JP5313156B2 - 接続端子、半導体パッケージ、配線基板、コネクタ、およびマイクロコンタクタ - Google Patents
接続端子、半導体パッケージ、配線基板、コネクタ、およびマイクロコンタクタ Download PDFInfo
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- JP5313156B2 JP5313156B2 JP2009538137A JP2009538137A JP5313156B2 JP 5313156 B2 JP5313156 B2 JP 5313156B2 JP 2009538137 A JP2009538137 A JP 2009538137A JP 2009538137 A JP2009538137 A JP 2009538137A JP 5313156 B2 JP5313156 B2 JP 5313156B2
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- 239000004065 semiconductor Substances 0.000 title claims description 24
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 31
- 230000002093 peripheral effect Effects 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 19
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 15
- 238000010586 diagram Methods 0.000 description 13
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 239000004020 conductor Substances 0.000 description 5
- 238000010030 laminating Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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Description
2、4a、4b、6、7、9a、9b、12a、12b 端子用部材
11a 内側端子用部材
11b 外側端子用部材
20、40a、40b、60、70、106、202、306 開口部
21、41a、41b、61、71、91a、91b、111a、111b 台座部
22、42a、42b、62、72、92a、92b、112a、112b 端子部
100、501 半導体パッケージ
101、301 基材
102、302、502 電極
103、303 半田
104、304 蓋部材
105、201、305、402 樹脂シート
113a、221 先端部
200 コネクタ
300 配線基板
400 マイクロコンタクタ
401 配線
500 被接触体
621 スリット
図1は、本発明の実施の形態1に係る接続端子の構成を示す斜視図である。図2は、図1の矢視A方向の平面図である。図3は、図2のB−B線断面図である。図1〜図3に示す接続端子1は、互いに同じ形状をなす4つの導電性の端子用部材2が積層した構成を有している。
図15は、本発明の実施の形態2に係る接続端子および当該接続端子を適用したコネクタの要部の構成を示す部分断面図である。同図に示す接続端子8は、2つの導電性の端子用部材9a、9bを積層したものである。図16は、端子用部材9aの構成を示す斜視図である。端子用部材9aは、半円形の切り欠き90aを有する台座部91aと、切り欠き90aの内周面から台座部91aの表面と異なる方向へ先細の帯状をなして延びる端子部92aとを有する。端子部92aの表面は、外周面および内周面ともに球面の一部をなしている。
図18は、本発明の実施の形態3に係る接続端子および当該接続端子を適用した配線基板の要部の構成を示す部分断面図である。同図に示す接続端子11は、基端部を通過する平面と異なる方向へ帯状に延びる内側端子用部材11aと、内側端子用部材11aの外周側に積層される外側端子用部材11bと、を備える。内側端子用部材11aおよび外側端子用部材11bは、導電性材料によって形成される。
図20は、本発明の実施の形態4に係る接続端子の構成および当該接続端子を適用したマイクロコンタクタの要部の構成を示す部分断面図である。図21は、図20の矢視D方向の平面図である。これらの図に示す接続端子12は、各々が長手方向に沿って略半楕円形状に丸まった帯状をなす2つの端子用部材12a、12bを備える。端子用部材12aの両端部は、端子用部材12bの両端部のいずれかと厚さ方向に積層している。このため、接続端子12は、周回して閉じた形状をなしている。端子用部材12a、12bの互いに積層された端部のうち一方の端部は、溶接等によって固着している。
Claims (9)
- 接触対象と接触することによって前記接触対象との電気的な接続を図る接続端子であって、
少なくとも一部の表面が曲面をなして帯状に延びる端子部を有するとともに、板厚方向に貫通する開口部が形成された平板状の台座部を有する導電性の端子用部材を複数備え、
前記複数の端子用部材がそれぞれ有する複数の前記端子部の先端部が全て厚さ方向に積層しており、
前記端子部は、前記開口部の内周面から帯状に延びており、
前記複数の端子部の先端部が積層している方向は、前記台座部の主面と直交している
ことを特徴とする接続端子。 - 前記接触対象と直接接触する前記端子部を有する前記端子用部材は、他の前記端子用部材と異なる材料からなることを特徴とする請求項1記載の接続端子。
- 前記複数の端子用部材は、互いに同じ形状をなすことを特徴とする請求項1または2記載の接続端子。
- 前記端子部は、他の前記端子部と異なる方向に延びていることを特徴とする請求項1〜3のいずれか一項記載の接続端子。
- 前記端子部は、帯状に延びている方向に沿って切り込まれたスリットを有することを特徴とする請求項1〜4のいずれか一項記載の接続端子。
- 請求項1〜5のいずれか一項に記載の接続端子が平面上に複数設けられていることを特徴とする半導体パッケージ。
- 請求項1〜5のいずれか一項に記載の接続端子が平面上に複数設けられていることを特徴とする配線基板。
- 異なる回路構造の電気的な接続を図るコネクタであって、
請求項1〜5のいずれか一項に記載の接続端子が平面の両側に同数ずつ設けられ、
前記平面を介して相反する方向に突起する前記接続端子同士が電気的に接続していることを特徴とするコネクタ。 - 請求項1〜5のいずれか一項に記載の接続端子を複数備えるとともに、
複数の前記接続端子とそれぞれ電気的に接続する複数の配線と、
前記複数の配線を互いに平行な状態で保持する絶縁性のシート部材と、
を備えたことを特徴とするマイクロコンタクタ。
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JP4947168B2 (ja) * | 2010-02-24 | 2012-06-06 | オムロン株式会社 | 音響センサ |
JP5599328B2 (ja) * | 2011-01-20 | 2014-10-01 | 三菱電機株式会社 | 電力用半導体装置とプリント配線板との接続機構 |
WO2013183734A1 (ja) * | 2012-06-08 | 2013-12-12 | 日本発條株式会社 | 接触端子 |
JP6239494B2 (ja) * | 2014-12-16 | 2017-11-29 | アルプス電気株式会社 | 圧接コネクタ |
JP6406644B2 (ja) * | 2015-09-15 | 2018-10-17 | アルプス電気株式会社 | 圧接コネクタ、圧接コネクタの製造方法 |
JP6406645B2 (ja) * | 2015-12-10 | 2018-10-17 | アルプス電気株式会社 | 圧接コネクタ |
JP6778596B2 (ja) * | 2016-11-30 | 2020-11-04 | アルプスアルパイン株式会社 | 圧接コネクタおよびその製造方法 |
WO2019240490A1 (ko) | 2018-06-12 | 2019-12-19 | 주식회사 케이엠더블유 | 캐비티 필터 및 이에 포함되는 커넥팅 구조체 |
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US8410610B2 (en) | 2013-04-02 |
TWI381594B (zh) | 2013-01-01 |
US20100219536A1 (en) | 2010-09-02 |
JPWO2009051183A1 (ja) | 2011-03-03 |
TW200929718A (en) | 2009-07-01 |
WO2009051183A1 (ja) | 2009-04-23 |
CN101828310B (zh) | 2013-04-03 |
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