JP5343283B2 - 複合材料、特には多層材料及び接着又は接合材料 - Google Patents
複合材料、特には多層材料及び接着又は接合材料 Download PDFInfo
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Description
銅箔の酸化によるムラのない酸化銅層の形成
銅箔のセラミック層上への配置
約1025〜1083℃、例えば約1071℃の処理温度までの複合体の加熱
室温までの冷却
Rth(oK/W)−(T1−T2)/Wでの加熱装置5の出力。従って、熱伝導率は1/Rthとなる。
位置A:接合層4によって接合されていない積層した銅板9、10を備えた試験片
位置B−E:それぞれ接合層4で接合された銅板9、10を備えた試験片。但し
位置B:更なる熱処理をしない場合
位置C:温度120℃で2.8日間に亘って試験片8を処理した場合
位置D:温度120℃で6日間に亘って試験片8を処理した場合
位置E:温度160℃で1日間に亘って試験片8を処理した場合
位置B:温度150℃で3日間に亘って試験片8を処理した場合
位置D:試験片8を更に処理しない場合
である。
2 基板
2.1 金属支持膜
2.2 絶縁層
3 金属皮膜
4 接着又は接合層
5 加熱板
6,7 測定板
8 試験片
9,10 銅板
11.12 熱伝導性化合物からなる層
Claims (17)
- 複合材料からなる、電気回路もしくはモジュール用プリント基板であって;該材料は、その隣接する表面上に熱伝達のために設けられた接着接合によって互いに接合された少なくとも2つの構成部材(2、3)から成り;構成部材の一つは、少なくとも別の構成部材と接合される面がセラミックからなる絶縁材料で形成された、層状の担持体基板(2)であり;別の構成部材は、金属皮膜(3)であり;基板(2)は、金属支持層(2.1)と基板(2)の表面上の絶縁層(2.2)からなる、多層型に設計され;金属皮膜(3)は条導体もしくは接続面を形成するようパターン形成され;基板(2)の両面に金属皮膜(3)が接合層(4)によって接合され;接着接合が接着剤としての使用に適した合成マトリクス中にナノ繊維材料を含有している接合層(4)によって形成されていることを特徴とする、基板。
- 接合層(4)がエポキシベースのマトリクスから形成されていることを特徴とする、請求項1に記載の基板。
- ナノ繊維材料又は前記材料を形成しているナノ繊維又はナノチューブが互いに隣接している表面に直交する軸方向に配向されていることを特徴とする、請求項1又は2に記載の基板。
- ナノ繊維材料又は前記材料を形成しているナノ繊維又はナノチューブが配列又は配向のための外部磁場により強磁性であることを特徴とする、請求項3に記載の基板。
- ナノ繊維材料又は前記材料を形成しているナノ粒子を有するナノ繊維及び/又はナノチューブが強磁性材料でコーティングされて強磁性であることを特徴とする、請求項4に記載の基板。
- 強磁性材料がFe2O3であることを特徴とする、請求項5に記載の基板。
- マトリクス成分がポリエステルであることを特徴とする、請求項1から6のいずれか1つに記載の基板。
- マトリクスが総重量に対してナノ繊維材料を5〜30重量%含有することを特徴とする、請求項1から7のいずれか1つに記載の基板。
- 炭素ナノ繊維をナノ繊維として使用することを特徴とする、請求項1から8のいずれか1つに記載の基板。
- ナノ繊維材料をマトリクスへの混合に先立って前処理において3000℃で加熱することを特徴とする、請求項1から9のいずれか1つに記載の基板。
- ナノ繊維材料がマトリクス内に溶剤を用いて混合されることを特徴とする、請求項1から10のいずれか1つに記載の基板。
- 金属皮膜(3)が銅板又は銅箔から形成されていることを特徴とする、請求項1から11のいずれか1つに記載の基板。
- 基板層(2)が、酸化アルミニウム、窒化アルミニウム及び/又は窒化ケイ素セラミックから形成された基板であることを特徴とする、請求項9又は10に記載の基板。
- ナノ繊維材料が少なくともその表面において化学的に前処理されていることを特徴とする、請求項1から13のいずれか1つに記載の基板。
- 少なくとも1つの接合層(4)が硬化後に圧縮されることを特徴とする、請求項1から14のいずれか1つに記載の基板。
- 少なくとも1つの接合層(4)が硬化後に方圧プレス又は真空内での処理によって圧縮されることを特徴とする、請求項15に記載の基板。
- ナノ繊維材料が1〜100μの長さを有していることを特徴とする、請求項1から18のいずれか1つに記載の基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102005062181.3 | 2005-12-23 | ||
DE200510062181 DE102005062181A1 (de) | 2005-12-23 | 2005-12-23 | Verbundmaterial |
PCT/IB2006/003030 WO2007072126A1 (de) | 2005-12-23 | 2006-08-10 | Verbundmaterial, insbesondere mehrschichtmaterial sowie kleber- oder bondmaterial |
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JP2009520612A JP2009520612A (ja) | 2009-05-28 |
JP5343283B2 true JP5343283B2 (ja) | 2013-11-13 |
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JP2008546659A Expired - Fee Related JP5343283B2 (ja) | 2005-12-23 | 2006-08-10 | 複合材料、特には多層材料及び接着又は接合材料 |
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US (2) | US8119220B2 (ja) |
EP (1) | EP1963455A1 (ja) |
JP (1) | JP5343283B2 (ja) |
CN (1) | CN101341225B (ja) |
DE (2) | DE102005062181A1 (ja) |
WO (1) | WO2007072126A1 (ja) |
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DE102006037185A1 (de) * | 2005-09-27 | 2007-03-29 | Electrovac Ag | Verfahren zur Behandlung von Nanofasermaterial sowie Zusammensetzung aus Nanofasermaterial |
DE102007039901A1 (de) * | 2007-08-23 | 2008-10-16 | Siemens Ag | Thermisches und elektrisches Kontaktmaterial mit mindestens zwei Materialbestandteilen und Verwendung des Kontaktmaterials |
DE102007062458B4 (de) | 2007-12-22 | 2011-05-19 | Schaal Engineering Gmbh | Antriebseinrichtung für eine Presse |
DE102009041574A1 (de) * | 2008-10-29 | 2010-05-12 | Electrovac Ag | Verbundmaterial, Verfahren zum Herstellen eines Verbundmaterials sowie Kleber oder Bondmaterial |
SG173778A1 (en) * | 2009-02-20 | 2011-09-29 | Ngk Insulators Ltd | Ceramic-metal bonded body and method of producing the same |
US9469790B2 (en) * | 2009-09-29 | 2016-10-18 | The Boeing Company | Adhesive compositions comprising electrically insulating-coated carbon-based particles and methods for their use and preparation |
DE102010002447A1 (de) | 2010-02-26 | 2011-09-01 | Tutech Innovation Gmbh | Klebstoff mit anisotroper elektrischer Leitfähigkeit sowie Verfahren zu dessen Herstellung und Verwendung |
US9696122B2 (en) | 2011-06-30 | 2017-07-04 | Imi Systems Ltd. | Antiballistic article and method of producing same |
CN102501548A (zh) * | 2011-10-25 | 2012-06-20 | 华南理工大学 | 一种高韧性抗冲击陶瓷基层状复合材料及其制备方法 |
DE102012102611B4 (de) * | 2012-02-15 | 2017-07-27 | Rogers Germany Gmbh | Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates |
CN203474703U (zh) * | 2012-04-13 | 2014-03-12 | 普罗旺斯科技(深圳)有限公司 | 一种散热涂层及散热片 |
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CN106068559A (zh) * | 2014-03-07 | 2016-11-02 | 三菱电机株式会社 | 绝缘基板及半导体装置 |
TWI653312B (zh) * | 2014-03-11 | 2019-03-11 | 日商味之素股份有限公司 | 接著薄膜 |
DE102015107223B4 (de) | 2015-05-08 | 2020-10-08 | Rogers Germany Gmbh | Verbundmaterial und Verfahren zu seiner Herstellung |
DE102015116901A1 (de) | 2015-10-05 | 2017-04-06 | Technische Universität Darmstadt | Verfahren zur Herstellung einer Isolatorplatte, Isolatorplatte und elektrochemische Messvorrichtung |
DE102017216878A1 (de) * | 2017-09-25 | 2019-03-28 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Klebstoffs und einer Klebung, insbesondere in Form einer Kleberschicht innerhalb einer Batteriezelle |
US20190116657A1 (en) * | 2017-10-18 | 2019-04-18 | Stryke Industries, LLC | Thermally enhanced printed circuit board architecture for high power electronics |
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JP2647589B2 (ja) * | 1992-01-27 | 1997-08-27 | 矢崎総業株式会社 | 電磁波遮蔽用複合シート |
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JP2001279215A (ja) | 2000-03-24 | 2001-10-10 | Three M Innovative Properties Co | 異方導電性接着剤組成物およびそれから形成された異方導電性接着フィルム |
JP2002146672A (ja) | 2000-11-06 | 2002-05-22 | Polymatech Co Ltd | 熱伝導性充填剤及び熱伝導性接着剤並びに半導体装置 |
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TWI323901B (en) * | 2004-11-26 | 2010-04-21 | Hon Hai Prec Ind Co Ltd | Anisotropic conductive material |
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2005
- 2005-12-23 DE DE200510062181 patent/DE102005062181A1/de not_active Withdrawn
- 2005-12-23 DE DE200510063403 patent/DE102005063403A1/de not_active Ceased
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2006
- 2006-08-10 CN CN200680048334XA patent/CN101341225B/zh not_active Expired - Fee Related
- 2006-08-10 US US12/086,983 patent/US8119220B2/en not_active Expired - Fee Related
- 2006-08-10 WO PCT/IB2006/003030 patent/WO2007072126A1/de active Application Filing
- 2006-08-10 EP EP06820829A patent/EP1963455A1/de not_active Withdrawn
- 2006-08-10 JP JP2008546659A patent/JP5343283B2/ja not_active Expired - Fee Related
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US8119220B2 (en) | 2012-02-21 |
US20120031653A1 (en) | 2012-02-09 |
CN101341225A (zh) | 2009-01-07 |
DE102005062181A1 (de) | 2007-07-05 |
US8304054B2 (en) | 2012-11-06 |
DE102005063403A1 (de) | 2007-09-06 |
US20100227114A1 (en) | 2010-09-09 |
EP1963455A1 (de) | 2008-09-03 |
JP2009520612A (ja) | 2009-05-28 |
CN101341225B (zh) | 2013-05-15 |
WO2007072126A1 (de) | 2007-06-28 |
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