JP5396047B2 - ガラス用研摩材スラリー - Google Patents
ガラス用研摩材スラリー Download PDFInfo
- Publication number
- JP5396047B2 JP5396047B2 JP2008226283A JP2008226283A JP5396047B2 JP 5396047 B2 JP5396047 B2 JP 5396047B2 JP 2008226283 A JP2008226283 A JP 2008226283A JP 2008226283 A JP2008226283 A JP 2008226283A JP 5396047 B2 JP5396047 B2 JP 5396047B2
- Authority
- JP
- Japan
- Prior art keywords
- particle size
- polishing
- glass
- abrasive
- average particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002002 slurry Substances 0.000 title claims description 53
- 239000011521 glass Substances 0.000 title claims description 39
- 239000002245 particle Substances 0.000 claims description 158
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 39
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 37
- 238000009826 distribution Methods 0.000 claims description 18
- 230000005540 biological transmission Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 238000005498 polishing Methods 0.000 description 72
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 26
- 238000006243 chemical reaction Methods 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 23
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 21
- 230000003746 surface roughness Effects 0.000 description 18
- 239000008119 colloidal silica Substances 0.000 description 17
- VYLVYHXQOHJDJL-UHFFFAOYSA-K cerium trichloride Chemical compound Cl[Ce](Cl)Cl VYLVYHXQOHJDJL-UHFFFAOYSA-K 0.000 description 14
- 239000007787 solid Substances 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 13
- 239000000047 product Substances 0.000 description 13
- 229910000420 cerium oxide Inorganic materials 0.000 description 12
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 12
- UNJPQTDTZAKTFK-UHFFFAOYSA-K cerium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[Ce+3] UNJPQTDTZAKTFK-UHFFFAOYSA-K 0.000 description 11
- 239000007788 liquid Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000003917 TEM image Methods 0.000 description 6
- 238000002441 X-ray diffraction Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000010453 quartz Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- HSJPMRKMPBAUAU-UHFFFAOYSA-N cerium(3+);trinitrate Chemical compound [Ce+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O HSJPMRKMPBAUAU-UHFFFAOYSA-N 0.000 description 2
- 239000013065 commercial product Substances 0.000 description 2
- 238000011033 desalting Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ZKQDCIXGCQPQNV-UHFFFAOYSA-N Calcium hypochlorite Chemical compound [Ca+2].Cl[O-].Cl[O-] ZKQDCIXGCQPQNV-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000005708 Sodium hypochlorite Substances 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- SATVIFGJTRRDQU-UHFFFAOYSA-N potassium hypochlorite Chemical compound [K+].Cl[O-] SATVIFGJTRRDQU-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
Claims (2)
- 透過型電子顕微鏡により測定された研摩材粒子の最大粒径Tmaxが90nm以下であり、
前記最大粒径Tmaxと、透過型電子顕微鏡により測定された研摩材粒子の平均粒径TavgとがTmax/Tavg≧3を満足し、
該研摩材粒子の粒度分布が、少なくとも、平均粒径値付近に出現する第一ピークとTavgの3倍以上の粒径値付近に出現する第二ピークとを有し、
第一ピークが5nm〜20nmの範囲に出現し、第二ピークが25nm〜60nmに出現するものであり、研摩材がコロイダルセリアであることを特徴とするガラス用研摩材スラリー。 - 平均粒径が5nm〜20nmの範囲にある請求項1に記載のガラス用研摩材スラリー。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008226283A JP5396047B2 (ja) | 2008-09-03 | 2008-09-03 | ガラス用研摩材スラリー |
PCT/JP2009/054636 WO2010026792A1 (ja) | 2008-09-03 | 2009-03-11 | ガラス用研摩材スラリー |
TW98112262A TWI404598B (zh) | 2008-09-03 | 2009-04-14 | 玻璃用研磨漿 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008226283A JP5396047B2 (ja) | 2008-09-03 | 2008-09-03 | ガラス用研摩材スラリー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010059310A JP2010059310A (ja) | 2010-03-18 |
JP5396047B2 true JP5396047B2 (ja) | 2014-01-22 |
Family
ID=41796968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008226283A Active JP5396047B2 (ja) | 2008-09-03 | 2008-09-03 | ガラス用研摩材スラリー |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5396047B2 (ja) |
TW (1) | TWI404598B (ja) |
WO (1) | WO2010026792A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103917332A (zh) * | 2011-11-01 | 2014-07-09 | 旭硝子株式会社 | 玻璃基板的制造方法 |
US9340706B2 (en) * | 2013-10-10 | 2016-05-17 | Cabot Microelectronics Corporation | Mixed abrasive polishing compositions |
CN103992743B (zh) * | 2014-05-09 | 2018-06-19 | 杰明纳微电子股份有限公司 | 含有二氧化铈粉体与胶体二氧化硅混合磨料的抛光液及其制备工艺 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4213858B2 (ja) * | 2000-02-03 | 2009-01-21 | 花王株式会社 | 研磨液組成物 |
KR100803876B1 (ko) * | 2000-05-12 | 2008-02-14 | 닛산 가가쿠 고교 가부시키 가이샤 | 연마용 조성물 |
JP4373776B2 (ja) * | 2003-02-05 | 2009-11-25 | 花王株式会社 | 研磨液組成物 |
JP4042906B2 (ja) * | 2003-05-06 | 2008-02-06 | 日本化学工業株式会社 | 研磨用組成物,研磨用組成物の調整方法および研磨方法 |
JP4214093B2 (ja) * | 2004-08-24 | 2009-01-28 | 花王株式会社 | 研磨液組成物 |
TWI284741B (en) * | 2005-06-06 | 2007-08-01 | Chien-Fu Chen | A simple detector for partial discharge with the acoustic emission technique |
JP5019429B2 (ja) * | 2006-12-26 | 2012-09-05 | 花王株式会社 | 容器入り分散液 |
JP4827805B2 (ja) * | 2007-08-01 | 2011-11-30 | 山口精研工業株式会社 | 硬脆材料用精密研磨組成物 |
-
2008
- 2008-09-03 JP JP2008226283A patent/JP5396047B2/ja active Active
-
2009
- 2009-03-11 WO PCT/JP2009/054636 patent/WO2010026792A1/ja active Application Filing
- 2009-04-14 TW TW98112262A patent/TWI404598B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2010026792A1 (ja) | 2010-03-11 |
JP2010059310A (ja) | 2010-03-18 |
TW201010824A (en) | 2010-03-16 |
TWI404598B (zh) | 2013-08-11 |
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