JP5170685B2 - 導電性接合材料、及び電子装置 - Google Patents
導電性接合材料、及び電子装置 Download PDFInfo
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- JP5170685B2 JP5170685B2 JP2008532041A JP2008532041A JP5170685B2 JP 5170685 B2 JP5170685 B2 JP 5170685B2 JP 2008532041 A JP2008532041 A JP 2008532041A JP 2008532041 A JP2008532041 A JP 2008532041A JP 5170685 B2 JP5170685 B2 JP 5170685B2
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- metal powder
- powder
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Description
2 基板(第1の電気構造体)
3 チップ型電子部品(第2の電気構造体)
5a、5b 外部電極(第2の電極)
6a、6b 導電性接合材料
7 熱硬化性樹脂
8 低融点金属粉末(第1の金属粉末)
9 高融点金属粉末(第2の金属粉末)
熱硬化性樹脂としてビスフェノールF型液状エポキシ樹脂、反応性稀釈材としてターシャルブチルグリシジルエーテル、硬化剤としてアミン化合物、前記硬化剤の反応抑制剤としてホウ素化合物とエポキシ樹脂との混合物、還元性物質としてこはく酸を用意した。
厚さ0.7mmのアルミナ基板上の所定位置にAg−Pdペーストを塗布し、焼付け処理を施し、アルミナ基板上に間隔が0.8mmの一対のランド電極を形成した。
試料番号1〜6の各試料について、ミリオームハイテスタ(HIOKI社製:3224型)を使用してランド電極間の接続抵抗の初期値R0を測定し、またボンドテスタ(DAGE社製:シリーズ4000)を使用して固着強度の初期値S0を測定した。
さらに、試料番号1〜6の各試料について、最高温度が270℃に調整されたリフロー炉に5回通過させてリフロー加熱処理を行った。そして、リフロー加熱処理後の抵抗値R2及び固着強度S2を測定し、リフロー後の抵抗変化率ΔR2を数式(2)に基づいて算出した。
表1は試料番号1〜6の導電性接合材料の仕様と実験結果を示している。
Claims (7)
- 熱硬化性樹脂と、該熱硬化性樹脂の熱硬化温度以下の温度で溶融するSn−Bi合金粉末からなる第1の金属粉末と、前記熱硬化性樹脂の熱硬化温度以下の温度で溶融せず、かつ前記熱硬化性樹脂の加熱硬化時に前記第1の金属粉末と反応して300℃以上の高融点を有する反応物を生成する第2の金属粉末と、該第2の金属粉末の表面に形成される酸化物を除去する還元性物質とを含有し、
前記第1の金属粉末及び前記第2の金属粉末の含有量が、総計で75〜88重量%であり、
かつ、前記第1の金属粉末の平均粒径D1と前記第2の金属粉末の平均粒径D2との粒径比D1/D2が、0.5〜6.0であることを特徴とする導電性接合材料。 - 前記第1の金属粉末及び前記第2の金属粉末の総量に対する前記第1の金属粉末の体積比率は、25〜75体積%であることを特徴とする請求項1記載の導電性接合材料。
- 前記第2の金属粉末は、前記第2の金属粉末よりも前記第1の金属粉末に対して濡れ性が高く、かつ、前記熱硬化性樹脂の熱硬化温度以下の温度で溶融する低融点金属で被覆されていることを特徴とする請求項1又は請求項2記載の導電性接合材料。
- 前記第2の金属粉末はCuを主成分とした金属粉末であり、前記低融点金属はSnを含有した金属であることを特徴とする請求項3記載の導電性接合材料。
- 前記第2の金属粉末は、該第2の金属粉末よりも前記第1の金属粉末に対して濡れ性の高い金属で被覆されていることを特徴とする請求項1又は請求項2記載の導電性接合材料。
- 前記第2の金属粉末はCuを主成分とした金属粉末であり、前記濡れ性が高い金属は貴金属であることを特徴とする請求項5記載の導電性接合材料。
- 第1の電極を有する第1の電気構造物と、第2の電極を有する第2の電気構造物とを備えた電子装置であって、
前記第1の電極と前記第2の電極とが、請求項1乃至請求項6のいずれかに記載の導電性接合材料を介して電気的に接続されると共に、
前記第1の金属粉末と前記第2の金属粉末との界面、前記第1の金属粉末と前記第1の電極との界面、及び前記第1の金属粉末と前記第2の電極との界面のうちの少なくとも1つの界面は、300℃以上の高融点を有する反応物で結合されていることを特徴とする電子装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008532041A JP5170685B2 (ja) | 2006-08-28 | 2007-08-24 | 導電性接合材料、及び電子装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006230726 | 2006-08-28 | ||
JP2006230726 | 2006-08-28 | ||
JP2008532041A JP5170685B2 (ja) | 2006-08-28 | 2007-08-24 | 導電性接合材料、及び電子装置 |
PCT/JP2007/066475 WO2008026517A1 (fr) | 2006-08-28 | 2007-08-24 | Liant conducteur et dispositif électronique |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008026517A1 JPWO2008026517A1 (ja) | 2010-01-21 |
JP5170685B2 true JP5170685B2 (ja) | 2013-03-27 |
Family
ID=39135800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008532041A Expired - Fee Related JP5170685B2 (ja) | 2006-08-28 | 2007-08-24 | 導電性接合材料、及び電子装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8222751B2 (ja) |
EP (1) | EP2058822A4 (ja) |
JP (1) | JP5170685B2 (ja) |
KR (1) | KR101056558B1 (ja) |
CN (1) | CN101506906A (ja) |
WO (1) | WO2008026517A1 (ja) |
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JP2012174332A (ja) * | 2011-02-17 | 2012-09-10 | Fujitsu Ltd | 導電性接合材料、導体の接合方法、及び半導体装置の製造方法 |
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JP5789544B2 (ja) * | 2011-03-02 | 2015-10-07 | 韓國電子通信研究院Electronics and Telecommunications Research Institute | 伝導性組成物並びにこれを含むシリコン太陽電池及びその製造方法 |
JP6003149B2 (ja) * | 2012-03-28 | 2016-10-05 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置 |
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JP6213666B2 (ja) * | 2014-04-18 | 2017-10-18 | 株式会社村田製作所 | 被着体の接着分離方法 |
KR101952004B1 (ko) * | 2014-08-29 | 2019-02-25 | 후루카와 덴키 고교 가부시키가이샤 | 도전성 접착제 조성물 |
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CN107614185B (zh) * | 2015-05-29 | 2020-09-08 | 株式会社村田制作所 | 接合用构件和接合方法 |
CN105111695B (zh) * | 2015-08-14 | 2017-01-11 | 中国工程物理研究院化工材料研究所 | 具有连续导电通道的聚合物基导电复合材料及其制备方法 |
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2007
- 2007-08-24 WO PCT/JP2007/066475 patent/WO2008026517A1/ja active Application Filing
- 2007-08-24 CN CNA2007800318224A patent/CN101506906A/zh active Pending
- 2007-08-24 EP EP07806061A patent/EP2058822A4/en not_active Withdrawn
- 2007-08-24 KR KR1020097003974A patent/KR101056558B1/ko active IP Right Grant
- 2007-08-24 JP JP2008532041A patent/JP5170685B2/ja not_active Expired - Fee Related
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2009
- 2009-02-27 US US12/394,113 patent/US8222751B2/en active Active
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2010
- 2010-12-03 US US12/959,752 patent/US8105687B2/en not_active Expired - Fee Related
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JP2001044590A (ja) * | 1999-07-30 | 2001-02-16 | Kyocera Corp | 配線基板 |
JP2003211289A (ja) * | 2002-01-21 | 2003-07-29 | Fujitsu Ltd | 導電性接合材料、それを用いた接合方法及び電子機器 |
JP2004335872A (ja) * | 2003-05-09 | 2004-11-25 | Fujitsu Ltd | 熱伝導性材料およびそれを用いた熱伝導性接合体とその製造方法 |
JP2004363052A (ja) * | 2003-06-06 | 2004-12-24 | Asahi Kasei Corp | 導電性材料、導電性成形体、導電性成形体の製造方法 |
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KR101056558B1 (ko) | 2011-08-11 |
US8222751B2 (en) | 2012-07-17 |
KR20090037961A (ko) | 2009-04-16 |
WO2008026517A1 (fr) | 2008-03-06 |
US20090155608A1 (en) | 2009-06-18 |
US20110067912A1 (en) | 2011-03-24 |
JPWO2008026517A1 (ja) | 2010-01-21 |
US8105687B2 (en) | 2012-01-31 |
CN101506906A (zh) | 2009-08-12 |
EP2058822A4 (en) | 2011-01-05 |
EP2058822A1 (en) | 2009-05-13 |
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