JP5277597B2 - module - Google Patents

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JP5277597B2
JP5277597B2 JP2007245439A JP2007245439A JP5277597B2 JP 5277597 B2 JP5277597 B2 JP 5277597B2 JP 2007245439 A JP2007245439 A JP 2007245439A JP 2007245439 A JP2007245439 A JP 2007245439A JP 5277597 B2 JP5277597 B2 JP 5277597B2
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substrate
wiring
hole
heat conducting
main surface
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JP2009076750A (en
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昭雄 吉本
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Daikin Industries Ltd
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Daikin Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate the emission of heat generated by en element and reduce the mounting height from a substrate. <P>SOLUTION: A module includes: a substrate 20 having one principal plane 20a, the other principal plane 20b and a through hole 22; a heat conducting part 30 having a mounting surface 32 arranged in such a manner as to close the through hole 22 and recessed towards the other principal plane 20b side rather than one principal plane 20a of the substrate 20; and an element 40 fixed onto the mounting surface 32. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

この発明は、パワー半導体のベアチップ等の素子を基板に実装するための技術に関する。   The present invention relates to a technique for mounting an element such as a power semiconductor bare chip on a substrate.

一般的なパワーモジュールでは、パワー半導体等のベアチップが金属基板やセラミック基板に放熱部材（スプレッダとも呼ばれる）を介して実装され、アルミニウム（Ａｌ）等のワイヤにより電気配線が行われている。   In a general power module, a bare chip such as a power semiconductor is mounted on a metal substrate or a ceramic substrate via a heat dissipation member (also referred to as a spreader), and electrical wiring is performed using a wire such as aluminum (Al).

しかしながら、金属基板やセラミック基板は高価であり、コスト的に不利である。   However, metal substrates and ceramic substrates are expensive and disadvantageous in cost.

一方、安価な樹脂基板を用いた場合、樹脂基板の熱伝導率は低いため、そのままでは樹脂基板を通じてパワー半導体を十分に放熱できない。   On the other hand, when an inexpensive resin substrate is used, since the thermal conductivity of the resin substrate is low, the power semiconductor cannot be sufficiently radiated through the resin substrate as it is.

これを解決する技術として、特許文献１に開示のものがある。特許文献１では、基板に形成された貫通孔を埋設するようにスプレッダが配設され、このスプレッダ上に素子が配置されている。そして、素子で生じた熱がスプレッダを通じて基板の反対側の面に放出されるようになっている。   As a technique for solving this, there is one disclosed in Patent Document 1. In Patent Document 1, a spreader is disposed so as to embed a through-hole formed in a substrate, and an element is disposed on the spreader. The heat generated by the element is released to the opposite surface of the substrate through the spreader.

特開２００７−８１３７９号公報JP 2007-81379 A

ところで、パワー半導体等を使用する装置において、近年小型化の要求が強まっている。このため、実装高さについても低くできることが好ましい。   Meanwhile, in recent years, there is an increasing demand for downsizing of devices using a power semiconductor or the like. For this reason, it is preferable that the mounting height can be lowered.

そこで、本発明は、素子で生じた熱を放出し易くでき、かつ、基板からの実装高さを低くすることを目的とする。   Therefore, an object of the present invention is to easily release the heat generated in the element and to reduce the mounting height from the substrate.

上記課題を解決するため、第１の態様に係るモジュールは、一方主面（２０ａ）と、この一方主面とは反対側の他方主面（２０ｂ）と、貫通孔（２２）とを有する基板（２０、１２０、２２０、３２０）と、前記貫通孔を塞ぐように配設され、前記基板の一方主面よりも前記他方主面側に凹む実装面（３２、２３２）を有する熱伝導部（３０、１３０、２３０、３３０）と、前記実装面上に固定された素子（４０）とを備えたものである。また、前記基板の一方主面に第２の配線（２８）が形成され、前記熱伝導部（３０、１３０、２３０、３３０）は導電性を有しており、前記素子は、前記熱伝導部を介して前記第２の配線に電気的に接続されており、前記基板（１２０）にスルーホールが形成され、前記熱伝導部（１３０）は、前記貫通孔を閉塞するように広がる板状の本体部（３４）と、前記本体部から前記貫通孔の内周面の少なくとも一部に沿って立上がるように延びる側壁部（３６）と、前記側壁部の先端部に設けられ、前記スルーホールに前記基板の一方主面側より挿入可能に形成されると共に前記スルーホールに挿入された状態で前記第２の配線に電気的に接続される挿入端子部（１３８）と、を有する。 In order to solve the above-described problem, the module according to the first aspect includes a substrate having one main surface (20a), the other main surface (20b) opposite to the one main surface, and a through hole (22). (20, 120, 220, 320) and a heat conduction part (32, 232) that is disposed so as to close the through-hole and is recessed toward the other main surface side from the one main surface of the substrate. 30, 130, 230, 330) and an element (40) fixed on the mounting surface. In addition, a second wiring (28) is formed on one main surface of the substrate, the heat conducting part (30, 130, 230, 330) is conductive, and the element is the heat conducting part. Is electrically connected to the second wiring via, a through hole is formed in the substrate (120), and the heat conducting part (130) is a plate-like opening that closes the through hole. A main body portion (34); a side wall portion (36) extending from the main body portion so as to rise along at least a part of an inner peripheral surface of the through hole; And an insertion terminal portion (138) formed so as to be insertable from one main surface side of the substrate and electrically connected to the second wiring in a state of being inserted into the through hole.

また、第１の態様に係るモジュールは、前記熱伝導部のうち前記実装面とその反対側の面間の厚み寸法（Ｈ１、Ｈ３）は、前記基板の厚み寸法（Ｈ２）よりも小さいものである。 Further, the module according to the first aspect, the thickness between surfaces of the mounting surface and the opposite side of the front Kinetsu conductive portion (H1, H3) are those wherein less than the thickness of the substrate (H2) It is.

さらに、第１の態様に係るモジュールは、前記基板の一方主面に第１の配線（２４）が形成され、前記素子がワイヤ（２６）を介して前記第１の配線に電気的に接続され、前記ワイヤを封止するように絶縁部材（５０）が設けられたものである。 Furthermore, the module according to the first aspect, the first wiring on one main surface of the front Stories substrate (24) is formed, said element electrically connected to said first wiring through the wire (26) An insulating member (50) is provided so as to seal the wire.

この第１の態様に係るモジュールによると、素子で生じた熱は熱伝導部を介して素子とは反対側に伝導される。したがって、素子で生じた熱を放出し易くできる。また、熱伝導部は、前記基板の一方主面よりも前記他方主面側に凹む実装面を有しており、この実装面に素子が固定される。このため、素子の高さを、基板の一方主面等に固定した場合よりも低くでき基板からの実装高さを低くすることができる。 According to the module according to the first aspect, the heat generated in the element is conducted to the opposite side of the element through the heat conducting portion. Therefore, heat generated in the element can be easily released. Further, the heat conducting portion has a mounting surface that is recessed toward the other main surface rather than the one main surface of the substrate, and the element is fixed to the mounting surface. For this reason, the height of an element can be made lower than the case where it fixes to the one main surface etc. of a board | substrate, and the mounting height from a board | substrate can be made low.

また、前記熱伝導部のうち前記実装面とその反対側の面間の厚み寸法は、前記基板の厚み寸法よりも小さいので、熱伝導部の体積を減少させることができ、軽量化及びコスト低減を図ることができる。 The thickness dimension between the plane of the mounting surface and the opposite side of the addition, prior Kinetsu conductive portion is smaller than the thickness of the substrate, it is possible to reduce the volume of the heat conductive portion, weight and Cost reduction can be achieved.

また、前記基板の一方主面に第１の配線が形成され、前記素子がワイヤを介して前記第１の配線に電気的に接続されている場合、素子の高さを、基板の一方主面等に固定した場合よりも低くできるので、ワイヤの高さも低くできる。このため、絶縁部材の高さも低くでき、封止用の絶縁部材の使用量を削減できる。 Also, the first wiring on one main surface of the front Stories substrate formation, when the device is electrically connected to the first wiring through the wire, the height of the elements, one of the substrates Since it can be made lower than when it is fixed to the main surface or the like, the height of the wire can also be reduced. For this reason, the height of an insulating member can also be made low and the usage-amount of the insulating member for sealing can be reduced.

さらに、熱伝導部を利用して、素子と第２の配線とを電気的に接続することができる。 In addition, by utilizing the heat conduction portion can be electrically connected to the element and the second wiring.

第１の態様によると、挿入端子部をスルーホールに挿入することで、熱伝導部と第２の配線とを容易に電気的に接続することができると共に、熱伝導部を強固に固定できる。 According to the first aspect, by inserting the insertion terminal portion into the through hole, the heat conducting portion and the second wiring can be easily electrically connected, and the heat conducting portion can be firmly fixed.

以下の各実施形態によって開示されるモジュールに共通する概括的な構成は、基板に形成された貫通孔に、当該貫通孔を塞ぐように熱伝導部を配設すると共に、当該熱伝導部の実装面を基板よりも凹むように形成し、当該実装面に素子を固定した点である。   The general configuration common to the modules disclosed in the following embodiments is that a heat conduction part is disposed in a through hole formed in a substrate so as to close the through hole, and the heat conduction part is mounted. The surface is formed so as to be recessed from the substrate, and the element is fixed to the mounting surface.

これにより、素子で生じた熱は熱伝導部を介して素子とは反対側に伝導され、効率よく放熱できる。また、素子の高さを低くすることができ、基板からの実装高さを低くすることができる。   Thereby, the heat generated in the element is conducted to the opposite side of the element through the heat conducting portion, and can be radiated efficiently. In addition, the height of the element can be reduced, and the mounting height from the substrate can be reduced.

以下、各実施形態により具体的な構成を説明する。   Hereinafter, a specific configuration will be described according to each embodiment.

｛第１実施形態｝
以下、第１実施形態に係るモジュール１０について説明する。図１は本実施形態に係るモジュール１０を示す平面図であり、図２は図１のＩＩ−ＩＩ線断面図であり、図３は本実施形態に係るモジュール１０の底面図である。 {First embodiment}
Hereinafter, the module 10 according to the first embodiment will be described. 1 is a plan view showing a module 10 according to the present embodiment, FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1, and FIG. 3 is a bottom view of the module 10 according to the present embodiment.

このモジュール１０は、基板２０と、熱伝導部３０と、素子４０とを備えている。   The module 10 includes a substrate 20, a heat conducting unit 30, and an element 40.

基板２０は、一方主面２０ａとこれとは反対側を向く他方主面２０ｂとを有する板状部材に形成されている。この基板２０としては、例えば、樹脂基板が用いられる。   The board | substrate 20 is formed in the plate-shaped member which has the one main surface 20a and the other main surface 20b which faces the other side. For example, a resin substrate is used as the substrate 20.

基板２０には、その厚み方向に沿って貫通する貫通孔２２が形成されている。貫通孔２２は、内部に素子４０を収容配置可能な程度に十分に大きさの開口形状に形成されている。貫通孔２２は、略円形状に開口していても、略多角形状に開口していてもよい。ここでは、貫通孔２２は、略方形状孔に形成されている。   A through hole 22 is formed in the substrate 20 so as to penetrate along the thickness direction. The through hole 22 is formed in an opening shape that is large enough to accommodate and dispose the element 40 therein. The through hole 22 may be opened in a substantially circular shape or may be opened in a substantially polygonal shape. Here, the through hole 22 is formed in a substantially rectangular hole.

また、基板２０の一方主面２０ａには、銅箔等によって第１の配線２４及び第２の配線２８が形成されている。第１の配線２４は、上記貫通孔２２から離れた領域に形成されている。第２の配線２８は、貫通孔２２の開口周縁部及びそこから一側外方に延出する領域に形成されている。また、第２の配線２８は、貫通孔２２の内周面に沿って形成された内周配線２９に対しても電気的に接続された態様で一体化されている。   Further, the first wiring 24 and the second wiring 28 are formed on one main surface 20a of the substrate 20 by using a copper foil or the like. The first wiring 24 is formed in a region away from the through hole 22. The second wiring 28 is formed in the opening peripheral edge of the through hole 22 and in a region extending outwardly from one side. Further, the second wiring 28 is integrated in such a manner that it is also electrically connected to the inner peripheral wiring 29 formed along the inner peripheral surface of the through hole 22.

図４は熱伝導部３０を示す斜視図である。図１〜図４に示すように、熱伝導部３０は、上記貫通孔２２と略同じ又はそれよりも大きな広がりを有する形状に形成され、当該貫通孔２２を塞ぐようにして配設可能に構成されている。また、熱伝導部３０のうち上記基板２０の一方主面２０ａと同じ方向を向く一主面は、平坦な実装面３２に形成されている。そして、上記貫通孔２２を塞ぐようにして熱伝導部３０を配設した状態で、実装面３２が基板２０の一方主面２０ａより他方主面２０ｂ側に凹むようになっている。   FIG. 4 is a perspective view showing the heat conducting unit 30. As shown in FIGS. 1 to 4, the heat conducting portion 30 is formed in a shape that is substantially the same as or larger than the through hole 22 and can be disposed so as to close the through hole 22. Has been. In addition, one main surface of the heat conducting unit 30 facing the same direction as the one main surface 20 a of the substrate 20 is formed on a flat mounting surface 32. The mounting surface 32 is recessed from the one main surface 20a of the substrate 20 toward the other main surface 20b in a state where the heat conducting portion 30 is disposed so as to close the through hole 22.

より具体的には、熱伝導部３０は、貫通孔２２を閉塞するように広がる板状の本体部３４と、当該本体部３４から貫通孔２２の内周面に沿って立上がるように延びる側壁部３６とを有している。ここでは、本体部３４は、貫通孔２２の開口形状に対応する略方形板状に形成されており、その４辺のそれぞれから立上がるようにして４方を囲うように側壁部３６が形成されている。また、各側壁部３６には、その上側の端縁部から外方に向けて突出する鍔状縁部３７が形成されている。本体部３４の底面と鍔状縁部３７の底面との間の距離寸法は、基板２０の厚み寸法に第２の配線２８の厚み寸法を付加した寸法と略同一に設定されている。   More specifically, the heat conducting portion 30 has a plate-like main body portion 34 that spreads so as to close the through hole 22, and a side wall that extends from the main body portion 34 along the inner peripheral surface of the through hole 22. Part 36. Here, the main body portion 34 is formed in a substantially rectangular plate shape corresponding to the opening shape of the through hole 22, and a side wall portion 36 is formed so as to surround the four sides so as to rise from each of the four sides. ing. Each side wall portion 36 is formed with a flange-like edge portion 37 that protrudes outward from the upper edge portion. The distance dimension between the bottom surface of the main body portion 34 and the bottom surface of the bowl-shaped edge portion 37 is set to be approximately the same as the dimension obtained by adding the thickness dimension of the second wiring 28 to the thickness dimension of the substrate 20.

そして、本熱伝導部３０を貫通孔２２内に基板２０の一方主面側から挿入配置し、本体部３４の底面と基板２０の他方主面とを面一状に揃えるように配設した状態で、鍔状縁部３７の底面が基板２０の一方主面に面接触状に当接するようになっている。また、このような配設状態で、各側壁部３６の外面と内周配線２９とが接触すると共に、鍔状縁部３７の底面と第２の配線２８とが接触するようになっている。   And this heat conduction part 30 is inserted and arranged in the through-hole 22 from the one main surface side of the substrate 20, and the bottom surface of the main body 34 and the other main surface of the substrate 20 are arranged so as to be flush with each other. Thus, the bottom surface of the flange-shaped edge portion 37 comes into contact with one main surface of the substrate 20 in a surface contact manner. Further, in such an arrangement state, the outer surface of each side wall portion 36 and the inner peripheral wiring 29 are in contact with each other, and the bottom surface of the bowl-shaped edge portion 37 and the second wiring 28 are in contact with each other.

また、熱伝導部３０のうち上記実装面３２とその反対側の面間の厚み寸法Ｈ１、即ち、上記本体部３４の厚み寸法Ｈ１は、基板２０の厚み寸法Ｈ２よりも小さくなっている。したがって、熱伝導部３０の体積を、貫通孔２２内全体の空間体積よりも小さくすることができる。   In addition, the thickness dimension H1 between the mounting surface 32 and the opposite surface of the heat conducting part 30, that is, the thickness dimension H1 of the main body part 34 is smaller than the thickness dimension H2 of the substrate 20. Therefore, the volume of the heat conducting unit 30 can be made smaller than the entire space volume in the through hole 22.

なお、熱伝導部３０は、後述するように放熱部材６０に対して隙間を介在させることなく近接配置することができるため、当該放熱部材６０を介して効率よく放熱することができる。このため、熱伝導部３０に要求される熱の拡散性はそれほどには要求されず、上記のように熱伝導部３０の厚みを薄くしても問題は無い。   In addition, since the heat conductive part 30 can be arrange | positioned closely without interposing a clearance gap with respect to the heat radiating member 60 so that it may mention later, it can thermally radiate efficiently through the said heat radiating member 60. FIG. For this reason, the heat diffusibility required for the heat conducting unit 30 is not so much required, and there is no problem even if the thickness of the heat conducting unit 30 is reduced as described above.

また、上記本体部３４のうち基板２０の一方主面２０ａと同一方向を向く面が実装面３２とされている。そして、本体部３４の底面と基板２０の他方主面とが面一状に揃っており、かつ、本体部３４の厚み寸法Ｈ１が基板２０の厚み寸法Ｈ２よりも小さいので、実装面３２は基板２０の一方主面よりも凹んでいる。   In addition, a surface of the main body 34 facing the same direction as the one main surface 20 a of the substrate 20 is a mounting surface 32. Since the bottom surface of the main body 34 and the other main surface of the substrate 20 are flush with each other, and the thickness dimension H1 of the main body 34 is smaller than the thickness dimension H2 of the substrate 20, the mounting surface 32 is the substrate. 20 is recessed from one main surface.

また、本熱伝導部３０は、熱伝導性と導電性とを有している。このような熱伝導部３０は、例えば、銅や銅合金等をプレス加工等することにより形成される。そして、本熱伝導部３０は、各側壁部３６の外面と内周配線２９との接触部分又は鍔状縁部３７の底面と第２の配線２８との接触部分を介して、第２の配線２８に電気的に接続されることになる。   Moreover, this heat conductive part 30 has heat conductivity and electroconductivity. Such a heat conducting unit 30 is formed by, for example, pressing a copper, a copper alloy, or the like. The heat conducting section 30 is connected to the second wiring via the contact portion between the outer surface of each side wall portion 36 and the inner peripheral wiring 29 or the bottom surface of the bowl-shaped edge portion 37 and the second wiring 28. 28 to be electrically connected.

もっとも、上記鍔状縁部３７は、４つの側壁部３６のうちの少なくとも１つに設けられていてもよく、また、４つの側壁部３６のうちの少なくとも１つに部分的に設けられていてもよく、さらには、４つの鍔状縁部３７が全て省略されていてもよい。鍔状縁部３７が全て省略された場合、側壁部３６が内周配線２９に接触することで、素子４０が熱伝導部３０の本体部３４及び側壁部３６から内周配線２９を介して第２の配線２８に電気的に接続される。これらの全ての場合が、熱伝導部３０が側壁部３６を介して第２の配線２８に電気的に接続された態様に含まれる。   However, the hook-shaped edge portion 37 may be provided on at least one of the four side wall portions 36, or may be provided partially on at least one of the four side wall portions 36. In addition, all the four hook-shaped edges 37 may be omitted. When all of the flange-shaped edge portions 37 are omitted, the side wall portion 36 comes into contact with the inner peripheral wiring 29, so that the element 40 is connected to the main body portion 34 and the side wall portion 36 of the heat conducting unit 30 via the inner peripheral wiring 29. The second wiring 28 is electrically connected. All of these cases are included in the aspect in which the heat conducting portion 30 is electrically connected to the second wiring 28 via the side wall portion 36.

なお、鍔状縁部３７が存在する場合、熱伝導部３０は基板２０に対して一方主面２０ａ側から貫通孔２２内に挿入する必要がある。これに対して、鍔状縁部３７全てが省略された場合、熱伝導部３０は基板２０に対して一方主面２０ａ側及び他方主面２０ｂ側のいずれからでも挿入できる。この場合、基板２０の他方主面２０ｂと本体部３４の他方主面とが面一状に配設されるように位置決めするとよい。   When the bowl-shaped edge portion 37 is present, the heat conducting portion 30 needs to be inserted into the through hole 22 from the one main surface 20a side with respect to the substrate 20. On the other hand, when all of the bowl-shaped edge portion 37 is omitted, the heat conducting portion 30 can be inserted into the substrate 20 from either the one main surface 20a side or the other main surface 20b side. In this case, the other main surface 20b of the substrate 20 and the other main surface of the main body 34 may be positioned so as to be flush with each other.

また、側壁部３６は、４つ全て存在する必要はなく、少なくとも１つある構成であってもよい。さらには、側壁部３６が全て省略された構成であってもよい。側壁部３６が全て省略された構成であっても、本体部３４の外周部が内周配線２９に接触することで、素子４０が熱伝導部３０から内周配線２９を介して第２の配線２８に電気的に接続される。このような場合も、熱伝導部３０が熱伝導部３０を介して第２の配線２８に電気的に接続された態様に含まれる。   Moreover, the side wall part 36 does not need to exist in all four, and the structure which has at least 1 may be sufficient. Furthermore, the structure by which all the side wall parts 36 were abbreviate | omitted may be sufficient. Even if the side wall portion 36 is entirely omitted, the element 40 is connected to the inner peripheral wiring 29 from the outer peripheral portion of the main body 34, so that the element 40 is connected to the second wiring via the inner peripheral wiring 29. 28 is electrically connected. Such a case is also included in the aspect in which the heat conducting unit 30 is electrically connected to the second wiring 28 via the heat conducting unit 30.

素子４０は、パワー半導体（例えばＩＧＢＴ（Insulated Gate Bipolar Transistor））等のベアチップ等、発熱し易い素子であり、上記実装面３２上に固定されている。この素子４０のうち実装面３２側の部分に少なくとも１つの端子が設けられている。そして、素子４０が実装面３２に固定された状態で、素子４０の当該実装面３２側の少なくとも１つの端子が熱伝導部３０にはんだ付け等で電気的に接続されている。そして、熱伝導部３０は上記態様にて第２の配線２８に電気的に接続されているので、素子４０は、熱伝導部３０を介して第２の配線２８に電気的に接続されている。   The element 40 is an element that easily generates heat, such as a bare chip such as a power semiconductor (eg, IGBT (Insulated Gate Bipolar Transistor)), and is fixed on the mounting surface 32. At least one terminal is provided on a portion of the element 40 on the mounting surface 32 side. In a state where the element 40 is fixed to the mounting surface 32, at least one terminal on the mounting surface 32 side of the element 40 is electrically connected to the heat conducting unit 30 by soldering or the like. And since the heat conductive part 30 is electrically connected to the 2nd wiring 28 in the said aspect, the element 40 is electrically connected to the 2nd wiring 28 via the heat conductive part 30. .

ここでは、素子４０は、熱伝導部３０の側壁部３６を介して第２の配線２８に電気的に接続される。より具体的には、素子４０の前記少なくとも１つの端子は、熱伝導部３０の本体部３４から側壁部３６及び鍔状縁部３７の底面を介して第２の配線２８に電気的に接続されている。   Here, the element 40 is electrically connected to the second wiring 28 through the side wall portion 36 of the heat conducting unit 30. More specifically, the at least one terminal of the element 40 is electrically connected from the main body 34 of the heat conducting unit 30 to the second wiring 28 via the side wall 36 and the bottom surface of the bowl-shaped edge 37. ing.

また、素子４０のうち実装面３２側とは反対側の部分に少なくとも１つの他の端子が設けられている。この少なくとも１つの端子は、屈曲容易な線状配線材であるワイヤ２６を介して第１の配線２４に電気的に接続されている。より具体的には、ワイヤ２６の一端部が前記少なくとも１つの端子に接合されると共に、ワイヤ２６の他端部が第１の配線２４に接合されており、ワイヤ２６の中間部は基板２０や素子４０の上方を迂回して通るように配設されている。   In addition, at least one other terminal is provided on a portion of the element 40 opposite to the mounting surface 32 side. The at least one terminal is electrically connected to the first wiring 24 via a wire 26 that is a linear wiring material that can be easily bent. More specifically, one end portion of the wire 26 is bonded to the at least one terminal, and the other end portion of the wire 26 is bonded to the first wiring 24, and the intermediate portion of the wire 26 is the substrate 20 or It is disposed so as to bypass the element 40.

そして、当該ワイヤ２６及び素子４０を封止するようにして絶縁樹脂等の絶縁部材５０が設けられている（断面図でのみ図示）。ここでは、絶縁部材５０は、ワイヤ２６及び素子４０を封止し得る程度になだらかな丘状を成す程度に盛られているが、封止形状はかかる形状に限られない。   An insulating member 50 such as an insulating resin is provided so as to seal the wire 26 and the element 40 (shown only in a sectional view). Here, the insulating member 50 is formed so as to form a gentle hill shape enough to seal the wire 26 and the element 40, but the sealing shape is not limited to this shape.

図５は上記モジュール１０に放熱部材６０を取付けた状態を示す図である。放熱部材６０は、フィン構造等放熱容易な構造を有する部材であり、上記基板２０の他方主面２０ｂ側に露出する熱伝導部３０の面に、側絶縁シート等の絶縁部材６２を介して取付けられている。そして、素子４０で生じた熱が熱伝導部３０を通って素子４０とは反対側の面に伝わると、そこからさらに放熱部材６０に伝わって効率よく放出される。   FIG. 5 is a view showing a state where the heat radiating member 60 is attached to the module 10. The heat dissipation member 60 is a member having a structure that facilitates heat dissipation, such as a fin structure, and is attached to the surface of the heat conducting portion 30 exposed on the other main surface 20b side of the substrate 20 via an insulating member 62 such as a side insulating sheet. It has been. Then, when the heat generated in the element 40 is transmitted to the surface opposite to the element 40 through the heat conducting portion 30, it is further transmitted to the heat radiating member 60 and efficiently released.

このように構成されたモジュール１０によると、素子４０で生じた熱は熱伝導部３０を介して素子４０とは反対側に伝わる。したがって、素子４０で生じた熱を効率よく放出できる。   According to the module 10 configured as described above, the heat generated in the element 40 is transmitted to the opposite side of the element 40 through the heat conducting unit 30. Therefore, the heat generated in the element 40 can be released efficiently.

また、熱伝導部３０は、基板２０の一方主面２０ａよりも基板２０の他方主面２０ｂ側に凹む実装面３２を有しており、この実装面３２に素子４０が固定されている。このため、素子４０の高さを、基板２０の一方主面２０ａに固定した場合よりも低くでき、基板２０からの実装高さを低くすることができる。   The heat conducting unit 30 has a mounting surface 32 that is recessed toward the other main surface 20 b of the substrate 20 relative to the one main surface 20 a of the substrate 20, and the element 40 is fixed to the mounting surface 32. For this reason, the height of the element 40 can be made lower than the case where it is fixed to the one main surface 20a of the substrate 20, and the mounting height from the substrate 20 can be lowered.

しかも、熱伝導部３０の底面は基板２０の他方主面と面一状に揃っているため、モジュール１０全体の高さ寸法も、基板２０の一方主面に素子を固定した場合よりも小さくできる。このため、より一層モジュール１０の小型化に寄与する。   Moreover, since the bottom surface of the heat conducting unit 30 is flush with the other main surface of the substrate 20, the overall height of the module 10 can be made smaller than when the element is fixed to the one main surface of the substrate 20. . For this reason, it contributes to further miniaturization of the module 10.

さらに、熱伝導部３０のうち実装面３２とその反対側の面間の厚み寸法Ｈ１が、基板２０の厚み寸法Ｈ２よりも小さいので、貫通孔内の空間を全て埋めるようにした従来例と比べて、熱伝導部３０の体積を減少させることができ、軽量化及びコスト低減を図ることができる。   Furthermore, since the thickness dimension H1 between the mounting surface 32 and the opposite surface of the heat conducting portion 30 is smaller than the thickness dimension H2 of the substrate 20, it is compared with the conventional example in which the entire space in the through hole is filled. Thus, the volume of the heat conducting unit 30 can be reduced, and weight reduction and cost reduction can be achieved.

また、上記のように実装面３２に固定された素子４０の高さ寸法を低くすることができるので、基板２０の一方主面２０ａに対するワイヤ２６の高さ寸法をも低くすることができる。このため、ワイヤ２６を封止するように設けた絶縁部材５０の高さ寸法も低くすることができる。このため、封止用の絶縁部材５０の使用量を削減することができ、この点からも軽量化及びコスト低減を図ることができる。   Moreover, since the height dimension of the element 40 fixed to the mounting surface 32 can be reduced as described above, the height dimension of the wire 26 relative to the one main surface 20a of the substrate 20 can also be reduced. For this reason, the height dimension of the insulating member 50 provided to seal the wire 26 can also be lowered. For this reason, the usage-amount of the insulating member 50 for sealing can be reduced, and also from this point, weight reduction and cost reduction can be achieved.

かかる効果は、例えば、インバータ回路が構成される場合等に、基板２０に複数の貫通孔２２が形成され、それぞれに熱伝導部３０が配設されると共に素子４０が固定された構成において、当該複数の素子４０及びワイヤ２６を封止するように絶縁部材５０が設けられている場合に、特に有効となる。実装面３２で凹んでいる領域よりも、当該実装面３２よりも突出している基板２０の一方主面の領域の割合が多くなり、絶縁部材５０の使用量削減効果が大きいからである。   Such an effect is obtained when, for example, when an inverter circuit is configured, the plurality of through holes 22 are formed in the substrate 20, the heat conducting unit 30 is disposed in each, and the element 40 is fixed. This is particularly effective when the insulating member 50 is provided so as to seal the plurality of elements 40 and the wires 26. This is because the ratio of the region of the one main surface of the substrate 20 that protrudes from the mounting surface 32 is larger than the region that is recessed on the mounting surface 32, and the amount of use of the insulating member 50 is greatly reduced.

また、熱伝導部３０が導電性を有しており、素子４０は熱伝導部３０を介して第２の配線２８に電気的に接続されているため、当該素子４０と基板２０上の第２の配線２８とを容易に電気的に接続することができる。   In addition, since the heat conducting unit 30 has conductivity and the element 40 is electrically connected to the second wiring 28 via the heat conducting unit 30, the element 40 and the second on the substrate 20. The wiring 28 can be easily electrically connected.

特に、熱伝導部３０は貫通孔２２の内周面に沿って立上がるように延びる側壁部３６を有しているため、当該側壁部３６を利用して熱伝導部３０と第２の配線２８とを容易に電気的に接続できる。   In particular, since the heat conducting portion 30 has a side wall portion 36 extending so as to rise along the inner peripheral surface of the through hole 22, the heat conducting portion 30 and the second wiring 28 are utilized using the side wall portion 36. Can be easily electrically connected.

｛第２実施形態｝
第２実施形態に係るモジュール１１０について説明する。図６は本実施形態に係るモジュール１１０を示す平面図であり、図７は図６のＶＩＩ−ＶＩＩ線断面図であり、図８は本実施形態に係るモジュール１１０の底面図である。なお、本実施形態の説明において、第１実施形態で説明したものと同様構成のものについては、同一符号を付してその説明を省略する。また、図６〜図８では、第１の配線２４及びワイヤ２６を省略している。 {Second Embodiment}
A module 110 according to the second embodiment will be described. 6 is a plan view showing the module 110 according to the present embodiment, FIG. 7 is a sectional view taken along the line VII-VII of FIG. 6, and FIG. 8 is a bottom view of the module 110 according to the present embodiment. In the description of the present embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals and description thereof is omitted. Also, in FIGS. 6 to 8, the first wiring 24 and the wire 26 are omitted.

このモジュール１１０では、基板１２０はスルーホール１２３を有している。スルーホール１２３は、基板１２０を貫通する孔１２３ａの内周面にメッキ等による導体部１２３ｂを形成した構成とされている。このスルーホール１２３は、第２の配線２８の外周囲の位置、ここでは、鍔状縁部３７の外周囲の２箇所の位置に形成されている。また、導体部１２３ｂは、第２の配線２８に電気的に接続されている。スルーホール１２３は、少なくとも１つあればよい。もっとも、熱伝導部１３０をバランスよく保持するためには、少なくとも２つあり、熱伝導部１３０周りで回転対称位置に存在していることが好ましい。また、スルーホール１２３の形状は、角穴状であっても丸孔状であってもよい。ここでは、スルーホール１２３は、角穴状に形成されている。   In this module 110, the substrate 120 has a through hole 123. The through hole 123 has a configuration in which a conductor portion 123b is formed on the inner peripheral surface of a hole 123a that penetrates the substrate 120 by plating or the like. The through holes 123 are formed at positions around the outer periphery of the second wiring 28, here, at two positions around the outer periphery of the bowl-shaped edge portion 37. The conductor portion 123b is electrically connected to the second wiring 28. There may be at least one through hole 123. However, in order to hold the heat conducting unit 130 in a well-balanced manner, it is preferable that there are at least two, and the heat conducting unit 130 exists in a rotationally symmetric position around the heat conducting unit 130. Further, the shape of the through hole 123 may be a square hole shape or a round hole shape. Here, the through hole 123 is formed in a square hole shape.

また、熱伝導部１３０は、上記熱伝導部３０と同様に本体部３４と側壁部３６と鍔状縁部３７とを有し、さらに、挿入端子部１３８を有している。挿入端子部１３８は、上記各スルーホール１２３に対応する位置で、鍔状縁部３７の外側縁部から本体部３４側に向けて突出している。挿入端子部１３８は、スルーホール１２３に挿入可能なピン状、ここでは、角柱ピン状に形成されている。そして、挿入端子部１３８がスルーホール１２３に挿入されることで、上記導体部１２３ｂに電気的に接続される。なお、挿入端子部１３８はスルーホール１２３に挿入された状態で、はんだ付けされることが好ましい。   In addition, the heat conducting part 130 has a main body part 34, a side wall part 36, and a flange-like edge part 37, similarly to the heat conducting part 30, and further has an insertion terminal part 138. The insertion terminal portion 138 protrudes from the outer edge portion of the flange-shaped edge portion 37 toward the main body portion 34 at a position corresponding to each of the through holes 123. The insertion terminal portion 138 is formed in a pin shape that can be inserted into the through hole 123, in this case, in a prismatic pin shape. And the insertion terminal part 138 is electrically connected to the said conductor part 123b by inserting in the through hole 123. FIG. Note that the insertion terminal portion 138 is preferably soldered in a state of being inserted into the through hole 123.

なお、ここでは、側壁部３６の先端部に設けられた鍔状縁部３７に挿入端子部１３８を設けているが、このように側壁部３６の先端部に、他の機能要素を介して挿入端子部１３８が設けられている場合も、側壁部３６の先端部に挿入端子部１３８が設けられた構成に含まれる。もっとも、鍔状縁部３７を省略し、側壁部３６の先端部に直接的に挿入端子部１３８を設けてもよい。   Here, the insertion terminal portion 138 is provided at the flange-shaped edge portion 37 provided at the distal end portion of the side wall portion 36. In this way, the insertion terminal portion 138 is inserted into the distal end portion of the side wall portion 36 via another functional element. The case where the terminal portion 138 is provided is also included in the configuration in which the insertion terminal portion 138 is provided at the distal end portion of the side wall portion 36. However, the hook-shaped edge portion 37 may be omitted, and the insertion terminal portion 138 may be provided directly at the distal end portion of the side wall portion 36.

そして、本熱伝導部１３０が上記熱伝導部３０と同様態様で基板１２０に貫通孔２２を閉塞するように配設されると、挿入端子部１３８が基板１２０の一方主面２０ａ側よりスルーホール１２３に挿入される。これにより、挿入端子部１３８とスルーホール１２３の導体部１２３ｂとが電気的に接続され、素子４０が熱伝導部１３０の本体部３４から側壁部３６及び挿入端子部１３８、導体部１２３ｂを介して第２の配線２８に電気的に接続される。つまり、熱伝導部１３０が側壁部３６を介して第２の配線２８に電気的に接続され、素子４０が熱伝導部１３０を介して第２の配線２８に電気的に接続される。   When the heat conducting portion 130 is arranged in the same manner as the heat conducting portion 30 so as to close the through hole 22 in the substrate 120, the insertion terminal portion 138 is a through hole from the one main surface 20a side of the substrate 120. 123 is inserted. Thereby, the insertion terminal part 138 and the conductor part 123b of the through hole 123 are electrically connected, and the element 40 is connected from the main body part 34 of the heat conducting part 130 through the side wall part 36, the insertion terminal part 138, and the conductor part 123b. It is electrically connected to the second wiring 28. That is, the heat conducting part 130 is electrically connected to the second wiring 28 via the side wall part 36, and the element 40 is electrically connected to the second wiring 28 via the heat conducting part 130.

このように構成されたモジュール１１０によると、上記第１実施形態と同様の効果に加えて、挿入端子部１３８をスルーホール１２３に挿入することで、熱伝導部１３０と第２の配線２８とを容易に電気的に接続することができると共に、熱伝導部１３０を強固に固定できるという効果を得ることができる。   According to the module 110 configured as described above, in addition to the same effects as those of the first embodiment, the insertion portion 138 is inserted into the through hole 123, whereby the heat conducting portion 130 and the second wiring 28 are connected. In addition to being able to be easily electrically connected, the effect of being able to firmly fix the heat conducting unit 130 can be obtained.

なお、本実施形態において、貫通孔２２の内周面に形成された内周配線２９を省略してもよい。   In the present embodiment, the inner peripheral wiring 29 formed on the inner peripheral surface of the through hole 22 may be omitted.

｛第３実施形態｝
第３実施形態に係るモジュール２１０について説明する。図９は本実施形態に係るモジュール２１０を示す平面図であり、図１０は図９のＸ−Ｘ線断面図であり、図１１は同モジュール２１０を示す底面図である。なお、本実施形態の説明において、第１実施形態で説明したものと同様構成のものについては、同一符号を付してその説明を省略する。 {Third embodiment}
A module 210 according to the third embodiment will be described. 9 is a plan view showing the module 210 according to the present embodiment, FIG. 10 is a sectional view taken along line XX of FIG. 9, and FIG. 11 is a bottom view showing the module 210. In the description of the present embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

このモジュール２１０は、基板２２０と、熱伝導部２３０と、素子４０とを備えている。   The module 210 includes a substrate 220, a heat conducting unit 230, and the element 40.

基板２２０は、次の相違点を除いて上記基板２０と同様構成とされている。基板２０との相違点として、基板２２０は、その他方主面２０ｂであって貫通孔２２の開口周縁部に、第２の配線２８に電気的に接続された介在配線２２９を有している。より具体的には、介在配線２２９は、銅箔等によって形成されており、基板２２０の他方主面に、貫通孔２２の開口周縁部を囲うように形成されている。この介在配線２２９は、貫通孔２２の内周面に形成された内周配線２９を介して第２の配線２８に電気的に接続されている。もっとも、介在配線２２９は、貫通孔２２の開口周縁部周り全体に形成されている必要はなく、部分的に形成されていてもよい。また、介在配線２２９は、必ずしも内周配線２９を介して第２の配線２８に電気的に接続される必要はなく、他のスルーホール等を介して第２の配線２８に電気的に接続されていてもよい。   The substrate 220 has the same configuration as the substrate 20 except for the following differences. As a difference from the substrate 20, the substrate 220 has an intervening wiring 229 that is electrically connected to the second wiring 28 on the opening peripheral edge of the through hole 22 on the other main surface 20 b. More specifically, the interposer wiring 229 is formed of copper foil or the like, and is formed on the other main surface of the substrate 220 so as to surround the opening peripheral portion of the through hole 22. The intervening wiring 229 is electrically connected to the second wiring 28 via an inner peripheral wiring 29 formed on the inner peripheral surface of the through hole 22. But the interposition wiring 229 does not need to be formed in the whole periphery of the opening peripheral part of the through-hole 22, and may be formed partially. The intervening wiring 229 does not necessarily need to be electrically connected to the second wiring 28 via the inner peripheral wiring 29, and is electrically connected to the second wiring 28 via another through hole or the like. It may be.

また、熱伝導部２３０は、熱伝導性及び導電性を有する材料で形成されており、基板２２０の他方主面２０ｂ側で貫通孔２２の開口を閉塞するように広がる板状の本体部２３４を有している。ここでは、本体部２３４は、基板２２０の他方主面２０ｂ側における貫通孔２２の開口よりも大きく、上記介在配線２２９を覆う程度に広がる板状に形成されている。   The heat conducting portion 230 is formed of a material having heat conductivity and conductivity, and has a plate-like main body portion 234 that spreads so as to close the opening of the through hole 22 on the other main surface 20b side of the substrate 220. Have. Here, the main body 234 is formed in a plate shape that is larger than the opening of the through hole 22 on the other main surface 20 b side of the substrate 220 and extends to the extent that it covers the interposition wiring 229.

そして、熱伝導部２３０の本体部２３４が介在配線２２９に電気的に接続された状態で、基板２２０の他方主面２０ｂであって貫通孔２２の開口部に配設されている。例えば、本体部２３４は、介在配線２２９にはんだ付けされることによって、当該介在配線２２９に電気的に接続された状態で、基板２２０に取付固定される。これにより、熱伝導部２３０は、介在配線２２９を介して第２の配線２８に電気的に接続される。このように、介在配線２２９と第２の配線２８との間に内周配線２９等のように他の配線が介在する場合も、熱伝導部２３０が介在配線２２９を介して第２の配線に電気的に接続される態様に含まれる。   The main body portion 234 of the heat conducting portion 230 is disposed in the opening portion of the through hole 22 on the other main surface 20 b of the substrate 220 with the body portion 234 electrically connected to the interposition wiring 229. For example, the main body 234 is attached and fixed to the substrate 220 while being electrically connected to the intermediate wiring 229 by being soldered to the intermediate wiring 229. Thereby, the heat conducting unit 230 is electrically connected to the second wiring 28 via the intervening wiring 229. As described above, even when another wiring such as the inner peripheral wiring 29 is interposed between the intervening wiring 229 and the second wiring 28, the heat conducting portion 230 is connected to the second wiring via the intervening wiring 229. It is contained in the aspect connected electrically.

なお、上記態様で、基板２０の他方主面２０ｂで、熱伝導部２３０の他方主面が当該他方主面２０ｂよりも突出して露出している。このため、放熱部材６０を熱伝導部３０に対して隙間無く接触させることができ、熱伝導部３０から放熱部材６０へも熱が伝わり易く、放熱部材６０による効率のよい放熱が可能となる。   In the above embodiment, the other main surface 20b of the substrate 20 exposes the other main surface of the heat conducting portion 230 so as to protrude from the other main surface 20b. For this reason, the heat radiating member 60 can be brought into contact with the heat conducting portion 30 without any gap, and heat can be easily transmitted from the heat conducting portion 30 to the heat radiating member 60, so that the heat radiating member 60 can efficiently radiate heat.

また、熱伝導部２３０の本体部２３４のうち、基板２２０の一方主面２０ａと同方向を向く面は、実装面２３２とされている。この実装面２３２は、基板２２０の他方主面２０ｂと同一面状に位置しており、したがって、基板２２０の一方主面２０ａよりも凹んでいる。そして、この実装面２３２に素子４０が固定されている。   In addition, a surface of the main body 234 of the heat conducting unit 230 that faces in the same direction as the one main surface 20 a of the substrate 220 is a mounting surface 232. The mounting surface 232 is located on the same plane as the other main surface 20 b of the substrate 220, and is therefore recessed from the one main surface 20 a of the substrate 220. The element 40 is fixed to the mounting surface 232.

また、熱伝導部２３０のうち実装面２３２とその反対側の面間の厚み寸法Ｈ３は、基板２２０の厚み寸法Ｈ２よりも小さい。したがって、熱伝導部２３０の体積を、貫通孔２２内部の空間体積よりも小さくすることができる。   In addition, the thickness dimension H3 between the mounting surface 232 and the opposite surface of the heat conducting unit 230 is smaller than the thickness dimension H2 of the substrate 220. Therefore, the volume of the heat conducting part 230 can be made smaller than the space volume inside the through hole 22.

また、この素子４０は、上記第１実施形態で説明したのと同様態様にて、熱伝導部２３０に電気的に接続されている。そして、素子４０は、熱伝導部２３０を介して第２の配線２８に電気的に接続されている。より具体的には、素子４０は、熱伝導部２３０から介在配線２２９及び内周配線２９を介して第２の配線２８に電気的に接続されている。   The element 40 is electrically connected to the heat conducting unit 230 in the same manner as described in the first embodiment. The element 40 is electrically connected to the second wiring 28 via the heat conducting unit 230. More specifically, the element 40 is electrically connected to the second wiring 28 from the heat conducting portion 230 via the intervening wiring 229 and the inner peripheral wiring 29.

さらに、素子４０は、上記第１実施形態で説明したのと同様態様にて、ワイヤ２６を介して第１の配線２４に電気的に接続されている。そして、ワイヤ２６及び素子４０を封止するようにして、絶縁樹脂等の絶縁部材５０が設けられている。   Further, the element 40 is electrically connected to the first wiring 24 via the wire 26 in the same manner as described in the first embodiment. An insulating member 50 such as an insulating resin is provided so as to seal the wire 26 and the element 40.

このように構成されたモジュール２１０によると、上記第１実施形態で述べたのと同様の理由により、素子４０で生じた熱を効率よく放出できると共に、素子４０の実装高さを比較的低くすることができる。   According to the module 210 configured as described above, for the same reason as described in the first embodiment, the heat generated in the element 40 can be efficiently released, and the mounting height of the element 40 is made relatively low. be able to.

特に、実装面２３２の位置は基板２２０の他方主面２０ｂと同一高さ位置にあるため、素子４０の高さ位置をより低くして、絶縁部材５０の高さをより低くすることができる。   In particular, since the mounting surface 232 is at the same height as the other main surface 20b of the substrate 220, the height position of the element 40 can be made lower and the height of the insulating member 50 can be made lower.

また、上記第１実施形態で述べたのと同様の理由により、熱伝導部２３０の体積を小さくすることができ、軽量化及びコスト低減を図ることができる。さらに、封止用の絶縁部材５０の使用量を削減することができ、この点からも軽量化及びコスト低減を図ることもできる。   Further, for the same reason as described in the first embodiment, the volume of the heat conducting unit 230 can be reduced, and the weight can be reduced and the cost can be reduced. Furthermore, the amount of the insulating member 50 for sealing can be reduced, and from this point, weight reduction and cost reduction can be achieved.

また、上記第１実施形態で述べたのと同様の理由により、素子４０は熱伝導部２３０を介して第２の配線２８に電気的に接続されているため、当該素子４０と基板２２０上の第２の配線２８とを容易に電気的に接続することができる。   Further, for the same reason as described in the first embodiment, the element 40 is electrically connected to the second wiring 28 via the heat conducting portion 230, so that the element 40 and the substrate 220 are connected. The second wiring 28 can be easily electrically connected.

特に、熱伝導部２３０は、板状の本体部２３４を有する構成であればよいため、熱伝導部２３０の構成を簡易なものとすることができる。   In particular, since the heat conducting unit 230 only needs to have a plate-like main body 234, the configuration of the heat conducting unit 230 can be simplified.

｛第４実施形態｝
第４実施形態に係るモジュール３１０について説明する。図１２は本実施形態に係るモジュール３１０を示す平面図であり、図１３は図１２のＸＩＩＩ−ＸＩＩＩ線断面図であり、図１４は本実施形態に係るモジュール３１０の底面図である。なお、本実施形態の説明において、第３実施形態で説明したものと同様構成のものについては、同一符号を付してその説明を省略する。また、図１２〜図１４では、第１の配線２４及びワイヤ２６を省略している。 {Fourth embodiment}
A module 310 according to the fourth embodiment will be described. 12 is a plan view showing the module 310 according to the present embodiment, FIG. 13 is a sectional view taken along line XIII-XIII in FIG. 12, and FIG. 14 is a bottom view of the module 310 according to the present embodiment. In the description of this embodiment, the same components as those described in the third embodiment are denoted by the same reference numerals and description thereof is omitted. Also, in FIG. 12 to FIG. 14, the first wiring 24 and the wire 26 are omitted.

このモジュール３１０では、基板３２０は、スルーホール３２３を有している。スルーホール３２３は、基板３２０を貫通する孔３２３ａの内周面にメッキ等による導体部３２３ｂを形成した構成とされている。このスルーホール３２３は、第２の配線２８の外周囲の位置、ここでは、熱伝導部３３０の本体部２３４の外周囲の２箇所の位置に形成されている。また、導体部３２３ｂは、第２の配線２８に電気的に接続されている。スルーホール３２３は、少なくとも１つあればよい。もっとも、熱伝導部３３０をバランスよく保持するためには、少なくとも２つあり、熱伝導部３３０周りで回転対称位置に存在していることが好ましい。また、スルーホール３２３の形状は、角穴状であっても丸孔状であってもよい。ここでは、スルーホール３２３は、角穴状に形成されている。   In this module 310, the substrate 320 has a through hole 323. The through hole 323 is configured such that a conductor portion 323b is formed by plating or the like on the inner peripheral surface of a hole 323a penetrating the substrate 320. The through holes 323 are formed at positions around the outer periphery of the second wiring 28, here, at two positions around the outer periphery of the main body portion 234 of the heat conducting unit 330. The conductor portion 323b is electrically connected to the second wiring 28. There may be at least one through hole 323. However, in order to hold the heat conducting unit 330 in a balanced manner, it is preferable that there are at least two, and the heat conducting unit 330 exists in a rotationally symmetric position around the heat conducting unit 330. Further, the shape of the through hole 323 may be a square hole shape or a round hole shape. Here, the through hole 323 is formed in a square hole shape.

また、熱伝導部３３０は、上記熱伝導部２３０と同様構成の本体部２３４を有し、さらに、挿入端子部３３８を有している。挿入端子部３３８は、上記各スルーホール３２３に対応する位置で、本体部２３４の外周縁部から当該本体部２３４に対して略直交する方向に沿って突出している。挿入端子部３３８は、スルーホール３２３に挿入可能なピン状、ここでは、角柱ピン状に形成されている。そして、挿入端子部３３８がスルーホール３２３に挿入されることで、上記導体部３２３ｂに電気的に接続される。なお、挿入端子部３３８はスルーホール３２３に挿入された状態で、はんだ付けされることが好ましい。   The heat conducting unit 330 has a main body 234 having the same configuration as the heat conducting unit 230, and further has an insertion terminal portion 338. The insertion terminal portion 338 protrudes from the outer peripheral edge portion of the main body portion 234 along a direction substantially orthogonal to the main body portion 234 at a position corresponding to each of the through holes 323. The insertion terminal portion 338 is formed in a pin shape that can be inserted into the through hole 323, in this case, in a prismatic pin shape. And the insertion terminal part 338 is electrically connected to the said conductor part 323b by inserting in the through hole 323. FIG. Note that the insertion terminal portion 338 is preferably soldered in a state of being inserted into the through hole 323.

なお、ここでは、上記挿入端子部３３８は、本体部２３４の外周囲から外方にはみ出る位置で突出形成されているが、本体部２３４の外周囲内で突出形成されていてもよい。   Here, the insertion terminal portion 338 is formed to protrude at a position protruding outward from the outer periphery of the main body portion 234, but may be formed to protrude within the outer periphery of the main body portion 234.

そして、本熱伝導部３３０が上記熱伝導部２３０と同様態様で基板３２０に貫通孔２２を閉塞するように配設されると、挿入端子部３３８が基板３２０の他方主面２０ｂ側よりスルーホール３２３に挿入される。これにより、挿入端子部３３８とスルーホール３２３の導体部３２３ｂとが電気的に接続され、素子４０が熱伝導部３３０の本体部２３４から挿入端子部３３８及びスルーホール３２３の導体部３２３ｂを介して第２の配線２８に電気的に接続される。つまり、熱伝導部３３０が挿入端子部３３８を介して第２の配線２８に電気的に接続され、素子４０が熱伝導部３３０を介して第２の配線２８に電気的に接続される。なお、本実施形態において介在配線２２９を省略してもよい。   When the heat conducting portion 330 is arranged in the same manner as the heat conducting portion 230 so as to close the through hole 22 in the substrate 320, the insertion terminal portion 338 has a through hole from the other main surface 20b side of the substrate 320. 323 is inserted. Thereby, the insertion terminal portion 338 and the conductor portion 323b of the through hole 323 are electrically connected, and the element 40 is connected from the main body portion 234 of the heat conducting portion 330 via the insertion terminal portion 338 and the conductor portion 323b of the through hole 323. It is electrically connected to the second wiring 28. That is, the heat conducting unit 330 is electrically connected to the second wiring 28 through the insertion terminal unit 338, and the element 40 is electrically connected to the second wiring 28 through the heat conducting unit 330. In the present embodiment, the intervening wiring 229 may be omitted.

このように構成されたモジュール３１０によると、上記第３実施形態と同様の効果に加えて、挿入端子部３３８をスルーホール３２３に挿入することで、熱伝導部３３０と第２の配線２８とを容易に電気的に接続することができると共に、熱伝導部３３０を強固に固定できるという効果を得ることができる。   According to the module 310 configured as described above, in addition to the same effects as those of the third embodiment, the heat conduction unit 330 and the second wiring 28 are connected by inserting the insertion terminal portion 338 into the through hole 323. While being able to connect easily easily, the effect that the heat conductive part 330 can be fixed firmly can be acquired.

なお、第３実施形態及び第４実施形態において、基板２２０、３２０の他方主面２０ｂ側に、上記熱伝導部２３０、３３０の本体部２３４全体を嵌め込み可能な凹部を形成しておき、当該凹部に本体部３４を嵌め込むようにしてもよい。これにより、熱伝導部２３０，３３０をより確実に位置決め保持できると共に、基板２２０、３２０の他方主面２０ｂと本体部２３４との面一状にすることができ、基板２２０、３２０と放熱部材６０との取付安定性を向上させることができる。   In the third embodiment and the fourth embodiment, a recess is formed on the other main surface 20b side of the substrates 220 and 320 so that the entire body portion 234 of the heat conducting portions 230 and 330 can be fitted therein. The main body 34 may be fitted into the main body 34. Thus, the heat conducting portions 230 and 330 can be positioned and held more reliably, and the other main surface 20b of the substrates 220 and 320 and the main body portion 234 can be flush with each other. And mounting stability can be improved.

第１実施形態に係るモジュールを示す平面図である。It is a top view which shows the module which concerns on 1st Embodiment. 図１のＩＩ−ＩＩ線断面図である。It is the II-II sectional view taken on the line of FIG. 本実施形態に係るモジュールを示す底面図である。It is a bottom view which shows the module which concerns on this embodiment. 熱伝導部を示す斜視図である。It is a perspective view which shows a heat conductive part. モジュールに放熱部材を取付けた状態を示す図である。It is a figure which shows the state which attached the heat radiating member to the module. 第２実施形態に係るモジュールを示す平面図である。It is a top view which shows the module which concerns on 2nd Embodiment. 図６のＶＩＩ−ＶＩＩ線断面図である。It is the VII-VII sectional view taken on the line of FIG. 本実施形態に係るモジュールを示す底面図である。It is a bottom view which shows the module which concerns on this embodiment. 第３実施形態に係るモジュールを示す平面図である。It is a top view which shows the module which concerns on 3rd Embodiment. 図９のＸ−Ｘ線断面図である。FIG. 10 is a sectional view taken along line XX in FIG. 9. 本実施形態に係るモジュールを示す底面図である。It is a bottom view which shows the module which concerns on this embodiment. 第４実施形態に係るモジュールを示す平面図である。It is a top view which shows the module which concerns on 4th Embodiment. 図１２のＸＩＩＩ−ＸＩＩＩ線断面図である。It is the XIII-XIII sectional view taken on the line of FIG. 本実施形態に係るモジュールを示す底面図である。It is a bottom view which shows the module which concerns on this embodiment.

符号の説明Explanation of symbols

１０、１１０、２１０、３１０ モジュール
２０、１２０、２２０、３２０ 基板
２０ａ 一方主面
２０ｂ 他方主面
２２ 貫通孔
２４ 第１の配線
２６ ワイヤ
２８ 第２の配線
２９ 内周配線
３０、１３０、２３０、３３０ 熱伝導部
３２、２３２ 実装面
３４、２３４ 本体部
３６ 側壁部
３７ 鍔状縁部
４０ 素子
１２３、３２３ スルーホール
１３８、３３８ 挿入端子部
２２９ 介在配線 10, 110, 210, 310 Module 20, 120, 220, 320 Substrate 20a One main surface 20b Other main surface 22 Through hole 24 First wiring 26 Wire 28 Second wiring 29 Inner peripheral wiring 30, 130, 230, 330 Heat conduction part 32, 232 Mounting surface 34, 234 Main body part 36 Side wall part 37 Gutter-like edge part 40 Element 123, 323 Through hole 138, 338 Insertion terminal part 229 Interposal wiring

Claims (1)

一方主面（２０ａ）と、この一方主面とは反対側の他方主面（２０ｂ）と、貫通孔（２２）とを有する基板（２０、１２０、２２０、３２０）と、
前記貫通孔を塞ぐように配設され、前記基板の一方主面よりも前記他方主面側に凹む実装面（３２、２３２）を有する熱伝導部（３０、１３０、２３０、３３０）と、
前記実装面上に固定された素子（４０）と、
を備え、
前記基板の一方主面に第２の配線（２８）が形成され、
前記熱伝導部（３０、１３０、２３０、３３０）は導電性を有しており、
前記素子は、前記熱伝導部を介して前記第２の配線に電気的に接続されており、
前記基板（１２０）にスルーホールが形成され、
前記熱伝導部（１３０）は、前記貫通孔を閉塞するように広がる板状の本体部（３４）と、前記本体部から前記貫通孔の内周面の少なくとも一部に沿って立上がるように延びる側壁部（３６）と、前記側壁部の先端部に設けられ、前記スルーホールに前記基板の一方主面側より挿入可能に形成されると共に前記スルーホールに挿入された状態で前記第２の配線に電気的に接続される挿入端子部（１３８）と、を有し、
前記熱伝導部のうち前記実装面とその反対側の面間の厚み寸法（Ｈ１、Ｈ３）は、前記基板の厚み寸法（Ｈ２）よりも小さく、
前記基板の一方主面に第１の配線（２４）が形成され、
前記素子がワイヤ（２６）を介して前記第１の配線に電気的に接続され、
前記ワイヤを封止するように絶縁部材（５０）が設けられたモジュール（１０、１１０、２１０、３１０）。 A substrate (20, 120, 220, 320) having one main surface (20a), the other main surface (20b) opposite to the one main surface, and a through hole (22);
A heat conducting portion (30, 130, 230, 330) that is disposed so as to close the through hole and has a mounting surface (32, 232) that is recessed toward the other main surface rather than the one main surface of the substrate;
An element (40) fixed on the mounting surface;
With
A second wiring (28) is formed on one main surface of the substrate,
The heat conducting part (30, 130, 230, 330) has conductivity,
The element is electrically connected to the second wiring through the heat conducting portion,
A through hole is formed in the substrate (120);
The heat conducting part (130) rises from the main body part along at least a part of the inner peripheral surface of the through hole, and a plate-like main body part (34) that spreads to close the through hole. An extended side wall (36), provided at the tip of the side wall, formed so as to be insertable into the through hole from the one main surface side of the substrate and inserted into the through hole. inserting the terminal portion electrically connected to the wiring (138), was closed,
The thickness dimension (H1, H3) between the mounting surface and the opposite surface of the heat conducting part is smaller than the thickness dimension (H2) of the substrate.
A first wiring (24) is formed on one main surface of the substrate,
The element is electrically connected to the first wiring via a wire (26);
Module (10, 110, 210, 310) provided with an insulating member (50) so as to seal the wire.
JP2007245439A 2007-09-21 2007-09-21 module Expired - Fee Related JP5277597B2 (en)

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