JP5241238B2 - プリント回路基板のための埋め込み過渡保護の実質的に連続する層 - Google Patents
プリント回路基板のための埋め込み過渡保護の実質的に連続する層 Download PDFInfo
- Publication number
- JP5241238B2 JP5241238B2 JP2007553396A JP2007553396A JP5241238B2 JP 5241238 B2 JP5241238 B2 JP 5241238B2 JP 2007553396 A JP2007553396 A JP 2007553396A JP 2007553396 A JP2007553396 A JP 2007553396A JP 5241238 B2 JP5241238 B2 JP 5241238B2
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- Prior art keywords
- transient
- transient protection
- material layer
- conductive
- layer
- Prior art date
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- 230000001052 transient effect Effects 0.000 title claims description 154
- 239000000463 material Substances 0.000 claims description 88
- 239000004020 conductor Substances 0.000 claims description 41
- 230000001681 protective effect Effects 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229920001940 conductive polymer Polymers 0.000 claims 2
- 239000010410 layer Substances 0.000 description 107
- 239000003989 dielectric material Substances 0.000 description 40
- 238000000034 method Methods 0.000 description 24
- 238000010586 diagram Methods 0.000 description 23
- 229920000642 polymer Polymers 0.000 description 16
- 239000002131 composite material Substances 0.000 description 11
- 239000011888 foil Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- BWWVXHRLMPBDCK-UHFFFAOYSA-N 1,2,4-trichloro-5-(2,6-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl BWWVXHRLMPBDCK-UHFFFAOYSA-N 0.000 description 9
- 239000012792 core layer Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012705 liquid precursor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/073—High voltage adaptations
- H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Semiconductor Integrated Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
C=0.2244εγA/d
ここで、C=静電容量(ピコファラド)、A=面積(スクエアインチ)、εγ=比誘電率、d=誘電体の厚さ(インチ)である。
Claims (2)
- プリント回路基板であって、
少なくとも一つの電力面又は接地面を含む複数の積層された層(1212、1202、1210)と、
前記複数の積層された層(1212、1202、1210)を貫通する導電ビアバレル(1206)と、
前記少なくとも一つの電力面又は接地面の導電材料層をコーティングする過渡保護材料層(1202)であって、共通する面上に設けられた前記導電材料層の一部(1212)と前記導電ビアバレル(1206)との間の非導電領域(1204)を掛け渡す過渡保護材料層(1202)と、
を備え、
前記導電材料層および前記過渡保護材料層は、非導電ポリマーである誘電体層上に積層されている、
プリント回路基板。 - プリント回路基板であって、
少なくとも一つの電力面又は接地面を含む複数の積層された層と、
前記複数の積層された層を貫通し、少なくとも一つのビアパッドを含むビア構造と、
前記少なくとも一つの電力面又は接地面の導電材料層をコーティングする過渡保護材料層であって、共通する面上に設けられた前記導電材料層の一部(1212)と前記少なくとも一つのビアパッド(1208)との間の非導電領域(1204)を掛け渡す過渡保護材料層(1202)と、
を備え、
前記導電材料層および前記過渡保護材料層は、非導電ポリマーである誘電体層上に積層されている、
プリント回路基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65372305P | 2005-02-16 | 2005-02-16 | |
US60/653,723 | 2005-02-16 | ||
PCT/US2006/005639 WO2007050114A2 (en) | 2005-02-16 | 2006-02-16 | A substantially continuous layer of embedded transient protection for printed circuit boards |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011002220A Division JP5588362B2 (ja) | 2005-02-16 | 2011-01-07 | プリント回路基板のための埋め込み過渡保護の実質的に連続する層 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008529309A JP2008529309A (ja) | 2008-07-31 |
JP5241238B2 true JP5241238B2 (ja) | 2013-07-17 |
Family
ID=36917156
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007553396A Active JP5241238B2 (ja) | 2005-02-16 | 2006-02-16 | プリント回路基板のための埋め込み過渡保護の実質的に連続する層 |
JP2007553397A Pending JP2008533699A (ja) | 2005-02-16 | 2006-02-16 | プリント回路基板のための埋め込み過渡保護の選択的な堆積 |
JP2011002220A Active JP5588362B2 (ja) | 2005-02-16 | 2011-01-07 | プリント回路基板のための埋め込み過渡保護の実質的に連続する層 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007553397A Pending JP2008533699A (ja) | 2005-02-16 | 2006-02-16 | プリント回路基板のための埋め込み過渡保護の選択的な堆積 |
JP2011002220A Active JP5588362B2 (ja) | 2005-02-16 | 2011-01-07 | プリント回路基板のための埋め込み過渡保護の実質的に連続する層 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7688598B2 (ja) |
JP (3) | JP5241238B2 (ja) |
CN (2) | CN101595769B (ja) |
TW (2) | TWI397356B (ja) |
WO (2) | WO2007050114A2 (ja) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7446030B2 (en) * | 1999-08-27 | 2008-11-04 | Shocking Technologies, Inc. | Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
US20100044079A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
US20080035370A1 (en) * | 1999-08-27 | 2008-02-14 | Lex Kosowsky | Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material |
US20100038121A1 (en) * | 1999-08-27 | 2010-02-18 | Lex Kosowsky | Metal Deposition |
AU6531600A (en) * | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US20100044080A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
US20100038119A1 (en) * | 1999-08-27 | 2010-02-18 | Lex Kosowsky | Metal Deposition |
US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
US7695644B2 (en) * | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
US7688598B2 (en) * | 2005-02-16 | 2010-03-30 | Sanmina-Sci Corporation | Substantially continuous layer of embedded transient protection for printed circuit boards |
TWI389205B (zh) * | 2005-03-04 | 2013-03-11 | Sanmina Sci Corp | 使用抗鍍層分隔介層結構 |
US9781830B2 (en) | 2005-03-04 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
JP3993211B2 (ja) * | 2005-11-18 | 2007-10-17 | シャープ株式会社 | 多層プリント配線板およびその製造方法 |
CN101496167A (zh) | 2005-11-22 | 2009-07-29 | 肖克科技有限公司 | 用于过电压保护的包括电压可变换材料的半导体器件 |
US20100263200A1 (en) * | 2005-11-22 | 2010-10-21 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
TWI276382B (en) * | 2006-02-07 | 2007-03-11 | Asustek Comp Inc | Circuit board |
US7968010B2 (en) | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Method for electroplating a substrate |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
US7872251B2 (en) | 2006-09-24 | 2011-01-18 | Shocking Technologies, Inc. | Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same |
US20080073114A1 (en) * | 2006-09-24 | 2008-03-27 | Lex Kosowsky | Technique for plating substrate devices using voltage switchable dielectric material and light assistance |
US20120119168A9 (en) * | 2006-11-21 | 2012-05-17 | Robert Fleming | Voltage switchable dielectric materials with low band gap polymer binder or composite |
US7793236B2 (en) * | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
US20090050856A1 (en) * | 2007-08-20 | 2009-02-26 | Lex Kosowsky | Voltage switchable dielectric material incorporating modified high aspect ratio particles |
TWI421996B (zh) * | 2008-01-10 | 2014-01-01 | Ind Tech Res Inst | 靜電放電防護架構 |
US8206614B2 (en) | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
US20090220771A1 (en) * | 2008-02-12 | 2009-09-03 | Robert Fleming | Voltage switchable dielectric material with superior physical properties for structural applications |
US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
US20100047535A1 (en) * | 2008-08-22 | 2010-02-25 | Lex Kosowsky | Core layer structure having voltage switchable dielectric material |
WO2010033635A1 (en) * | 2008-09-17 | 2010-03-25 | Shocking Technologies, Inc. | Voltage switchable dielectric material containing boron compound |
KR101653426B1 (ko) | 2008-09-30 | 2016-09-01 | 쇼킹 테크놀로지스 인코포레이티드 | 도전 코어 쉘 입자를 포함하는 전압 절환형 유전 물질 |
US9208931B2 (en) * | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
US8362871B2 (en) * | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
US8272123B2 (en) * | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
EP2412212A1 (en) | 2009-03-26 | 2012-02-01 | Shocking Technologies Inc | Components having voltage switchable dielectric materials |
TWI363583B (en) * | 2009-07-15 | 2012-05-01 | Quanta Comp Inc | Audio circuit board |
US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
US9320135B2 (en) | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
US9082622B2 (en) * | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
US9224728B2 (en) | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
EP2564482B1 (en) * | 2010-04-28 | 2023-10-25 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
JP2012018907A (ja) * | 2010-06-11 | 2012-01-26 | Nissan Motor Co Ltd | 電機部品 |
WO2013044096A2 (en) * | 2011-09-21 | 2013-03-28 | Shocking Technologies, Inc. | Vertical switching formations for esd protection |
CN103716994B (zh) * | 2012-09-28 | 2016-09-07 | 珠海方正科技高密电子有限公司 | 一种印制电路板的制作方法及其印制电路板 |
TWI496516B (zh) * | 2013-08-06 | 2015-08-11 | Pegatron Corp | 電路板結構 |
TWI501709B (zh) * | 2013-08-16 | 2015-09-21 | Pegatron Corp | 電路板 |
US9510439B2 (en) * | 2014-03-13 | 2016-11-29 | Honeywell International Inc. | Fault containment routing |
US9503090B2 (en) | 2014-08-19 | 2016-11-22 | International Business Machines Corporation | High speed level translator |
TWI569392B (zh) * | 2014-10-20 | 2017-02-01 | 欣興電子股份有限公司 | 凹槽式載板製造方法 |
US9980381B2 (en) | 2014-12-16 | 2018-05-22 | Motorola Solutions, Inc. | Method and apparatus for intrinsically safe circuit board arrangement for portable electronic devices |
CN114814669A (zh) * | 2022-05-06 | 2022-07-29 | 中国科学院近代物理研究所 | 一种磁场纹波测量方法及装置 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4133735A (en) * | 1977-09-27 | 1979-01-09 | The Board Of Regents Of The University Of Washington | Ion-sensitive electrode and processes for making the same |
US4628022A (en) | 1983-07-13 | 1986-12-09 | At&T Technologies, Inc. | Multilayer circuit board fabrication process and polymer insulator used therein |
US4992333A (en) * | 1988-11-18 | 1991-02-12 | G&H Technology, Inc. | Electrical overstress pulse protection |
DE3911711A1 (de) * | 1989-04-10 | 1990-10-11 | Ibm | Modul-aufbau mit integriertem halbleiterchip und chiptraeger |
US5010641A (en) * | 1989-06-30 | 1991-04-30 | Unisys Corp. | Method of making multilayer printed circuit board |
US5260848A (en) | 1990-07-27 | 1993-11-09 | Electromer Corporation | Foldback switching material and devices |
JP2773578B2 (ja) | 1992-10-02 | 1998-07-09 | 日本電気株式会社 | 半導体装置の製造方法 |
US5382928A (en) | 1993-01-22 | 1995-01-17 | The Whitaker Corporation | RF filter having composite dielectric layer and method of manufacture |
GB2277197B (en) | 1993-04-13 | 1997-08-27 | Motorola Inc | Voltage protection arrangement |
US5479031A (en) | 1993-09-10 | 1995-12-26 | Teccor Electronics, Inc. | Four layer overvoltage protection device having buried regions aligned with shorting dots to increase the accuracy of overshoot voltage value |
MX9700370A (es) | 1994-07-14 | 1998-03-31 | Surgx Corp | Estructuras de proteccion de voltaje variable y metodos para fabricarlas. |
CN1094237C (zh) | 1994-07-14 | 2002-11-13 | 苏吉克斯公司 | 单层及多层可变电压保护装置及其制作方法 |
US6210537B1 (en) | 1995-06-19 | 2001-04-03 | Lynntech, Inc. | Method of forming electronically conducting polymers on conducting and nonconducting substrates |
US5906042A (en) * | 1995-10-04 | 1999-05-25 | Prolinx Labs Corporation | Method and structure to interconnect traces of two conductive layers in a printed circuit board |
US6172590B1 (en) | 1996-01-22 | 2001-01-09 | Surgx Corporation | Over-voltage protection device and method for making same |
US5796570A (en) * | 1996-09-19 | 1998-08-18 | National Semiconductor Corporation | Electrostatic discharge protection package |
US6013358A (en) | 1997-11-18 | 2000-01-11 | Cooper Industries, Inc. | Transient voltage protection device with ceramic substrate |
US6251513B1 (en) * | 1997-11-08 | 2001-06-26 | Littlefuse, Inc. | Polymer composites for overvoltage protection |
US6642297B1 (en) * | 1998-01-16 | 2003-11-04 | Littelfuse, Inc. | Polymer composite materials for electrostatic discharge protection |
GB2334627B (en) | 1998-02-21 | 2003-03-12 | Mitel Corp | Vertical spark gap for microelectronic circuits |
US6064094A (en) | 1998-03-10 | 2000-05-16 | Oryx Technology Corporation | Over-voltage protection system for integrated circuits using the bonding pads and passivation layer |
US6130459A (en) * | 1998-03-10 | 2000-10-10 | Oryx Technology Corporation | Over-voltage protection device for integrated circuits |
US6549114B2 (en) | 1998-08-20 | 2003-04-15 | Littelfuse, Inc. | Protection of electrical devices with voltage variable materials |
DE19958915A1 (de) * | 1998-12-08 | 2000-06-29 | Littelfuse Inc | Schutz eines integrierten Schaltkreises mit spannungsvariablen Materialien |
US6329603B1 (en) | 1999-04-07 | 2001-12-11 | International Business Machines Corporation | Low CTE power and ground planes |
AU6531600A (en) * | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US7446030B2 (en) * | 1999-08-27 | 2008-11-04 | Shocking Technologies, Inc. | Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
NL1014319C2 (nl) | 2000-02-08 | 2001-08-09 | Fci S Hertogenbosch B V | Connector omvattende een ESD onderdrukker. |
US6373719B1 (en) | 2000-04-13 | 2002-04-16 | Surgx Corporation | Over-voltage protection for electronic circuits |
US6669871B2 (en) | 2000-11-21 | 2003-12-30 | Saint-Gobain Ceramics & Plastics, Inc. | ESD dissipative ceramics |
US7258819B2 (en) | 2001-10-11 | 2007-08-21 | Littelfuse, Inc. | Voltage variable substrate material |
WO2003088356A1 (en) * | 2002-04-08 | 2003-10-23 | Littelfuse, Inc. | Voltage variable material for direct application and devices employing same |
US6981319B2 (en) | 2003-02-13 | 2006-01-03 | Shrier Karen P | Method of manufacturing devices to protect election components |
US20040183135A1 (en) | 2003-03-19 | 2004-09-23 | Oh-Hun Kwon | ESD dissipative structural components |
US6853036B1 (en) | 2003-08-06 | 2005-02-08 | Esd Pulse, Inc. | Method and apparatus for preventing microcircuit dynamic thermo-mechanical damage during an ESD event |
US7688598B2 (en) | 2005-02-16 | 2010-03-30 | Sanmina-Sci Corporation | Substantially continuous layer of embedded transient protection for printed circuit boards |
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2006
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- 2006-02-16 JP JP2007553396A patent/JP5241238B2/ja active Active
- 2006-02-16 US US11/357,618 patent/US7593203B2/en active Active
- 2006-02-16 CN CN200680004951.XA patent/CN101595769B/zh active Active
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US20060181827A1 (en) | 2006-08-17 |
WO2006089272A2 (en) | 2006-08-24 |
TW200642548A (en) | 2006-12-01 |
JP2011109121A (ja) | 2011-06-02 |
CN101595769B (zh) | 2011-09-14 |
US20060181826A1 (en) | 2006-08-17 |
US7688598B2 (en) | 2010-03-30 |
CN101189365B (zh) | 2015-09-16 |
WO2006089272A3 (en) | 2009-04-16 |
TW200642547A (en) | 2006-12-01 |
US7593203B2 (en) | 2009-09-22 |
WO2007050114A2 (en) | 2007-05-03 |
JP2008529309A (ja) | 2008-07-31 |
JP2008533699A (ja) | 2008-08-21 |
TWI375494B (en) | 2012-10-21 |
JP5588362B2 (ja) | 2014-09-10 |
WO2007050114A3 (en) | 2007-12-21 |
CN101189365A (zh) | 2008-05-28 |
CN101595769A (zh) | 2009-12-02 |
TWI397356B (zh) | 2013-05-21 |
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