JP5264171B2 - 基板搬送装置 - Google Patents
基板搬送装置 Download PDFInfo
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- JP5264171B2 JP5264171B2 JP2007527725A JP2007527725A JP5264171B2 JP 5264171 B2 JP5264171 B2 JP 5264171B2 JP 2007527725 A JP2007527725 A JP 2007527725A JP 2007527725 A JP2007527725 A JP 2007527725A JP 5264171 B2 JP5264171 B2 JP 5264171B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C23/00—Cranes comprising essentially a beam, boom, or triangular structure acting as a cantilever and mounted for translatory of swinging movements in vertical or horizontal planes or a combination of such movements, e.g. jib-cranes, derricks, tower cranes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/14—Arm movement, spatial
- Y10S901/15—Jointed arm
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/27—Arm part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
Claims (22)
- 基板搬送装置であって、
駆動セクションと、
前記駆動セクションに作動自在に結合されたスカラアームと、を有し、
前記駆動セクションは前記スカラアームを作動せしめ、
前記スカラアームは、上方アームと、前記上方アームに可動自在に取り付けられてその上に基板を保持することが可能な少なくとも1つの前方アームと、を有し、
前記上方アームは、第1及び第2のアームセクションを有する共通アームリンクであり、前記第1及び第2のアームセクションが前記第1及び第2のアームセクションを互いに対して選択された固定角度に選択的に位置決めする係止及び解放可能な結合部によって互いに結合されていることで、前記上方アームの所定の形状が変更可能であることを特徴とする装置。 - 前記結合部は、前記第1のアームセクションと前記第2のアームセクションとの間の結合部インターフェースを含み、前記結合部インターフェースは、係止状態が解除されて前記第1のアームセクションと前記第2のアームセクションとの間の角度が変化させられ、係止状態にされて前記第1のアームセクションと前記第2のアームセクションとの間の角度が固定維持されることで角度的に調整可能であることを特徴とする請求項1に記載の装置。
- 前記第1アームセクション及び前記第2アームセクションの各々は指標位置を備えた前記結合部インターフェースの係合表面を有し、よって前記上方アームの前記第1アームセクション及び第2アームセクションが互いに位置決めされることを可能にすることを特徴とする請求項2に記載の装置。
- 前記第1アームセクションの前記結合部インターフェースの係合表面及び前記第2アームセクションの前記結合部インターフェースの係合表面は前記結合部を少なくとも部分的に形成し、前記指標位置は留め具によって機械的に係合せしめられることが可能であることを特徴とする請求項3に記載の装置。
- 前記結合部は、前記第1アームセクションと前記第2アームセクションとが互いに角度調整自在に位置決めされることを可能にすることを特徴とする請求項2に記載の装置。
- 前記結合部は回転軸を有し、前記第1アームセクションと第2アームセクションとの位置を互いに調整する際に前記第1アームセクション及び第2アームセクションは前記回転軸の回りに互いに回転自在であることを特徴とする請求項2に記載の装置。
- 前記駆動セクションは回転軸を形成し、前記スカラアームは前記駆動セクションに取り付けられて前記回転軸の回りを前記駆動セクションに対して回転することを特徴とする請求項2に記載の装置。
- 前記上方アームの前記第1アームセクション及び前記第2アームセクションは前記回転軸を挟む両側に延在するように配置されていることを特徴とする請求項7に記載の装置。
- 前記駆動セクションは前記スカラアームの駆動用の3つの独立した回転駆動軸を有していることを特徴とする請求項2に記載の装置。
- 前記3つの駆動軸は互いに同軸であることを特徴とする請求項9に記載の装置。
- 前記第1アームセクション及び前記第2アームセクションは前記上方アームの対向する両端部を各々形成し、前記3つの駆動軸の1つが前記上方アームの端部を形成する前記第1アームセクションの端部を経て延在するように位置し、前記3つの駆動軸のその他は前記上方アームの対向する端部を形成する前記第2アームセクションの端部を経て延在するように位置することを特徴とする請求項9に記載の装置。
- 基板搬送装置であって、
駆動セクションと、
前記駆動セクションに作動自在に結合されたスカラアームと、を有し、
前記駆動セクションは前記スカラアームを作動せしめ、
前記スカラアームは、上方アームと、前記上方アームに移動自在に取り付けられてその上に基板を保持することが可能な少なくとも1つの前方アームと、を有し
前記上方アームは、剛体である第1アームセクション、及び係止及び解放可能な結合部によって前記第1アームセクションに固定及び解放自在に結合された剛体である第2アームセクションを有する共通アームリンクであり、解放時には、前記上方アームの所定の形状の変更のために前記第1アームセクションは前記第2アームセクションに対して移動自在であり、固定時には前記第1及び第2のアームセクションが互いに対して係止されることを特徴とする装置。 - 前記上方アームは前記第1アームセクション及び前記第2アームセクションによって形成される湾曲形状を有していることを特徴とする請求項12に記載の装置。
- 前記第1アームセクション及び前記第2アームセクションによって形成される前記上方アームの湾曲部は所定のスカラアーム到達距離に対する基板装置到達範囲の比を達成すべく調整自在であることを特徴とする請求項13に記載の装置。
- 前記駆動セクションは回転軸を形成し、前記スカラアームは前記駆動セクションに取り付けられて前記回転軸の回りに前記駆動セクションに対して回転することを特徴とする請求項12に記載の装置。
- 前記第1アームセクション及び前記第2アームセクションは前記回転軸を挟む両側に延在することを特徴とする請求項12に記載の装置。
- 前記少なくとも1つの前方アームは前記上方アームの両端部において前記上方アームに運動自在に各々取り付けられた2つの前方アームからなることを特徴とする請求項12に記載の装置。
- 前記2つの前方アームの第1は前記上方アームの前記第1アームセクションに枢動自在に結合されて前記スカラアームの第1エルボ結合部を形成し、前記2つの前方アームの第2は前記上方アームの前記第2アームセクションに枢動自在に結合されて前記スカラアームの第2エルボ結合部を形成することを特徴とする請求項17に記載の装置。
- 各前方アームはそこに従属する個別のエンドエフェクタを有していることを特徴とする請求項12に記載の装置。
- 前記駆動セクションは3つの独立した回転駆動軸を有していることを特徴とする請求項12に記載の装置。
- 前記駆動セクションの前記3つの駆動軸は互いに同軸上に配置されて前記回転軸を形成することを特徴とする請求項20に記載の装置。
- 前記駆動セクションは3つの回転駆動モータを有し、各々は前記3つの独立した駆動軸の対応する1つを生じ、前記3つの駆動モータの少なくとも1つは前記少なくとも1つの前方アームに作動自在に結合されて前記少なくとも1つの前方アームを前記上方アームに関して回転せしめ、前記少なくとも1つの駆動モータは前記上方アームの前記第1アームセクションに搭載されていることを特徴とする請求項21に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57857104P | 2004-06-09 | 2004-06-09 | |
US60/578,571 | 2004-06-09 | ||
PCT/US2005/020304 WO2005123565A2 (en) | 2004-06-09 | 2005-06-09 | Dual sacra arm |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008502498A JP2008502498A (ja) | 2008-01-31 |
JP2008502498A5 JP2008502498A5 (ja) | 2012-05-31 |
JP5264171B2 true JP5264171B2 (ja) | 2013-08-14 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007527725A Active JP5264171B2 (ja) | 2004-06-09 | 2005-06-09 | 基板搬送装置 |
Country Status (4)
Country | Link |
---|---|
US (5) | US8376685B2 (ja) |
JP (1) | JP5264171B2 (ja) |
KR (1) | KR101398665B1 (ja) |
WO (1) | WO2005123565A2 (ja) |
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