JP5334704B2 - Cutting tools - Google Patents

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JP5334704B2
JP5334704B2 JP2009150612A JP2009150612A JP5334704B2 JP 5334704 B2 JP5334704 B2 JP 5334704B2 JP 2009150612 A JP2009150612 A JP 2009150612A JP 2009150612 A JP2009150612 A JP 2009150612A JP 5334704 B2 JP5334704 B2 JP 5334704B2
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coating layer
flank
cutting
substrate
cutting tool
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JP2011005582A (en
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正人 松澤
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Kyocera Corp
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Description

本発明は、基体の表面に被覆層が形成された切削工具に関する。   The present invention relates to a cutting tool in which a coating layer is formed on the surface of a substrate.

現在、切削工具では耐摩耗性や摺動性、耐欠損性が必要とされるため、ＷＣ基超硬合金やＴｉＣＮ基サーメット等の硬質基体の表面に様々な被覆層を成膜して切削工具の耐摩耗性、耐欠損性を向上させる手法が使われている。   At present, cutting tools require wear resistance, slidability, and fracture resistance. Therefore, various coating layers are formed on the surface of a hard substrate such as a WC-based cemented carbide or TiCN-based cermet, and the cutting tool is formed. A technique for improving the wear resistance and fracture resistance of steel is used.

例えば、特許文献１では、基体の表面に被覆層（セラミックス膜）を成膜した部材について、被覆層の表面からイオン注入して被覆層の表面にイオン注入した金属原子の濃度冨化層を形成することによって、切削抵抗の大きい被削材を切削する場合でもチッピングの発生を抑制できることが開示されている。   For example, in Patent Document 1, a member having a coating layer (ceramic film) formed on the surface of a substrate is ion-implanted from the surface of the coating layer to form a concentration-enhanced layer of metal atoms ion-implanted on the surface of the coating layer. Thus, it is disclosed that the occurrence of chipping can be suppressed even when a work material having a large cutting resistance is cut.

また、特許文献２では、被覆層を成膜する前の基体の表面にＮイオン注入を行い、その後に被覆層を成膜することによって、基体と被覆層との界面に発生する歪みを抑制できることが開示されている。   Further, in Patent Document 2, N ion implantation is performed on the surface of the substrate before the coating layer is formed, and then the coating layer is formed, thereby suppressing distortion generated at the interface between the substrate and the coating layer. Is disclosed.

特開平６−２１０７号公報JP-A-6-2107 特開２００７−２１７７７１号公報JP 2007-217771 A

しかしながら、フライス切削やドリル加工、エンドミル加工等の断続的な衝撃がかかる回転工具の加工や、表面が粗い被削材を旋削加工するような加工において、上記特許文献１、２の構成の切削工具を用いた場合、切刃において被覆層のチッピングや剥離を充分に抑制できるとは言えず、さらなる改良が必要であった。   However, in the processing of rotating tools that are subject to intermittent impacts such as milling, drilling, and end milling, and the processing of turning work materials with rough surfaces, the cutting tools configured in Patent Documents 1 and 2 above. However, it was not possible to sufficiently suppress chipping and peeling of the coating layer at the cutting edge, and further improvement was necessary.

本発明は、切刃に断続的に衝撃がかかる切削条件においても被覆層のチッピングや剥離を抑制できる切削工具を提供することを目的とする。   An object of this invention is to provide the cutting tool which can suppress the chipping and peeling of a coating layer also on the cutting conditions which an impact is intermittently applied to a cutting blade.

本発明の切削工具は、基体の表面が被覆層で被覆され、すくい面と逃げ面との交差稜線部を切刃とする切削工具であって、前記逃げ面における前記基体の表面に深さ０．５μｍ以内の窒素、炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が多い基体表面冨化領域が存在し、前記すくい面における前記基体の表面には前記基体表面冨化領域が存在しないとともに、前記逃げ面における前記被覆層の厚みが前記すくい面における前記被覆層の厚みよりも１．２〜３倍厚いものである。   The cutting tool of the present invention is a cutting tool in which the surface of the base is covered with a coating layer, and the cutting edge is a cross ridge line portion between the rake face and the flank, and the depth of the surface of the base at the flank is 0. There is a substrate surface hatching region rich in one or more elements selected from the group consisting of nitrogen, carbon, boron, silicon, and titanium within 5 μm, and the substrate surface hatching region on the surface of the substrate at the rake face And the thickness of the coating layer on the flank face is 1.2 to 3 times thicker than the thickness of the coating layer on the rake face.

ここで、前記被覆層中における窒素、炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が、前記逃げ面のほうが前記すくい面よりも多いか、または前記逃げ面における前記被覆層の表面にも深さ１μｍ以内の炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が多い被覆層表面冨化領域が存在し、前記すくい面には前記被覆層表面冨化領域が存在しないことが望ましい。   Here, one or more elements selected from the group consisting of nitrogen, carbon, boron, silicon, and titanium in the coating layer are more on the flank surface than the rake surface, or the coating layer on the flank surface There is also a coating layer surface hatching region rich in one or more elements selected from the group consisting of carbon, boron, silicon and titanium within a depth of 1 μm, and the rake surface has the coating layer surface hatching region on the rake surface. It is desirable that is not present.

また、前記基体がＣｏを結合相とする超硬合金からなり、前記基体表面冨化領域の内部に隣接して、Ｃｏ冨化層が存在することが望ましい。   Further, it is desirable that the base is made of a cemented carbide having Co as a binder phase, and a Co hatched layer is present adjacent to the inside of the base surface hatched area.

本発明の切削工具によれば、基体の表面の逃げ面のみにイオン注入などの手法によって深さ０．５μｍ以内の窒素、炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が多い基体表面冨化領域を存在させて、逃げ面における被覆層の厚みをすくい面における被覆層の厚みよりも１．２〜３倍に厚くすることによって、強い衝撃のかかる条件での切削において耐摩耗性が求められる逃げ面においては被覆層が厚くても剥離せずかつ摩耗しにくい構成とし、被覆層が剥離しやすいすくい面においては被覆層の剥離を防止できる構成として、耐摩耗性および耐欠損性を兼ね備えた構成からなる。   According to the cutting tool of the present invention, at least one element selected from the group of nitrogen, carbon, boron, silicon and titanium having a depth of 0.5 μm or less by a technique such as ion implantation only on the flank of the surface of the substrate. In the presence of many substrate surface hatching regions, the thickness of the coating layer on the flank face is 1.2 to 3 times greater than the thickness of the coating layer on the rake face. The flank that requires wear is configured so that it does not peel off and is not easily worn even if the coating layer is thick, and the rake surface where the coating layer is easy to peel off can prevent peeling of the coating layer. It consists of a structure that also has deficiency.

ここで、前記被覆層中における窒素、炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が、前記逃げ面のほうが前記すくい面よりも多いか、または前記逃げ面における前記被覆層の表面にも深さ１μｍ以内の炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が多い被覆層表面冨化領域が存在し、前記すくい面には前記被覆層表面冨化領域が存在しない構成とすることによって、逃げ面における耐チッピング性がより向上する。   Here, one or more elements selected from the group consisting of nitrogen, carbon, boron, silicon, and titanium in the coating layer are more on the flank surface than the rake surface, or the coating layer on the flank surface There is also a coating layer surface hatching region rich in one or more elements selected from the group consisting of carbon, boron, silicon and titanium within a depth of 1 μm, and the rake surface has the coating layer surface hatching region on the rake surface. By adopting a configuration that does not exist, chipping resistance at the flank face is further improved.

また、前記基体がＣｏを結合相とする超硬合金からなり、前記基体表面冨化領域の内部に隣接して、Ｃｏ冨化層が存在することが、逃げ面における耐衝撃性を高める点で望ましい。   In addition, the fact that the substrate is made of a cemented carbide having Co as a binder phase, and a Co hatched layer is present adjacent to the inside of the substrate surface hatched region, improves the impact resistance on the flank. desirable.

本発明の切削工具の好適例であるスローアウェイ式ミリング工具の一例を示す概略斜視図である。It is a schematic perspective view which shows an example of the throw away type milling tool which is a suitable example of the cutting tool of this invention. 図１のスローアウェイ式ミリング工具に装着されるスローアウェイチップの一例を示し、（ａ）概略斜視図、（ｂ）平面図である。An example of the throw away tip with which the throw away type milling tool of Drawing 1 is equipped is shown, (a) a schematic perspective view, (b) a top view. 図２（ａ）におけるａ−ａ線についての概略断面図である。It is a schematic sectional drawing about the aa line in Fig.2 (a).

本発明の切削工具の一例について、その好適例であるスローアウェイチップ（以下、単にチップと略す。）を装着したスローアウェイ式ミリング工具（以下、単に工具と略す。）Ａの先端部についての概略斜視図である図１、装着されるチップ１の（ａ）概略斜視図、（ｂ）平面図である図２、図２のチップ１について図２（ａ）のａ−ａラインについての断面図である図３を基に説明する。   About an example of the cutting tool of this invention, the outline about the front-end | tip part of the throw-away type milling tool (henceforth only abbreviated as a tool) A which equipped with the throw-away tip (henceforth only abbreviated as a chip) which is the example of the cutting tool. FIG. 1 is a perspective view, (a) is a schematic perspective view of a chip 1 to be mounted, (b) is a plan view of FIG. 2, and FIG. 2 is a cross-sectional view of the chip 1 of FIG. This will be described with reference to FIG.

図１〜３によれば、チップ１は、主面が略平板状を呈する基体２のすくい面３をなす主面および逃げ面４をなす側面との交差稜線がコーナー切刃５を挟んで主切刃６および副切刃７を具備した切刃８をなしている。また、工具Ａではホルダ２０のチップポケット２１にチップ１が装着されている。そして、チップ１の中央部に形成されているねじ穴２３にねじ２２を挿入してホルダ２０にねじ２２を螺合することにより、チップ１がホルダ２０にクランプされている。   According to FIGS. 1 to 3, the tip 1 has a crossed ridge line between the main surface forming the rake face 3 and the side surface forming the flank 4 of the base 2 having a substantially flat main surface across the corner cutting edge 5. A cutting edge 8 having a cutting edge 6 and a secondary cutting edge 7 is formed. In the tool A, the chip 1 is mounted in the chip pocket 21 of the holder 20. And the chip | tip 1 is clamped by the holder 20 by inserting the screw | thread 22 in the screw hole 23 currently formed in the center part of the chip | tip 1, and screwing the screw | thread 22 in the holder 20. FIG.

ここで、図３に示すように、チップ１は、基体２の表面が被覆層９で被覆され、すくい面３と逃げ面４との交差稜線部が切刃８をなしており、逃げ面４における基体２の表面に深さ０．５μｍ以内の窒素、炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が多い基体表面冨化領域１１が存在し、すくい面３における基体２の表面には基体表面冨化領域１１が存在しないとともに、逃げ面４における被覆層９の厚みがすくい面３における被覆層９の厚みよりも１．２〜３倍厚い構成となっている。   Here, as shown in FIG. 3, in the chip 1, the surface of the base body 2 is covered with the coating layer 9, and the intersecting ridge line portion between the rake face 3 and the flank face 4 forms a cutting edge 8. In the surface of the substrate 2, a substrate surface hatching region 11 containing one or more elements selected from the group consisting of nitrogen, carbon, boron, silicon and titanium within a depth of 0.5 μm is present. The surface of the substrate 11 does not have the substrate surface hatching region 11, and the thickness of the coating layer 9 on the flank 4 is 1.2 to 3 times larger than the thickness of the coating layer 9 on the rake face 3.

これによって、強い衝撃のかかる条件での切削において耐摩耗性と耐欠損性が求められる逃げ面においては被覆層が厚くても剥離せずかつ摩耗しにくく、被覆層９が剥離しやすいすくい面３においては被覆層９の剥離を防止できる構成となり、チップ１は耐摩耗性および耐欠損性を兼ね備えた構成となる。   As a result, a rake face 3 in which the coating layer 9 is easy to peel off because it does not peel off and is not easily worn even if the coating layer is thick on the flank surface that requires wear resistance and chipping resistance in cutting under a strong impact condition. In this case, the coating layer 9 can be prevented from being peeled off, and the chip 1 has a configuration having both wear resistance and chipping resistance.

ここで、被覆層９中における窒素、炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が、逃げ面４のほうがすくい面３よりも多いか、または逃げ面４における被覆層９の表面にも深さ０．５μｍ以内の窒素、炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が多い被覆層表面冨化領域１２が存在し、すくい面３における被覆層９の表面には被覆層表面冨化領域１２が存在しないことが、逃げ面４における耐チッピング性を向上させる点で望ましい。   Here, one or more elements selected from the group of nitrogen, carbon, boron, silicon and titanium in the covering layer 9 are more on the flank face 4 than on the rake face 3 or on the flank face 4. Also on the surface of the coating layer, there is a coating layer surface hatching region 12 containing one or more elements selected from the group consisting of nitrogen, carbon, boron, silicon and titanium within a depth of 0.5 μm. In order to improve the chipping resistance on the flank 4, it is desirable that the coating layer surface hatching region 12 does not exist on the surface.

また、基体２がＣｏを結合相とする超硬合金からなり、基体表面冨化領域１１の内側に隣接してＣｏ冨化層１３が存在することが、逃げ面４における耐衝撃性を高める点で望ましい。   Further, the fact that the base body 2 is made of a cemented carbide having a binder phase of Co and the Co hatched layer 13 exists adjacent to the inside of the base surface hatched area 11 improves the impact resistance on the flank 4. Is desirable.

さらに、コーナー切刃５にホーニング１０を設けることもできる。ホーニング１０の形状は、被覆層９の剥離を抑制するためにＲホーニングであることが望ましいが、Ｃホーニング（チャンファホーニング）であってもよい。なお、ホーニング量は、すくい面３側Ｒｒと逃げ面４側Ｒｆとの比率Ｒｒ／Ｒｆが１〜１．５であることが切刃５における切れ味と耐チッピング性能との兼ね合いで望ましい。また、底刃である主切刃６側が大きく外周刃である副切刃７側が小さいことが、切刃８の各位置での切削環境に適した構成を実現して、最適な切削性能を発揮できるために望ましい。 Furthermore, the honing 10 can be provided on the corner cutting edge 5. The shape of the honing 10 is desirably R honing in order to suppress peeling of the coating layer 9, but may be C honing (Chanhwa honing). Incidentally, honing amount, it ratio R r / R f of the rake face 3 side R r and the flank 4 side R f is 1 to 1.5 is in view of the sharpness and chipping resistance in cutting edge 5 desirable. In addition, the fact that the main cutting edge 6 side as the bottom edge is large and the secondary cutting edge 7 side as the outer edge is small realizes a configuration suitable for the cutting environment at each position of the cutting edge 8 and exhibits optimum cutting performance. Desirable because it can.

さらに、被覆層９は、ＴｉＣ、ＴｉＮ、ＴｉＣＮ、Ａｌ２Ｏ３、ＴｉＡｌＮ等が好適に使用可能である。特に、ＴｉＡｌＮについては、単純なＴｉ１−ａＡｌａＮにて構成されていても良いが、例えば、Ｔｉ１−ａ−ｂＡｌａＭｂ（ＣｘＮ１−ｘ）（ただし、ＭはＴｉを除く周期表第４、５、６族元素、希土類元素、Ｓｉ、ダイヤモンド、ダイヤモンドライクカーボン（ＤＬＣ）および立方晶窒化硼素（ｃＢＮ）の群から選ばれる１種以上であり、０≦ａ＜１、０＜ｂ≦１、０≦ｘ≦１である。）にて構成されていることが望ましい。なお、被覆層９の組成はエネルギー分散型Ｘ線分光（ＥＤＳ）分析法またはＸ線光電子分光分析法（ＸＰＳ）にて測定できる。 Further, the coating layer 9, TiC, TiN, TiCN, Al 2 O 3, TiAlN or the like can be suitably used. In particular, TiAlN may be composed of simple Ti 1-a Al a N. For example, Ti 1-a-B Al a M b (C x N 1-x ) (where M is It is at least one selected from the group consisting of Group 4, 5, 6 elements, rare earth elements, Si, diamond, diamond-like carbon (DLC), and cubic boron nitride (cBN), excluding Ti, and 0 ≦ a < 1 and 0 <b ≦ 1, and 0 ≦ x ≦ 1). The composition of the coating layer 9 can be measured by energy dispersive X-ray spectroscopy (EDS) analysis or X-ray photoelectron spectroscopy (XPS).

また、基体としては、炭化タングステンや、炭窒化チタンを主成分とする硬質相とコバルト、ニッケル等の鉄族金属を主成分とする結合相とからなる超硬合金やサーメットの他、窒化ケイ素や、酸化アルミニウムを主成分とするセラミック、多結晶ダイヤモンドや立方晶窒化ホウ素からなる硬質相と、セラミックスや鉄族金属等の結合相とを超高圧下で焼成する超高圧焼結体等の硬質材料が好適に使用される。   In addition, as a substrate, tungsten carbide, a cemented carbide or cermet composed of a hard phase mainly composed of titanium carbonitride and a binder phase mainly composed of an iron group metal such as cobalt and nickel, silicon nitride, , Hard materials such as ceramics mainly composed of aluminum oxide, hard phases made of polycrystalline diamond or cubic boron nitride, and bonded phases such as ceramics and iron group metals under super high pressure, etc. Are preferably used.

本発明の切削工具は、切削工具として種々の切削条件で使用することができるが、特に、切削油を使用しながら切削加工を行う湿式切削条件で、中でも、エンドミル加工、ドリル加工を含むフライス加工や、表面が粗い被削材の旋削加工をする際に優れた耐摩耗性および耐欠損性を示す。   The cutting tool of the present invention can be used as a cutting tool under various cutting conditions. In particular, it is a wet cutting condition in which cutting is performed while using a cutting oil, and in particular, milling including end milling and drilling. In addition, it exhibits excellent wear resistance and fracture resistance when turning a work material with a rough surface.

（製造方法）
次に、本発明の切削工具の製造方法の一例について説明する。 (Production method)
Next, an example of the manufacturing method of the cutting tool of this invention is demonstrated.

まず、工具形状の基体を成形、焼成し、この基体に対して、所望によりすくい面、またはすくい面および逃げ面に研削加工を施す。次に、この基体表面の逃げ面のみにイオン注入を行う。このとき、基体表面の特定の部位のみに局所的にイオン注入を行うことが重要である。   First, a tool-shaped substrate is molded and fired, and the rake face or the rake face and the flank face are ground on the base as desired. Next, ion implantation is performed only on the flank of the substrate surface. At this time, it is important to locally ion-implant only a specific part of the substrate surface.

その後、基体の表面に、被覆層を成膜する。被覆層の成膜方法として、イオンプレーティング法やスパッタリング法等の物理蒸着（ＰＶＤ）法が好適に適応可能である。   Thereafter, a coating layer is formed on the surface of the substrate. A physical vapor deposition (PVD) method such as an ion plating method or a sputtering method can be suitably applied as the coating layer forming method.

成膜方法の一例についての詳細について説明すると、被覆層をイオンプレーティング法で作製する場合には、金属チタン（Ｔｉ）、金属アルミニウム（Ａｌ）、金属Ｍ（ただし、ＭはＴｉを除く周期表第４、５、６族元素、希土類元素およびＳｉから選ばれる１種以上）をそれぞれ独立に含有する金属ターゲットまたは複合化した合金ターゲットに用いる。   The details of an example of the film forming method will be described. When the coating layer is manufactured by an ion plating method, metal titanium (Ti), metal aluminum (Al), metal M (where M is a periodic table excluding Ti). One or more selected from Group 4, 5, 6 elements, rare earth elements and Si) are used independently for metal targets or composite alloy targets.

成膜条件としては、このターゲットを用いて、アーク放電やグロー放電などにより金属源を蒸発させイオン化すると同時に、窒素源の窒素（Ｎ２）ガスや炭素源のメタン（ＣＨ４）／アセチレン（Ｃ２Ｈ２）ガスと反応させる条件が好適に採用できる。このとき、窒素（Ｎ２）ガスやアルゴン（Ａｒ）ガスを用いて、イオンプレーティング法またはスパッタリング法によって、成膜温度４５０〜５５０℃、スパッタ電力６ｋＷ〜９ｋＷまたはバイアス電圧３０〜２００Ｖにて被覆層を成膜する。 As the film forming conditions, using this target, the metal source is evaporated and ionized by arc discharge or glow discharge, and at the same time, nitrogen (N 2 ) gas as a nitrogen source or methane (CH 4 ) / acetylene (C) as a carbon source. Conditions for reacting with 2 H 2 ) gas can be suitably employed. At this time, using nitrogen (N 2 ) gas or argon (Ar) gas, coating is performed at a deposition temperature of 450 to 550 ° C., a sputtering power of 6 kW to 9 kW, or a bias voltage of 30 to 200 V by an ion plating method or a sputtering method. Deposit layers.

なお、成膜に際して、逃げ面方向へイオン注入を併用しながら成膜処理を行うことも可能であり、これによって、逃げ面における被覆層の厚みを厚くしても剥離しくにい被覆層を成膜することが可能である。また、成膜した後に、逃げ面の被覆層表面からイオン注入を行うことも可能である。さらに、成膜する際には、工具の逃げ面がターゲットに対向する向きに基体をセットして成膜を行う。   In film formation, it is also possible to perform film formation while using ion implantation in the direction of the flank surface. This makes it possible to form a coating layer that is difficult to peel off even if the thickness of the coating layer on the flank surface is increased. It is possible to membrane. It is also possible to perform ion implantation from the surface of the coating layer on the flank after film formation. Further, when forming a film, the substrate is set in such a direction that the flank of the tool faces the target.

本発明によれば、逃げ面においては内部応力が低いために、被覆層の厚みを増加させても内部応力の蓄積による耐チッピング性の低下などが生じにくい傾向にある。そのため、より厚い被覆層の成膜が可能となり、その場合でも加工中における脆性的な剥離も抑制され、切削工具による耐摩耗性向上の効果を発揮させることができる。   According to the present invention, since the internal stress is low at the flank, even if the thickness of the coating layer is increased, the chipping resistance is not easily lowered due to the accumulation of internal stress. Therefore, it is possible to form a thicker coating layer, and even in this case, brittle peeling during processing is suppressed, and the effect of improving wear resistance by the cutting tool can be exhibited.

平均粒径０．８μｍの炭化タングステン（ＷＣ）粉末を主成分として、平均粒径１．５μｍの金属コバルト（Ｃｏ）粉末を９質量％、平均粒径１．０μｍの炭化バナジウム（ＶＣ）粉末を０．２質量％、平均粒径１．０μｍの炭化クロム（Ｃｒ３Ｃ２）粉末を０．６質量％の割合で添加し混合して、プレス成形により刃先交換式ミリング用スローアウェイチップ形状（ＢＤＭＴ１１Ｔ３０８ＥＲ−ＪＴ）に成形した後、脱バインダ処理を施し、０．０１Ｐａの真空中、１４６０℃で１時間焼成して超硬合金を作製した。 Mainly composed of tungsten carbide (WC) powder having an average particle size of 0.8 μm, 9% by mass of metallic cobalt (Co) powder having an average particle size of 1.5 μm, and vanadium carbide (VC) powder having an average particle size of 1.0 μm. Chromium carbide (Cr 3 C 2 ) powder of 0.2% by mass and average particle size of 1.0 μm is added and mixed at a ratio of 0.6% by mass, and the tip-away tip shape for milling changeable blade tip by press molding ( BDMT11T308ER-JT) was subjected to a binder removal treatment and fired at 1460 ° C. for 1 hour in a vacuum of 0.01 Pa to produce a cemented carbide.

また、各試料のすくい面表面をブラシ加工およびブラスト加工によって研磨加工するとともに、切刃にブラシ加工を施して、ホーニング量がすくい面側から見た研磨量Ｒｒ＝０．０３ｍｍ、逃げ面側から見た研磨量Ｒｆ＝０．０２ｍｍとなるように刃先処理（ホーニング）を行った。そして、表１の方向からイオン注入を行った。 Further, the rake face surface of each sample is polished by brushing and blasting, and the cutting edge is brushed so that the honing amount is the polishing amount R r = 0.03 mm as viewed from the rake face side, the flank side The blade edge treatment (honing) was performed so that the polishing amount R f as seen from FIG. Then, ion implantation was performed from the direction of Table 1.

Figure 0005334704
Figure 0005334704

次に、このようにして作製した基体に対して、アークイオンプレーティング法により成膜温度５００℃で表１に示す条件でＴｉＡｌＮ組成の被覆層を成膜してスローアウェイチップを作製した。なお、試料Ｎｏ．１、２については成膜後に逃げ面にてイオン注入を行い、試料Ｎｏ．３〜８については成膜中に表１に記載した方向からイオン注入を併用した。その後、さらに表１の条件で被覆層の表面からイオン注入を行った。また、被覆層の厚みを調整するために、試料のセットの向き、ターゲットとの距離を調整して成膜した。   Next, a coating layer having a TiAlN composition was formed on the substrate thus prepared at a film forming temperature of 500 ° C. under the conditions shown in Table 1 by an arc ion plating method to manufacture a throw-away tip. Sample No. For Nos. 1 and 2, ion implantation was performed on the flank after film formation. As for 3 to 8, ion implantation was used in combination from the direction described in Table 1 during film formation. Thereafter, ions were further implanted from the surface of the coating layer under the conditions shown in Table 1. Further, in order to adjust the thickness of the coating layer, the film was formed by adjusting the direction of setting the sample and the distance from the target.

得られたチップに対して、被覆層の表面からＳＩＭＳ（二次イオン質量分析）にて組成分析を行った。また、基体と被覆層との界面における組成分析をＸＰＳ（Ｘ線光電子分光分析）にて行った。さらに、切削工具の断面を走査型電子顕微鏡にて観察して、すくい面および逃げ面における被覆層の厚みを測定した。   The obtained chip was subjected to composition analysis by SIMS (secondary ion mass spectrometry) from the surface of the coating layer. Further, composition analysis at the interface between the substrate and the coating layer was performed by XPS (X-ray photoelectron spectroscopy). Furthermore, the cross section of the cutting tool was observed with a scanning electron microscope, and the thickness of the coating layer on the rake face and flank face was measured.

また、各チップをホルダに取り付けて図１のエンドミルを作製し、下記条件で切削試験を行った。
切削方法：肩削り（ミリング加工）
被削材 ：ＳＫＤ１１
切削速度：１５０ｍ／ｍｉｎ
送り ：０．１２ｍｍ／ｔｏｏｔｈ
切り込み：横切り込み１０ｍｍ、深さ切り込み３ｍｍ
切削状態：湿式
評価方法：１５分間切削した時点で、刃先の観察を行うと共に、逃げ面における摩耗量（幅）を測定した。なお、加工済みのホーニング量は摩耗幅には含めないように注意した。 Moreover, each chip | tip was attached to the holder, the end mill of FIG. 1 was produced, and the cutting test was done on the following conditions.
Cutting method: Shoulder (milling)
Work material: SKD11
Cutting speed: 150 m / min
Feeding: 0.12mm / tooth
Incision: Horizontal incision 10mm, depth incision 3mm
Cutting state: wet evaluation method: At the time of cutting for 15 minutes, the cutting edge was observed and the wear amount (width) on the flank was measured. Care was taken not to include the processed honing amount in the wear width.

Figure 0005334704
Figure 0005334704

表１、２より、逃げ面に基体表面冨化領域が存在しない試料Ｎｏ．９では、逃げ面での摩耗幅が大きく、また、すくい面に基体表面冨化領域が存在する試料Ｎｏ．６では、摩耗量が大きいものであった。さらに、逃げ面における被覆層の厚みとすくい面における被覆層の厚みとの比率が１．２よりも小さい試料Ｎｏ．７でも、摩耗量が大きくなり、逆に、逃げ面における被覆層の厚みとすくい面における被覆層の厚みとの比率が３よりも大きい試料Ｎｏ．８では、チッピングが発生した。   From Tables 1 and 2, sample no. In Sample No. 9, the wear width on the flank face is large, and the substrate surface hatching region is present on the rake face. In No. 6, the amount of wear was large. Further, the sample No. 1 in which the ratio of the thickness of the coating layer on the flank surface to the thickness of the coating layer on the rake surface is smaller than 1.2. 7 also increased the amount of wear and, conversely, the ratio of the coating layer thickness on the flank surface to the coating layer thickness on the rake surface was greater than 3. In No. 8, chipping occurred.

これに対し、本発明に従う試料Ｎｏ．１〜５では、切削性能に優れたものであった。   On the other hand, sample no. In 1-5, it was what was excellent in cutting performance.

Ａ スローアウェイ式ミリング工具（工具）
１ スローアウェイチップ（チップ）
２ 基体
３ すくい面
４ 逃げ面
５ コーナー切刃
６ 主切刃
７ 副切刃
８ 切刃
９ 被覆層
１０ ホーニング
Ｒｒ すくい面３側のホーニング量
Ｒｆ 逃げ面４側のホーニング量
２０ ホルダ
２１ チップポケット
２２ ねじ
２３ ねじ穴 A Throw-away milling tool (tool)
1 Throw away tip (chip)
2 Substrate 3 Rake face 4 Relief face 5 Corner cutting edge 6 Main cutting edge 7 Sub cutting edge 8 Cutting edge 9 Covering layer 10 Honing R r Honing amount on rake face 3 side R f Honing amount on flank face 4 side Holder 21 Tip Pocket 22 Screw 23 Screw hole

Claims (4)

基体の表面が被覆層で被覆され、すくい面と逃げ面との交差稜線部を切刃とする切削工具であって、前記逃げ面における前記基体の表面に深さ０．５μｍ以内の窒素、炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が多い基体表面冨化領域が存在し、前記すくい面における前記基体の表面には前記基体表面冨化領域が存在しないとともに、前記逃げ面における前記被覆層の厚みが前記すくい面における前記被覆層の厚みよりも１．２〜３倍厚い切削工具。   A cutting tool in which the surface of a base is coated with a coating layer, and the cutting edge is a cross ridge line portion between a rake face and a flank, and the surface of the base at the flank is nitrogen or carbon having a depth of 0.5 μm or less. There is a substrate surface hatching region rich in one or more elements selected from the group consisting of boron, silicon, and titanium, the substrate surface hatching region does not exist on the surface of the substrate at the rake face, and the escape A cutting tool in which the thickness of the coating layer on the surface is 1.2 to 3 times thicker than the thickness of the coating layer on the rake surface. 前記被覆層中における窒素、炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が、前記逃げ面のほうが前記すくい面よりも多い請求項１記載の切削工具。   2. The cutting tool according to claim 1, wherein the flank has a larger amount of one or more elements selected from the group of nitrogen, carbon, boron, silicon and titanium in the coating layer than the rake face. 前記逃げ面における前記被覆層の表面にも深さ１μｍ以内の炭素、硼素、珪素およびチタンの群から選ばれる１種以上の元素が多い被覆層表面冨化領域が存在し、前記すくい面には前記被覆層表面冨化領域が存在しない請求項１記載の切削工具。   The surface of the coating layer on the flank surface also has a coating layer surface hatching region rich in one or more elements selected from the group of carbon, boron, silicon and titanium within a depth of 1 μm, and the rake surface has The cutting tool according to claim 1, wherein the coating layer surface hatching region does not exist. 前記基体がＣｏを結合相とする超硬合金からなり、前記基体表面冨化領域の内側に隣接して、Ｃｏ冨化層が存在する請求項１乃至３のいずれか記載の切削工具。   The cutting tool according to any one of claims 1 to 3, wherein the base body is made of a cemented carbide having Co as a binder phase, and a Co hatched layer is present adjacent to the inside of the base surface hatched area.
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