JP5349944B2 - 基板処理装置の液飛散防止カップ、基板処理装置、及びその運転方法 - Google Patents
基板処理装置の液飛散防止カップ、基板処理装置、及びその運転方法 Download PDFInfo
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- JP5349944B2 JP5349944B2 JP2008327331A JP2008327331A JP5349944B2 JP 5349944 B2 JP5349944 B2 JP 5349944B2 JP 2008327331 A JP2008327331 A JP 2008327331A JP 2008327331 A JP2008327331 A JP 2008327331A JP 5349944 B2 JP5349944 B2 JP 5349944B2
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- 238000005520 cutting process Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
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- 239000004925 Acrylic resin Substances 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
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- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004826 Synthetic adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/025—Prevention of fouling with liquids by means of devices for containing or collecting said liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Description
11 液飛散防止カップ本体
12 親水性材層
13 シート材
14 接着剤
15 接着剤
16 液飛散防止シート
17 継ぎ目
20 基板洗浄装置
21 洗浄槽
22 基板回転機構
23 回転軸
24 スピンホイール
25 揺動アーム
26 気体供給ノズル
27 水供給ノズル
28 基板上面リンスノズル
29 揺動軸
30 シャッター
31 基板下面リンスノズル
32 ブラケット
33 ノズル装着台
34 カップリンスノズル
35 配管
36 カバーリンスノズル
41 シート保持治具
42 クリップ
43 ネジ
44 ナット
45 ボルト
Claims (8)
- 基板を保持し回転させる基板回転機構、該基板回転機構に保持された基板の外周を囲むように配置され、該回転する基板から離脱する液滴の飛散を防止する液飛散防止カップを備えた基板処理装置の液飛散防止カップであって、
前記液飛散防止カップは、筒状の液飛散防止カップ本体を具備し、該液飛散防止カップ本体の内周面全面又は該内周面の所定部分の表面に親水性材層を設けた液飛散防止シートを該親水性材層がカップの内側を向くように装着手段で装着した構成であり、
前記液飛散防止シートは、弾性を有する弾性シートの表面に親水性材を貼り付けて親水性材層を設け、該液飛散防止シートをその反親水性材層側の面が前記液飛散防止カップ本体の内周面に密着する形状に型抜きした構成であり、
前記装着手段は、前記型抜きした液飛散防止シートを弾性変形させて丸めて前記液飛散防止カップ本体内に収容し、前記弾性シートの弾性復元力で前記液飛散防止カップ本体の内周面に前記弾性シートの前記親水性材層の反対側面を密着させて装着する手段であることを特徴とする基板処理装置の液飛散防止カップ。 - 請求項1に記載の基板処理装置の液飛散防止カップにおいて、
前記液飛散防止カップ本体の内周面の前記液飛散防止シートの継ぎ目は、該液飛散防止カップ本体の鉛直方向に対して上方から下方に向けて前記基板回転機構の回転方向に傾斜していることを特徴とする基板処理装置の液飛散防止カップ。 - 基板を保持し回転させる基板回転機構、該基板回転機構に保持された基板の外周を囲むように配置され、該回転する基板から離脱する液滴の飛散を防止する液飛散防止カップを備えた基板処理装置であって、
前記液飛散防止カップに、請求項1又は2に記載の液飛散防止カップを用い、
前記液飛散防止カップの前記液飛散防止シートの親水性材層にリンス液を供給し、該親水性材層を湿潤状態に維持する湿潤手段を設けたことを特徴とする基板処理装置。 - 請求項3に記載の基板処理装置において、
前記湿潤手段は、複数個のリンス液噴射ノズルを備え、該複数個のリンス液噴射ノズルを前記親水性材層の内周面に均等にリンス液が供給されるように配置したことを特徴とする基板処理装置。 - 請求項4に記載の基板処理装置において、
前記複数個のリンス液噴射ノズルは、前記液飛散防止カップに取り付けられていることを特徴とする基板処理装置。 - 請求項3乃至5のいずれか1項に記載の基板処理装置において、
前記リンス液噴射ノズルは噴射するリンス液の噴射角度を調整して、前記親水性材層に当るリンス液の位置を調整できる噴射角度調整手段を設けたことを特徴とする基板処理装置。 - 基板を保持し回転させる基板回転機構、該基板回転機構に保持された基板の外周を囲むように配置され、該回転する基板から離脱する液滴の飛散を防止する液飛散防止カップに請求項1又は2に記載の液飛散防止カップを備えた基板処理装置の運転方法であって、
基板装置のアイドリング時にリンス液供給手段からリンス液を供給して前記液飛散防止カップの内周面に設けた前記親水性材層を湿潤状態に維持することを特徴とする基板処理装置の運転方法。 - 請求項7に記載の基板処理装置の運転方法において、
前記リンス液供給手段はリンス液噴射ノズルを備え、前記基板処理装置のアイドリング時に、前記リンス液噴射ノズルから前記親水性材層にリンス液を噴射して該親水性材層を湿潤状態に維持することを特徴とする基板処理装置の運転方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008327331A JP5349944B2 (ja) | 2008-12-24 | 2008-12-24 | 基板処理装置の液飛散防止カップ、基板処理装置、及びその運転方法 |
US12/654,437 US20100154837A1 (en) | 2008-12-24 | 2009-12-18 | Liquid-scattering prevention cup, substrate processing apparatus and method for operating the apparatus |
TW098144111A TW201034104A (en) | 2008-12-24 | 2009-12-22 | Liquid-scattering prevention cup, substrate processing apparatus and method for operating the apparatus |
KR1020090128589A KR20100075393A (ko) | 2008-12-24 | 2009-12-22 | 액체비산방지컵, 기판처리장치 및 상기 장치의 운전방법 |
CN200911000252A CN101834116A (zh) | 2008-12-24 | 2009-12-24 | 液体散射防止杯、基底处理设备及设备的操作方法 |
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JP2008327331A JP5349944B2 (ja) | 2008-12-24 | 2008-12-24 | 基板処理装置の液飛散防止カップ、基板処理装置、及びその運転方法 |
Publications (2)
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JP2010149003A JP2010149003A (ja) | 2010-07-08 |
JP5349944B2 true JP5349944B2 (ja) | 2013-11-20 |
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Country Status (5)
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US (1) | US20100154837A1 (ja) |
JP (1) | JP5349944B2 (ja) |
KR (1) | KR20100075393A (ja) |
CN (1) | CN101834116A (ja) |
TW (1) | TW201034104A (ja) |
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JP4983885B2 (ja) * | 2009-10-16 | 2012-07-25 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及び記憶媒体 |
JP5645796B2 (ja) | 2011-11-21 | 2014-12-24 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法 |
JP5923357B2 (ja) * | 2012-03-23 | 2016-05-24 | 株式会社ディスコ | 保護膜塗布装置 |
KR101318510B1 (ko) * | 2012-06-29 | 2013-10-16 | 주식회사 케이씨텍 | 화학 기계식 연마 시스템에 사용되는 기판 세정 장치 |
US10043653B2 (en) * | 2012-08-27 | 2018-08-07 | Taiwan Semiconductor Manufacturing Company | Maranagoni dry with low spin speed for charging release |
JP6064875B2 (ja) * | 2013-11-25 | 2017-01-25 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及び記憶媒体 |
KR101874402B1 (ko) * | 2016-04-12 | 2018-07-05 | 주식회사 지엔테크 | 디스플레이용 글래스 오염 방지막 및 이를 포함한 디스플레이용 글래스 마감장치 |
JP6713893B2 (ja) | 2016-09-26 | 2020-06-24 | 株式会社Screenホールディングス | 基板処理装置 |
KR102098108B1 (ko) * | 2018-11-02 | 2020-04-07 | 김규원 | 스핀코터 시스템 |
JP6773167B1 (ja) * | 2019-04-16 | 2020-10-21 | ダイキン工業株式会社 | ウェハーカップ |
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JPH0354764U (ja) * | 1989-09-20 | 1991-05-27 | ||
JPH10258249A (ja) * | 1997-03-19 | 1998-09-29 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置 |
JPH11297652A (ja) * | 1998-04-14 | 1999-10-29 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2003100687A (ja) * | 2001-09-21 | 2003-04-04 | Ebara Corp | 基板処理装置及びその洗浄方法 |
US7311781B2 (en) * | 2004-11-17 | 2007-12-25 | Dainippon Screen Mgf, Co., Ltd | Substrate rotation type treatment apparatus |
JP2007149892A (ja) * | 2005-11-25 | 2007-06-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
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JP4823036B2 (ja) * | 2006-09-15 | 2011-11-24 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4983565B2 (ja) * | 2006-12-20 | 2012-07-25 | 東京エレクトロン株式会社 | 基板洗浄装置、基板洗浄方法及び記憶媒体 |
US20100092768A1 (en) * | 2008-10-13 | 2010-04-15 | Tesa Ag | Pressure-sensitive adhesive tape with functionalized adhesive and use thereof |
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2008
- 2008-12-24 JP JP2008327331A patent/JP5349944B2/ja not_active Expired - Fee Related
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2009
- 2009-12-18 US US12/654,437 patent/US20100154837A1/en not_active Abandoned
- 2009-12-22 TW TW098144111A patent/TW201034104A/zh unknown
- 2009-12-22 KR KR1020090128589A patent/KR20100075393A/ko not_active Application Discontinuation
- 2009-12-24 CN CN200911000252A patent/CN101834116A/zh active Pending
Also Published As
Publication number | Publication date |
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KR20100075393A (ko) | 2010-07-02 |
CN101834116A (zh) | 2010-09-15 |
US20100154837A1 (en) | 2010-06-24 |
JP2010149003A (ja) | 2010-07-08 |
TW201034104A (en) | 2010-09-16 |
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