 | 2003-01-10 | Commissariat Energie Atomique | Dispositif magnetique a polarisation de spin et a rotation d'aimantation, memoire et procede d'ecriture utilisant ce dispositif |
JP2002314164A (ja) * | 2001-02-06 | 2002-10-25 | Sony Corp | 磁気トンネル素子及びその製造方法、薄膜磁気ヘッド、磁気メモリ、並びに磁気センサ |
DE10123820C2 (de) * | 2001-05-16 | 2003-06-18 | Infineon Technologies Ag | Verfahren zur Herstellung eines TMR-Schichtsystems mit Diodencharakteristik und MRAM-Speicheranordnung |
FR2832542B1 (fr) | 2001-11-16 | 2005-05-06 | Commissariat Energie Atomique | Dispositif magnetique a jonction tunnel magnetique, memoire et procedes d'ecriture et de lecture utilisant ce dispositif |
DE10202903B4 (de) * | 2002-01-25 | 2009-01-22 | Qimonda Ag | Magnetoresistive Speicherzelle mit polaritätsabhängigem Widerstand und Speicherzelle |
CN101114694A (zh) * | 2002-11-26 | 2008-01-30 | 株式会社东芝 | 磁单元和磁存储器 |
US6944052B2 (en) | 2002-11-26 | 2005-09-13 | Freescale Semiconductor, Inc. | Magnetoresistive random access memory (MRAM) cell having a diode with asymmetrical characteristics |
JP2004179483A (ja) * | 2002-11-28 | 2004-06-24 | Hitachi Ltd | 不揮発性磁気メモリ |
US6747335B1 (en) * | 2003-01-31 | 2004-06-08 | Hewlett-Packard Development Company, L.P. | Magnetic memory cell |
US6982901B1 (en) * | 2003-01-31 | 2006-01-03 | Hewlett-Packard Development Company, L.P. | Memory device and method of use |
US6794697B1 (en) * | 2003-10-01 | 2004-09-21 | Hewlett-Packard Development Company, L.P. | Asymmetric patterned magnetic memory |
US6936479B2 (en) * | 2004-01-15 | 2005-08-30 | Hewlett-Packard Development Company, L.P. | Method of making toroidal MRAM cells |
WO2007038971A1 (en) * | 2005-09-20 | 2007-04-12 | Freescale Semiconductor, Inc. | Spin-dependent tunnelling cell and method of formation thereof |
-
2005
- 2005-10-14 FR FR0510533A patent/FR2892231B1/fr not_active Expired - Fee Related
-
2006
- 2006-10-13 KR KR1020087008675A patent/KR20080063767A/ko not_active Application Discontinuation
- 2006-10-13 EP EP06807238A patent/EP1949466B1/en active Active
- 2006-10-13 AT AT06807238T patent/ATE497259T1/de not_active IP Right Cessation
- 2006-10-13 DE DE602006019897T patent/DE602006019897D1/de active Active
- 2006-10-13 CN CN2006800381280A patent/CN101288186B/zh active Active
- 2006-10-13 WO PCT/EP2006/067374 patent/WO2007042563A1/en active Application Filing
- 2006-10-13 TW TW095137826A patent/TWI459385B/zh active
- 2006-10-13 US US12/083,398 patent/US7821818B2/en active Active
- 2006-10-13 JP JP2008535037A patent/JP5468262B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP1949466B1 (en) | 2011-01-26 |
TWI459385B (zh) | 2014-11-01 |
CN101288186B (zh) | 2011-06-29 |
JP2009512204A (ja) | 2009-03-19 |
FR2892231A1 (fr) | 2007-04-20 |
EP1949466A1 (en) | 2008-07-30 |
CN101288186A (zh) | 2008-10-15 |
KR20080063767A (ko) | 2008-07-07 |
TW200733104A (en) | 2007-09-01 |
US20090231909A1 (en) | 2009-09-17 |
DE602006019897D1 (de) | 2011-03-10 |
WO2007042563A1 (en) | 2007-04-19 |
US7821818B2 (en) | 2010-10-26 |
ATE497259T1 (de) | 2011-02-15 |
FR2892231B1 (fr) | 2008-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5468262B2 (ja) | 磁気抵抗トンネル接合素子およびmramへのその適用 | |
US10651369B2 (en) | Magnetoresistive element and magnetic memory | |
US10600460B2 (en) | Perpendicular magnetic memory using spin-orbit torque | |
US8976577B2 (en) | High density magnetic random access memory | |
US8039913B2 (en) | Magnetic stack with laminated layer | |
KR100754930B1 (ko) | 전압제어 자화반전 기록방식의 mram 소자 및 이를이용한 정보의 기록 및 판독 방법 | |
JP4435189B2 (ja) | 磁気記憶素子及び磁気記憶装置 | |
KR100548997B1 (ko) | 다층박막구조의 자유층을 갖는 자기터널 접합 구조체들 및이를 채택하는 자기 램 셀들 | |
KR102316122B1 (ko) | 마그네틱 접합부, 마그네틱 접합부를 제공하는 방법 및 마그네틱 메모리 | |
US11257862B2 (en) | MRAM having spin hall effect writing and method of making the same | |
TWI333207B (en) | Magnetic memory cell with multiple-bit in stacked structure and magnetic memory device | |
US7978505B2 (en) | Heat assisted switching and separated read-write MRAM | |
US7366009B2 (en) | Separate write and read access architecture for a magnetic tunnel junction | |
KR20120025489A (ko) | 스핀 토크 스위칭을 보조하는 층을 갖는 스핀 토크 스위칭을 이용하는 자기 스택 | |
JP4128418B2 (ja) | 導体を埋め込まれた磁気的に軟らかい基準層を含む磁気抵抗素子 | |
JP2010114143A (ja) | 半導体記憶装置および半導体記憶装置の製造方法 | |
KR101946457B1 (ko) | 열적으로 안정한 자기터널접합 셀 및 이를 포함하는 메모리 소자 | |
JP2008147488A (ja) | 磁気抵抗効果素子及びmram | |
US11854589B2 (en) | STT-SOT hybrid magnetoresistive element and manufacture thereof | |
JP2004273918A (ja) | 磁気ランダムアクセスメモリおよびその製造方法 | |
JP5383744B2 (ja) | 磁気メモリ | |
US20220045267A1 (en) | Magnetoresistive element having a sidewall-current-channel structure | |
JP2004023015A (ja) | 磁気抵抗効果素子およびその製造方法並びに磁気メモリ装置 | |
JP2008047840A (ja) | 磁気抵抗効果素子、磁気ランダムアクセスメモリ、及びそれらの製造方法 | |
WO2012137911A1 (ja) | 磁気抵抗効果素子、及び磁気ランダムアクセスメモリ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091009 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120515 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120720 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120727 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121114 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130910 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130918 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131010 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131018 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131108 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131115 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131205 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140107 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140129 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5468262 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |