JP5454226B2 - 放熱基板とその製造方法 - Google Patents
放熱基板とその製造方法 Download PDFInfo
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Description
図1は、本発明の実施例1における放熱基板を斜めから見た様子を示す断面図である。
次に実施例2として、図6(A)〜(B)を用いて、図1等に示した放熱基板101の製造方法の一例について説明する。
実施例3では、伝熱層102の表面状態について、図8、図9を用いて説明する。119は光沢度計、120は光源、121はレンズ、122は受光部、123は点線、124は表面である。
実施例4では、未硬化組成物116について説明する。
また必要に応じて、無機系の難燃剤を添加する方法が知られている。しかし有機系の難燃剤として、構造的に大きく異なる樹脂を配合すると結晶化が阻害されるため添加量が制限される。そのため、結晶性を保ったまま難燃化が達成できない。また、無機系の難燃剤の場合、難燃剤の熱伝導率が低いため、量を多くすると熱伝導率が低下する。
次に、特に高熱伝導率と、高い難燃性と、耐衝撃性との両立について説明する。
図12(A)は本実施例による伝熱層102の表面124の顕微鏡写真、図12(B)はその模式図である。図13(A)はその伝熱層102の表面124を3次元的に示す斜視図、図13(B)はその模式図である。
次に、本発明の実施例8を用いて放熱基板101に用いる各種部材について説明する。
以下に実施例9として、伝熱層102の製造に用いた、未硬化組成物116について説明する。
実施例10を用いて、実施例1等で説明した伝熱層102中に含まれる無機フィラの含有率の最適化について実験した結果について説明する。
実施例11では、図19、20を用いて、リードフレーム103と配線基板104との半田部108を介した接続の一例について接続する。
102 伝熱層
103 リードフレーム
104 配線基板
105 配線部
106 絶縁部
107 金属板
108 半田部
109 接続部
110 ボンディングワイヤ
111 側面電極
112 スルーホール
114 金型
115 保護フィルム
116 未硬化組成物
117 矢印
118 成形装置
119 光沢度計
120 光源
121 レンズ
122 受光部
123 点線
124 表面
125 表面粗さ計
126 模様
127 無機フィラ
128 表面層
129 主要部
130 熱硬化性樹脂
131 汚れ
132 突起部
133 クラック
Claims (5)
- 金属板と、
この金属板上に設けられたシート状の、結晶性エポキシ樹脂を含む硬化済の熱硬化性樹脂と、無機フィラとからなる伝熱層と、
この伝熱層に固定された、配線基板と、リードフレームと、
を有する放熱基板であって、
前記伝熱層における前記無機フィラの含有率が、66Vol%以上、90Vol%以下であって、
前記配線基板の側面の一部以上と、前記リードフレームの側面の一部以上とは、半田部もしくは機械的接続部の一つ以上を介して接続されている放熱基板。 - 前記伝熱層の表面の算術平均粗さRaが3000Å以下もしくは最大高さRy15000Å以下のいずれか1つ以上である請求項1に記載の放熱基板。
- 前記伝熱層の表面の20度光沢が70以上である請求項1に記載の放熱基板。
- 前記無機フィラは、アルミナ、窒化アルミ、窒化ホウ素、炭化ケイ素、窒化ケイ素、酸化マグネシウム、酸化亜鉛から選ばれた少なくとも1種類以上からなる請求項1に記載の放熱基板。
- 金属板上に、結晶性エポキシ樹脂を含む未硬化状態の熱硬化性樹脂と、無機フィラとを含む未硬化組成物と、リードフレームと、配線基板とを配置する配置工程と、
前記金属板上で、前記未硬化組成物を加熱し、前記未硬化組成物に前記リードフレームと前記配線基板とを埋め込む、埋め込み工程と、
少なくとも前記未硬化組成物を、前記結晶性エポキシ樹脂の結晶化温度、あるいは融点のいずれか1つ以上まで加熱して、液体状態とし、前記無機フィラの間を対流させる対流工程と、
前記未硬化組成物を熱硬化させ、伝熱層とする熱硬化工程と、
を備える放熱基板の製造方法であって、
前記無機フィラの含有率が、66Vol%以上、90Vol%以下であり、
前記配線基板の側面の一部以上と、前記リードフレームの側面の一部以上とは、半田部もしくは機械的接続部の一つ以上を介して接続していることを特徴とする放熱基板の製造方法。
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JP2015037103A (ja) * | 2013-08-12 | 2015-02-23 | 新電元工業株式会社 | 半導体装置及び半導体装置の製造方法 |
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