JP5338028B2 - エポキシ樹脂組成物及び半導体装置 - Google Patents
エポキシ樹脂組成物及び半導体装置 Download PDFInfo
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Description
また、生産性向上への取り組みとしては、離型効果の高い離型剤の適用が提案されている(例えば、特許文献4参照。)。しかしながら、離型効果の高い離型剤は必然的に成形品の表面に浮き出しやすく、連続生産すると成形品の外観を著しく汚してしまう欠点があった。成形品外観に優れるエポキシ樹脂組成物として特定の構造を有するシリコーン化合物を添加する手法等が提案されている(例えば、特許文献5、6参照。)。しかしながら、該エポキシ樹脂組成物は、離型性が不十分なので、連続成形においてエアベント部分で樹脂がとられ、金型への樹脂の未充填等の成形不具合を生じさせる等、生産性の低下を引き起こす問題があった。以上より、半田耐熱性、離型性、連続成形性、成形品外観、金型汚れ全ての課題に対応した半導体封止用エポキシ樹脂組成物が要求されている。
[1](A)エポキシ樹脂、(B)フェノール樹脂、(C)(C−1)カルボキシル基を有するオルガノポリシロキサン及び/又は(C−2)カルボキシル基を有するオルガノポリシロキサンとエポキシ樹脂との反応生成物、並びに(D)グリセリントリ脂肪酸エステルを必須成分とすることを特徴とする半導体封止用エポキシ樹脂組成物であって、前記(A)エポキシ樹脂がフェノールアラルキル型エポキシ樹脂であり、前記(B)フェノール樹脂がフェノールアラルキル樹脂であり、前記(D)グリセリントリ脂肪酸エステルが、全エポキシ樹脂組成物中に0.02〜0.80重量%含有し、前記(C)におけるカルボキシル基を有するオルガノポリシロキサンが一般式(1)で表されるオルガノポリシロキサンである半導体封止用エポキシ樹脂組成物、
である。
102 ダイパッド
103 金線
104 リードフレーム
105 封止樹脂
106 ダイボンド材硬化体
以下、本発明について詳細に説明する。
本発明の(C)成分に用いるカルボキシル基を有するオルガノポリシロキサンは、1分子中に1個以上のカルボキシル基を有するオルガノポリシロキサンであり、グリセリントリ脂肪酸エステルと併用する必要がある。カルボキシル基を有するオルガノポリシロキサンを単独で使用した場合、離型性が不十分となり、連続成形性が低下する。グリセリントリ脂肪酸エステルを単独使用した場合は成形品の外観が悪い。カルボキシル基を有するオルガノポリシロキサンとグリセリントリ脂肪酸エステルと併用することにより、グリセリントリ脂肪酸エステルを相溶化させることができ、成形品の外観と離型性を両立でき、連続成形が良好になる。本発明の(C)成分とグリセリントリ脂肪酸エステル(D)との併合配合割合(C)/(D)は、重量比で3/1〜1/5が望ましく、この範囲が最も効果が高い。
また、本発明に用いられるカルボキシル基を有するオルガノポリシロキサンを添加する効果を損なわない範囲で、他のオルガノポリシロキサンを併用することができる。
また、グリセリントリ脂肪酸エステルの配合量としては、全エポキシ樹脂組成物中に0.02〜1重量%が好ましい。下限を下回ると十分な離型性が得られず、上限を超えると成形品の外観汚れや密着性の低下を引き起こす恐れがある。
本発明に用いる硬化促進剤としては、エポキシ基とフェノール性水酸基との硬化反応を促進させるものであればよく、一般に封止材料に使用するものを用いることができる。例えば、1,8−ジアザビシクロ(5,4,0)ウンデセン−7等のジアザビシクロアルケン及びその誘導体、トリフェニルホスフィン、メチルジフェニルホスフィン等の有機ホスフィン類、2−メチルイミダゾール等のイミダゾール化合物、テトラフェニルホスホニウム・テトラフェニルボレート等のテトラ置換ホスホニウム・テトラ置換ボレート等が挙げられ、これらは単独でも混合して用いても差し支えない。硬化促進剤の配合量としては、全エポキシ樹脂組成物中に0.05〜0.8重量%が好ましい。
<実施例1>
E−1:式(2)で表されるエポキシ樹脂(日本化薬(株)製、NC3000P、軟化点58℃、エポキシ当量274);8.13重量部
1,8−ジアザビシクロ(5,4,0)ウンデセン−7(以下、DBUという);0.20重量部
溶融球状シリカ(平均粒径21μm);85.00重量部
カップリング剤(γ−グリシドキシプロピルトリメトキシシラン);0.40重量部
カーボンブラック;0.40重量部
を混合し、熱ロールを用いて、95℃で8分間混練して冷却後粉砕し、エポキシ樹脂組成物を得た。得られたエポキシ樹脂組成物を、以下の方法で評価した。結果を表1に示す。
(1)スパイラルフロー:低圧トランスファー成形機を用いて、EMMI−1−66に準じたスパイラルフロー測定用金型に、金型温度175℃、注入圧力6.9MPa、硬化時間120秒の条件でエポキシ樹脂組成物を注入し、流動長を測定した。単位はcm。判定基準は70cm未満を不合格(×)、70cm以上を合格(○)とした。
表1、表2の配合に従い、実施例1と同様にしてエポキシ樹脂組成物を得て、実施例1と同様にして評価した。結果を表1、表2に示す。
E−2:ビフェニル型エポキシ樹脂(ジャパンエポキシレジン(株)製、YX−4000、エポキシ当量190g/eq、融点105℃)
E−3:オルソクレゾールノボラック型エポキシ樹脂(日本化薬(株)製、EOCN−1020 62、エポキシ当量200g/eq、軟化点62℃)
H−2:パラキシリレン変性ノボラック型フェノール樹脂(三井化学(株)製、XLC−4L、水酸基当量168g/eq、軟化点62℃)
グリセリントリモンタン酸エステル
グリセリンジモンタン酸エステル
カルナバワックス
Claims (6)
- (A)エポキシ樹脂、(B)フェノール樹脂、(C)(C−1)カルボキシル基を有するオルガノポリシロキサン及び/又は(C−2)カルボキシル基を有するオルガノポリシロキサンとエポキシ樹脂との反応生成物、並びに(D)グリセリントリ脂肪酸エステルを含有する、半導体封止用エポキシ樹脂組成物であって、前記(A)エポキシ樹脂がフェノールアラルキル型エポキシ樹脂であり、前記(B)フェノール樹脂がフェノールアラルキル樹脂であり、前記(D)グリセリントリ脂肪酸エステルが、全エポキシ樹脂組成物中に0.02〜0.80重量%含有し、前記(C)におけるカルボキシル基を有するオルガノポリシロキサンが一般式(1)で表されるオルガノポリシロキサンである半導体封止用エポキシ樹脂組成物。
- 前記(D)グリセリントリ脂肪酸エステルがグリセリンと炭素数24〜36の飽和脂肪酸とのトリエステルである請求項1に記載の半導体封止用エポキシ樹脂組成物。
- 前記(C)成分と前記(D)成分との重量比(C)/(D)が3/1〜1/5である請求項1又は2に記載の半導体封止用エポキシ樹脂組成物。
- 請求項1乃至5のいずれかに記載の半導体封止用エポキシ樹脂組成物を用いて半導体素子を封止してなることを特徴とする半導体装置。
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CN (1) | CN100519619C (ja) |
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JP4590899B2 (ja) * | 2004-03-30 | 2010-12-01 | 住友ベークライト株式会社 | 金型離型回復樹脂組成物及び半導体装置の製造方法 |
JP4765310B2 (ja) * | 2004-12-24 | 2011-09-07 | 住友ベークライト株式会社 | 樹脂封止型半導体装置の製造方法 |
JP4973146B2 (ja) * | 2006-11-20 | 2012-07-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物、封止用エポキシ樹脂組成物及び電子部品装置 |
JP5024073B2 (ja) * | 2007-02-16 | 2012-09-12 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP4930145B2 (ja) * | 2007-03-28 | 2012-05-16 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP5157473B2 (ja) * | 2007-03-28 | 2013-03-06 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP4973322B2 (ja) * | 2007-06-04 | 2012-07-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP5169285B2 (ja) * | 2007-08-22 | 2013-03-27 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP5169287B2 (ja) * | 2007-09-21 | 2013-03-27 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP5169288B2 (ja) * | 2007-09-21 | 2013-03-27 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
KR101309820B1 (ko) * | 2010-12-29 | 2013-09-23 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
US10030141B2 (en) * | 2012-10-19 | 2018-07-24 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board |
SG11201502925UA (en) * | 2012-10-19 | 2015-06-29 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, laminate and printed-wiring board |
US10163765B2 (en) | 2016-04-19 | 2018-12-25 | Kabushiki Kaisha Toshiba | Semiconductor device that includes a molecular bonding layer for bonding of elements |
KR102112865B1 (ko) * | 2017-11-06 | 2020-05-19 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5869244A (ja) * | 1981-10-21 | 1983-04-25 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
JPH01319529A (ja) * | 1988-06-20 | 1989-12-25 | Denki Kagaku Kogyo Kk | エポキシ樹脂組成物 |
JPH04108851A (ja) * | 1990-08-29 | 1992-04-09 | Toray Dow Corning Silicone Co Ltd | 硬化性エポキシ樹脂組成物 |
JPH0669379A (ja) * | 1991-05-13 | 1994-03-11 | Nitto Denko Corp | 半導体装置 |
JP2000044774A (ja) * | 1998-07-28 | 2000-02-15 | Toray Ind Inc | 半導体封止用エポキシ樹脂組成物および半導体装置 |
JP2000103938A (ja) * | 1998-09-25 | 2000-04-11 | Matsushita Electric Works Ltd | 封止用のエポキシ樹脂組成物および半導体装置 |
JP2002212393A (ja) * | 2001-01-17 | 2002-07-31 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2002220434A (ja) * | 2001-01-26 | 2002-08-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2003105057A (ja) * | 2001-09-28 | 2003-04-09 | Toray Ind Inc | エポキシ樹脂組成物及び半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3012358B2 (ja) * | 1991-04-30 | 2000-02-21 | 東レ・ダウコーニング・シリコーン株式会社 | 加熱硬化性エポキシ樹脂組成物 |
US6610406B2 (en) * | 2000-03-23 | 2003-08-26 | Henkel Locktite Corporation | Flame retardant molding compositions |
JP4411760B2 (ja) * | 2000-09-06 | 2010-02-10 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP2003252960A (ja) * | 2002-03-05 | 2003-09-10 | Toray Ind Inc | エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置 |
-
2005
- 2005-03-14 MY MYPI20051065A patent/MY159179A/en unknown
- 2005-03-14 TW TW94107659A patent/TWI398461B/zh not_active IP Right Cessation
- 2005-03-15 JP JP2006511039A patent/JP5338028B2/ja active Active
- 2005-03-15 WO PCT/JP2005/004555 patent/WO2005087834A1/ja active Application Filing
- 2005-03-15 SG SG2012066528A patent/SG184731A1/en unknown
- 2005-03-15 KR KR1020067019468A patent/KR101149453B1/ko active IP Right Grant
- 2005-03-15 SG SG200901749-2A patent/SG151268A1/en unknown
- 2005-03-15 CN CNB2005800084595A patent/CN100519619C/zh active Active
- 2005-03-15 US US10/592,643 patent/US20070196664A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5869244A (ja) * | 1981-10-21 | 1983-04-25 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
JPH01319529A (ja) * | 1988-06-20 | 1989-12-25 | Denki Kagaku Kogyo Kk | エポキシ樹脂組成物 |
JPH04108851A (ja) * | 1990-08-29 | 1992-04-09 | Toray Dow Corning Silicone Co Ltd | 硬化性エポキシ樹脂組成物 |
JPH0669379A (ja) * | 1991-05-13 | 1994-03-11 | Nitto Denko Corp | 半導体装置 |
JP2000044774A (ja) * | 1998-07-28 | 2000-02-15 | Toray Ind Inc | 半導体封止用エポキシ樹脂組成物および半導体装置 |
JP2000103938A (ja) * | 1998-09-25 | 2000-04-11 | Matsushita Electric Works Ltd | 封止用のエポキシ樹脂組成物および半導体装置 |
JP2002212393A (ja) * | 2001-01-17 | 2002-07-31 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2002220434A (ja) * | 2001-01-26 | 2002-08-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2003105057A (ja) * | 2001-09-28 | 2003-04-09 | Toray Ind Inc | エポキシ樹脂組成物及び半導体装置 |
Also Published As
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SG184731A1 (en) | 2012-10-30 |
KR20070012655A (ko) | 2007-01-26 |
CN1934156A (zh) | 2007-03-21 |
SG151268A1 (en) | 2009-04-30 |
WO2005087834A1 (ja) | 2005-09-22 |
KR101149453B1 (ko) | 2012-05-25 |
MY159179A (en) | 2016-12-30 |
TW200609263A (en) | 2006-03-16 |
US20070196664A1 (en) | 2007-08-23 |
CN100519619C (zh) | 2009-07-29 |
TWI398461B (zh) | 2013-06-11 |
JPWO2005087834A1 (ja) | 2008-01-24 |
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