JP5359732B2 - Method for manufacturing light emitting device - Google Patents

Method for manufacturing light emitting device Download PDF

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JP5359732B2
JP5359732B2 JP2009217721A JP2009217721A JP5359732B2 JP 5359732 B2 JP5359732 B2 JP 5359732B2 JP 2009217721 A JP2009217721 A JP 2009217721A JP 2009217721 A JP2009217721 A JP 2009217721A JP 5359732 B2 JP5359732 B2 JP 5359732B2
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silicone resin
emitting element
light emitting
primer layer
light
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JP2011066335A (en
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正太 下西
博幸 田嶌
陽祐 土屋
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Toyoda Gosei Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method requiring only one type of die for molding, in a method of manufacturing a light-emitting device including a light-emitting element, a fluorescent material arranged in the vicinity of a surface of the light-emitting element, and a lens part formed of a first silicone resin covering the light-emitting element. <P>SOLUTION: The method is used for manufacturing a light-emitting device including a light-emitting element, a fluorescent material arranged in the vicinity of a surface of the light-emitting element, and a lens part formed of a first silicone resin covering the light-emitting element. The method of manufacturing the light-emitting device includes steps of: forming a primer layer formed of an uncured second silicone resin on a surface of the light-emitting element; supporting the fluorescent material to the primer layer; and setting the light-emitting element in a die in a state where the primer layer is not cured, and curing both the first silicone resin and the second silicone resin when forming the lens part by compressing and molding the first silicone resin. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

本発明は、発光装置の製造方法の改良に関する。 The present invention relates to an improvement in a method for manufacturing a light emitting device.

従来、圧縮成型により発光素子の周囲に蛍光体を配置する方法の例として、発光素子を蛍光体層で被覆した後、シリコーン樹脂層で被覆する方法が特許文献１に開示されている。また、蛍光体が分散した封止樹脂を圧縮成型して硬化する際に、封止樹脂中の蛍光体を沈降させて、発光素子近傍に蛍光体を配置する方法が特許文献２に開示されている。一方、圧縮成型ではないが、発光素子の周囲に蛍光体を配置する方法の例として、発光素子に定着剤を塗布して蛍光体を振りかけて付着させる方法が特許文献３に開示されている。 Conventionally, Patent Document 1 discloses a method in which a phosphor is disposed around a light-emitting element by compression molding, and then the light-emitting element is coated with a phosphor layer and then coated with a silicone resin layer. Further, Patent Document 2 discloses a method of placing a phosphor in the vicinity of a light emitting element by precipitating the phosphor in the sealing resin when the sealing resin in which the phosphor is dispersed is compression-molded and cured. Yes. On the other hand, although not compression molding, Patent Document 3 discloses a method in which a phosphor is applied to a light emitting element and a phosphor is sprinkled and attached as an example of a method of arranging the phosphor around the light emitting element.

特開２００８−２１１２０５号公報JP 2008-211205 A 特開２００６−２２９０５４号公報JP 2006-229054 A 特表２００３−５２６２１２号公報Special table 2003-526212 gazette

特許文献１の方法では二段階で圧縮成型をするため、二種類の金型が必要となり、作業効率が悪い。特許文献２の方法では、圧縮成型用の封止樹脂は比較的粘度が高く硬化時間が短いため、蛍光体が沈降する前に硬化が終了して良好な蛍光体層が形成されないおそれがある。特許文献３の方法では蛍光体が定着剤に振りかけられるため、蛍光体が十分に固定されず、良好な蛍光体層を形成できないおそれがある。
そこで、本発明は、発光素子と、該発光素子の表面近傍に配置される蛍光材料及び前記発光素子を被覆する第１のシリコーン樹脂からなるレンズ部とを備える発光装置の製造方法において、成形のための金型が一種類で済む方法を提供することを目的の一つとする。また、当該発光装置の製造方法において、良好な蛍光体層を形成することを目的の一つとする。 In the method of Patent Document 1, since compression molding is performed in two stages, two types of molds are required, and work efficiency is poor. In the method of Patent Document 2, since the sealing resin for compression molding has a relatively high viscosity and a short curing time, there is a possibility that the curing is finished before the phosphor is settled and a good phosphor layer is not formed. In the method of Patent Document 3, since the phosphor is sprinkled on the fixing agent, the phosphor is not sufficiently fixed, and a good phosphor layer may not be formed.
Therefore, the present invention relates to a method of manufacturing a light emitting device including a light emitting element, a fluorescent material disposed in the vicinity of the surface of the light emitting element, and a lens portion made of a first silicone resin that covers the light emitting element. An object is to provide a method that requires only one type of mold. Another object of the method for manufacturing a light-emitting device is to form a favorable phosphor layer.

以上の目的を達成するため、本発明の第１の局面は次の構成からなる。即ち、
発光素子と、該発光素子の表面近傍に配置される蛍光材料及び前記発光素子を被覆する第１のシリコーン樹脂からなるレンズ部とを備える発光装置の製造方法であって、
前記発光素子の表面に未硬化の第２のシリコーン樹脂からなるプライマ層を形成するステップと、
前記プライマ層に前記蛍光材料を担持させるステップと、
前記プライマ層が未硬化の状態で、前記発光素子を金型にセットし、前記第１のシリコーン樹脂を圧縮成形して前記レンズ部を形成する際に、前記第１のシリコーン樹脂と前記第２のシリコーン樹脂をともに硬化するステップと、
を含む発光装置の製造方法である。 In order to achieve the above object, a first aspect of the present invention has the following configuration. That is,
A method for manufacturing a light emitting device comprising: a light emitting element; a fluorescent material disposed in the vicinity of the surface of the light emitting element; and a lens portion made of a first silicone resin that covers the light emitting element.
Forming a primer layer made of an uncured second silicone resin on the surface of the light emitting element;
Carrying the fluorescent material on the primer layer;
When the primer layer is uncured, the light emitting element is set in a mold, and the first silicone resin and the second silicone resin are formed when the first silicone resin is compression molded to form the lens portion. Curing the silicone resin together,
The manufacturing method of the light-emitting device containing this.

本発明の製造方法によれば、第２のシリコーン樹脂からなるプライマ層に蛍光材料を担持させた後、第１のシリコーン樹脂を圧縮成形して第１のシリコーン樹脂と前記第２のシリコーン樹脂を硬化させるため、金型が一種類で済む。そのため、作業効率が向上する。さらに、蛍光材料はプライマ層に担持され、第１のシリコーン樹脂がプライマ層を覆って圧縮成型されるため、当該蛍光材料はプライマ層に強固に保持され、蛍光体層が良好に形成される。また、第１のシリコーン樹脂と第２のシリコーン樹脂とが同種の材料であるため、互いになじみやすく、接着性が高い。これにより、硬化後に第１のシリコーン樹脂と第２のシリコーン樹脂との間に亀裂や剥離が生じることが防止される。   According to the manufacturing method of the present invention, after the fluorescent material is supported on the primer layer made of the second silicone resin, the first silicone resin and the second silicone resin are formed by compression molding the first silicone resin. Only one mold is required for curing. Therefore, work efficiency is improved. Furthermore, since the fluorescent material is carried on the primer layer and the first silicone resin is compression-molded over the primer layer, the fluorescent material is firmly held by the primer layer, and the phosphor layer is formed well. Further, since the first silicone resin and the second silicone resin are the same type of material, they are easily compatible with each other and have high adhesiveness. Thereby, it is prevented that a crack and peeling arise between 1st silicone resin and 2nd silicone resin after hardening.

図１は実施例の製造方法のフロー図である。FIG. 1 is a flowchart of the manufacturing method of the embodiment. 図２は実施例の製造方法を説明する図である。FIG. 2 is a diagram for explaining the manufacturing method of the embodiment. 図３は実施例の製造方法を説明する図である。FIG. 3 is a diagram for explaining the manufacturing method of the embodiment.

本発明の製造方法は、発光素子と、該発光素子の表面近傍に配置される蛍光材料及び前記発光素子を被覆する第１のシリコーン樹脂からなるレンズ部とを備える発光装置の製造方法であって、まず、発光素子の表面に未硬化の第２のシリコーン樹脂からなるプライマ層を形成する（第１のステップ）。プライマ層は、基板へ実装された発光素子をシリコーン樹脂溶液へ浸漬したり、シリコーン樹脂溶液を発光素子上へポッティングしたりして形成することができる。中でも基板へ実装された発光素子をシリコーン樹脂溶液へ浸漬してプライマ層を形成することが好ましい。発光素子の表面全域にプライマ層を薄く形成することができるからである。尚、プライマ層を形成する必要のない基板上の領域にマスク層を形成して、当該領域からプライマ層を除去してもよい。
未硬化状態において、プライマ層を形成する第２のシリコーン樹脂の粘度は、レンズ部を形成する第１のシリコーン樹脂よりも低いことが好ましい。プライマ層をより薄く形成することができるからである。プライマ層を発光素子の表面に薄く形成することにより、後述の蛍光材料を発光素子の一層近傍に配置することができ、発光色の色ムラの発生が低減される。プライマ層の層厚は、後述の蛍光材料が担持できる層厚であればよく、蛍光材料の大きさや形状を考慮して決定することができる。プライマ層の層厚は均一であってもよいし、プライマ層の一部の領域が他の領域よりも層厚が異なっていてもよい。プライマ層は発光素子の表面全域に設けることが好ましい。蛍光材料を発光素子の表面全域に付着することができるからである。なお、必要に応じて発光素子の表面において所定の領域にのみ設けることとしても良い。 The manufacturing method of the present invention is a method of manufacturing a light emitting device including a light emitting element, a fluorescent material disposed in the vicinity of the surface of the light emitting element, and a lens portion made of a first silicone resin that covers the light emitting element. First, a primer layer made of an uncured second silicone resin is formed on the surface of the light emitting element (first step). The primer layer can be formed by immersing a light emitting element mounted on a substrate in a silicone resin solution or potting a silicone resin solution on the light emitting element. In particular, it is preferable to form a primer layer by immersing a light-emitting element mounted on a substrate in a silicone resin solution. This is because the primer layer can be thinly formed over the entire surface of the light emitting element. Note that a mask layer may be formed in a region on the substrate where it is not necessary to form a primer layer, and the primer layer may be removed from the region.
In the uncured state, the viscosity of the second silicone resin forming the primer layer is preferably lower than that of the first silicone resin forming the lens portion. This is because the primer layer can be formed thinner. By forming the primer layer thinly on the surface of the light emitting element, a fluorescent material to be described later can be arranged in the vicinity of the light emitting element, and the occurrence of uneven color of the emitted color is reduced. The layer thickness of the primer layer may be any layer thickness that can carry a fluorescent material described later, and can be determined in consideration of the size and shape of the fluorescent material. The layer thickness of the primer layer may be uniform, or a part of the primer layer may have a different layer thickness than other regions. The primer layer is preferably provided over the entire surface of the light emitting element. This is because the fluorescent material can be attached to the entire surface of the light emitting element. In addition, it is good also as providing only in the predetermined area | region in the surface of a light emitting element as needed.

第１のステップの後、プライマ層に蛍光材料を担持させる（第２のステップ）。蛍光材料の種類は特に限定されず、発光素子の発光色を考慮して決定することができる。
蛍光材料の形状は粉状、顆粒状とすることができる。なお、発光色の色調調整のために、蛍光材料にシリカや酸化チタン等の粉末を混入させてもよい。蛍光材料は、例えば、未硬化の状態のプライマ層に振りかけたり、飛散させたりしてプライマ層に付着させて担持させることができる。 After the first step, the fluorescent material is supported on the primer layer (second step). The type of the fluorescent material is not particularly limited and can be determined in consideration of the emission color of the light emitting element.
The shape of the fluorescent material can be powdery or granular. In order to adjust the color tone of the luminescent color, powder such as silica or titanium oxide may be mixed into the fluorescent material. For example, the fluorescent material can be carried on the primer layer by being sprinkled or scattered on the uncured primer layer.

第２のシリコーン樹脂の替わりに、予め第２のシリコーン樹脂に蛍光材料を分散させた蛍光材料含有シリコーン樹脂を使用して、蛍光材料が担持されたプライマ層を形成してもよい。これにより、第１のステップと第２のステップを同時に行うことができる。   Instead of the second silicone resin, a fluorescent material-containing silicone resin in which the fluorescent material is dispersed in advance in the second silicone resin may be used to form a primer layer carrying the fluorescent material. Thereby, a 1st step and a 2nd step can be performed simultaneously.

第２のステップの後、プライマ層が未硬化の状態で、発光素子を金型にセットし、第１のシリコーン樹脂を圧縮成形してレンズ部を形成する際に、第１のシリコーン樹脂と第２のシリコーン樹脂をともに硬化する（第３のステップ）。金型は複数の発光素子を同時にセット可能なものであってもよい。圧縮成形の条件は、第１のシリコーン樹脂や第２のシリコーン樹脂の特性等を考慮して適宜決定できる。
以下本発明の実施例について、より詳細に説明する。 After the second step, when the light emitting element is set in a mold with the primer layer uncured and the first silicone resin is compression-molded to form the lens portion, The two silicone resins are cured together (third step). The mold may be capable of simultaneously setting a plurality of light emitting elements. The compression molding conditions can be appropriately determined in consideration of the characteristics of the first silicone resin and the second silicone resin.
Examples of the present invention will be described in detail below.

本発明の実施例である発光装置１の製造方法のフロー図を図１に示す。当該製造方法を説明する図を図２に示す。まず、図２Ａに示すように、発光素子１０が複数実装された基板２０を用意する（図２Ａでは発光素子１０が３個実装されている）。次に、未硬化の第２のシリコーン樹脂溶液３０を用意する。第２のシリコーン樹脂３０は付加反応硬化型のシリコーン樹脂である。そして、図２Ｂに示すように、発光素子１０を第２のシリコーン樹脂３０が貯留されたディップ漕３０aに浸漬する。その後、図２Ｃに示すように発光素子１０をディップ漕３０aから引き上げ、発光素子１０の表面に第２のシリコーン樹脂３０からなるプライマ層３１を形成する（図１におけるステップ１）。   FIG. 1 shows a flowchart of a method for manufacturing a light emitting device 1 that is an embodiment of the present invention. FIG. 2 is a diagram for explaining the manufacturing method. First, as shown in FIG. 2A, a substrate 20 on which a plurality of light emitting elements 10 are mounted is prepared (in FIG. 2A, three light emitting elements 10 are mounted). Next, an uncured second silicone resin solution 30 is prepared. The second silicone resin 30 is an addition reaction curable silicone resin. Then, as shown in FIG. 2B, the light emitting element 10 is immersed in a dip bowl 30a in which the second silicone resin 30 is stored. Thereafter, as shown in FIG. 2C, the light emitting element 10 is pulled up from the dip rod 30a, and a primer layer 31 made of the second silicone resin 30 is formed on the surface of the light emitting element 10 (step 1 in FIG. 1).

ステップ１の後、発光素子１０に粉末状の蛍光材料４０を振りかけて、図２Ｄに示すようにプライマ層３１に蛍光材料４０を担持させる（図１におけるステップ２）。蛍光材料４０はプライマ層３１の表面全域に略均一に担持されている。なお、未硬化の第２のシリコーン樹脂３０の粘度は後述の未硬化の第１のシリコーン樹脂３２の粘度よりも低ため、プライマ層３１は蛍光材料４０に対して高い接着性が有する。
その後、図２Ｅに示すように、プライマ層３１が未硬化の状態で、発光素子１０を備える基板２０を上側金型５０にセットする。上側金型５０は吸引口５２を備え、当該吸引口５２を介して基板２０が吸引されて上側金型５０の所定位置に固定される。一方、下側金型５１は発光素子２０に対向する位置に半球状の凹部５１ａを備える。凹部５１ａには未硬化の第１のシリコーン樹脂３２が充填されている。第１のシリコーン樹脂３２は付加反応硬化型のシリコーン樹脂である。なお、下側金型５１と未硬化の第１のシリコーン樹脂３２の間には第１のシリコーン樹脂３２の離型性を高めるためにリリースフィルム（図示せず）が配置されている。 After step 1, the powdery fluorescent material 40 is sprinkled on the light emitting element 10, and the fluorescent material 40 is supported on the primer layer 31 as shown in FIG. 2D (step 2 in FIG. 1). The fluorescent material 40 is supported substantially uniformly over the entire surface of the primer layer 31. In addition, since the viscosity of the uncured second silicone resin 30 is lower than the viscosity of the uncured first silicone resin 32 described later, the primer layer 31 has high adhesion to the fluorescent material 40.
Thereafter, as shown in FIG. 2E, the substrate 20 including the light emitting element 10 is set in the upper mold 50 with the primer layer 31 uncured. The upper mold 50 includes a suction port 52, and the substrate 20 is sucked through the suction port 52 and fixed to a predetermined position of the upper mold 50. On the other hand, the lower mold 51 includes a hemispherical recess 51 a at a position facing the light emitting element 20. The recess 51a is filled with the uncured first silicone resin 32. The first silicone resin 32 is an addition reaction curable silicone resin. Note that a release film (not shown) is disposed between the lower mold 51 and the uncured first silicone resin 32 in order to improve the releasability of the first silicone resin 32.

そして、図２Ｆに示すように、上側金型５０を下側金型５１側に押下し、吸引口５３から吸引して、第１のシリコーン樹脂３２を圧縮成形し、第１のシリコーン樹脂３２と第２のシリコーン樹脂３１をともに硬化する（図１のステップ３）。そして図２Ｇに示すように発光素子２０にレンズ部６０と蛍光体層６１が形成され、これを破線６２の位置でダイシングして、発光装置が形成される。   Then, as shown in FIG. 2F, the upper mold 50 is pressed toward the lower mold 51 and sucked from the suction port 53 to compress and mold the first silicone resin 32. The second silicone resin 31 is cured together (step 3 in FIG. 1). Then, as shown in FIG. 2G, the lens portion 60 and the phosphor layer 61 are formed on the light emitting element 20, and the light emitting device is formed by dicing them at the position of the broken line 62.

本実施例の製造方法によれば、第２のシリコーン樹脂３０からなるプライマ層３１に蛍光材料４０を担持させた後、第１のシリコーン樹脂３２を圧縮成形して第１のシリコーン樹脂３２と第２のシリコーン樹脂３０を硬化させるため、下側金型５１が一種類で済む。そのため、作業効率が向上する。また、コスト面でも有利となる。
第２のシリコーン樹脂３０には蛍光材料４０が担持されているため接着性が低下するおそれがあるが、第１のシリコーン樹脂３２と第２のシリコーン樹脂３０がともに同種の材料であるため、互いになじみやすく、高い接着性が得られる。これにより、硬化後に第１のシリコーン樹脂３２と第２のシリコーン樹脂３０との間に亀裂や剥離が生じることを防止できる。さらに、蛍光材料４０を担持するプライマ層３１は第１のシリコーン樹脂３２とともに圧縮成型されるため、当該蛍光材料４０はプライマ層３１に強固に保持される。これにより、発光素子２０の表面に蛍光体層６１が良好に形成される。また、プライマ層３１は低粘度の第２のシリコーン樹脂３０のディップ漕３０ａにディップして形成されるため、プライマ層３１は薄く形成される。発光素子２０の表面に薄く形成されたプライマ層３１に蛍光材料４０を担持させることにより、蛍光材料４０を発光素子２０の一層近傍に配置することができる。これにより、発光色の色ムラの発生が低減される。 According to the manufacturing method of the present embodiment, after the fluorescent material 40 is supported on the primer layer 31 made of the second silicone resin 30, the first silicone resin 32 is compression-molded to form the first silicone resin 32 and the first silicone resin 32. Since the second silicone resin 30 is cured, only one type of lower mold 51 is required. Therefore, work efficiency is improved. Further, it is advantageous in terms of cost.
Since the second silicone resin 30 carries the fluorescent material 40, there is a possibility that the adhesiveness may be lowered. However, since both the first silicone resin 32 and the second silicone resin 30 are the same type of material, Easy to adapt and high adhesion can be obtained. Thereby, it can prevent that a crack and peeling arise between the 1st silicone resin 32 and the 2nd silicone resin 30 after hardening. Furthermore, since the primer layer 31 that carries the fluorescent material 40 is compression-molded together with the first silicone resin 32, the fluorescent material 40 is firmly held by the primer layer 31. Thereby, the phosphor layer 61 is favorably formed on the surface of the light emitting element 20. Further, since the primer layer 31 is formed by dipping on the dip rod 30a of the second silicone resin 30 having a low viscosity, the primer layer 31 is formed thin. By supporting the fluorescent material 40 on the primer layer 31 thinly formed on the surface of the light emitting element 20, the fluorescent material 40 can be disposed in the vicinity of the light emitting element 20. As a result, the occurrence of uneven color of the emitted color is reduced.

この発明は、上記発明の実施の形態及び実施例の説明に何ら限定されるものではない。特許請求の範囲の記載を逸脱せず、当業者が容易に想到できる範囲で種々の変形態様もこの発明に含まれる。   The present invention is not limited to the description of the embodiments and examples of the invention described above. Various modifications may be included in the present invention as long as those skilled in the art can easily conceive without departing from the description of the scope of claims.

１０ 発光素子
２０ 基板
３０ 第２のシリコーン樹脂
３０ａ ディップ漕
３１ プライマ層
３２ 第１のシリコーン樹脂
４０ 蛍光材料
５０ 上側金型
５１ 下側金型
６０ レンズ部
６１ 蛍光体層 DESCRIPTION OF SYMBOLS 10 Light emitting element 20 Substrate 30 2nd silicone resin 30a Dip pad 31 Primer layer 32 1st silicone resin 40 Fluorescent material 50 Upper mold 51 Lower mold 60 Lens part 61 Phosphor layer

Claims (1)

発光素子と、該発光素子の表面近傍に配置される蛍光材料及び前記発光素子を被覆する第１のシリコーン樹脂からなるレンズ部とを備える発光装置の製造方法であって、
基板に実装された前記発光素子を貯留された第２のシリコーン樹脂の溶液に浸漬することにより、前記発光素子の表面全域に未硬化の前記第２のシリコーン樹脂からなるプライマ層を形成する第１のステップと、
粉状または顆粒状の前記蛍光材料を、前記プライマ層の表面に付着させることにより、前記プライマ層に前記蛍光材料を担持させる第２のステップと、
前記プライマ層が未硬化の状態で、前記発光素子を金型にセットし、前記第１のシリコーン樹脂を圧縮成形して前記レンズ部を形成する際に、前記第１のシリコーン樹脂と前記第２のシリコーン樹脂をともに硬化する第３のステップと、を含み、
前記第２のシリコーン樹脂は前記第１のシリコーン樹脂よりも、未硬化の状態における粘度が低い、発光装置の製造方法。 A method for manufacturing a light emitting device comprising: a light emitting element; a fluorescent material disposed in the vicinity of the surface of the light emitting element; and a lens portion made of a first silicone resin that covers the light emitting element.
A primer layer made of the uncured second silicone resin is formed on the entire surface of the light emitting element by immersing the light emitting element mounted on the substrate in a stored solution of the second silicone resin. And the steps
A second step of supporting the fluorescent material on the primer layer by attaching the fluorescent material in powder or granular form to the surface of the primer layer;
When the primer layer is uncured, the light emitting element is set in a mold, and the first silicone resin and the second silicone resin are formed when the first silicone resin is compression molded to form the lens portion. look free the third step of both cure the silicone resin, a
The method for manufacturing a light-emitting device, wherein the second silicone resin has a lower viscosity in an uncured state than the first silicone resin .
JP2009217721A 2009-09-18 2009-09-18 Method for manufacturing light emitting device Expired - Fee Related JP5359732B2 (en)

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