JP5300156B2 - 無電解めっきにより銅薄膜を形成しためっき物 - Google Patents
無電解めっきにより銅薄膜を形成しためっき物 Download PDFInfo
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- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
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- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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Description
特にULSI超微細銅配線(ダマシン銅配線)を形成する際のシード層として、無電解めっきにより銅薄膜を形成しためっき物に関する。
従来、半導体ウェハーのような鏡面上に無電解銅めっきを行った場合、析出しためっき膜に十分な密着性を得るのは困難であった。また、めっきの反応性が低く、基板全面に均一なめっきを行うことも困難であった。従来は、例えば、窒化タンタルなどのバリアメタル層上に無電解めっき法で銅シード層を形成する場合、めっきを均一に形成することが難しく密着力が十分でないという問題があった。また、バリアメタル層として、タングステンやモリブデンなどの金属単体上に無電解めっき法で銅シード層を形成する場合も、めっきを均一に形成することが難しく密着力が十分でないという問題があった。従って、窒化タンタルなどのバリアメタル層上に無電解めっき法で銅シード層を均一に形成するためには、めっき前に触媒付与工程が必要であった。
(1)基材上に、無電解銅めっき液に含まれる銅イオンと置換めっきが可能でかつ銅に対してバリア性を持つタングステンまたはモリブデンである金属Bと、pH10以上の無電解銅めっき液中でのイオン化傾向が金属Bより小さなニッケル、コバルト、スズ、マグネシウム、アルミニウム、亜鉛から選ばれる少なくとも1種の金属Aからなる銅拡散防止用バリア合金薄膜が形成され、該銅拡散防止用バリア合金薄膜が、前記金属Aを15原子%以上、35原子%以下とする組成であり、その上にpH10以上の無電解銅めっき液を用いた無電解めっきにより銅薄膜が形成されたことを特徴とするめっき物。
(2)金属Aがニッケル、コバルト、スズから選ばれる少なくとも1種の金属である請求項1記載のめっき物。
(3)金属Aがニッケル、コバルトから選ばれる少なくとも1種の金属である前記(1)記載のめっき物。
(4)前記無電解めっきにより形成された銅薄膜が膜厚10nm以下で、抵抗率10μΩ・cm以下であることを特徴とする前記(1)〜(3)のいずれか一つに記載のめっき物。
(5)前記銅拡散防止用バリア合金薄膜がスパッタリングで形成されたことを特徴とする前記(1)〜(4)のいずれか一つに記載のめっき物。
さらに、前記合金薄膜は、その上に触媒金属層を設けなくても、無電解銅めっきにより成膜均一性、密着性に優れる銅シード層の形成が可能であるので、ダマシン銅配線形成における、バリア層と触媒金属層との二層を形成する煩雑さを解消でき、さらに薄膜化が可能となる。
合金薄膜の膜厚は3〜20nmであることが好ましく、より好ましくは5〜15nmである。
本発明において、反応初期に置換めっきにより、銅薄膜が形成されることにより、前記合金薄膜の表面の酸化物が置換めっきの過程で除かれる。また上記の作用により、前記合金薄膜と銅薄膜との界面の酸素濃度をオージェ電子分光法(AES)にて分析したところ1原子%以下(検出限界以下)とすることができる。界面に酸素が存在する場合には、配線の抵抗が上がったり、バリア機能が落ちる等の悪影響がある。
また、その結果、銅薄膜の厚みを10nm以下でかつ抵抗率10μΩ・cm以下とすることができる。シード層の膜厚を薄くすることにより、線幅が数十nmレベルのダマシン銅配線への適用が可能となる。
無電解銅めっき液は、通常、銅イオン、銅イオンの錯化剤、還元剤、およびpH調整剤等を含んでいる。
グリオキシル酸の濃度は、めっき液中0.005〜0.5mol/Lが好ましく、0.01〜0.2mol/Lがより好ましい。濃度が0.005mol/L未満であるとめっき反応が起こらず、0.5mol/Lを超えるとめっき液が不安定になり分解する。
その他の添加剤として、めっき液に一般的に用いられている添加剤、例えば2,2’−ビピリジル、ポリエチレングリコール、フェロシアン化カリウム等を用いることができる。
また、本発明における無電解銅めっき液は、浴温40〜90℃で使用するのが、浴安定性および銅の析出速度の点から好ましい。
本発明の無電解めっきにより作製した銅薄膜の厚さは、3〜10nmがより好ましい。
配線部は銅又は銅を主成分とする合金であることが好ましく、銅がより好ましい。電気銅めっき液は、一般にダマシン銅配線埋め込み用に使用されている組成であればよく、特に限定されないが、例えば主成分として硫酸銅及び硫酸、微量成分として塩素、ポリエチレングリコール、二硫化ビス(3−スルホプロピル)二ナトリウム、ヤヌスグリーンなどを含んだ液を用いることができる。また、埋め込みに使用する無電解銅めっき液としては、例えば国際公開第2005/038086号パンフレットに記載の銅配線埋め込み用めっき液を用いることができる。
実施例1
半導体基板上に、無電解銅めっき液に含まれる銅イオンと置換めっきが可能でかつ銅に対してバリア性を持つ金属Bとしてタングステン、pH10以上の無電解銅めっき液中でのイオン化傾向が金属Bより小さな金属Aとしてニッケルからなるスパッタリング合金ターゲットを用いて膜厚10nmの合金薄膜を作製し、その合金膜上に無電解めっき法により銅めっき薄膜を形成した。前記スパッタリング合金ターゲットを用いて形成されたこの合金薄膜の組成、および無電解めっきにより形成された銅めっき薄膜の膜厚を表1に示す。
尚、無電解めっきによる銅膜の形成は、以下の組成のめっき液を用いて、pH12.5(調整剤:水酸化カリウム)、50℃×30〜40秒の条件で実施した。
めっき液組成
硫酸銅 0.02mol/L
エチレンジアミン四酢酸塩 0.21mol/L
グリオキシル酸 0.03mol/L
2、2’−ビピリジル 20mg/L
なお、電気めっきによる配線の埋め込みは、以下の組成のめっき液を用いて25℃×60秒、電流密度1A/dm2で実施した。
硫酸銅 0.25mol/L
硫酸 1.8mol/L
塩酸 10mmol/L
微量添加剤(ポリエチレングリコール、二硫化ビス(3−スルホプロピル)二ナトリウム、ヤヌスグリーン)
得られた銅めっき膜の断面TEM観察により、線幅90nmトレンチ部の埋め込み性を評価した。ボイド・シームの有無を判定し、○:ボイド・シーム無、×:ボイド・シーム有とした。
結果を表1に示す。
実施例1における合金薄膜の組成を表1記載のように変えた以外は実施例1と同様にして合金薄膜を作製し、無電解めっきを行い、評価した。
結果を表1に示す。
Claims (5)
- 基材上に、無電解銅めっき液に含まれる銅イオンと置換めっきが可能でかつ銅に対してバリア性を持つタングステンまたはモリブデンである金属Bと、pH10以上の無電解銅めっき液中でのイオン化傾向が金属Bより小さなニッケル、コバルト、スズ、マグネシウム、アルミニウム、亜鉛から選ばれる少なくとも1種の金属Aからなる銅拡散防止用バリア合金薄膜が形成され、該銅拡散防止用バリア合金薄膜が、前記金属Aを15原子%以上、35原子%以下とする組成であり、その上にpH10以上の無電解銅めっき液を用いた無電解めっきにより銅薄膜が形成されたことを特徴とするめっき物。
- 金属Aがニッケル、コバルト、スズから選ばれる少なくとも1種の金属である請求項1記載のめっき物。
- 金属Aがニッケル、コバルトから選ばれる少なくとも1種の金属である請求項1記載のめっき物。
- 前記無電解めっきにより形成された銅薄膜が膜厚10nm以下で、抵抗率10μΩ・cm以下であることを特徴とする請求項1〜3のいずれか一つに記載のめっき物。
- 前記銅拡散防止用バリア合金薄膜がスパッタリングで形成されたことを特徴とする請求項1〜4のいずれか一つに記載のめっき物。
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