JP5217358B2 - タッチパネル - Google Patents
タッチパネル Download PDFInfo
- Publication number
- JP5217358B2 JP5217358B2 JP2007274977A JP2007274977A JP5217358B2 JP 5217358 B2 JP5217358 B2 JP 5217358B2 JP 2007274977 A JP2007274977 A JP 2007274977A JP 2007274977 A JP2007274977 A JP 2007274977A JP 5217358 B2 JP5217358 B2 JP 5217358B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring
- conductive layer
- touch panel
- wiring patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/052—Branched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Position Input By Displaying (AREA)
- Laminated Bodies (AREA)
- Push-Button Switches (AREA)
Description
さらに、引出パターンの端部が上基板及び下基板より外方に位置することによって、引出パターンの端部に金属バリ等が発生したとしても、これらが上基板と下基板下端の間の、配線パターン上端や上下電極に付着しづらいという作用を有する。
図1は本発明の一実施の形態によるタッチパネルの平面図であり、同図において、21はポリイミドやポリエチレンテレフタレート等のフィルム状の基材で、上端中央部には切欠部21Aが設けられると共に、基材21上面には金メッキされた銅等によって、複数の配線パターン22が形成されている。
6 下基板
7 上導電層
8 下導電層
9 スペーサ
21 基材
21A 切欠部
22 配線パターン
23 引出パターン
24 配線基板
25 接着剤
26 ベースシート
Claims (1)
- フィルム状の基材と、この基材の上面または下面の少なくとも一方に、上記基材の一端部と他端部に対応して一端から他端に延出形成された複数の配線パターンを備えた配線基板と、下面に上導電層が形成された上基板と、上面に上記上導電層と所定の間隙を空けて対向する下導電層が形成された下基板を備え、上記上基板の上記上導電層両端と、これと直交方向の上記下基板の上記下導電層両端に、上記配線基板の上記複数の配線パターンの一端を接続したタッチパネルであって、上記配線基板には、上記複数の配線パターンの一端及び他端を上記基材の一端部及び他端部より各々内方に形成して、上記複数の配線パターンの一端及び他端を除く部分から側方に延出し、上記基材の外形切断時に切断されて端部が形成されると共に上記端部が上記上基板及び上記下基板より外方に位置する引出パターンを設けたタッチパネル。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007274977A JP5217358B2 (ja) | 2007-10-23 | 2007-10-23 | タッチパネル |
CN200810189890XA CN101483972B (zh) | 2007-10-23 | 2008-10-20 | 布线基板及使用此布线基板的触摸屏 |
US12/255,981 US20090102812A1 (en) | 2007-10-23 | 2008-10-22 | Wiring board and touch panel using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007274977A JP5217358B2 (ja) | 2007-10-23 | 2007-10-23 | タッチパネル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009104372A JP2009104372A (ja) | 2009-05-14 |
JP5217358B2 true JP5217358B2 (ja) | 2013-06-19 |
Family
ID=40563035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007274977A Active JP5217358B2 (ja) | 2007-10-23 | 2007-10-23 | タッチパネル |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090102812A1 (ja) |
JP (1) | JP5217358B2 (ja) |
CN (1) | CN101483972B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103677368B (zh) * | 2012-09-20 | 2016-11-23 | 瀚宇彩晶股份有限公司 | 触控面板与软性电路板的接合结构 |
CN103226427A (zh) * | 2012-11-30 | 2013-07-31 | 深圳市骏达光电有限公司 | 一种电阻触摸屏用fpc、电阻触摸屏及电子设备 |
US10716221B2 (en) * | 2016-03-04 | 2020-07-14 | Samsung Display Co., Ltd. | Method of manufacturing electronic device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3258218B2 (ja) * | 1995-11-17 | 2002-02-18 | アルプス電気株式会社 | タブレット |
JP2002041231A (ja) * | 2000-05-17 | 2002-02-08 | Hitachi Ltd | 画面入力型表示装置 |
JP2003004562A (ja) * | 2001-06-18 | 2003-01-08 | Alps Electric Co Ltd | 入力装置ならびに検出装置 |
JP2003140181A (ja) * | 2001-11-02 | 2003-05-14 | Nec Corp | 液晶表示装置 |
JP2003271311A (ja) * | 2002-03-18 | 2003-09-26 | Alps Electric Co Ltd | 座標入力装置およびこれを用いた液晶表示装置 |
JP2003280820A (ja) * | 2002-03-22 | 2003-10-02 | Fujitsu Component Ltd | 入力装置及び電子装置 |
JP4591157B2 (ja) * | 2005-03-31 | 2010-12-01 | パナソニック株式会社 | 配線基板及びこれを用いた入力装置とその製造方法 |
JP4777759B2 (ja) * | 2005-12-01 | 2011-09-21 | 富士フイルム株式会社 | 配線基板及び配線基板接続装置 |
JP2007172025A (ja) * | 2005-12-19 | 2007-07-05 | Matsushita Electric Ind Co Ltd | タッチパネル |
JP4779681B2 (ja) * | 2006-02-07 | 2011-09-28 | パナソニック株式会社 | タッチパネル |
-
2007
- 2007-10-23 JP JP2007274977A patent/JP5217358B2/ja active Active
-
2008
- 2008-10-20 CN CN200810189890XA patent/CN101483972B/zh active Active
- 2008-10-22 US US12/255,981 patent/US20090102812A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN101483972A (zh) | 2009-07-15 |
US20090102812A1 (en) | 2009-04-23 |
JP2009104372A (ja) | 2009-05-14 |
CN101483972B (zh) | 2011-03-23 |
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