JP5422138B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
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- JP5422138B2 JP5422138B2 JP2008094894A JP2008094894A JP5422138B2 JP 5422138 B2 JP5422138 B2 JP 5422138B2 JP 2008094894 A JP2008094894 A JP 2008094894A JP 2008094894 A JP2008094894 A JP 2008094894A JP 5422138 B2 JP5422138 B2 JP 5422138B2
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- conductive film
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- Expired - Fee Related
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/5328—Conductive materials containing conductive organic materials or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
本実施の形態では、本発明の半導体装置の一例に関し図面を参照して説明する。なお、以下の説明において、図1は半導体装置の上面を示しており、図2は図1のA1−B1間の断面図を示している。
本実施の形態では、上記実施の形態と異なる構成の半導体装置に関して、図面を参照して説明する。
本実施の形態では、上記実施の形態で示した半導体装置の作製方法の一例に関して、図面を参照して説明する。本実施の形態においては、半導体装置の集積回路部に含まれる素子等を同一基板上に薄膜トランジスタを用いて設ける場合について説明する。なお、本実施の形態では、薄膜トランジスタ等の素子を一度支持基板に設けた後、可撓性を有する基板に転置して半導体装置を作製する場合に関して説明する。また、本実施の形態では、一つの基板に複数の集積回路部及びアンテナを形成し(ここでは、縦4×横3)、複数の半導体装置を作製する場合について説明する。以下の説明において、図12、図13は上面図の模式図であり、図14〜図18は図12〜図13におけるA−B間の断面図の模式図である。
本実施の形態では、上記実施の形態で示した半導体装置の使用形態の一例について説明する。具体的には、非接触でデータの入出力が可能である半導体装置の適用例に関して図面を参照して以下に説明する。非接触でデータの入出力が可能である半導体装置は利用の形態によっては、RFIDタグ、IDタグ、ICタグ、ICチップ、RFタグ、無線タグ、電子タグまたは無線チップともよばれる。
81 高周波回路
82 電源回路
83 リセット回路
84 クロック発生回路
85 データ復調回路
86 データ変調回路
87 制御回路
88 記憶回路
89 アンテナ
91 コード抽出回路
92 コード判定回路
93 CRC判定回路
94 出力ユニット回路
101 基板
102 集積回路部
103 導電膜
104 導電膜
105 導電膜
106 絶縁膜
107 開口部
109 絶縁膜
110 素子
111 シード層
121 絶縁膜
Claims (2)
- 基板上に集積回路部を形成し、
前記集積回路部上に第1の絶縁膜を形成し、
前記第1の絶縁膜上に第1の導電膜を形成し、
前記第1の導電膜上に第2の絶縁膜を形成し、
前記第1の絶縁膜の一部、前記第1の導電膜の一部、及び前記第2の絶縁膜の一部をエッチングして、開口部を形成し、
前記エッチングにより、前記開口部近傍における前記第1の導電膜の上面は露出され、
前記開口部の内面及び前記第1の導電膜の上面にシード層を形成し、
めっき処理により前記開口部及び前記第1の導電膜の上面に第2の導電膜を形成し、
前記第1の導電膜と前記集積回路部とは、前記第2の導電膜を介して電気的に接続されることを特徴とする半導体装置の作製方法。 - 基板上に集積回路部を形成し、
前記集積回路部上に第1の絶縁膜を形成し、
前記第1の絶縁膜上に第1の導電膜を形成し、
前記第1の導電膜上に第2の絶縁膜を形成し、
前記第2の絶縁膜上に第2の導電膜を形成し、
前記第2の導電膜上に第3の絶縁膜を形成し、
前記第1の絶縁膜の一部、前記第1の導電膜の一部、前記第2の絶縁膜の一部、前記第2の導電膜の一部、及び前記第3の絶縁膜の一部をエッチングして、開口部を形成し、
前記エッチングにより、前記開口部近傍における前記第2の導電膜の上面は露出され、
前記開口部の内面及び前記第2の導電膜の上面にシード層を形成し、
めっき処理により前記開口部及び前記第2の導電膜の上面に第3の導電膜を形成し、
前記第1の導電膜と前記集積回路部との電気的接続、及び前記第2の導電膜と前記集積回路部との電気的接続は、前記第3の導電膜を介して行われることを特徴とする半導体装置の作製方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008094894A JP5422138B2 (ja) | 2007-04-06 | 2008-04-01 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007100062 | 2007-04-06 | ||
JP2007100062 | 2007-04-06 | ||
JP2008094894A JP5422138B2 (ja) | 2007-04-06 | 2008-04-01 | 半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008277798A JP2008277798A (ja) | 2008-11-13 |
JP2008277798A5 JP2008277798A5 (ja) | 2011-05-06 |
JP5422138B2 true JP5422138B2 (ja) | 2014-02-19 |
Family
ID=39537436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008094894A Expired - Fee Related JP5422138B2 (ja) | 2007-04-06 | 2008-04-01 | 半導体装置の作製方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8353459B2 (ja) |
EP (1) | EP1978472A3 (ja) |
JP (1) | JP5422138B2 (ja) |
Families Citing this family (16)
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US8698697B2 (en) * | 2007-06-12 | 2014-04-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2009147547A1 (en) * | 2008-06-02 | 2009-12-10 | Nxp B.V. | Electronic device and method of manufacturing an electronic device |
CN102224768A (zh) | 2008-11-25 | 2011-10-19 | Kovio股份有限公司 | 印刷天线, 制作印刷天线之方法, 以及包含印刷天线之设备 |
JP2010128937A (ja) * | 2008-11-28 | 2010-06-10 | Fujitsu Ltd | Rfidユニット |
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JP5418510B2 (ja) * | 2010-02-25 | 2014-02-19 | 日立化成株式会社 | 評価用半導体チップ、評価システム及びそのリペア方法 |
JP2011253898A (ja) * | 2010-06-01 | 2011-12-15 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置及び製造方法 |
JP2012049338A (ja) * | 2010-08-27 | 2012-03-08 | Hitachi Ltd | ヒータ配線付き半導体チップ |
DE102013006624B3 (de) * | 2013-04-18 | 2014-05-28 | Forschungszentrum Jülich GmbH | Hochfrequenzleiter mit verbesserter Leitfähigkeit und Verfahren seiner Herstellung |
JP6402017B2 (ja) | 2013-12-26 | 2018-10-10 | 株式会社半導体エネルギー研究所 | 半導体装置 |
USD850424S1 (en) * | 2016-12-14 | 2019-06-04 | AQ Corporation | Flexible PCB dual antenna module for use in smartphone |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
US11437331B2 (en) * | 2019-10-17 | 2022-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chip structure and method for forming the same |
USD896208S1 (en) * | 2019-10-22 | 2020-09-15 | Avery Dennison Retail Information Services, Llc | Antenna |
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2008
- 2008-03-20 EP EP20080005387 patent/EP1978472A3/en not_active Withdrawn
- 2008-03-26 US US12/076,997 patent/US8353459B2/en not_active Expired - Fee Related
- 2008-04-01 JP JP2008094894A patent/JP5422138B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1978472A3 (en) | 2015-04-22 |
US20080245880A1 (en) | 2008-10-09 |
US8353459B2 (en) | 2013-01-15 |
EP1978472A2 (en) | 2008-10-08 |
JP2008277798A (ja) | 2008-11-13 |
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