JP5214690B2 - 赤外線検出素子 - Google Patents
赤外線検出素子 Download PDFInfo
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- JP5214690B2 JP5214690B2 JP2010204798A JP2010204798A JP5214690B2 JP 5214690 B2 JP5214690 B2 JP 5214690B2 JP 2010204798 A JP2010204798 A JP 2010204798A JP 2010204798 A JP2010204798 A JP 2010204798A JP 5214690 B2 JP5214690 B2 JP 5214690B2
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- 238000001514 detection method Methods 0.000 claims description 169
- 239000000758 substrate Substances 0.000 claims description 58
- 239000004065 semiconductor Substances 0.000 claims description 49
- 238000010521 absorption reaction Methods 0.000 claims description 40
- 238000006243 chemical reaction Methods 0.000 claims description 26
- 230000001681 protective effect Effects 0.000 description 59
- 238000005530 etching Methods 0.000 description 45
- 230000035945 sensitivity Effects 0.000 description 30
- 238000000034 method Methods 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- 239000011810 insulating material Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 15
- 239000010410 layer Substances 0.000 description 14
- 230000004044 response Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000008859 change Effects 0.000 description 9
- 230000007423 decrease Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- 238000000059 patterning Methods 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 5
- 230000004043 responsiveness Effects 0.000 description 5
- 239000002356 single layer Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/023—Particular leg structure or construction or shape; Nanotubes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Description
また、赤外線センサ素子の応答特性は検出セルの熱容量Cthと熱コンダクタンスGthを用いると(2)式で表される。
(2)式において、τは熱時定数であり、入射信号に対する出力信号変化が最大値の約63%に変化するまでの時間を意味し、応答特性を指標となるものである。
以下、第1の実施形態について、図面を用いて説明する。なお、以下の図面の記載において、同一または類似の部分には同一または類似の符号が付してある。
また、第2の実施の形態について、以下に説明する。
さらに、第3の実施の形態について、以下に説明する。
2…支持部
3…信号線配線部
3a…水平アドレス線
3b…垂直信号線
4…半導体基板
5…エッチングホール
7…空洞部
8…保護絶縁膜
9…フォトレジスト
10…熱電変換部
11…検出セル配線部
12…検出セル貫通孔
13…検出セルトレンチ
20…支持配線部
Claims (5)
- 表面に空洞部が設けられた半導体基板と、
前記半導体基板の前記空洞部を囲む領域に形成された信号配線部と、
前記信号配線部に接続され、前記信号配線部より内側であって前記空洞部よりも上側に配置された支持部と、
前記支持部に接続され、前記支持部よりも内側であって前記半導体基板の前記空洞部よりも上側に支持され、熱電変換部と、検出セル配線部と、吸収層と、が順次積層されている検出セルと、を備え、
前記検出セルに、上部が広がった形状である複数の孔を設け、前記複数の孔の少なくとも一部は前記吸収層を貫通して前記空洞部まで達するように配置されることを特徴とする赤外線検出素子。 - 前記孔は、貫通している第1の孔と、底部が前記吸収層内の前記検出セル配線部の上部に位置している第2の孔と、をそれぞれ有することを特徴とする請求項1記載の赤外線検出素子。
- 前記支持部の高さが、前記信号配線部又は前記検出セルの高さよりも低いことを特徴とする請求項1または2に記載の赤外線検出素子。
- 前記孔の上部の直径が、15μm以下であることを特徴とする請求項1乃至請求項3のいずれかに記載の赤外線検出素子。
- 前記孔の上部に広がった形状のテーパー角が、45°以上90°以下であることを特徴とする請求項1乃至請求項4のいずれかに記載の赤外線検出素子。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010204798A JP5214690B2 (ja) | 2010-09-13 | 2010-09-13 | 赤外線検出素子 |
US13/069,610 US8541861B2 (en) | 2010-09-13 | 2011-03-23 | Infrared detection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010204798A JP5214690B2 (ja) | 2010-09-13 | 2010-09-13 | 赤外線検出素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012058212A JP2012058212A (ja) | 2012-03-22 |
JP5214690B2 true JP5214690B2 (ja) | 2013-06-19 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2010204798A Active JP5214690B2 (ja) | 2010-09-13 | 2010-09-13 | 赤外線検出素子 |
Country Status (2)
Country | Link |
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US (1) | US8541861B2 (ja) |
JP (1) | JP5214690B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5521827B2 (ja) * | 2010-06-28 | 2014-06-18 | セイコーエプソン株式会社 | 焦電型検出器、焦電型検出装置及び電子機器 |
DE112013001984T5 (de) | 2012-04-10 | 2015-03-12 | Ud Holdings, Llc | Thermoelektrischer Supergitter-Quantenmulden-Generator mit Strahlungsaustausch und/oder -leitung / -konvektion |
US10439119B2 (en) | 2013-11-13 | 2019-10-08 | Ud Holdings, Llc | Thermoelectric generator with minimal thermal shunting |
FR3033042A1 (fr) * | 2015-02-20 | 2016-08-26 | Commissariat Energie Atomique | Dispositif de detection de rayonnement electromagnetique comportant une structure d'encapsulation a event de liberation |
TWI646672B (zh) | 2017-12-01 | 2019-01-01 | 財團法人工業技術研究院 | 紅外線感測元件及其製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0961234A (ja) * | 1995-08-28 | 1997-03-07 | Matsushita Electric Works Ltd | 赤外線検出素子およびその製造方法 |
JP3175662B2 (ja) * | 1997-10-07 | 2001-06-11 | 日本電気株式会社 | 熱型赤外線検出素子の製造方法 |
JP3514681B2 (ja) | 1999-11-30 | 2004-03-31 | 三菱電機株式会社 | 赤外線検出器 |
JP3497797B2 (ja) * | 2000-03-30 | 2004-02-16 | 株式会社東芝 | 赤外線センサの製造方法 |
US7134343B2 (en) * | 2003-07-25 | 2006-11-14 | Kabushiki Kaisha Toshiba | Opto-acoustoelectric device and methods for analyzing mechanical vibration and sound |
JP2005045463A (ja) * | 2003-07-25 | 2005-02-17 | Toshiba Corp | 音響電気変換素子 |
JP2006226891A (ja) * | 2005-02-18 | 2006-08-31 | Nec Corp | 熱型赤外線検出素子 |
JP4915898B2 (ja) | 2005-07-21 | 2012-04-11 | パナソニック株式会社 | 赤外線センサ |
JP4670757B2 (ja) * | 2006-07-06 | 2011-04-13 | 日産自動車株式会社 | 赤外線センサおよび該赤外線センサの製造方法 |
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2010
- 2010-09-13 JP JP2010204798A patent/JP5214690B2/ja active Active
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2011
- 2011-03-23 US US13/069,610 patent/US8541861B2/en active Active
Also Published As
Publication number | Publication date |
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US20120061791A1 (en) | 2012-03-15 |
JP2012058212A (ja) | 2012-03-22 |
US8541861B2 (en) | 2013-09-24 |
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