JP5298856B2 - Organic electroluminescence panel - Google Patents
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- 238000005401 electroluminescence Methods 0.000 title claims description 62
- 238000007789 sealing Methods 0.000 claims abstract description 92
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
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- 206010037660 Pyrexia Diseases 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/88—Terminals, e.g. bond pads
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
本発明は、特に照明等に用いられる大面積発光の有機エレクトロルミネッセンス（ＥＬ）パネルにおいて、電極自身の配線抵抗による輝度ムラを低減することのできる有機エレクトロルミネッセンスパネルに関する。 The present invention relates to an organic electroluminescence panel that can reduce luminance unevenness due to wiring resistance of an electrode itself, particularly in a large-area light-emitting organic electroluminescence (EL) panel used for illumination or the like.
有機エレクトロルミネッセンス（ＥＬ）パネルは、基板上にキャリア輸送や発光能を有する有機機能薄膜を、一対の電極で挟んだ構造となっており、前記基板及び一対の電極のうちの少なくとも一方には光透過性の材料が用いられている。この光透過性の電極にはＩＴＯやＺｎＯなどに代表される金属酸化物が用いられ、一般的な金属と比較してその電気抵抗は大きいので、有機ＥＬを駆動した際に電圧が均等に印加されずに輝度ムラが生じたり、発熱量が大きくなるという問題がある。 An organic electroluminescence (EL) panel has a structure in which an organic functional thin film having carrier transport and light emitting ability is sandwiched between a pair of electrodes on a substrate, and at least one of the substrate and the pair of electrodes has no light. A permeable material is used. The light transmissive electrode is made of a metal oxide typified by ITO or ZnO, and its electric resistance is higher than that of a general metal, so that a voltage is applied evenly when driving an organic EL. There is a problem that uneven brightness occurs or the amount of heat generation increases.
そのために透光性の電極上に補助電極を設けることが知られている（例えば特許文献１）。 For this purpose, it is known to provide an auxiliary electrode on a translucent electrode (for example, Patent Document 1).
必要な輝度が高く、発光面積も大きい照明用途などでは、駆動電流も大きくなり、配線抵抗による電圧降下や発熱の問題はより深刻である。また、近年有機ＥＬ自体の性能は向上してきており、配線抵抗によって生じる印加電圧のムラは輝度のムラに直結する。従って従来技術における配線抵抗低減手段のみでは不足である。 In lighting applications where the required luminance is high and the light emission area is large, the drive current also increases, and the problems of voltage drop and heat generation due to wiring resistance are more serious. In recent years, the performance of the organic EL itself has been improved, and unevenness in applied voltage caused by wiring resistance is directly connected to unevenness in luminance. Therefore, only the wiring resistance reduction means in the prior art is insufficient.
また、従来技術においては、パネルに用いられる有機材料は大気中の水分や酸素と反応することで劣化してしまうので、これらの雰囲気を遮断するために、前記有機ＥＬ構造部分を凹面を有するカバーにて気密封止したり、水分や酸素に対してバリア性を有するフィルムなどを貼り付けることによって保護している（例えば、特許文献２）。 In the prior art, the organic material used for the panel is deteriorated by reacting with moisture and oxygen in the atmosphere. Therefore, in order to block these atmospheres, the organic EL structure part has a concave surface. It is protected by sealing hermetically or by attaching a film having a barrier property against moisture or oxygen (for example, Patent Document 2).
封止技術に関していえば、外部からの水分・酸素の浸入は封止部材そのものを通してよりも、むしろ封止部材の接着界面からの浸入が課題であり、従来の技術ではこの課題を克服出来ていなかった。
本発明は、電極の配線抵抗による印加電圧のムラに起因する輝度ムラを低減すると共に、外部からの水分・酸素の浸入に対する封止性能の向上を果たした、特に照明等に用いる大面積発光の有機エレクトロルミネッセンスパネルを得ることにある。 The present invention has reduced luminance unevenness due to applied voltage unevenness due to electrode wiring resistance and improved sealing performance against the ingress of moisture and oxygen from the outside. The object is to obtain an organic electroluminescence panel.
本発明の上記課題は以下の手段により達成される。 The above object of the present invention is achieved by the following means.
１．基板上に、第１の電極、１層以上の有機薄膜、第２の電極を、この順序で有する有機エレクトロルミネッセンス素子と、前記有機エレクトロルミネッセンス素子を覆う封止部材と、を有する有機エレクトロルミネッセンスパネルにおいて、
前記第１の電極から引き出された少なくとも２つの第１の領域に、金属材料からなる第１の接合端子をそれぞれ有し、前記第１の接合端子はそれぞれが電気的に接続されており、
前記第２の電極から引き出された少なくとも２つの前記第１の領域と重ならない第２の領域に、金属材料からなる第２の接合端子をそれぞれ有し、前記第２の接合端子はそれぞれが電気的に接続されており、
前記電気的な接続がそれぞれ、前記封止部材を横断する金属薄膜層によるものであり、
前記金属薄膜層の幅が封止部材の接続部の１辺の長さに対して７０％以上であり、
前記第１の接合端子と、前記第２の接合端子とは、前記封止部材を前記有機エレクトロルミネッセンス素子に接着する機能を兼ねており、
前記第１の領域及び前記第２の領域のそれぞれの接合端子と、前記封止部材との接合は金属材料により行われていることを特徴とする有機エレクトロルミネッセンスパネル。
1. An organic electroluminescence panel having an organic electroluminescence element having a first electrode, one or more organic thin films, and a second electrode in this order on a substrate, and a sealing member covering the organic electroluminescence element In
In each of at least two first regions drawn out from the first electrode, each has a first joint terminal made of a metal material , and each of the first joint terminals is electrically connected;
Each of the second junction terminals made of a metal material has a second junction terminal in a second region that does not overlap the at least two first regions extracted from the second electrode, and each of the second junction terminals is an electric Connected,
Each of the electrical connections is by a metal thin film layer traversing the sealing member;
The width of the metal thin film layer is 70% or more with respect to the length of one side of the connecting portion of the sealing member,
The first joint terminal and the second joint terminal also have a function of bonding the sealing member to the organic electroluminescence element ,
The organic electroluminescence panel according to claim 1, wherein the joining terminals of the first region and the second region are joined to the sealing member by a metal material .
２．前記第１の領域及び前記第２の領域のそれぞれの接合端子と、前記封止部材との接合は半田もしくは熔着により行われることを特徴とする前記１に記載の有機エレクトロルミネッセンスパネル。 2. 2. The organic electroluminescence panel according to 1 above, wherein the joining terminals of the first region and the second region are joined to the sealing member by soldering or welding.
３．前記封止部材の、前記第１の接合端子に接合する部分及び前記第２の接合端子に接合する部分以外の辺縁部において、封止部材と前記基板とを樹脂を用いて接着することを特徴とする前記１または２に記載の有機エレクトロルミネッセンスパネル。 3. Bonding the sealing member and the substrate using a resin at a peripheral portion of the sealing member other than a portion bonded to the first bonding terminal and a portion bonded to the second bonding terminal. 3. The organic electroluminescence panel as described in 1 or 2 above.
４．第１の領域における第１の接合端子及び第２の領域における第２の接合端子と、前記封止部材との接合、または、樹脂による前記封止部材と基板との接着を水分または酸素濃度を低下させた雰囲気中で行うことを特徴とする前記１〜３のいずれか１項に記載の有機エレクトロルミネッセンスパネル。 4). The bonding between the first bonding terminal in the first region and the second bonding terminal in the second region and the sealing member, or the bonding between the sealing member and the substrate by resin is performed with moisture or oxygen concentration. 4. The organic electroluminescence panel according to any one of 1 to 3, which is performed in a reduced atmosphere.
５．前記封止部材に、外部の電源回路と接続される端子、または、有機エレクトロルミネッセンスの発光を制御する回路が組み込まれることを特徴とする前記１〜４のいずれか１項に記載の有機エレクトロルミネッセンスパネル。 5. 5. The organic electroluminescence according to any one of 1 to 4, wherein a terminal connected to an external power supply circuit or a circuit for controlling light emission of organic electroluminescence is incorporated in the sealing member. panel.
本発明により、輝度ムラや発熱が抑えられ、かつ、外部からの水分や酸素を充分に遮断できる、封止性能が向上した有機エレクトロルミネッセンスパネルが得られる。 According to the present invention, it is possible to obtain an organic electroluminescence panel with improved sealing performance that can suppress luminance unevenness and heat generation and can sufficiently block moisture and oxygen from the outside.
１ 基板
２ 陽極
３ 有機層
４ 陰極
５ 封止部材
６ 接着剤
７ 接合端子
８、９ 金属薄膜層DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Anode 3 Organic layer 4 Cathode 5 Sealing member 6 Adhesive 7 Joining terminal 8, 9 Metal thin film layer
以下本発明を実施するための最良の形態について詳細に説明する。 Hereinafter, the best mode for carrying out the present invention will be described in detail.
有機エレクトロルミネッセンス（ＥＬ）パネルにおいては、必要な輝度が高く、発光面積も大きい照明用途などでは、駆動電流も大きくなり、配線抵抗による電圧降下や発熱の問題はより深刻である。また、近年有機ＥＬパネル自体の性能は向上してきており、配線抵抗によって生じる印加電圧のむらは輝度のむらに直結する。したがって、従来技術において用いられている配線抵抗低減手段のみでは不足である。 In an organic electroluminescence (EL) panel, in a lighting application where required luminance is high and a light emitting area is large, a driving current becomes large, and problems of voltage drop and heat generation due to wiring resistance are more serious. In recent years, the performance of the organic EL panel itself has been improved, and unevenness in applied voltage caused by wiring resistance is directly related to unevenness in luminance. Therefore, only the wiring resistance reduction means used in the prior art is insufficient.
一方、封止技術に関していえば、外部からの水分・酸素の浸入は封止部材そのものを通してよりも、むしろ封止部材の接着界面からの浸入が課題であり、従来の技術においてはこの課題を克服できていなかった。 On the other hand, in terms of sealing technology, the entry of moisture and oxygen from the outside is a problem of penetration from the adhesive interface of the sealing member rather than through the sealing member itself, and this problem is overcome in the conventional technology. It wasn't done.
本発明においては、有機ＥＬ素子構造を構成する１対の電極は、それぞれの電極の、基材上の対向する２つの辺縁部に、少なくとも２つの第１の領域（第１の電極から）、少なくとも２つの第２の領域（第２の電極から）が引き出されている。引き出されたこの領域には金属材料がコーティングされて、接合端子が形成される。 In the present invention, the pair of electrodes constituting the organic EL element structure includes at least two first regions (from the first electrode) on the two opposing edge portions of the respective electrodes on the substrate. , At least two second regions (from the second electrode) are drawn. This extracted region is coated with a metal material to form a junction terminal.
引き出された第１の領域同士、および第２の領域同士、即ち、同一電極上の対向する領域同士を電気的に接続するように、少なくとも４箇所の辺縁部と合致する位置に接続端子を有し、対向するそれぞれの領域どうしを電気的に接続する短絡配線を備えた封止部材を封止部材として用意し、前記金属材料がコーティングされ形成された接合端子と封止部材とを半田もしくは溶接によって接合して、第１の電極および第２の電極のそれぞれの両端部を電気的に接続する。 In order to electrically connect the drawn first regions and the second regions, i.e., the opposing regions on the same electrode, connect the connection terminals at positions that match at least four edge portions. A sealing member provided with a short-circuit wiring for electrically connecting the opposing areas is prepared as a sealing member, and the joint terminal formed by coating the metal material and the sealing member are soldered or It joins by welding and the both ends of each of the 1st electrode and the 2nd electrode are electrically connected.
封止部材は、前記第１の領域と前記第２の領域に適合する位置にそれぞれ接合端子を有しており、前記接合端子は、基板上の前記第１の領域に形成された第１の接合端子、前記第２の領域に形成された第２の接合端子と溶接により接合されているので、前記封止部材の前記第１の領域に対向した接合端子部分及び前記第２の領域に対応した接合端子部分以外の辺縁部の封止されていない部分において、封止部材と前記基板とを例えばＵＶ硬化樹脂を用いて接着することにより、周囲全体が封止された、有機ＥＬパネルを得ることが出来る。 The sealing member has a joint terminal at a position that matches the first region and the second region, and the joint terminal is formed in the first region on the substrate. Since it is joined to the joining terminal and the second joining terminal formed in the second region by welding, it corresponds to the joining terminal portion facing the first region of the sealing member and the second region. An organic EL panel in which the entire periphery is sealed by bonding the sealing member and the substrate using, for example, a UV curable resin, in a non-sealed portion other than the joined terminal portion. Can be obtained.
このような封止部材（封止カバー）を用いることにより、有機ＥＬ素子構造を構成する電極の両端は外部において短絡することができるので、理論的には電気抵抗は１／４となり、輝度むらや発熱が抑制される。特に、陽極に用いられるＩＴＯ等の金属酸化物による透明電極においては、電位勾配が緩和されるのでこの輝度の均一化に好ましい。 By using such a sealing member (sealing cover), both ends of the electrodes constituting the organic EL element structure can be short-circuited outside, theoretically the electrical resistance becomes 1/4, and uneven brightness. And fever is suppressed. In particular, in a transparent electrode made of a metal oxide such as ITO used for the anode, the potential gradient is relaxed, which is preferable for uniforming the luminance.
また、上記第１の領域、また第２の領域における半田、溶接等は、基板及び封止部材の（即ち有機ＥＬパネルの）辺縁部の、前記領域が形成された部分を金属で覆い封止することになるので、その部分は外部からの水分や酸素を完全に遮断でき封止性能が高く、その他部分について樹脂の封止材料または接着剤を用いて接着、封止することで、樹脂の封止材料または接着剤等のみを用いた封止に比べ、封止性能の高い有機ＥＬパネルが得られる。 In addition, soldering, welding, etc. in the first region and the second region are performed by covering the portion where the region is formed on the edge of the substrate and the sealing member (that is, the organic EL panel) with metal. Therefore, the part can completely block moisture and oxygen from the outside, and the sealing performance is high, and the other parts are bonded and sealed using a resin sealing material or adhesive, and the resin is sealed. Compared with sealing using only a sealing material or an adhesive, an organic EL panel with high sealing performance can be obtained.
また、封止部材（封止カバー）を介してパネルへの給電が可能であり、封止カバーに、電源供給回路と接続される端子、ヒューズ、昇圧回路、その他有機ＥＬの発光を制御する回路（駆動回路）をここに搭載すれば実装スペースの削減も可能である。 In addition, power can be supplied to the panel via a sealing member (sealing cover), and a terminal connected to the power supply circuit, a fuse, a booster circuit, and other circuits for controlling light emission of the organic EL are connected to the sealing cover. If the (drive circuit) is mounted here, the mounting space can be reduced.
以下、本発明の有機ＥＬパネルの実施形態について、図を用いて説明する。 Hereinafter, embodiments of the organic EL panel of the present invention will be described with reference to the drawings.
図１は、従来の封止された有機ＥＬパネルの１例を断面図で示したものである。 FIG. 1 is a sectional view showing an example of a conventional sealed organic EL panel.
ガラス等の基板１上に、透明な陽極２、電極間に電位を印加することにより発光する発光層を含む有機層３、次いで陰極４が順次形成され、更に、前記有機ＥＬ素子構造部分に凹面を有する例えばガラス製の封止部材５を、基板周囲において接着剤６で接着することで、前記有機ＥＬ素子構造部分が封止された有機ＥＬパネルをうる。有機ＥＬ素子構造を構成する陽極、陰極にはそれぞれ基板辺縁部において金属の補助電極７ａが付けられていてもよい。 On a substrate 1 such as glass, a transparent anode 2, an organic layer 3 including a light emitting layer that emits light by applying a potential between the electrodes, and then a cathode 4 are sequentially formed, and a concave surface is formed on the organic EL element structure portion. An organic EL panel in which the organic EL element structure is sealed is obtained by adhering a sealing member 5 made of, for example, glass with an adhesive 6 around the substrate. A metal auxiliary electrode 7a may be attached to each of the anode and cathode constituting the organic EL element structure at the edge of the substrate.
図２に、本発明に係わる有機ＥＬパネルの１例を断面図及び平面図で示した。 FIG. 2 shows an example of an organic EL panel according to the present invention in a sectional view and a plan view.
基板１上にＩＴＯからなる陽極２、有機層３、アルミニウム等の金属からなる陰極４が順次形成された後、陽極上の両端辺縁部の２カ所の引き出し部２′の直上に、金属材料の接続端子７が形成される。ここでいう引き出し部２′が第１の領域である。
引き出し部２′は、封止部材５から外側にはみ出した陽極２上であって、その直上に補助電極７ａが設けられる部分を指す。図２では第１の領域が２ケ所であるが、補助電極の設計によってはこれに限られず、後述するように４ケ所であってもよい。After an anode 2 made of ITO, an organic layer 3 and a cathode 4 made of a metal such as aluminum are sequentially formed on the substrate 1, a metal material is placed immediately above the two lead portions 2 'on both sides of the anode. The connection terminal 7 is formed. The lead-out portion 2 'here is the first region.
The lead portion 2 ′ is a portion on the anode 2 that protrudes outward from the sealing member 5 and is provided with the auxiliary electrode 7 a immediately above it. In FIG. 2, there are two first regions, but the number of the first regions is not limited to this depending on the design of the auxiliary electrode, and may be four as described later.
接合端子７は、陽極２と、後述する封止部材５に設けられた短絡手段としての金属薄膜８とを、電気的に接続すると同時に、封止部材５を基板１と接着するための接着剤として機能するものである。よって、接合端子７は、導電性の高い金属材料により形成されることが好ましく、その方法は限定されないが、半田或いは熔封材料による成型、また、導電性、特に金属微粒子また金属めっき微粒子、例えば、銀微粒子等を含有する（銀ペースト）導電性接着剤をそのまま金属材料として所望の形状に適用して成型してもよいし、また、マスクを用いて、スパッタリング、蒸着等によりやや厚めに（数百ｎｍ〜数μｍ）金属薄膜をパターニング形成してもよい。 The bonding terminal 7 is an adhesive for electrically connecting the anode 2 and the metal thin film 8 as a short-circuit means provided on the sealing member 5 described later, and simultaneously bonding the sealing member 5 to the substrate 1. It functions as. Therefore, it is preferable that the junction terminal 7 is formed of a highly conductive metal material, and the method is not limited, but the molding is performed using solder or a sealing material, and the conductivity, particularly metal fine particles or metal plating fine particles, for example, In addition, a conductive adhesive containing silver fine particles or the like (silver paste) may be molded as it is by applying it as a metal material to a desired shape, or by using a mask to make it slightly thicker by sputtering, vapor deposition or the like ( (Several hundred nm to several μm) A metal thin film may be formed by patterning.
封止部材（封止カバー）５の組み込みにおいては、先ず、陽極２の辺縁部（第１の領域）もしくは陰極４の辺縁部（第２の領域）と、封止部材５とを、接合端子７によって接合し、封止部材５の表裏面上に形成された金属薄膜層８（陽極短絡配線）及び金属薄膜層９（陰極短絡配線）を介して同一電極同士を電気的に接続する。 In assembling the sealing member (sealing cover) 5, first, the edge portion (first region) of the anode 2 or the edge portion (second region) of the cathode 4, and the sealing member 5, The same electrodes are electrically connected to each other through the metal thin film layer 8 (anode short-circuit wiring) and the metal thin film layer 9 (cathode short-circuit wiring) formed on the front and back surfaces of the sealing member 5. .
図２（ａ）において、有機ＥＬ素子構造を構成する陽極２には、それぞれ基板上の陽極辺縁部の引き出し部２′の２箇所において金属の接合端子７が配置されることとなる。 In FIG. 2A, the anode 2 constituting the organic EL element structure is provided with metal junction terminals 7 at two portions of the lead-out portion 2 'on the edge of the anode on the substrate.
ガラス製の封止部材５の内部表面には、断面図で示すように、接合端子７間を電気的に接続できるよう、封止部材５を横断する補助電極幅の金属薄膜層８が形成されており、陽極２の対向する両端部と、金属薄膜層８とが、半田或いは熔封による接合端子７よって接合され、接合端子両端部は電気的に接続される（陽極短絡配線）。 On the inner surface of the sealing member 5 made of glass, a metal thin film layer 8 having an auxiliary electrode width that crosses the sealing member 5 is formed so as to be electrically connected between the joining terminals 7 as shown in a sectional view. The opposite end portions of the anode 2 and the metal thin film layer 8 are joined by the joining terminals 7 by soldering or sealing, and both the joining terminal end portions are electrically connected (anode short-circuit wiring).
また、前記金属薄膜層８が設けられた内部側と反対の封止部材外部表面側には、金属薄膜層８に直交するように別の金属薄膜層９が形成され、図２の断面図においては示されていないが、陰極４の、陽極の補助電極が形成されていない辺の両端２ケ所に設けられた引き出し部４′（第２の領域）と、金属薄膜層９とが、やはり半田或いは熔封による接合端子７により接合され、電気的に接続している（陰極短絡配線）。 Further, another metal thin film layer 9 is formed so as to be orthogonal to the metal thin film layer 8 on the outer surface side of the sealing member opposite to the inner side where the metal thin film layer 8 is provided. Although not shown, the lead-out portions 4 '(second regions) provided at the two ends of the cathode 4 where the auxiliary electrode for the anode is not formed and the metal thin film layer 9 are also soldered. Or it is joined by the joining terminal 7 by fusing, and is electrically connected (cathode short-circuit wiring).
金属薄膜層８の形態（形状）は規定されない。導通が図れれば、薄膜である必要さえなく、リード線、或いは複数のリード線からなる接続でも構わない。しかしながら、半田或いは熔封による前記陽極短絡配線及び陰極短絡配線の接合端子とそれぞれの補助電極との接続は、連続した端部を形成して基板周囲の所定領域を封止することが好ましいため、短絡配線は所定の面積をもつ金属薄膜層からなることが好ましい。 The form (shape) of the metal thin film layer 8 is not specified. As long as conduction is achieved, it is not necessary to be a thin film, and a lead wire or a connection consisting of a plurality of lead wires may be used. However, the connection between the anode short-circuit wiring and the cathode short-circuit wiring junction terminal and each auxiliary electrode by soldering or sealing preferably forms a continuous end and seals a predetermined region around the substrate. The short-circuit wiring is preferably made of a metal thin film layer having a predetermined area.
従って、封止部材（封止カバー）５は、対向する辺縁部同士が電気的に接続されるように、基材の表裏のほとんどを金属薄膜層でカバーすることが好ましい。 Therefore, it is preferable that the sealing member (sealing cover) 5 covers most of the front and back of the base material with the metal thin film layer so that the opposing edge portions are electrically connected to each other.
陽極２或いは陰極４の短絡配線となる金属薄膜８または９は、導電性金属、例えば、銀、金、プラチナ、或いは銅、ニッケル等の金属薄膜であり、スパッタリング、蒸着等の方法で、また金属微粒子ペーストの塗布による形成などによって、封止部材上に、所望のパターンで形成することが出来る。またメッキ法によって金属薄膜を作製してもよい。 The metal thin film 8 or 9 serving as the short-circuit wiring of the anode 2 or the cathode 4 is a conductive metal, for example, a metal thin film such as silver, gold, platinum, copper, nickel, etc. It can be formed in a desired pattern on the sealing member by, for example, formation by applying a fine particle paste. Moreover, you may produce a metal thin film by the plating method.
金属薄膜８または９の抵抗率は、１×１０−７Ωｍ以下であることが望ましい。The resistivity of the metal thin film 8 or 9 is desirably 1 × 10 −7 Ωm or less.
金属薄膜層８または９のそれぞれの面積は、封止部材５の接続部の面積の３０％以上となることが好ましく、５０％以上となることがより好ましく、７０％以上となることが最も好ましい。また、金属薄膜８または９の幅は、封止部材５の接続部の１辺の長さに対し、３０％以上となることが好ましく、５０％以上となることがより好ましく、７０％以上となることが最も好ましい。 The area of each metal thin film layer 8 or 9 is preferably 30% or more, more preferably 50% or more, and most preferably 70% or more of the area of the connecting portion of the sealing member 5. . Further, the width of the metal thin film 8 or 9 is preferably 30% or more, more preferably 50% or more, and 70% or more with respect to the length of one side of the connecting portion of the sealing member 5. Most preferably.
尚、このような金属薄膜８または９を有する封止部材５とパネルの辺縁部に形成される接合端子７は、半田もしくはそれぞれの金属自体の融着による接合により設けられることが好ましい。 In addition, it is preferable that the sealing member 5 having the metal thin film 8 or 9 and the joining terminal 7 formed on the edge of the panel are provided by joining by soldering or fusion of each metal itself.
パネルの辺縁部の接合端子７は、金属により接合或いは熔封されたものであるため、これ以外の部分、即ち、金属どうしが接合されない部分（図２の平面図で肩の部分４箇所）を接着剤を用い有機ＥＬパネルを封止する。 Since the joining terminal 7 at the edge of the panel is joined or melted by metal, other parts, that is, parts where the metals are not joined (four shoulder parts in the plan view of FIG. 2). The organic EL panel is sealed with an adhesive.
接着剤としては、エポキシ系、アクリル系等の熱或いは光（ＵＶ）硬化型の接着剤を用いることができる。 As the adhesive, an epoxy or acrylic heat or light (UV) curable adhesive can be used.
このようにして封止された有機ＥＬパネルは、基板と封止部材の接着を、周囲の（例えば四辺）の大部分において金属材料で行うため、この部分の気密度は高く、空気、酸素、水蒸気等のガスに対して封止性が高いので、全体としても外部からの水分や酸素を充分に遮断できる、封止性能が高い有機ＥＬパネルが得られる。 The organic EL panel thus sealed adheres the substrate and the sealing member with a metal material in most of the surroundings (for example, the four sides). Therefore, the air density of this part is high, and air, oxygen, Since the sealing property is high with respect to a gas such as water vapor, an organic EL panel with high sealing performance that can sufficiently block moisture and oxygen from the outside as a whole can be obtained.
図２（ｂ）は、前述の図２（ａ）において、接合端子７を、金属補助電極７ａと、結着部材７ｂとで構成したものである。金属補助電極７ａは、金属テープ等を加工して陽極２上の引き出し部に作製し、その後、この上に結着部材７ｂとして、半田或いは、導電性接着剤を用い熔封し、封止部材５と接合する。このような構成とすることで、より電気抵抗を下げ、封止効果も高めることができる。 FIG. 2B shows a structure in which the junction terminal 7 is composed of the metal auxiliary electrode 7a and the binding member 7b in FIG. 2A. The metal auxiliary electrode 7a is produced by processing a metal tape or the like on the lead-out portion on the anode 2, and then sealing with a solder or a conductive adhesive as a binding member 7b on the sealing member. 5 is joined. By setting it as such a structure, an electrical resistance can be lowered | hung more and the sealing effect can also be improved.
それ以外の構成は、図２（ａ）と同じである。 The other configuration is the same as that of FIG.
以下、本発明の実施の態様についても図を用いて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
図３に本発明に係わる有機ＥＬパネルの製造工程を示した。 FIG. 3 shows a manufacturing process of the organic EL panel according to the present invention.
図３（ａ）は、基板上に透明電極（陽極）を形成したところを示す。 FIG. 3A shows a state where a transparent electrode (anode) is formed on the substrate.
基板としては、透明であればよく、ガラス、また、ガラス以外の材質、たとえばポリカーボネート（ＰＣ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）などのプラスチックでもよい。基板のサイズ、板厚の限定はしない。 The substrate may be transparent and may be glass or a material other than glass, for example, plastic such as polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN). There is no limitation on the size and thickness of the substrate.
例えば、無アルカリガラス（１００×１００ｍｍ、ｔ０．７ｍｍ）上に、陽極（第１の電極）２を作製する（図３（ａ））。 For example, the anode (first electrode) 2 is produced on an alkali-free glass (100 × 100 mm, t0.7 mm) (FIG. 3A).
即ち、透明電極としてＩＴＯをスパッタリング法にて厚み１２０ｎｍで形成した。次に、ＩＴＯパターンの両端（第１の領域）と、ＩＴＯパターンとは接触しない第２の領域（図１、左右両端部）に、５ｍｍの幅でＮｉをスパッタリング法にて５００ｎｍの厚みで形成し接合端子７とした。尚、ＩＴＯ、Ｎｉのパターニングには成膜時にマスクを用いた（図３（ａ））。 That is, ITO was formed as a transparent electrode with a thickness of 120 nm by sputtering. Next, Ni is formed with a width of 5 mm and a thickness of 500 nm by sputtering at both ends (first region) of the ITO pattern and a second region (FIG. 1, both left and right end portions) that are not in contact with the ITO pattern. The joint terminal 7 was obtained. Note that a mask was used during the film formation for patterning ITO and Ni (FIG. 3A).
透明電極としてはＩＺＯ、ネサ膜、Ａｕなどの金属薄膜でもよい。補助電極の材料はＦｅ、Ｃｕ、Ｐｂ、Ｚｎ、Ｓｎ、Ａｌ等の金属、またはこれらの合金や積層膜でもよい。透明電極、接合端子ともに成膜方法は限定されずＰＶＤ法、ＣＶＤ法、印刷などによってもよい。また、パターニング方法、膜厚も限定されない。 The transparent electrode may be a metal thin film such as IZO, Nesa film or Au. The material of the auxiliary electrode may be a metal such as Fe, Cu, Pb, Zn, Sn, Al, or an alloy or laminated film thereof. The film forming method is not limited for both the transparent electrode and the junction terminal, and the PVD method, the CVD method, printing, or the like may be used. Further, the patterning method and the film thickness are not limited.
透明電極と接合端子配置パターンのバリエーション（例）を図４（ａ）に示す。 A variation (example) of the transparent electrode and the joining terminal arrangement pattern is shown in FIG.
次いで、陽極２上に有機層３を成膜する。正孔輸送層としてα−ＮＰＤを１５ｎｍ、発光層としてＡｌｑ3を３０ｎｍの膜厚で順次に蒸着法にてマスクを用いパターニング、積層成膜する（図３（ｂ））。Next, the organic layer 3 is formed on the anode 2. Patterning and stacking are performed by using a mask by vapor deposition in sequence with a film thickness of α-NPD of 15 nm as the hole transport layer and Alq 3 as the light emitting layer of 30 nm (FIG. 3B).
図４（ｂ）に電極配置パターンを変えた例についても有機層を成膜した例を示した。 FIG. 4B shows an example in which an organic layer is formed as an example in which the electrode arrangement pattern is changed.
有機層３の構成は少なくとも１層の発光層を含む以外、特に限定はない。すなわち最も単純ケースにおいては発光層のみであるし、例えば、電荷注入層／輸送層、電荷阻止層等を追加しても良い。また各層とも複数の材料からなる混合層（共蒸着層）であってもよい。また、各層の膜厚、成膜方法についても蒸着法、塗布法等特に限定はない
有機層形成後、陰極（第２の電極）４を形成する（図３（ｃ））。The configuration of the organic layer 3 is not particularly limited except that it includes at least one light emitting layer. That is, in the simplest case, only the light emitting layer is provided. For example, a charge injection layer / transport layer, a charge blocking layer, or the like may be added. Each layer may be a mixed layer (co-evaporation layer) made of a plurality of materials. Further, the film thickness and film forming method of each layer are not particularly limited, such as a vapor deposition method and a coating method. After the organic layer is formed, the cathode (second electrode) 4 is formed (FIG. 3C).
陰極４として、Ａｌを抵抗加熱蒸着法にて２００ｎｍ成膜する。また、陰極は先に形成した第２の領域の接合端子と接触して電気的に接続されるように形成する。パターニングにはマスクを用いる。 As the cathode 4, Al is deposited to a thickness of 200 nm by resistance heating vapor deposition. Further, the cathode is formed so as to be in contact with and electrically connected to the junction terminal of the second region formed previously. A mask is used for patterning.
陰極を成膜する前にバッファ層としてＬｉ、Ｃａ、Ｃｓまたはこれらの酸化物やフッ化物などを成膜してもよい。また上記材料と陰極材料との共蒸着でも良い。陰極の材料としては、４ｅＶより小さな仕事関数をもつ金属が適しており、マグネシウム、アルミニウム等、また合金としては、マグネシウム／銀、リチウム／アルミニウム等が代表例として挙げられる。膜厚、成膜方法はマスク蒸着、フォトリソパターニング、メッキ、印刷等が使用できるが、限定されない。 Before forming the cathode, Li, Ca, Cs, or an oxide or fluoride thereof may be formed as a buffer layer. Further, co-evaporation of the above material and the cathode material may be used. A metal having a work function smaller than 4 eV is suitable as the material for the cathode, and magnesium / silver, lithium / aluminum, and the like are given as typical examples of magnesium and aluminum, and alloys. The film thickness and film forming method can be mask vapor deposition, photolithography patterning, plating, printing, or the like, but are not limited.
次いで、封止部材（封止カバー）を用意した。 Next, a sealing member (sealing cover) was prepared.
厚み１．１ｍｍのガラス基板の片側をサンドブラスト法により深さ０．５ｍｍ切削してキャップ状にする。図３（ｄ）に断面図を示した。 One side of a glass substrate having a thickness of 1.1 mm is cut into a cap shape by cutting 0.5 mm in depth by a sandblast method. A cross-sectional view is shown in FIG.
この封止部材の外側（外面）、内側（内面）に、それぞれ陽極の接合端子（第１の領域に設けられた）同士、陰極の接合端子（第２の領域に設けられた）同士を電気的に接続し得るＮｉの短絡配線（陽極短絡配線、陰極短絡配線）のパターンを設けた。 The anode joining terminals (provided in the first region) and the cathode joining terminals (provided in the second region) are electrically connected to the outside (outer surface) and inside (inner surface) of the sealing member, respectively. A pattern of a Ni short-circuit wiring (anode short-circuit wiring, cathode short-circuit wiring) that can be connected to each other was provided.
短絡配線の形成方法は接合端子と同じくスパッタリング法を用いた（厚み５００ｎｍ）。短絡配線のパターンは図３（ｄ）のように封止部材の断面にも形成した。 As a method for forming the short-circuit wiring, the sputtering method was used as in the case of the junction terminal (thickness: 500 nm). The short-circuit wiring pattern was also formed on the cross-section of the sealing member as shown in FIG.
封止部材の材質はガラスに限定されず、また、キャップ状の構造も必須ではなく、むしろフィルム状であれば薄型化も実現できる。この場合には、封止部材に形成した接合端子を連結する短絡配線（陽極短絡配線）が有機ＥＬの陰極と接触しないように注意する必要がある。 The material of the sealing member is not limited to glass, and a cap-like structure is not essential. In this case, it is necessary to be careful that the short-circuit wiring (anode short-circuit wiring) that connects the joining terminals formed on the sealing member does not contact the cathode of the organic EL.
図４（ｃ）左図のごとき接合端子配置であれば、陽極と陰極それぞれの短絡配線が交差しないので（図４（ｄ）左図）、双方の短絡線を同じ面、例えば外側（外面）に形成できる。 In the case of the junction terminal arrangement as shown in the left figure of FIG. 4C, since the short-circuit wirings of the anode and the cathode do not intersect each other (FIG. 4D left figure), both short-circuit lines are arranged on the same surface, for example, the outside (outer surface). Can be formed.
これら短絡配線の材質はＮｉに限定する必要はなく、上記接合端子と同様な材質、形成方法がそのまま使用できる。後に接合端子と接合される箇所とそれらを短絡する材質が勿論異なっていてもよい。 The material of these short-circuit wirings need not be limited to Ni, and the same material and formation method as those of the above-mentioned junction terminals can be used as they are. Of course, the location to be joined to the joining terminal later and the material for short-circuiting them may be different.
また、封止部材（封止カバー）自体を、給電端子や有機ＥＬの駆動回路を実装したＦＰＣ（フレキシブルプリント基板）、ＣＯＦ（Ｃｈｉｐ ｏｎ Ｆｉｌｍ）にしてしまうことも出来る。 Further, the sealing member (sealing cover) itself can be an FPC (flexible printed circuit board) or COF (Chip on Film) on which a power supply terminal or an organic EL drive circuit is mounted.
図４（ｄ）右図に、図４（ｃ）右図の電極配置に対応した、封止部材としてＦＰＣ（フレキシブルプリント基板）を用いた例を示した。接合端子と接続される位置に銅電極が形成されており、駆動回路（昇圧回路、低電流回路、過電流保護回路等）を内蔵したＩＣチップが基板上に搭載されている。多層ＦＰＣを用い、各接合端子との接続はＦＰＣ内部で実現することができる。 FIG. 4D shows an example in which an FPC (flexible printed circuit board) is used as a sealing member corresponding to the electrode arrangement shown in the right diagram of FIG. A copper electrode is formed at a position connected to the junction terminal, and an IC chip incorporating a drive circuit (a boost circuit, a low current circuit, an overcurrent protection circuit, etc.) is mounted on the substrate. Using a multilayer FPC, connection with each junction terminal can be realized inside the FPC.
次いで、図５を用い封止方法の説明をする。 Next, the sealing method will be described with reference to FIG.
図３（ａ）〜（ｃ）に示した電極、接合端子配置を有する素子の封止について説明する。 The sealing of the element having the electrode and junction terminal arrangement shown in FIGS. 3A to 3C will be described.
図５（１）に示す如く有機ＥＬ素子基板と封止部材を合わせて保持し、陽極短絡配線の接合端子と接続される接合部と、接合端子を半田槽に点線で示される位置まで浸漬して接合する。陽極短絡配線の反対側についても同様に接合し、また、陰極についても同様にしてそれぞれ各辺を半田槽に浸漬して接合する。 As shown in FIG. 5 (1), the organic EL element substrate and the sealing member are held together, and the joining portion connected to the joining terminal of the anode short-circuit wiring and the joining terminal are immersed in the solder bath to the position indicated by the dotted line. And join. The opposite side of the anode short-circuit wiring is similarly bonded, and the cathode is similarly bonded by dipping each side in a solder bath.
図５（２）に半田付けされた有機ＥＬパネルを断面図にて示した。 FIG. 5B is a cross-sectional view of the organic EL panel soldered.
半田付けできない箇所は、ＵＶ硬化樹脂（例えば、光硬化性の樹脂（ＷｏｒｌｄＲｏｃｋ型番７２Ａ１４：協立化学産業（株）製））をディスペンサでポッティングして、ＵＶ照射装置で紫外線照射行い硬化して封止する（図５（３））。 A portion that cannot be soldered is sealed with a UV curable resin (for example, a photo-curable resin (WorldRock Model No. 72A14: manufactured by Kyoritsu Chemical Industry Co., Ltd.)) with a dispenser, irradiated with ultraviolet rays using a UV irradiation device, and cured. Stop (FIG. 5 (3)).
これらのプロセスは脱酸素、脱水分の不活性ガス雰囲気下、例えば窒素下で実施することが好ましい。 These processes are preferably carried out under an inert gas atmosphere of deoxygenated and dehydrated, for example, nitrogen.
また、有機ＥＬパネルの基板や封止部材をフィルム化した場合には、陰極４の接合端子７と、封止部材の陽極短絡線の接合端子とを半田を用いてレーザ（ＹＡＧレーザ、高出力半導体レーザ等）や抵抗加熱でシームレスに合金化、溶接しても良い（図５（４））。図では陰極短絡配線と接合端子を溶接した例を示す。また、隙間を埋める樹脂はＵＶ硬化樹脂に限定されない。 In addition, when the organic EL panel substrate or the sealing member is formed into a film, the joining terminal 7 of the cathode 4 and the joining terminal of the anode short-circuit line of the sealing member are lasered (YAG laser, high output) using solder. It may be alloyed and welded seamlessly by a semiconductor laser or the like or resistance heating (FIG. 5 (4)). The figure shows an example in which the cathode short-circuit wiring and the junction terminal are welded. The resin that fills the gap is not limited to the UV curable resin.
以上により本発明に係わる有機ＥＬパネルについてその構造また製造方法について説明したが、本発明は勿論これらに限定されるものではない。本発明は、陽極短絡配線、また陰極短絡配線を設けることで、電極の配線抵抗による印加電圧のムラに起因する輝度ムラを低減すると共に、短絡配線による接合端子の接続を用いて、外部からの水分・酸素の浸入に対する封止性能の向上を果たしたものであり、これにより特に大面積発光の有機ＥＬパネルにおける輝度ムラの低減を果し、封止性能が向上した有機ＥＬパネルを得ることが出来る。 Although the structure and the manufacturing method of the organic EL panel according to the present invention have been described above, the present invention is not limited to these. The present invention reduces the luminance unevenness due to the unevenness of the applied voltage due to the wiring resistance of the electrode by providing the anode short-circuit wiring or the cathode short-circuit wiring, and also uses the connection of the junction terminal by the short-circuit wiring, from the outside. Improves sealing performance against moisture / oxygen intrusion, thereby reducing luminance unevenness particularly in large-area organic EL panels and obtaining an organic EL panel with improved sealing performance I can do it.
Claims (5)
前記第１の電極から引き出された少なくとも２つの第１の領域に、金属材料からなる第１の接合端子をそれぞれ有し、前記第１の接合端子はそれぞれが電気的に接続されており、
前記第２の電極から引き出された少なくとも２つの前記第１の領域と重ならない第２の領域に、金属材料からなる第２の接合端子をそれぞれ有し、前記第２の接合端子はそれぞれが電気的に接続されており、
前記電気的な接続がそれぞれ、前記封止部材を横断する金属薄膜層によるものであり、
前記金属薄膜層の幅が封止部材の接続部の１辺の長さに対して７０％以上であり、
前記第１の接合端子と、前記第２の接合端子とは、前記封止部材を前記有機エレクトロルミネッセンス素子に接着する機能を兼ねており、
前記第１の領域及び前記第２の領域のそれぞれの接合端子と、前記封止部材との接合は金属材料により行われていることを特徴とする有機エレクトロルミネッセンスパネル。 An organic electroluminescence panel having an organic electroluminescence element having a first electrode, one or more organic thin films, and a second electrode in this order on a substrate, and a sealing member covering the organic electroluminescence element In
In each of at least two first regions drawn out from the first electrode, each has a first joint terminal made of a metal material , and each of the first joint terminals is electrically connected;
Each of the second junction terminals made of a metal material has a second junction terminal in a second region that does not overlap the at least two first regions extracted from the second electrode, and each of the second junction terminals is an electric Connected,
Each of the electrical connections is by a metal thin film layer traversing the sealing member;
The width of the metal thin film layer is 70% or more with respect to the length of one side of the connecting portion of the sealing member,
The first joint terminal and the second joint terminal also have a function of bonding the sealing member to the organic electroluminescence element ,
The organic electroluminescence panel according to claim 1, wherein the joining terminals of the first region and the second region are joined to the sealing member by a metal material .
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