JP5274285B2 - Polishing pad manufacturing method - Google Patents
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- JP5274285B2 JP5274285B2 JP2009026098A JP2009026098A JP5274285B2 JP 5274285 B2 JP5274285 B2 JP 5274285B2 JP 2009026098 A JP2009026098 A JP 2009026098A JP 2009026098 A JP2009026098 A JP 2009026098A JP 5274285 B2 JP5274285 B2 JP 5274285B2
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- 238000005498 polishing Methods 0.000 title claims description 187
- 238000004519 manufacturing process Methods 0.000 title claims description 29
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- 238000007711 solidification Methods 0.000 claims description 29
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- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 51
- 239000010410 layer Substances 0.000 description 48
- 239000000243 solution Substances 0.000 description 43
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 31
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- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 7
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
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- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
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- 229920000515 polycarbonate Polymers 0.000 description 1
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Description
本発明は研磨パッドの製造方法に係り、特に、発泡構造を有する樹脂製シートを備えた研磨パッドの製造方法に関する。 The present invention relates to a method for manufacturing a polishing pad, and more particularly, to a method for manufacturing a polishing pad provided with a resin sheet having a foam structure.
半導体デバイスの製造や液晶ディスプレイ用ガラス基板等の材料（被研磨物）の表面（加工面）では、平坦性が求められるため、研磨パッドを使用した研磨加工が行われている。半導体デバイスでは、半導体回路の集積度が急激に増大するにつれて高密度化を目的とした微細化や多層配線化が進み、加工面を一層高度に平坦化する技術が重要となっている。一方、液晶ディスプレイでは、大型化に伴いガラス基板が薄く脆くなる傾向にあり、加工面のより高度な平坦性が要求されている。 Since the surface (processed surface) of a material (object to be polished) such as a semiconductor device manufacturing or a glass substrate for liquid crystal display is required to have flatness, polishing using a polishing pad is performed. In semiconductor devices, as the degree of integration of semiconductor circuits increases rapidly, miniaturization and multilayer wiring for the purpose of higher density have progressed, and a technique for further flattening the processed surface has become important. On the other hand, in a liquid crystal display, a glass substrate tends to become thin and brittle with an increase in size, and higher flatness of a processed surface is required.
一般に、研磨加工に用いられる研磨パッドは、発泡構造を有する樹脂製で、被研磨物を研磨加工するための研磨面を有する研磨層（樹脂製シート）を備えている。研磨加工時には、研磨面と加工面との間に砥粒を含む研磨液（スラリ）が供給され、被研磨物に研磨圧（押圧力）がかけられる。また、被研磨物のグローバル平坦化とローカル平坦化との両方を同時に達成するために、クッション層を含む多層構造の研磨パッドが使用されている。このクッション層には、不織布が多用されてきたが、高弾性の不織布に代えて、ウレタン発泡フィルムのような柔軟なクッション層が求められている。多層構造の研磨パッドでは、貼り合わされて一体化されているため、製造工程が煩雑なうえ、貼り合わせた部分で剥離を招くことがある。 In general, a polishing pad used for polishing is made of a resin having a foam structure, and includes a polishing layer (resin sheet) having a polishing surface for polishing an object to be polished. At the time of polishing, a polishing liquid (slurry) containing abrasive grains is supplied between the polishing surface and the processing surface, and a polishing pressure (pressing force) is applied to the object to be polished. In addition, in order to achieve both global planarization and local planarization of an object to be polished, a polishing pad having a multilayer structure including a cushion layer is used. Nonwoven fabrics have been frequently used for this cushion layer, but a flexible cushion layer such as a urethane foam film is required instead of a highly elastic nonwoven fabric. A multi-layered polishing pad is bonded and integrated, so that the manufacturing process is complicated and peeling may occur at the bonded portion.
一方、被研磨物としては、パターニングされたウエハ類、例えば層間絶縁膜、バリア膜除去、シャロウトレンチ分離法（ＳＴＩ）、軟質なＣｕ配線や、薄く多孔質なｌｏｗ−ｋ膜のように、機械的強度が極めて低く研磨キズが発生しやすいものや、薄板ガラスのような硬く脆いために割れが発生しやすいものが増加する傾向にある。これらの被研磨物では、キズの発生数やキズサイズが厳しく制限されており、高精度な研磨加工が要求されている。被研磨物に対するダメージを低減する目的で、研磨表面が軟質で圧縮性を有するスウェード調の研磨パッドが開示されている（例えば、特許文献１参照）。 On the other hand, the object to be polished includes mechanically patterned wafers such as interlayer insulating films, barrier film removal, shallow trench isolation (STI), soft Cu wiring, and thin and porous low-k films. There is a tendency that the mechanical strength is extremely low and polishing scratches are likely to occur, and those that are prone to cracking because they are hard and brittle, such as thin glass. In these objects to be polished, the number of scratches and the size of scratches are severely limited, and high-precision polishing is required. For the purpose of reducing damage to an object to be polished, a suede-like polishing pad having a soft polishing surface and compressibility has been disclosed (for example, see Patent Document 1).
一般的なスウェード調の研磨パッドは湿式凝固法により製造されている。湿式凝固法では、ポリエステルフィルムや不織布等の基材上にポリウレタン樹脂溶液を塗布した後、水溶液中でポリウレタン樹脂の溶剤と水とを置換させることで３次元網目状のポリウレタン発泡体が形成される。この発泡体では、ポリウレタン樹脂溶液と水溶液との界面で瞬時に溶剤と水との置換が生じることで、界面部分に緻密な微多孔で構成される表皮層が形成され、表皮層から離れるに従い肥大する孔径が約１０μｍから数百μｍの発泡が形成される。特許文献１の技術では、従来のスウェード調の研磨パッドにおいて除去されていた表面皮膜付近に存在する孔径が１０μｍから６０μｍの小さな発泡部を使用することで研磨特性を向上させている。この場合、小さな発泡部の領域が広くなるほど良好な研磨特性で使用できる期間が長くなり、製品寿命も長くなる。しかし、研磨パッドの寿命を延長するために小さな発泡部を厚く製造しようとすると、全体の発泡形状を小さくしなければならず、弾性が小さくなるためにクッション性を損なうこととなる。反対に、クッション性を重視すると発泡を大きくする必要があり、小さな発泡部の領域が小さくなる、または、小さな発泡部が形成されなくなってしまう。つまり、従来の湿式凝固法による研磨パッドでは、クッション機能と製品寿命とのどちらかが犠牲となり、両者の機能を兼ね備えた研磨パッドが得られていないのが現状である。発泡構造の異なるシートを一体成型した研磨パッドの例もあるが満足できるものは得られていない。 A general suede-like polishing pad is manufactured by a wet coagulation method. In the wet coagulation method, a polyurethane resin solution is applied on a substrate such as a polyester film or a nonwoven fabric, and then the polyurethane resin solvent and water are replaced in an aqueous solution to form a three-dimensional network polyurethane foam. . In this foam, an instantaneous replacement of the solvent and water occurs at the interface between the polyurethane resin solution and the aqueous solution, so that a skin layer composed of dense micropores is formed at the interface, and the surface becomes thicker as the distance from the skin layer increases. Foam having a pore diameter of about 10 μm to several hundred μm is formed. In the technique of Patent Document 1, the polishing characteristics are improved by using a small foamed part having a pore diameter of 10 μm to 60 μm that exists in the vicinity of the surface film that has been removed by the conventional suede-like polishing pad. In this case, the wider the area of the small foamed portion, the longer the period in which it can be used with good polishing characteristics, and the longer the product life. However, if an attempt is made to make a small foamed portion thick in order to extend the life of the polishing pad, the entire foamed shape must be reduced, and the cushioning property is impaired due to the reduced elasticity. On the other hand, if emphasis is placed on cushioning properties, it is necessary to increase foaming, and the area of the small foamed part becomes small, or the small foamed part is not formed. In other words, in the conventional polishing pad by the wet coagulation method, either the cushion function or the product life is sacrificed, and a polishing pad having both functions has not been obtained. There are examples of polishing pads in which sheets with different foam structures are integrally molded, but satisfactory ones have not been obtained.
本発明は上記事案に鑑み、クッション性を確保しつつ長期にわたり研磨性能を発揮することができる研磨パッドの製造方法を提供することを課題とする。 An object of the present invention is to provide a method for manufacturing a polishing pad capable of exhibiting polishing performance over a long period of time while ensuring cushioning properties.
上記課題を解決するために、本発明は、発泡構造を有する樹脂製シートを備えた研磨パッドの製造方法であって、有機溶媒に樹脂を溶解させた樹脂溶液を準備する準備ステップと、前記準備ステップで準備された樹脂溶液を基材にシート状に塗布する塗布ステップと、前記塗布ステップで基材に塗布された樹脂溶液を主成分が水の凝固液中に案内し、前記樹脂溶液の凝固完了前に前記凝固液中で前記基材から剥離した後、前記樹脂溶液の凝固を完了させる凝固ステップと、を含むことを特徴とする。 In order to solve the above-mentioned problems, the present invention provides a method for producing a polishing pad comprising a resin sheet having a foamed structure, comprising a preparation step of preparing a resin solution in which a resin is dissolved in an organic solvent, and the preparation A coating step in which the resin solution prepared in the step is applied to the base material in a sheet form, and the main component guides the resin solution applied to the base material in the coating step into a water coagulating liquid, so that the resin solution is solidified. And a coagulation step for completing coagulation of the resin solution after peeling from the substrate in the coagulation liquid before completion.
本発明では、凝固ステップで、基材に塗布された樹脂溶液を凝固液中に案内することで表面側から有機溶媒と凝固液との置換が生じて樹脂溶液の凝固が進行することに加えて、樹脂溶液の凝固完了前に基材から剥離することで基材が剥離された面側からも凝固が進行する。当初基材に塗布された樹脂溶液の表面側からと、基材が剥離された面側からとで凝固の進行に差異が生じるため、厚み方向両側で発泡構造の異なるシート状の樹脂が一体形成される。本発明によれば、樹脂溶液の凝固中に基材から剥離することで、厚み方向で発泡構造の異なる発泡体が１種類の樹脂で形成されるため、研磨加工時にクッション性を確保しつつ長期にわたり研磨性能を発揮することができる。 In the present invention, in the coagulation step, the resin solution applied to the base material is guided into the coagulation liquid, so that the organic solvent and the coagulation liquid are replaced from the surface side and the coagulation of the resin solution proceeds. The solidification proceeds from the surface side where the substrate is peeled off by peeling off from the substrate before the completion of the solidification of the resin solution. Since there is a difference in the progress of solidification from the surface side of the resin solution initially applied to the base material and from the surface side from which the base material has been peeled off, sheet-like resins with different foam structures are integrally formed on both sides in the thickness direction Is done. According to the present invention, since the foam having a different foam structure in the thickness direction is formed of one kind of resin by peeling from the substrate during the solidification of the resin solution, the cushioning property is ensured for a long time while polishing. The polishing performance can be exhibited over a wide range.
この場合において、凝固ステップで少なくとも基材近傍の樹脂溶液がゲル状態のときに基材から剥離されるようにすることができる。塗布ステップで、基材に、樹脂溶液の塗布前に、剥離性を良化する剥離剤が塗布されていることが好ましい。また、凝固ステップで樹脂中に、厚み方向中央部より基材が剥離される面と反対の面側に多数の第１の発泡を連続発泡状に形成し、中央部より基材が剥離される面側に多数の第２の発泡を連続発泡状に形成することができる。このとき、凝固ステップで基材に塗布された樹脂溶液の表面側および基材が剥離された面側に緻密な微多孔構造を有する表面層を形成することができる。凝固ステップで第１および第２の発泡の少なくとも一部が網目状に連通してもよい。凝固ステップで第１の発泡を第２の発泡の平均容積より小さい平均容積に形成することができる。凝固ステップで第１の発泡を縦長円錐状に形成し、第２の発泡を球状に形成することができる。塗布ステップで有機溶媒に溶解させる樹脂をポリウレタン樹脂としてもよい。準備ステップで、樹脂溶液が、樹脂溶液全量に対して０．２〜５重量パーセントの親水性界面活性剤を含むようにしてもよい。また、凝固ステップで凝固した樹脂の基材が剥離された面側ないし基材が剥離された面と反対の面側をバフ処理またはスライス処理で研削する研削ステップを更に含むようにしてもよい。 In this case, at least the resin solution in the vicinity of the substrate can be peeled off from the substrate in the solidification step. In the coating step, it is preferable that a release agent for improving the peelability is applied to the base material before the application of the resin solution. Further, a large number of first foams are formed in a continuous foam shape on the surface opposite to the surface from which the base material is peeled from the central portion in the thickness direction in the resin in the solidification step, and the base material is peeled from the central portion. A large number of second foams can be formed in a continuous foam shape on the surface side. At this time, a surface layer having a dense microporous structure can be formed on the surface side of the resin solution applied to the substrate in the coagulation step and on the surface side from which the substrate is peeled. In the coagulation step, at least a part of the first and second foams may be communicated in a mesh shape. In the solidification step, the first foam can be formed to an average volume that is less than the average volume of the second foam. In the solidification step, the first foam can be formed into a vertically long cone, and the second foam can be formed into a spherical shape. The resin dissolved in the organic solvent in the coating step may be a polyurethane resin. In the preparation step, the resin solution may contain 0.2 to 5 weight percent of a hydrophilic surfactant based on the total amount of the resin solution. Moreover, you may make it further include the grinding step which grinds by the buff process or the slicing process the surface side opposite to the surface from which the base material of the resin solidified in the solidification step was peeled or the surface from which the base material was peeled.
本発明によれば、樹脂溶液の凝固中に基材から剥離することで、厚み方向で発泡構造の異なる発泡体が１種類の樹脂で形成されるため、研磨加工時にクッション性を確保しつつ長期にわたり研磨性能を発揮することができる、という効果を得ることができる。 According to the present invention, since the foam having a different foam structure in the thickness direction is formed of one kind of resin by peeling from the substrate during the solidification of the resin solution, the cushioning property is ensured for a long time while polishing. The effect that the polishing performance can be exhibited over a wide range can be obtained.
以下、図面を参照して、本発明を適用し製造した研磨パッドの実施の形態について説明する。 Hereinafter, embodiments of a polishing pad manufactured by applying the present invention will be described with reference to the drawings.
（研磨パッド）
図１に示すように、本実施形態の研磨パッド１０は、湿式成膜法で一体形成されたポリウレタン樹脂製のウレタン発泡体（樹脂製シート）２を備えている。ウレタン発泡体２は、被研磨物を研磨加工するための研磨面Ｐを有し発泡４が形成された研磨部２ａと、発泡５が形成されたクッション部２ｂと、発泡４および発泡５が非形成の中間部２ｃとを有している。
(Polishing pad)
As shown in FIG. 1, the polishing pad 10 of the present embodiment includes a polyurethane resin urethane foam (resin sheet) 2 integrally formed by a wet film forming method. The urethane foam 2 has a polishing portion 2a having a polishing surface P for polishing an object to be polished and having a foam 4 formed thereon, a cushion portion 2b having a foam 5 formed therein, a foam 4 and a foam 5 being non- And an intermediate portion 2c of formation.
研磨部２ａは、研磨面Ｐの近傍で厚さ数μｍにわたり緻密な微多孔が形成されたスキン層（表面層）２１を有している。すなわち、スキン層２１は微多孔構造を有している。研磨部２ａのスキン層２１より内側（内部）には、多数の発泡（第１の発泡）４が略均等に分散した状態で形成されている。発泡４は、丸みを帯びた縦長円錐状（断面縦長三角状）に形成されており、研磨面Ｐ側の孔径が研磨面Ｐと反対の面（以下、裏面Ｑという。）側より小さく形成されている。すなわち、発泡４は研磨面Ｐ側で縮径されている。発泡４の縦長方向の大きさは、研磨部２ａの厚さの範囲でバラツキを有している。発泡４同士の間のポリウレタン樹脂中には、発泡４より小さい図示を省略した発泡が形成されている。研磨部２ａでは、スキン層２１の微多孔、発泡４および図示を省略した発泡が網目状に連通しており、発泡が連続発泡状に形成された連続発泡構造を有している。 The polishing part 2a has a skin layer (surface layer) 21 in which fine micropores are formed in the vicinity of the polishing surface P over a thickness of several μm. That is, the skin layer 21 has a microporous structure. A large number of foams (first foams) 4 are formed in a substantially uniformly dispersed state inside (inside) the skin layer 21 of the polishing portion 2a. The foam 4 is formed in a rounded vertical conical shape (longitudinal triangular shape in cross section), and the hole diameter on the polishing surface P side is smaller than the surface opposite to the polishing surface P (hereinafter referred to as back surface Q). ing. That is, the diameter of the foam 4 is reduced on the polishing surface P side. The size of the foam 4 in the longitudinal direction varies within the thickness range of the polishing portion 2a. In the polyurethane resin between the foams 4, foam smaller than the foam 4 and not shown is formed. The polishing portion 2a has a continuous foaming structure in which the fine porosity of the skin layer 21, foaming 4 and foaming (not shown) are connected in a mesh shape, and foaming is formed in a continuous foaming shape.
クッション部２ｂは、研磨部２ａより裏面Ｑ側に形成されており、裏面Ｑの近傍で厚さ数μｍにわたり緻密な微多孔が形成されたスキン層２２を有している。すなわち、スキン層２２は微多孔構造を有している。クッション部２ｂのスキン層２２より内側（内部）には、多数の発泡（第２の発泡）５が略均等に分散した状態で形成されている。発泡５は、球状（断面円形状）に形成されている。発泡５同士の間のポリウレタン樹脂中には、発泡５より小さい図示しない発泡が形成されている。クッション部２ｂでは、スキン層２２の微多孔、発泡５および図示しない発泡が網目状に連通しており、発泡が連続発泡状に形成された連続発泡構造を有している。 The cushion portion 2b is formed on the back surface Q side from the polishing portion 2a, and has a skin layer 22 in which fine micropores are formed in the vicinity of the back surface Q over a thickness of several μm. That is, the skin layer 22 has a microporous structure. On the inner side (inside) of the skin layer 22 of the cushion portion 2b, a large number of foams (second foams) 5 are formed in a substantially uniformly dispersed state. The foam 5 is formed in a spherical shape (circular cross section). In the polyurethane resin between the foams 5, foam (not shown) smaller than the foams 5 is formed. The cushion portion 2b has a continuous foaming structure in which the fine pores of the skin layer 22, foaming 5 and foaming (not shown) are connected in a mesh shape, and foaming is formed in a continuous foaming shape.
中間部２ｃは、研磨部２ａとクッション部２ｂとの間に形成されている。ウレタン発泡体２が１つのウレタン樹脂のみで形成されたことから、研磨部２ａとクッション部２ｂとが中間部２ｃでつながれている。中間部２ｃには、発泡４および発泡５が形成されておらず、発泡４および発泡５より小さい径の連通孔（不図示）が形成されている。発泡４および発泡５の一部は、中間部２ｃに形成された連通孔で連通している。本例では、ウレタン発泡体２の厚みが０．３〜２．０ｍｍの範囲に調整されており、湿式成膜時の条件にもよるが、中間部２ｃの厚みが２０〜２００μｍの範囲で形成されている。このため、研磨部２ａ、クッション部２ｂの厚みがいずれも概ね１００〜８００μｍの範囲となる。ウレタン発泡体２では、研磨部２ａ、クッション部２ｂがそれぞれ連続発泡構造を有しており、中間部２ｃに発泡４および発泡５の一部を連通する連通孔が形成されている。このため、ウレタン発泡体２は、全体として連続発泡体である。 The intermediate part 2c is formed between the polishing part 2a and the cushion part 2b. Since the urethane foam 2 is formed of only one urethane resin, the polishing portion 2a and the cushion portion 2b are connected by the intermediate portion 2c. In the intermediate portion 2 c, the foam 4 and the foam 5 are not formed, and communication holes (not shown) having a diameter smaller than those of the foam 4 and the foam 5 are formed. A part of the foam 4 and the foam 5 communicates with each other through a communication hole formed in the intermediate part 2c. In this example, the thickness of the urethane foam 2 is adjusted to a range of 0.3 to 2.0 mm, and the thickness of the intermediate portion 2c is formed to a range of 20 to 200 μm, depending on the conditions during wet film formation. Has been. For this reason, the thickness of both the polishing part 2a and the cushion part 2b is generally in the range of 100 to 800 μm. In the urethane foam 2, the polishing portion 2 a and the cushion portion 2 b each have a continuous foam structure, and a communication hole that connects part of the foam 4 and the foam 5 is formed in the intermediate portion 2 c. For this reason, the urethane foam 2 is a continuous foam as a whole.
クッション部２ｂに形成された発泡５は、発泡径が研磨部２ａに形成された発泡４の発泡径より大きくなる。発泡４が発泡５の平均容積より小さい平均容積を有するため、クッション部２ｂで発泡５の占める空隙割合が研磨部２ａで発泡４の占める空隙割合より大きくなり、クッション部２ｂの密度が研磨部２ａの密度より小さくなる。 The foam 5 formed in the cushion portion 2b has a foam diameter larger than the foam diameter of the foam 4 formed in the polishing portion 2a. Since the foam 4 has an average volume smaller than the average volume of the foam 5, the void ratio occupied by the foam 5 in the cushion portion 2b is larger than the void ratio occupied by the foam 4 in the polishing portion 2a, and the density of the cushion portion 2b is larger than the polishing portion 2a. Less than the density of
また、研磨パッド１０は、ウレタン発泡体２の裏面Ｑ側に、研磨機に研磨パッド１０を装着するための両面テープ７が貼り合わされている。両面テープ７は、例えば、ポリエチレンテレフタレート（以下、ＰＥＴと略記する。）製フィルム等の可撓性フィルムの基材を有しており、基材の両面にアクリル系接着剤等の感圧型接着剤層（不図示）がそれぞれ形成されている。両面テープ７は、基材の一面側の接着剤層でウレタン発泡体２と貼り合わされており、他面側（ウレタン発泡体２と反対側）の接着剤層が剥離紙８で覆われている。なお、この両面テープ７の基材は、研磨パッド１０の基材を兼ねている。 The polishing pad 10 has a double-sided tape 7 attached to the back surface Q side of the urethane foam 2 for mounting the polishing pad 10 on a polishing machine. The double-sided tape 7 has, for example, a flexible film substrate such as a polyethylene terephthalate (hereinafter abbreviated as PET) film, and a pressure-sensitive adhesive such as an acrylic adhesive on both surfaces of the substrate. Each layer (not shown) is formed. The double-sided tape 7 is bonded to the urethane foam 2 with an adhesive layer on one side of the base material, and the adhesive layer on the other side (the side opposite to the urethane foam 2) is covered with the release paper 8. . The base material of the double-sided tape 7 also serves as the base material of the polishing pad 10.
（研磨パッドの製造）
図２に示すように、研磨パッド１０は、湿式成膜法により１枚のシート状のウレタン発泡体２を一体形成し、ウレタン発泡体２と両面テープ７とを貼り合わせることで製造される。湿式成膜法では、ポリウレタン樹脂溶液を準備する準備工程（準備ステップ）、成膜基材にポリウレタン樹脂溶液を塗布する塗布工程（塗布ステップ）、成膜基材に塗布したポリウレタン樹脂溶液を凝固液中に案内し浸漬させる浸漬工程（凝固ステップの一部）、凝固液中で成膜基材から剥離しポリウレタン樹脂を凝固再生させる剥離工程（凝固ステップの一部）、シート状のポリウレタン樹脂を洗浄し乾燥させる洗浄・乾燥工程を経てウレタン発泡体２が作製される。以下、ウレタン発泡体２の作製、ウレタン発泡体２と両面テープ７との貼り合わせの順に説明する。
(Manufacture of polishing pad)
As shown in FIG. 2, the polishing pad 10 is manufactured by integrally forming a single sheet-like urethane foam 2 by a wet film forming method and bonding the urethane foam 2 and the double-sided tape 7 together. In the wet film-forming method, a preparation process (preparation step) for preparing a polyurethane resin solution, an application process (application step) for applying the polyurethane resin solution to the film-forming substrate, and a coagulating liquid for the polyurethane resin solution applied to the film-forming substrate Immersion process (part of the coagulation step) that guides and soaks in, peeling process (part of the coagulation step) that exfoliates the polyurethane resin in the coagulation liquid and coagulates and regenerates the polyurethane resin, and cleans the sheet-like polyurethane resin Then, the urethane foam 2 is produced through a washing / drying process. Hereinafter, the production of the urethane foam 2 and the bonding of the urethane foam 2 and the double-sided tape 7 will be described in this order.
ウレタン発泡体２の作製では、準備工程で、ポリウレタン樹脂、ポリウレタン樹脂を溶解可能な水混和性の有機溶媒のＮ，Ｎ−ジメチルホルムアミド（以下、ＤＭＦと略記する。）および添加剤を混合してポリウレタン樹脂を溶解させる。ポリウレタン樹脂は、ポリエステル系、ポリエーテル系、ポリカーボネート系等の樹脂から選択して用い、例えば、ポリウレタン樹脂が３０％となるようにＤＭＦに溶解させる。添加剤としては、発泡４、発泡５の大きさや量（個数）を制御するため、カーボンブラック等の顔料、発泡を促進させる親水性界面活性剤、ポリウレタン樹脂の凝固再生を安定化させる疎水性界面活性剤等を用いることができる。親水性界面活性剤は、ポリウレタン樹脂溶液の全量に対して、０．２〜５重量％の範囲で混合することが好ましい。親水性界面活性剤の量が０．２重量％未満では、凝固液とＤＭＦとの置換がスムーズに進行せず、気泡が小さくなる。反対に、親水性界面活性剤の量が５重量％を超えると、凝固液とＤＭＦとの置換の進行が速くなりすぎるため、半凝固の状態が短くなり、上述したウレタン発泡体２の構造を得ることが難しくなる。得られた溶液を濾過することで凝集塊等を除去した後、真空下で脱泡してポリウレタン樹脂溶液を得る。 In the preparation of the urethane foam 2, a polyurethane resin, a water-miscible organic solvent N, N-dimethylformamide (hereinafter abbreviated as DMF), and an additive are mixed in a preparation step. The polyurethane resin is dissolved. The polyurethane resin is selected from polyester, polyether, polycarbonate, and the like and used, for example, dissolved in DMF so that the polyurethane resin becomes 30%. Additives include pigments such as carbon black to control the size and quantity (number) of foam 4 and foam 5, hydrophilic surfactants that promote foaming, and hydrophobic interfaces that stabilize the solidification regeneration of polyurethane resins. An activator or the like can be used. The hydrophilic surfactant is preferably mixed in the range of 0.2 to 5% by weight with respect to the total amount of the polyurethane resin solution. When the amount of the hydrophilic surfactant is less than 0.2% by weight, the replacement of the coagulating liquid with DMF does not proceed smoothly, and the bubbles become small. On the contrary, if the amount of the hydrophilic surfactant exceeds 5% by weight, the substitution of the coagulating liquid and DMF becomes too fast, so that the semi-solid state is shortened and the structure of the urethane foam 2 described above is obtained. It becomes difficult to obtain. The obtained solution is filtered to remove aggregates and the like, and then defoamed under vacuum to obtain a polyurethane resin solution.
塗布工程では、準備工程で得られたポリウレタン樹脂溶液を常温下でナイフコータ等により帯状の成膜基材にシート状に略均一に塗布する。このとき、ナイフコータ等と成膜基材との間隙（クリアランス）を調整することで、ポリウレタン樹脂溶液の塗布厚さ（塗布量）が調整される。成膜基材としては、布帛や不織布等を用いることもできるが、次工程の凝固再生工程で成膜基材を剥離することを考慮すれば、表面が平滑に形成された樹脂製フィルムを用いることが望ましい。成膜基材には、本例では、表面平滑性を有するＰＥＴ製フィルムが用いられる。また、成膜基材にポリウレタン樹脂溶液を塗布する前に、カルボキシメチルセルロース（以下、ＣＭＣと略記する。）等の剥離剤を塗布しておくことで、次工程における剥離性を良化することができる。本例では、ＰＥＴ製フィルムの成膜基材が、予め、ＣＭＣでコーティングされている。 In the application step, the polyurethane resin solution obtained in the preparation step is applied substantially uniformly in a sheet form to the belt-shaped film forming substrate with a knife coater or the like at room temperature. At this time, the application thickness (application amount) of the polyurethane resin solution is adjusted by adjusting the gap (clearance) between the knife coater and the film forming substrate. As the film-forming substrate, fabric or non-woven fabric can be used. However, considering that the film-forming substrate is peeled off in the next solidification regeneration step, a resin film having a smooth surface is used. It is desirable. In this example, a PET film having surface smoothness is used as the film forming substrate. In addition, by applying a release agent such as carboxymethyl cellulose (hereinafter abbreviated as CMC) before applying the polyurethane resin solution to the film forming substrate, the releasability in the next step can be improved. it can. In this example, the film formation substrate of the PET film is coated with CMC in advance.
浸漬工程では、成膜基材に塗布されたポリウレタン樹脂溶液を、ポリウレタン樹脂に対して貧溶媒である水を主成分とする凝固液中に案内し浸漬させる。凝固液には、ポリウレタン樹脂の凝固再生速度を調整するために、ＤＭＦやＤＭＦ以外の極性溶媒等の有機溶媒を添加してもよい。本例では、凝固液として水が使用される。凝固液中でポリウレタン樹脂溶液が凝固し、連続発泡構造を有するポリウレタン樹脂が凝固再生する。凝固液中では、まず、ポリウレタン樹脂溶液と凝固液との界面に皮膜が形成され、被膜の直近のポリウレタン樹脂中にスキン層２１を構成する無数の微多孔が形成される。その後、ポリウレタン樹脂溶液中のＤＭＦの凝固液中への拡散と、ウレタン樹脂への水の浸入の協調現象とによりポリウレタン樹脂の凝固再生が進行する。ポリウレタン樹脂は凝集力が大きいために皮膜表面で急速に凝固が起こり、内部のウレタン樹脂含量が減少する。そして、表面に形成した緻密気孔の皮膜により凝固液中への溶剤の拡散が抑制されて、巨大な気孔が内部に形成される。ＤＭＦがポリウレタン樹脂溶液から脱溶媒し、ＤＭＦと凝固液とが置換することで、スキン層２１より内側のポリウレタン樹脂中に発泡４および図示を省略した発泡が形成され、スキン層２１の微多孔、発泡４および図示を省略した発泡が網目状に連通する。このとき、成膜基材のＰＥＴ製フィルムが水を浸透させないため、ポリウレタン樹脂溶液の表面側（スキン層２１側）で脱溶媒が生じて成膜基材側が表面側より大きな発泡４が形成される。 In the dipping process, the polyurethane resin solution applied to the film forming substrate is guided and dipped in a coagulation liquid containing water as a main component as a poor solvent for the polyurethane resin. An organic solvent such as DMF or a polar solvent other than DMF may be added to the coagulation liquid in order to adjust the coagulation regeneration rate of the polyurethane resin. In this example, water is used as the coagulating liquid. The polyurethane resin solution coagulates in the coagulating liquid, and the polyurethane resin having a continuous foam structure is coagulated and regenerated. In the coagulating liquid, first, a film is formed at the interface between the polyurethane resin solution and the coagulating liquid, and innumerable micropores constituting the skin layer 21 are formed in the polyurethane resin immediately adjacent to the film. Thereafter, coagulation regeneration of the polyurethane resin proceeds by the diffusion phenomenon of DMF in the polyurethane resin solution into the coagulating liquid and the cooperative phenomenon of water intrusion into the urethane resin. Since the polyurethane resin has a high cohesive force, it rapidly solidifies on the surface of the film, and the content of the internal urethane resin decreases. Then, the diffusion of the solvent into the coagulation liquid is suppressed by the dense pore film formed on the surface, and huge pores are formed inside. By removing DMF from the polyurethane resin solution and replacing DMF and the coagulating liquid, foam 4 and foam not shown are formed in the polyurethane resin inside the skin layer 21. The foam 4 and the foam (not shown) communicate with each other in a mesh shape. At this time, since the PET film of the film formation substrate does not allow water to permeate, desolvation occurs on the surface side (skin layer 21 side) of the polyurethane resin solution, and a foam 4 having a larger film formation substrate side than the surface side is formed. The
剥離工程では、ポリウレタン樹脂の凝固再生が完了する前、すなわち、成膜基材に塗布したポリウレタン樹脂溶液中のＤＭＦの全量が凝固液の水と置換される前に、凝固液中で凝固再生中のポリウレタン樹脂を成膜基材から剥離する。換言すれば、ポリウレタン樹脂の凝固再生が不完全の状態、すなわち、スキン層２１側で塗布厚さのおよそ１／２程度のポリウレタン樹脂が凝固再生し、成膜基材側にＤＭＦを含む状態で成膜基材から剥離される。このとき、少なくとも成膜基材近傍のポリウレタン樹脂溶液がゲル状態である。ここでいう「ゲル状態」は、凝固液中では成膜基材から剥離可能であるものの、剥離面同士が接着性を有しており、また、大気中では成膜基材に樹脂が残る粘着質な（タック性を有する）状態のことである。成膜基材から剥離するタイミングは、凝固液の組成や温度、上述した塗布工程での塗布厚さ、用いたポリウレタン樹脂の種類、配合した添加剤等により調整される。例えば、凝固液を温度２０℃の水としてポリウレタン樹脂溶液を成膜基材に２ｍｍの塗布厚さで塗布した場合、３分後には剥離可能な半凝固（ゲル）状態となるが、１０分後では凝固再生がほぼ完了した状態となる。成膜基材には、表面平滑性を有するＰＥＴ製フィルムが用いられており、剥離剤のＣＭＣが塗布されているため、ポリウレタン樹脂の凝固再生が不完全な状態でも容易に成膜基材から剥離することができる。成膜基材から剥離した後は、スキン層２１側から凝固再生が進行することに加えて、成膜基材が剥離された面、すなわち、溶媒置換が進行していない面側からも凝固再生が進行する。このため、両面からＤＭＦと水との置換が生じ、シート状のポリウレタン樹脂の凝固再生が完了する。 In the peeling process, before the solidification regeneration of the polyurethane resin is completed, that is, before the total amount of DMF in the polyurethane resin solution applied to the film forming substrate is replaced with the water of the solidification liquid, the solidification regeneration is performed in the coagulation liquid. The polyurethane resin is peeled from the film forming substrate. In other words, the polyurethane resin coagulation regeneration is incomplete, that is, the polyurethane resin having a coating thickness of about ½ of the coating thickness on the skin layer 21 side is coagulated and regenerated and DMF is contained on the film forming substrate side. It peels from the film-forming substrate. At this time, at least the polyurethane resin solution in the vicinity of the film forming substrate is in a gel state. The “gel state” here refers to an adhesive that can be peeled off from the film-forming substrate in the coagulation liquid, but the peeled surfaces have adhesiveness, and the resin remains on the film-forming substrate in the air. It is a quality state (having tackiness). The timing of peeling from the film-forming substrate is adjusted by the composition and temperature of the coagulation liquid, the coating thickness in the coating process described above, the type of polyurethane resin used, the additive added, and the like. For example, when a coagulating liquid is water at a temperature of 20 ° C. and a polyurethane resin solution is applied to a film-forming substrate with a coating thickness of 2 mm, a semi-solidified (gel) state is obtained after 3 minutes, but after 10 minutes Then, the coagulation regeneration is almost completed. A PET film having surface smoothness is used as the film forming substrate, and since the release agent CMC is applied, it can be easily removed from the film forming substrate even when the polyurethane resin is not completely solidified and regenerated. Can be peeled off. After peeling from the film forming substrate, in addition to progress of solidification regeneration from the skin layer 21 side, coagulation regeneration from the surface from which the film forming substrate is peeled, that is, the surface side where solvent replacement is not progressing. Progresses. For this reason, substitution of DMF and water occurs from both sides, and the coagulation regeneration of the sheet-like polyurethane resin is completed.
ここで、成膜基材剥離後のポリウレタン樹脂の凝固再生に伴う発泡形成について説明する。凝固液中で成膜基材が剥離されると、成膜基材と接触していたポリウレタン樹脂溶液（実際にはゲル状態）の表面が凝固液に接触する。このとき、凝固液中ではスキン層２１側からポリウレタン樹脂の凝固再生が進行中のため、ポリウレタン樹脂の厚み方向で密度勾配が形成されている。すなわち、凝固再生の進行に伴いスキン層２１側にポリウレタン樹脂が凝集するため、成膜基材が剥離された面側の固形分濃度が小さくなっている。このため、成膜基材が剥離された面側に形成されるスキン層２２では、スキン層２１より緻密に微多孔が形成される。スキン層２２に形成された緻密気孔の皮膜により凝固液中への溶剤（ＤＭＦ）の拡散が抑制されて、巨大な空孔が内部に形成される。このとき、成膜基材が剥離された面側の固形分濃度が小さくなっているので、発泡５が発泡４より大きくなり、縦長円錐状より球状に近い形状に形成される。すなわち、図３（Ａ）に示すように、研磨部２ａ（図の上側）では縦長円錐状の発泡４が形成され、クッション部２ｂ（図の下側）では球状で発泡４より大きい発泡５が形成される。また、ポリウレタン樹脂の凝固再生が両面側（厚み方向両側）から進行するため、研磨部２ａとクッション部２ｂとの間の部分では、発泡が非形成で、発泡４および発泡５の一部を連通する連通孔が形成された中間部２ｃが形成される。つまり、ウレタン発泡体２では、厚み方向中央部の中間部２ｃよりスキン層２１側に研磨部２ａの発泡４が形成され、中間部２ｃよりスキン層２２側にクッション部２ｂの発泡５が形成される。このような凝固再生により得られるウレタン発泡体２は、全体として連続発泡構造を有しており、研磨部２ａ、中間部２ｃ、クッション部２ｂがシームレスにつながれ一体形成されたものである。 Here, the foam formation accompanying the coagulation regeneration of the polyurethane resin after the film forming substrate is peeled will be described. When the film-forming substrate is peeled in the coagulating liquid, the surface of the polyurethane resin solution (actually in a gel state) that has been in contact with the film-forming substrate comes into contact with the coagulating liquid. At this time, in the coagulation liquid, since the coagulation regeneration of the polyurethane resin is in progress from the skin layer 21 side, a density gradient is formed in the thickness direction of the polyurethane resin. That is, as the solidification regeneration progresses, the polyurethane resin aggregates on the skin layer 21 side, so that the solid content concentration on the surface side from which the film-forming substrate is peeled is small. For this reason, in the skin layer 22 formed on the surface side from which the film-forming substrate is peeled off, fine pores are formed more densely than the skin layer 21. Diffusion of the solvent (DMF) into the coagulating liquid is suppressed by the dense pore film formed in the skin layer 22, and huge pores are formed inside. At this time, since the solid content concentration on the surface side from which the film forming substrate is peeled is small, the foam 5 is larger than the foam 4 and is formed in a shape closer to a sphere than the vertically long cone. That is, as shown in FIG. 3A, a vertically conical foam 4 is formed in the polishing part 2a (upper side in the figure), and a foam 5 larger than the foam 4 is spherical in the cushion part 2b (lower side in the figure). It is formed. Further, since solidification regeneration of the polyurethane resin proceeds from both sides (both sides in the thickness direction), no foam is formed in the portion between the polishing portion 2a and the cushion portion 2b, and a part of the foam 4 and the foam 5 is communicated. The intermediate part 2c in which the communicating hole which forms is formed is formed. That is, in the urethane foam 2, the foam 4 of the polishing portion 2a is formed on the skin layer 21 side from the intermediate portion 2c at the center in the thickness direction, and the foam 5 of the cushion portion 2b is formed on the skin layer 22 side from the intermediate portion 2c. The The urethane foam 2 obtained by such solidification regeneration has a continuous foam structure as a whole, and the polishing part 2a, the intermediate part 2c, and the cushion part 2b are seamlessly connected and integrally formed.
図２に示すように、洗浄・乾燥工程では、浸漬工程、剥離工程を経て凝固再生したポリウレタン樹脂を水等の洗浄液中で洗浄してポリウレタン樹脂中に残留するＤＭＦを除去した後、乾燥させる。ポリウレタン樹脂の乾燥には、本例では、内部に熱源を有するシリンダを備えたシリンダ乾燥機が用いられる。ポリウレタン樹脂がシリンダの周面に沿って通過することで乾燥する。得られたウレタン発泡体２はロール状に巻き取られる。 As shown in FIG. 2, in the washing / drying step, the polyurethane resin coagulated and regenerated through the dipping step and the peeling step is washed in a washing solution such as water to remove DMF remaining in the polyurethane resin and then dried. In the present example, a cylinder dryer having a cylinder having a heat source is used for drying the polyurethane resin. The polyurethane resin is dried by passing along the peripheral surface of the cylinder. The obtained urethane foam 2 is wound up into a roll.
湿式成膜法で作製されたウレタン発泡体２と、両面テープ７とが貼り合わされる。このとき、ウレタン発泡体２の裏面Ｑと両面テープ７とが貼り合わされる。そして、円形や角形等の所望の形状に裁断した後、汚れや異物等の付着がないことを確認する等の検査を行い、研磨パッド１０を完成させる。 The urethane foam 2 produced by the wet film forming method and the double-sided tape 7 are bonded together. At this time, the back surface Q of the urethane foam 2 and the double-sided tape 7 are bonded together. Then, after cutting into a desired shape such as a circle or a square, an inspection is performed such as confirming that there is no adhesion of dirt or foreign matter, and the polishing pad 10 is completed.
（作用等）
次に、本実施形態の研磨パッド１０の作用等について製造方法を中心に説明する。
(Action etc.)
Next, the operation and the like of the polishing pad 10 of this embodiment will be described focusing on the manufacturing method.
本実施形態では、剥離工程において、凝固再生中のポリウレタン樹脂溶液が凝固液中で成膜基材から剥離される。このため、スキン層２１側から進行していたポリウレタン樹脂の凝固再生に加えて、成膜基材を剥離した面側からも凝固再生が進行する。スキン層２１側から進行する凝固再生により成膜基材側の樹脂（固形分）濃度が低下しているため、研磨部２ａ（中間部２ｃより研磨面Ｐ側）とクッション部２ｂ（中間部２ｃより裏面Ｑ側）とで異なる発泡構造を有するウレタン発泡体２を一体形成することができる。つまり、ウレタン発泡体２を、厚み方向両側でシームレスに発泡構造の異なるシート状に形成することができる。 In the present embodiment, in the peeling step, the polyurethane resin solution being coagulated and regenerated is peeled from the film forming substrate in the coagulating liquid. For this reason, in addition to the solidification regeneration of the polyurethane resin that has progressed from the skin layer 21 side, the solidification regeneration also proceeds from the surface side from which the film-forming substrate has been peeled off. Since the resin (solid content) concentration on the film-forming substrate side is reduced by the solidification regeneration that proceeds from the skin layer 21 side, the polishing portion 2a (the polishing surface P side from the intermediate portion 2c) and the cushion portion 2b (intermediate portion 2c). The urethane foam 2 having a different foam structure on the back surface Q side) can be integrally formed. That is, the urethane foam 2 can be formed into a sheet shape having different foam structures seamlessly on both sides in the thickness direction.
また、本実施形態では、スキン層２１側からとスキン層２２側からとで凝固再生時の樹脂濃度が異なるため、クッション部２ｂに形成された発泡５の平均容積が研磨部２ａに形成された発泡４の平均容積より大きくなる。このため、研磨加工時にかけられる研磨圧でクッション部２ｂが研磨部２ａより変形しやすくなる。これにより、得られたウレタン発泡体２を用いた研磨パッド１０では、クッション部２ｂのクッション性が研磨部２ａより大きくなるので、クッション部２ｂでクッション性を確保することができ、研磨加工時にかけられる研磨圧をウレタン発泡体２の全体に均等化することができる。 In this embodiment, since the resin concentration at the time of coagulation regeneration is different from the skin layer 21 side and from the skin layer 22 side, the average volume of the foam 5 formed in the cushion portion 2b is formed in the polishing portion 2a. It becomes larger than the average volume of the foam 4. For this reason, the cushion portion 2b is more easily deformed than the polishing portion 2a by the polishing pressure applied during the polishing process. As a result, in the polishing pad 10 using the obtained urethane foam 2, the cushioning property of the cushion part 2b is larger than that of the polishing part 2a. The polishing pressure applied can be equalized over the entire urethane foam 2.
更に、本実施形態では、塗布工程においてポリウレタン樹脂溶液が塗布される成膜基材が、ゲル状態のポリウレタン樹脂を剥離しやすいように予め剥離剤のＣＭＣでコーティングされている。このため、剥離工程でポリウレタン樹脂の凝固再生が不完全な状態で成膜基材から容易に剥離することができる。これにより、表裏面（厚み方向両側）で発泡構造の異なるウレタン発泡体２を得ることができる。また、剥離工程で成膜基材から剥離する操作を除けば、従来の湿式成膜法を適用することができるため、繁雑な工程を経ることなく、ウレタン発泡体２ひいては研磨パッド１０を製造することができる。更には、１層のウレタン発泡体２が研磨部２ａとクッション部２ｂとを有するので、従来のように研磨層およびクッション層の２層を貼り合わせて構成される研磨パッドでは粘着剤や両面テープによる貼り合わせを要するのに比べて、製造工程を簡略化することができる。 Furthermore, in this embodiment, the film-forming substrate to which the polyurethane resin solution is applied in the applying step is coated with a release agent CMC in advance so that the polyurethane resin in a gel state can be easily peeled off. For this reason, it can peel easily from a film-forming base material in the state in which coagulation | solidification reproduction | regeneration of a polyurethane resin is incomplete in a peeling process. Thereby, the urethane foam 2 from which a foam structure differs in front and back (both thickness direction both sides) can be obtained. In addition, since the conventional wet film forming method can be applied except for the operation of peeling from the film forming substrate in the peeling process, the urethane foam 2 and thus the polishing pad 10 are manufactured without going through complicated processes. be able to. Furthermore, since one layer of urethane foam 2 has a polishing portion 2a and a cushion portion 2b, an adhesive or double-sided tape is used for a polishing pad configured by bonding two layers of a polishing layer and a cushion layer as in the prior art. The manufacturing process can be simplified as compared with the case where bonding is required.
本実施形態の製造方法で得られた研磨パッド１０では、ウレタン発泡体２の研磨部２ａ、中間部２ｃ、クッション部２ｂが１つの樹脂のみで形成されるため、研磨安定性を高めることができ、製品寿命を向上させることができる。すなわち、図３（Ｂ）に示すように、クッション部の大きな発泡から研磨面側に縮径しながら伸びる雫状の発泡が形成された従来のスウェード調研磨パッドでは、クッション部の発泡と研磨部の発泡とが明確に分かれて形成されていないため、研磨面での発泡径が研磨パッドの摩耗に伴い（厚みが変わるにつれて）バラツキを生じ、研磨安定性を損なうこととなる。また、研磨面に研磨加工に有効な発泡径の開孔を形成する研磨部の厚み領域が狭くなるため、安定した研磨加工が行える時間が短くなり、製品寿命が短くなる。これに対して、本実施形態の研磨パッド１０では、研磨部２ａとクッション部２ｂとが中間部２ｃにより明確に分けられているため、研磨部２ａの研磨面Ｐに形成される孔のサイズのバラツキが小さくなり、安定した研磨加工を長時間行うことができる。 In the polishing pad 10 obtained by the manufacturing method of the present embodiment, the polishing portion 2a, the intermediate portion 2c, and the cushion portion 2b of the urethane foam 2 are formed of only one resin, so that polishing stability can be improved. The product life can be improved. That is, as shown in FIG. 3 (B), in the conventional suede-like polishing pad in which the cocoon-like foam extending from the large foam of the cushion part to the polishing surface side is formed, the cushion part is foamed and the grinding part. Therefore, the foam diameter on the polishing surface varies with wear of the polishing pad (as the thickness changes), and the polishing stability is impaired. In addition, since the thickness region of the polishing portion that forms an opening having a foam diameter effective for polishing is narrowed on the polishing surface, the time during which stable polishing can be performed is shortened, and the product life is shortened. On the other hand, in the polishing pad 10 of the present embodiment, the polishing portion 2a and the cushion portion 2b are clearly separated by the intermediate portion 2c, so that the size of the hole formed in the polishing surface P of the polishing portion 2a is the same. The variation is reduced and stable polishing can be performed for a long time.
ここで、１つの樹脂で形成された研磨部２ａ、中間部２ｃ、クッション部２ｂを有する３層構造に類似のウレタン発泡体２の作用について、コイルバネを用い、（Ａ）、（Ｂ）の２つの等価モデルを考えると、次のように説明することもできる。すなわち、（Ａ）巻径が大きく高弾性を有する複数個のコイルバネＡを平面状に並べたクッション材の場合は、一面側の全体にかかる圧力では他面側に略均等に伝達されるものの、局部的な圧力では個々のコイルバネＡにかかる圧力が偏重するうえ、コイルバネＡの大きな巻径の単位での応答となり略均等に伝達され難くなる。これに対して、（Ｂ）巻径を小さくして弾性を低くしたコイルバネＢを用いコイルバネＡより多くの個数を平面状に並べたクッション材の場合は、全体にかかる圧力が略均等に伝達されることはもちろん、巻径を小さくしたことで即応性に優れるため、局部的な圧力でもコイルバネＢの小さな巻径の単位で応答でき伝達される。（Ａ）が研磨層およびクッション層を粘着剤を介して貼り合わせた従来の研磨パッドに対応し、（Ｂ）が１つの樹脂のみで形成された３層構造を有する本実施形態の研磨パッド１０に対応する。従って、本実施形態のウレタン発泡体２のように、シームレスに一体形成されたことで、被研磨物の微小な凹凸に対応してクッション部２ｂのクッション応答性が高められることが説明できる。 Here, with respect to the action of the urethane foam 2 similar to a three-layer structure having a polishing portion 2a, an intermediate portion 2c, and a cushion portion 2b formed of a single resin, a coil spring is used and (A) and (B) 2 Considering one equivalent model, it can be explained as follows. That is, (A) In the case of a cushioning material in which a plurality of coil springs A having a large winding diameter and high elasticity are arranged in a planar shape, the pressure applied to the entire one surface side is transmitted substantially uniformly to the other surface side, With the local pressure, the pressure applied to each coil spring A is deviated, and the response becomes a unit of a large winding diameter of the coil spring A, so that it is difficult to transmit substantially evenly. On the other hand, in the case of a cushion material in which (B) a coil spring B having a reduced winding diameter and a low elasticity is used and a larger number than the coil spring A are arranged in a plane, the pressure applied to the whole is transmitted substantially evenly. Of course, since the responsiveness is excellent by reducing the winding diameter, even a local pressure can be transmitted in response to a small winding diameter unit of the coil spring B. (A) corresponds to a conventional polishing pad in which a polishing layer and a cushion layer are bonded together with an adhesive, and (B) is a polishing pad 10 of this embodiment having a three-layer structure formed of only one resin. Corresponding to Therefore, it can be explained that the cushion responsiveness of the cushion portion 2b is enhanced by being seamlessly formed integrally like the urethane foam 2 of the present embodiment, corresponding to minute irregularities of the object to be polished.
また、研磨パッド１０では、クッション部２ｂに形成された発泡５が研磨部２ａに形成された発泡４の平均容積より大きい平均容積を有している。このため、クッション部２ｂ中で発泡５の占める空隙割合が研磨部２ａ中で発泡４の占める空隙割合より大きくなり、研磨圧でクッション部２ｂが研磨部２ａより変形しやすくなる。これにより、研磨パッド１０の全体としてクッション性が確保され、被研磨物にかかる研磨圧が均等化されるため、被研磨物の平坦性を向上させることができる。換言すれば、研磨パッド１０では、同一成分で一体形成されたウレタン発泡体２が厚さ方向で擬似的な３層構造を有するため、研磨加工時に剥離の心配がなく、クッション性を十分兼ね備えることとなる。 Moreover, in the polishing pad 10, the foam 5 formed in the cushion part 2b has an average volume larger than the average volume of the foam 4 formed in the polishing part 2a. For this reason, the void ratio occupied by the foam 5 in the cushion portion 2b is larger than the void ratio occupied by the foam 4 in the polishing portion 2a, and the cushion portion 2b is more easily deformed than the polishing portion 2a by the polishing pressure. Thereby, the cushioning property is ensured as a whole of the polishing pad 10 and the polishing pressure applied to the object to be polished is equalized, so that the flatness of the object to be polished can be improved. In other words, in the polishing pad 10, since the urethane foam 2 integrally formed with the same component has a pseudo three-layer structure in the thickness direction, there is no fear of peeling at the time of polishing, and it has sufficient cushioning properties. It becomes.
更に、研磨パッド１０では、中間部２ｃがウレタン発泡体２の厚み方向略中央部に形成されている。このため、研磨部２ａとクッション部２ｂとがほぼ同じ厚さに形成される。研磨部２ａの厚さがクッション部２ｂの厚さより小さいと、クッション性を高めることができるものの、研磨加工に有効な研磨部２ａの厚さが小さくなる分で研磨パッド１０の寿命が短くなる。反対に、研磨部２ａの厚さがクッション部２ｂの厚さより大きくなると、長寿命化にはなるもののクッション性が不十分となり、被研磨物の平坦性を損なうこととなる。従って、研磨部２ａとクッション部２ｂとをほぼ同じ厚さとすることで、クッション性および寿命性能をバランスよく確保することができる。このような研磨パッド１０では、例えば、高精度な平坦性を要求される半導体デバイスの研磨加工に好適に使用することができる。 Further, in the polishing pad 10, the intermediate portion 2 c is formed at a substantially central portion in the thickness direction of the urethane foam 2. For this reason, the polishing part 2a and the cushion part 2b are formed in substantially the same thickness. When the thickness of the polishing portion 2a is smaller than the thickness of the cushion portion 2b, the cushioning property can be improved, but the life of the polishing pad 10 is shortened because the thickness of the polishing portion 2a effective for polishing is reduced. On the contrary, if the thickness of the polishing portion 2a is larger than the thickness of the cushion portion 2b, the cushioning property is insufficient but the flatness of the object to be polished is impaired. Therefore, by setting the polishing portion 2a and the cushion portion 2b to substantially the same thickness, the cushioning property and the life performance can be ensured in a balanced manner. Such a polishing pad 10 can be suitably used, for example, for polishing a semiconductor device that requires high-precision flatness.
また更に、研磨パッド１０では、ウレタン発泡体２が湿式成膜法で形成されることから発泡４および発泡５が網目状に連通している。このため、研磨層とクッション層とを貼り合わせて形成した従来の研磨パッドと比べて、研磨加工時に供給される研磨液がウレタン発泡体２の内部で移動しやすくなり、研磨加工で生じた研磨屑を発泡４、発泡５を通じて排出しやすくなる。これにより、研磨面Ｐおよび被研磨物間に略均等に研磨液が供給されると共に、研磨屑が効率よく排出されるため、研磨効率を向上させ被研磨物の平坦性向上を図ることができる。 Furthermore, in the polishing pad 10, since the urethane foam 2 is formed by a wet film forming method, the foam 4 and the foam 5 are communicated in a mesh shape. For this reason, compared with the conventional polishing pad formed by laminating the polishing layer and the cushion layer, the polishing liquid supplied at the time of polishing is easily moved inside the urethane foam 2, and polishing caused by the polishing processing It becomes easy to discharge waste through foam 4 and foam 5. As a result, the polishing liquid is supplied substantially evenly between the polishing surface P and the object to be polished, and the polishing scraps are efficiently discharged. Therefore, it is possible to improve the polishing efficiency and improve the flatness of the object to be polished. .
従来湿式成膜法で形成された研磨層を有する研磨パッドには、例えば、クッション層を有していない研磨パッドや、クッション性が不十分な研磨パッドがある。これらのクッション性を有していない、または、クッション性が不十分な研磨パッドを研磨加工に使用した場合、研磨パッドの変形が不十分なため、研磨パッド表面（研磨面）、ひいては、被研磨物に研磨装置から受ける研磨圧（押圧力）が均等化されず、被研磨物の加工面全体を略均一に平坦化することが難しくなる。一方、ウレタン発泡体の研磨層とクッション層とを貼り合わせて形成した研磨パッドでは、貼り合わせに使用する粘着剤等の層がクッション層の即応性を阻害するおそれがあり、研磨加工時に研磨層とクッション層とが剥離することがある。この剥離の問題を解消するためにクッション性を有する１枚の発泡シートで形成した研磨パッドも知られているが、発泡分布の差が不十分でクッション性を発揮させることが難しくなる。このため、被研磨物に対する研磨圧を均等化できず被研磨物の平坦性の均一性を達成することが難しくなる。本実施形態は、これらの問題を解決することができる研磨パッドである。 Conventional polishing pads having a polishing layer formed by a wet film formation method include, for example, polishing pads that do not have a cushion layer and polishing pads that have insufficient cushioning properties. When a polishing pad that does not have these cushioning properties or has insufficient cushioning properties is used for polishing processing, the polishing pad surface (polishing surface), and hence the object to be polished, is not sufficiently deformed. The polishing pressure (pressing force) applied to the object from the polishing apparatus is not equalized, and it becomes difficult to flatten the entire processed surface of the object to be polished substantially uniformly. On the other hand, in a polishing pad formed by bonding together a urethane foam polishing layer and a cushion layer, the adhesive layer used for bonding may interfere with the quick response of the cushion layer. And the cushion layer may peel off. A polishing pad formed of a single foamed sheet having cushioning properties is also known in order to eliminate this peeling problem, but it is difficult to exert cushioning properties because the difference in foaming distribution is insufficient. For this reason, it is difficult to equalize the polishing pressure on the object to be polished, and it becomes difficult to achieve uniformity in the flatness of the object to be polished. The present embodiment is a polishing pad that can solve these problems.
なお、本実施形態の製造方法では、塗布工程でポリウレタン樹脂溶液を塗布する成膜基材を予めコーティングする剥離剤として、ＣＭＣを例示したが、本発明はこれに限定されるものではない。例えば、ＣＭＣ以外に、アルギン酸ナトリウム、ポリエチレングリコール、ポリエチレンオキサイド、ポリビニルアルコール等の水溶性の剥離剤を用いてもよい。また、ポリウレタン樹脂溶液を塗布する成膜基材として、ＰＥＴ製フィルムを例示したが、剥離工程で凝固再生中のポリウレタン樹脂を成膜基材から剥離することを考慮すれば、表面平滑性を有する樹脂製であることが好ましい。本実施形態以外の成膜基材としては、例えば、ポリエチレンやポリプロピレンを挙げることができる。成膜基材の表面平滑性の程度については、特に制限されるものではなく、ポリウレタン樹脂溶液がゲル状態のときに剥離することができる程度であればよい。 In the manufacturing method of the present embodiment, CMC is exemplified as the release agent for coating the film forming substrate on which the polyurethane resin solution is applied in the application step, but the present invention is not limited to this. For example, in addition to CMC, a water-soluble release agent such as sodium alginate, polyethylene glycol, polyethylene oxide, and polyvinyl alcohol may be used. Moreover, although the film made from PET was illustrated as a film-forming base material which apply | coats a polyurethane resin solution, if it considers peeling the polyurethane resin in the solidification reproduction | regeneration in a peeling process from a film-forming base material, it has surface smoothness. It is preferably made of resin. Examples of the film forming substrate other than the present embodiment include polyethylene and polypropylene. The degree of surface smoothness of the film-forming substrate is not particularly limited as long as it can be peeled off when the polyurethane resin solution is in a gel state.
また、本実施形態の製造方法では、特に言及していないが、洗浄・乾燥工程後に、得られたウレタン発泡体２の研磨面Ｐ側ないし裏面Ｑ側をバフ処理またはスライス処理で研削する研削工程を経るようにしてもよい。バフ処理やスライス処理によりウレタン発泡体２の厚さの均一化を図ることができるため、被研磨物に対する押圧力を一層均等化し、被研磨物の平坦性を向上させることができる。 Although not particularly mentioned in the manufacturing method of the present embodiment, a grinding step of grinding the polishing surface P side or the back surface Q side of the obtained urethane foam 2 by buffing or slicing after the cleaning / drying step. You may be allowed to go through. Since the thickness of the urethane foam 2 can be made uniform by buffing or slicing, it is possible to further equalize the pressing force on the object to be polished and improve the flatness of the object to be polished.
更に、本実施形態では、中間部２ｃがウレタン発泡体２の厚み方向中央部に形成された例を示したが、本発明はこれに制限されるものではない。凝固再生工程で、ポリウレタン樹脂の種類、凝固液の組成や温度等により成膜基材から剥離するタイミングを調整することで、ウレタン発泡体２の厚み方向で中間部２ｃの形成位置を調整することができる。これにより、被研磨物にあわせてクッション性を適正化した研磨パッド１０を得ることができるが、クッション性および寿命のバランスを考慮すれば、中間部２ｃが厚み方向中央部に形成されることが好ましい。 Furthermore, in this embodiment, although the intermediate part 2c showed the example formed in the thickness direction center part of the urethane foam 2, this invention is not restrict | limited to this. In the coagulation regeneration step, the formation position of the intermediate portion 2c is adjusted in the thickness direction of the urethane foam 2 by adjusting the timing of peeling from the film forming substrate according to the type of polyurethane resin, the composition and temperature of the coagulation liquid, and the like. Can do. Thereby, it is possible to obtain the polishing pad 10 with the cushioning property optimized in accordance with the object to be polished, but considering the balance between the cushioning property and the life, the intermediate portion 2c may be formed in the central portion in the thickness direction. preferable.
また更に、本実施形態では、樹脂シートとしてポリウレタン樹脂の湿式成膜法によるウレタン発泡体２を用いる例を示したが、本発明はこれに限定されるものではない。例えば、ポリウレタン樹脂に代えてポリエチレンやポリエステル等の樹脂を用いてもよく、湿式成膜法で連続発泡構造が形成されるようにすればよい。 Furthermore, in this embodiment, although the example which uses the urethane foam 2 by the wet film-forming method of a polyurethane resin as a resin sheet was shown, this invention is not limited to this. For example, a resin such as polyethylene or polyester may be used instead of the polyurethane resin, and the continuous foam structure may be formed by a wet film forming method.
更にまた、本実施形態では、ウレタン発泡体２の裏面Ｑに基材を有する両面テープ７を貼り合わせ、両面テープの基材が研磨パッド１０の基材を兼ねる例を示したが、本発明はこれに限定されるものではない。例えば、基材を用いることなく接着剤のみをウレタン発泡体２の裏面Ｑに配しておくことで、研磨機の定盤への装着を行うことができる。また、両面テープ７の基材に代えて別の基材を貼り合わせるようにしてもよい。ウレタン発泡体２が柔軟性を有していることを考慮すれば、研磨パッド１０の搬送時や定盤への装着時の取扱いを容易にするため、基材を有していることが好ましい。 Furthermore, in this embodiment, the double-sided tape 7 having the base material is bonded to the back surface Q of the urethane foam 2 and the base material of the double-sided tape also serves as the base material of the polishing pad 10. It is not limited to this. For example, by placing only the adhesive on the back surface Q of the urethane foam 2 without using a base material, the polishing machine can be mounted on the surface plate. Moreover, it may replace with the base material of the double-sided tape 7, and you may make it stick another base material together. Considering that the urethane foam 2 has flexibility, it is preferable to have a base material in order to facilitate handling when the polishing pad 10 is transported or mounted on a surface plate.
以下、本実施形態に従い製造した研磨パッド１０の実施例について説明する。なお、比較のために製造した比較例の研磨パッドについても併記する。 Hereinafter, examples of the polishing pad 10 manufactured according to the present embodiment will be described. A comparative polishing pad manufactured for comparison is also shown.
（実施例１）
実施例１では、ウレタン発泡体２の作製にポリエステルＭＤＩ（ジフェニルメタンジイソシアネート）ポリウレタン樹脂を用いた。得られたウレタン発泡体２とＰＥＴ製の基材を有する両面テープ７とを貼り合わせ研磨パッド１０を製造した。
Example 1
In Example 1, polyester MDI (diphenylmethane diisocyanate) polyurethane resin was used for the production of the urethane foam 2. The obtained urethane foam 2 and a double-sided tape 7 having a PET base material were bonded together to produce a polishing pad 10.
（比較例１）
比較例１では、凝固再生工程において成膜基材を剥離しないこと以外は実施例１と同様にして研磨パッドを製造した。すなわち、比較例１の研磨パッドは、従来の研磨パッドである。
(Comparative Example 1)
In Comparative Example 1, a polishing pad was produced in the same manner as in Example 1 except that the film forming substrate was not peeled off in the coagulation regeneration process. That is, the polishing pad of Comparative Example 1 is a conventional polishing pad.
（評価）
各実施例および比較例の研磨パッドについて、断面を走査型電子顕微鏡で観察した。この結果、実施例１の研磨パッド１０では、図３（Ａ）に示すように、小さな発泡径を維持した縦長の発泡４が形成された研磨部２ａ、球状の発泡５が形成されたクッション部２ｂ、中間部２ｃが形成されていることが確認された。これに対して、従来の湿式凝固法により作製された比較例１の研磨パッドでは、図３（Ｂ）に示すように、研磨部とクッション部との境となる中間部が形成されず、厚み全体にわたる連続発泡が形成されていた。また、実施例１のウレタン発泡体２から、裏面Ｑ側を研削処理しクッション部２ｂと中間部２ｃとを除去することで得られた研磨部２ａの試料、研磨面Ｐ側を研削処理し研磨部２ａと中間部２ｃとを除去することで得られたクッション部２ｂの試料について、研削処理した面、すなわち、中間部２ｃ側の面での発泡形状を観察した。この結果、研磨部２ａの中間部２ｃ側の面では、図４（Ａ）に示すように、発泡が比較的細かく整然と形成されていることが判った。これに対して、クッション部２ｂの中間部２ｃ側の面では、図４（Ｂ）に示すように、研磨部２ａと比べて発泡が大きく比較的乱れた状態で形成されていることが判った。実施例１および比較例１の研磨パッドで、一般的な研磨条件でハードディスク用アルミニウム基板の研磨加工を繰り返し行った結果、比較例１の研磨パッドでは比較的早期に研磨性能が低下したのに対して、実施例１の研磨パッド１０では長期にわたり安定した研磨性能の得られることが確認された。
(Evaluation)
About the polishing pad of each Example and the comparative example, the cross section was observed with the scanning electron microscope. As a result, in the polishing pad 10 of Example 1, as shown in FIG. 3A, the polishing portion 2a in which the vertically long foam 4 maintaining a small foam diameter is formed, and the cushion portion in which the spherical foam 5 is formed. It was confirmed that 2b and the intermediate part 2c were formed. On the other hand, in the polishing pad of Comparative Example 1 manufactured by the conventional wet coagulation method, as shown in FIG. 3 (B), the intermediate portion serving as the boundary between the polishing portion and the cushion portion is not formed, and the thickness A continuous foam was formed throughout. Further, the sample of the polishing part 2a obtained by grinding the back surface Q side and removing the cushion part 2b and the intermediate part 2c from the urethane foam 2 of Example 1 and the polishing surface P side are ground and polished. Regarding the sample of the cushion portion 2b obtained by removing the portion 2a and the intermediate portion 2c, the foamed shape on the ground surface, that is, the surface on the intermediate portion 2c side was observed. As a result, it was found that foaming was formed relatively finely and orderly on the surface of the polishing portion 2a on the intermediate portion 2c side as shown in FIG. On the other hand, as shown in FIG. 4B, it was found that the foam on the surface on the intermediate part 2c side of the cushion part 2b was formed in a state where the foaming was large and relatively disturbed as compared with the polishing part 2a. . In the polishing pad of Example 1 and Comparative Example 1, the polishing process of the aluminum substrate for hard disk was repeated under general polishing conditions. As a result, the polishing performance of the polishing pad of Comparative Example 1 deteriorated relatively early. Thus, it was confirmed that the polishing pad 10 of Example 1 can obtain stable polishing performance over a long period of time.
本発明はクッション性を確保しつつ長期にわたり研磨性能を発揮することができる研磨パッドの製造方法を提供するものであるため、研磨パッドの製造、販売に寄与するので、産業上の利用可能性を有する。 Since the present invention provides a method for manufacturing a polishing pad that can exhibit polishing performance over a long period while ensuring cushioning properties, it contributes to the manufacture and sale of the polishing pad. Have.
Ｐ 研磨面
２ ウレタン発泡体（樹脂シート）
２ａ 研磨部
２ｂ クッション部
２ｃ 中間部
４ 発泡
５ 発泡
１０ 研磨パッド
P Polished surface 2 Urethane foam (resin sheet)
2a Polishing part 2b Cushion part 2c Intermediate part 4 Foam 5 Foam 10 Polishing pad
Claims (11)
有機溶媒に樹脂を溶解させた樹脂溶液を準備する準備ステップと、
前記準備ステップで準備された樹脂溶液を基材にシート状に塗布する塗布ステップと、
前記塗布ステップで基材に塗布された樹脂溶液を主成分が水の凝固液中に案内し、前記樹脂溶液の凝固完了前に前記凝固液中で前記基材から剥離した後、前記樹脂溶液の凝固を完了させる凝固ステップと、
を含むことを特徴とする製造方法。 A method for producing a polishing pad comprising a resin sheet having a foam structure,
A preparation step of preparing a resin solution in which a resin is dissolved in an organic solvent;
An application step of applying the resin solution prepared in the preparation step to a substrate in a sheet form;
The main component guides the resin solution applied to the base material in the application step into a water coagulation liquid, and after the resin solution is peeled off from the base material in the coagulation liquid before the completion of the coagulation of the resin solution, A coagulation step to complete the coagulation;
The manufacturing method characterized by including.
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