JP5237878B2 - シンセティック・ジェット強化自然冷却用のシステムおよび方法 - Google Patents
シンセティック・ジェット強化自然冷却用のシステムおよび方法 Download PDFInfo
- Publication number
- JP5237878B2 JP5237878B2 JP2009110238A JP2009110238A JP5237878B2 JP 5237878 B2 JP5237878 B2 JP 5237878B2 JP 2009110238 A JP2009110238 A JP 2009110238A JP 2009110238 A JP2009110238 A JP 2009110238A JP 5237878 B2 JP5237878 B2 JP 5237878B2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- synthetic jet
- enclosure
- synthetic
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
- F15D1/00—Influencing flow of fluids
- F15D1/08—Influencing flow of fluids of jets leaving an orifice
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
Description
102 側壁
104 上壁
106 表面
108 下部
110 流れ
112 上部
200 熱プロファイルマップ
202 x軸
204 y軸
206 第1の温度の階調
208 第2の温度の階調
210 第3の温度の階調
212 第4の温度の階調
300 コンポーネントのエンクロージャ
302 側壁
304 シンセティック・ジェット組立体
306 ジェット・ポート
308 シンセティック・ジェット組立体ハウジング
400 熱プロファイルマップ
402 x軸
404 y軸
502 シンセティック・ジェット・エジェクタ
504 表面
506 コンポーネント
508 流体
510 流体のジェット
512 圧電部材
514 アクチュエータ
516 渦リング
518 シンセティック・ジェット空洞
600 シンセティック・ジェット組立体
602 第1のシンセティック・ジェット・エジェクタ
604 第2のシンセティック・ジェット・エジェクタ
606 第3のシンセティック・ジェット・エジェクタ
Claims (6)
- 体積内に配置された発熱コンポーネントを取り囲むようにして前記体積を画定する1つまたは複数の側壁と、
前記1つまたは複数の側壁の少なくとも1つの側壁の表面に隣接して一体的に形成され、前記体積の外側に配置されたシンセティック・ジェット組立体と、
を備えるコンポーネントのエンクロージャであって、
前記シンセティック・ジェット組立体は、ジェット・ポートを備える少なくとも1つのシンセティック・ジェット・エジェクタを含み、前記ジェット・ポートは、前記少なくとも1つの側壁の表面と垂直、平行および斜めのうちの少なくとも1つで位置合わせされており、
前記シンセティック・ジェット組立体は、前記ポートを貫く流体のジェットを前記表面とほぼ平行、前記表面の上へ垂直、および前記表面に向って斜めのうちの少なくとも1つに向けるように構成され、前記流体のジェットが前記体積の外部へ流れ、
前記シンセティック・ジェット組立体が、直列流体連通で共に結合される複数のシンセティック・ジェット・エジェクタを備えること
を特徴とするコンポーネントのエンクロージャ。 - 前記シンセティック・ジェット・エジェクタが、複数のジェット・ポートを備えることを特徴とする請求項1に記載のエンクロージャ。
- 前記シンセティック・ジェット組立体が、単一のハウジング中に囲まれる複数のシンセティック・ジェット・エジェクタを備えることを特徴とする請求項1に記載のエンクロージャ。
- 前記シンセティック・ジェット・エジェクタが、流体の流れが発生するように振動するように構成される圧電アクチュエータを備えることを特徴とする請求項1に記載のエンクロージャ。
- 前記複数の側壁のうちの少なくとも1つ側壁が、拡張した表面を含み、前記ジェット・ポートが、前記拡張した表面の表面と垂直および斜めのうちの少なくとも1つで位置合わせされることを特徴とする請求項1に記載のエンクロージャ。
- 体積を画定する複数の側壁を備えるコンポーネントのエンクロージャと、
前記体積内に配置される発熱コンポーネントと、
前記複数の側壁のうちの少なくとも1つの側壁の外側の表面に隣接して配置され、一体的に形成されたハウジングを備えたシンセティック・ジェット組立体と、
を備える電子式コンポーネントシステムであって、
前記シンセティック・ジェット組立体は、ジェット・ポートを備える少なくとも1つのシンセティック・ジェット・エジェクタを含み、前記ジェット・ポートは、前記少なくとも1つの側壁の表面と垂直、平行および斜めのうちの少なくとも1つで位置合わせされており、
前記シンセティック・ジェット組立体は、前記ポートを貫く流体のジェットを前記表面とほぼ平行、前記表面の上へ垂直、および前記表面に向って斜めのうちの少なくとも1つに向けるように構成され、前記流体のジェットが前記体積の外部へ流れ、
前記シンセティック・ジェット組立体が、直列流体連通で共に結合される複数のシンセティック・ジェット・エジェクタを備えること
を特徴とする電子式コンポーネントシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/118,435 US7990705B2 (en) | 2008-05-09 | 2008-05-09 | Systems and methods for synthetic jet enhanced natural cooling |
US12/118,435 | 2008-05-09 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009272626A JP2009272626A (ja) | 2009-11-19 |
JP2009272626A5 JP2009272626A5 (ja) | 2012-05-24 |
JP5237878B2 true JP5237878B2 (ja) | 2013-07-17 |
Family
ID=40935660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009110238A Expired - Fee Related JP5237878B2 (ja) | 2008-05-09 | 2009-04-30 | シンセティック・ジェット強化自然冷却用のシステムおよび方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7990705B2 (ja) |
EP (1) | EP2116730B1 (ja) |
JP (1) | JP5237878B2 (ja) |
CN (1) | CN101577144B (ja) |
BR (1) | BRPI0901827C8 (ja) |
CA (1) | CA2665056C (ja) |
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US10274263B2 (en) | 2009-04-09 | 2019-04-30 | General Electric Company | Method and apparatus for improved cooling of a heat sink using a synthetic jet |
US8776871B2 (en) * | 2009-11-19 | 2014-07-15 | General Electric Company | Chassis with distributed jet cooling |
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-
2008
- 2008-05-09 US US12/118,435 patent/US7990705B2/en active Active
-
2009
- 2009-04-30 CA CA2665056A patent/CA2665056C/en not_active Expired - Fee Related
- 2009-04-30 JP JP2009110238A patent/JP5237878B2/ja not_active Expired - Fee Related
- 2009-04-30 EP EP09159255.0A patent/EP2116730B1/en not_active Not-in-force
- 2009-05-07 BR BRPI0901827A patent/BRPI0901827C8/pt not_active IP Right Cessation
- 2009-05-08 CN CN200910145681.XA patent/CN101577144B/zh not_active Expired - Fee Related
-
2013
- 2013-08-01 US US13/956,904 patent/USRE47790E1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2665056C (en) | 2013-08-20 |
CA2665056A1 (en) | 2009-11-09 |
USRE47790E1 (en) | 2019-12-31 |
BRPI0901827A2 (pt) | 2010-01-26 |
EP2116730A2 (en) | 2009-11-11 |
BRPI0901827B8 (pt) | 2019-05-07 |
CN101577144B (zh) | 2014-08-13 |
BRPI0901827B1 (pt) | 2019-04-02 |
BRPI0901827C8 (pt) | 2019-06-25 |
JP2009272626A (ja) | 2009-11-19 |
EP2116730A3 (en) | 2010-03-10 |
CN101577144A (zh) | 2009-11-11 |
EP2116730B1 (en) | 2017-03-15 |
US7990705B2 (en) | 2011-08-02 |
US20100271775A1 (en) | 2010-10-28 |
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