JP5161532B2

JP5161532B2 - Substrate surface processing equipment

Info

Publication number: JP5161532B2
Application number: JP2007268517A
Authority: JP
Inventors: 雅登山田
Original assignee: ワイエイシイ株式会社
Priority date: 2007-10-16
Filing date: 2007-10-16
Publication date: 2013-03-13
Anticipated expiration: 2027-10-16
Also published as: JP2009095914A

Description

本発明は、磁気ディスク等の基板の表面を平滑に加工する基板表面加工装置に関する。 The present invention relates to a substrate surface processing apparatus for processing a surface of a substrate such as a magnetic disk smoothly.

基板表面加工装置として、例えば特許文献１が挙げられる。この構造を図４及び図５により説明する。図４に示すように、基板１は、図示しない駆動手段で回転させられるスピンドル２にチャックされ、基板１の両面は、基板１の左右に配設された加圧装置３Ａ、３Ｂによって加工される。加圧装置３Ａ、３Ｂは次のような構造となっている。基板１の両面側には、相対向して支軸４Ａ、４Ｂが垂直に配設されており、支軸４Ａ、４Ｂには軸受５Ａ、５Ｂを介して加圧ヘッド６Ａ、６Ｂが回転自在に支承されている。加圧ヘッド６Ａ、６Ｂは、回転ドラム７Ａ、７Ｂと、この回転ドラム７Ａ、７Ｂの外周に固定されたゴム等の弾性体よりなる加圧ドラム８Ａ、８Ｂとからなっている。 As a substrate surface processing apparatus, for example, Patent Document 1 is cited. This structure will be described with reference to FIGS. As shown in FIG. 4, the substrate 1 is chucked by a spindle 2 that is rotated by a driving means (not shown), and both surfaces of the substrate 1 are processed by pressure devices 3 </ b> A and 3 </ b> B disposed on the left and right sides of the substrate 1. . The pressurizing devices 3A and 3B have the following structure. Support shafts 4A and 4B are vertically arranged on both sides of the substrate 1 so as to face each other, and pressure heads 6A and 6B are freely rotatable on the support shafts 4A and 4B via bearings 5A and 5B. It is supported. The pressure heads 6A and 6B are composed of rotating drums 7A and 7B and pressure drums 8A and 8B made of an elastic body such as rubber fixed to the outer periphery of the rotating drums 7A and 7B.

支軸４Ａ、４Ｂは、支軸固定板１０Ａ、１０Ｂに固定されており、支軸固定板１０Ａ、１０Ｂは支持板１１Ａ、１１Ｂに支軸１２Ａ、１２Ｂを介して揺動自在に支承されている。図５に示すように、支軸１２Ａ、１２Ｂより上方の支持板１１Ａ、１１Ｂ部分には、支軸固定板１０Ａ、１０Ｂに螺合する調整ねじ１３Ａ、１３Ｂが挿入されている。支軸１２Ａ、１２Ｂより下方の支持板１１Ａ、１１Ｂ部分には、ばね受けねじ１４Ａ、１４Ｂが摺動自在に挿入されており、ばね受けねじ１４Ａ、１４Ｂには、支軸固定板１０Ａ、１０Ｂに挿入された固定ねじ１５Ａ、１５Ｂが螺合している。ばね受けねじ１４Ａ、１４Ｂには、固定ねじ１５Ａ、１５Ｂが支軸固定板１０Ａ、１０Ｂに圧接するように皿ばね１６Ａ、１６Ｂが装着されている。 The support shafts 4A and 4B are fixed to support shaft fixing plates 10A and 10B, and the support shaft fixing plates 10A and 10B are swingably supported by support plates 11A and 11B via support shafts 12A and 12B. . As shown in FIG. 5, adjustment screws 13A and 13B that are screwed into the support shaft fixing plates 10A and 10B are inserted into the support plates 11A and 11B above the support shafts 12A and 12B. Spring receiving screws 14A and 14B are slidably inserted into the support plates 11A and 11B below the supporting shafts 12A and 12B. The spring receiving screws 14A and 14B are connected to the supporting shaft fixing plates 10A and 10B. The inserted fixing screws 15A and 15B are screwed together. Belleville springs 16A and 16B are mounted on the spring receiving screws 14A and 14B so that the fixing screws 15A and 15B are in pressure contact with the support shaft fixing plates 10A and 10B.

そこで、調整ねじ１３Ａ、１３Ｂを回すと、支軸固定板１０Ａ、１０Ｂは支軸１２Ａ、１２Ｂを中心として揺動する。これにより、加圧ドラム８Ａ、８Ｂを基板１に平行に調整することができる。即ち、後記する研磨テープ２１Ａ、２１Ｂの全面が基板１に圧接するように調整することができる。 Therefore, when the adjusting screws 13A and 13B are turned, the support shaft fixing plates 10A and 10B swing around the support shafts 12A and 12B. Thereby, the pressure drums 8 </ b> A and 8 </ b> B can be adjusted parallel to the substrate 1. That is, adjustment can be made so that the entire surfaces of polishing tapes 21A and 21B described later are in pressure contact with the substrate 1.

支持板１１Ａ、１１Ｂの下端は、図示しない駆動手段で水平及び上下方向に移動させられる移動板２０Ａ、２０Ｂの上面に固定されている。また加圧ドラム８Ａ、８Ｂの基板１側の面に圧接するように研磨テープ２１Ａ、２１Ｂが配設されている。研磨テープ２１Ａ、２１Ｂは、加圧ヘッド６Ａ、６Ｂと共に水平及び上下移動するようになっている。なお、特許文献１には記載されていないが、基板１の外周の外側で、かつ加圧ドラム８Ａ、８Ｂに圧接する研磨テープ２１Ａ、２１Ｂ間には、基板１の厚さより薄い加圧ヘッド受け板２２が配設されている。加圧ヘッド受け板２２は、装置の固定部に固定された固定板２３に固定されている。また研磨テープ２１Ａ、２１Ｂが加圧ヘッド受け板２２に位置する時に研磨テープ２１Ａ、２１Ｂの新しい部分を加圧ヘッド６Ａ、６Ｂの加圧面に位置させるように、図示しない巻取りリールで巻き取るようになっている。
特開２００４−２８３９６３号公報 The lower ends of the support plates 11A and 11B are fixed to the upper surfaces of the moving plates 20A and 20B that are moved horizontally and vertically by a driving means (not shown). Further, polishing tapes 21A and 21B are arranged so as to be in pressure contact with the surface of the pressure drums 8A and 8B on the substrate 1 side. The polishing tapes 21A and 21B move horizontally and up and down together with the pressure heads 6A and 6B. Although not described in Patent Document 1, a pressure head receiver thinner than the thickness of the substrate 1 is provided between the polishing tapes 21A and 21B outside the outer periphery of the substrate 1 and between the polishing tapes 21A and 21B pressed against the pressure drums 8A and 8B. A plate 22 is provided. The pressure head receiving plate 22 is fixed to a fixed plate 23 fixed to a fixed portion of the apparatus. Further, when the polishing tapes 21A and 21B are positioned on the pressure head receiving plate 22, the new portions of the polishing tapes 21A and 21B are wound by a take-up reel (not shown) so as to be positioned on the pressure surfaces of the pressure heads 6A and 6B. It has become.
JP 2004-283963 A

次に作用について説明する。始動前は移動板２０Ａ、２０Ｂが下降して研磨テープ２１Ａ、２１Ｂが加圧ヘッド６Ａ、６Ｂによって加圧ヘッド受け板２２に圧接した状態にある。スピンドル２に基板１をチャックさせ、スピンドル２が回転すると、移動板２０Ａ、２０Ｂが矢印Ｅ方向に移動して加圧ヘッド受け板２２より離れ、続いて移動板２０Ａ、２０Ｂが矢印Ｆ方向に上昇して加圧ヘッド６Ａ、６Ｂは図４に２点鎖線で示す状態になる。次に移動板２０Ａ、２０Ｂが矢印Ｇ方向に移動して加圧ヘッド６Ａ、６Ｂによって研磨テープ２１Ａ、２１Ｂが基板１に加圧される。 Next, the operation will be described. Before starting, the moving plates 20A and 20B are lowered and the polishing tapes 21A and 21B are in pressure contact with the pressure head receiving plate 22 by the pressure heads 6A and 6B. When the substrate 2 is chucked by the spindle 2 and the spindle 2 rotates, the moving plates 20A and 20B move in the direction of arrow E to move away from the pressure head receiving plate 22, and then the moving plates 20A and 20B rise in the direction of arrow F. Then, the pressure heads 6A and 6B are in a state indicated by a two-dot chain line in FIG. Next, the moving plates 20A and 20B move in the direction of the arrow G, and the polishing tapes 21A and 21B are pressed against the substrate 1 by the pressure heads 6A and 6B.

この状態で移動板２０Ａ、２０Ｂを矢印Ｈ及びＩ方向に複数回往復移動させる。これにより、基板１の両面は研磨テープ２１Ａ、２１Ｂによって研磨されて平滑化される。研磨終了後は、加圧ヘッド６Ａ、６Ｂが矢印Ｊ方向に移動させられて加圧ヘッド受け板２２上に移動させられる。 In this state, the moving plates 20A and 20B are reciprocated a plurality of times in the directions of arrows H and I. Thereby, both surfaces of the substrate 1 are polished and smoothed by the polishing tapes 21A and 21B. After the polishing, the pressure heads 6A and 6B are moved in the direction of arrow J and moved onto the pressure head receiving plate 22.

上記従来技術は、研磨終了後の加圧ヘッド６Ａ、６Ｂを加圧ヘッド受け板２２上に移動させるために、加圧ヘッド受け板２２の厚さは基板１の厚さより薄く形成されている。このため、加圧ヘッド６Ａ、６Ｂを基板１上に移動させるには、図４に示すように、加圧ヘッド６Ａ、６Ｂを基板１より離れた状態より矢印Ｇ方向に移動させて基板１上に研磨テープ２１Ａ、２１Ｂを圧接させる。このように、加圧ヘッド６Ａ、６Ｂを矢印Ｇ方向に移動させて基板１に圧接させるので、基板１の表面に傷が付くことがあった。また加圧ヘッド６Ａ、６Ｂを加圧ヘッド受け板２２から離れるように外側の矢印Ｅ方向に移動させた後、矢印Ｆ及びＧ方向に移動させるアイドル動作を行うので、生産性が悪いという問題があった。 In the above prior art, the thickness of the pressure head receiving plate 22 is made thinner than the thickness of the substrate 1 in order to move the pressure heads 6A, 6B after polishing to the pressure head receiving plate 22. For this reason, in order to move the pressure heads 6A and 6B onto the substrate 1, as shown in FIG. The polishing tapes 21A and 21B are pressed against each other. As described above, the pressure heads 6A and 6B are moved in the direction of the arrow G and pressed against the substrate 1, so that the surface of the substrate 1 may be damaged. Further, after the pressure heads 6A and 6B are moved in the direction of the arrow E so as to be separated from the pressure head receiving plate 22, an idle operation is performed in which the pressure heads 6A and 6B are moved in the directions of the arrows F and G. there were.

本発明の課題は、基板に傷が付くのを防止することができ、品質の向上が図れると共に、アイドル動作を削減して生産性の向上が図れる基板表面加工装置を提供することにある。 An object of the present invention is to provide a substrate surface processing apparatus that can prevent a substrate from being scratched, improve quality, and reduce idle operation to improve productivity.

上記課題を解決するための本発明の請求項１は、スピンドルにチャックされて回転する基板に研磨テープを圧接させて研磨する加圧ヘッドと、スピンドルにチャックされた基板の外周外側で装置の固定部に固定され、加工前には前記加圧ヘッドを受ける加圧ヘッド受け板とを備えた基板表面加工装置において、前記加圧ヘッド受け板は、厚さが基板より厚く、基板側に向けて先細のテーパ部が形成され、先端部の厚さは基板より細く形成され、かつ基板の表面の延長線上のテーパ部から先端部までの長さは、加圧ヘッドの幅より短く形成され、前記加圧ヘッドで圧接された研磨テープは、前記加圧ヘッド受け板に沿って移動して前記基板に圧接することを特徴とする。 According to a first aspect of the present invention for solving the above-mentioned problems, a pressure head for polishing by pressing a polishing tape against a rotating substrate chucked by a spindle, and fixing the apparatus outside the outer periphery of the substrate chucked by the spindle. In the substrate surface processing apparatus provided with a pressure head receiving plate that is fixed to a portion and receives the pressure head before processing, the pressure head receiving plate is thicker than the substrate and faces the substrate side. A tapered portion is formed, the thickness of the tip portion is formed thinner than the substrate, and the length from the taper portion on the extension line of the surface of the substrate to the tip portion is formed shorter than the width of the pressure head , The polishing tape pressed by the pressure head moves along the pressure head receiving plate and presses against the substrate .

研磨テープは加圧ヘッド受け板のテーパ部に沿って移動して基板に圧接するので、加圧ヘッドによって基板が傷付くことがない。また加圧ヘッドが基板の方向に移動する動作によって研磨テープは基板上に移動させられるので、無駄な動作がなく生産性の向上が図れる。 Since the polishing tape moves along the taper portion of the pressure head receiving plate and presses against the substrate, the pressure head does not damage the substrate. Further, since the polishing tape is moved onto the substrate by the movement of the pressure head in the direction of the substrate, there is no wasteful operation and productivity can be improved.

本発明の基板表面加工装置の一実施の形態を図１乃至図３により説明する。なお、図４及び図５と同じ部材に同一符号を付し、その詳細な説明は省略する。本実施の形態の加圧ヘッド受け板３０の厚さＴ１は、図３（ａ）に示すように、基板１の厚さＴ０より厚く、基板１側に向けて先細のテーパ部３１Ａ、３１Ｂが形成され、先端部３２の厚さＴ２は基板１より細く形成されている。また図３（ｂ）に示すように、基板１の表面の延長線上のテーパ部３３Ａ、３３Ｂから先端部３２までの長さＬ１は、加圧ヘッド６Ａ、６Ｂの幅Ｌ２より短く形成されている。加圧ヘッド受け板３０は、従来と同様に、装置の固定部に固定された固定板２３に固定されている。 An embodiment of a substrate surface processing apparatus of the present invention will be described with reference to FIGS. The same members as those in FIGS. 4 and 5 are denoted by the same reference numerals, and detailed description thereof is omitted. As shown in FIG. 3A, the thickness T1 of the pressure head receiving plate 30 of the present embodiment is thicker than the thickness T0 of the substrate 1, and the tapered portions 31A and 31B taper toward the substrate 1 side. The tip portion 32 is formed with a thickness T2 that is thinner than that of the substrate 1. Further, as shown in FIG. 3B, the length L1 from the taper portions 33A, 33B to the tip portion 32 on the extended line of the surface of the substrate 1 is formed shorter than the width L2 of the pressure heads 6A, 6B. . The pressure head receiving plate 30 is fixed to a fixing plate 23 fixed to the fixing portion of the apparatus, as in the conventional case.

次に作用について説明する。加圧ヘッド６Ａ、６Ｂ及び研磨テープ２１Ａ、２１Ｂは、従来と同様に、移動板２０Ａ、２０Ｂと共に水平及び上下移動させられる。そこで、以下、移動板２０Ａ、２０Ｂの移動の説明を省略し、加圧ヘッド６Ａ、６Ｂの移動について説明する。 Next, the operation will be described. The pressure heads 6A and 6B and the polishing tapes 21A and 21B are moved horizontally and up and down together with the moving plates 20A and 20B as in the prior art. Therefore, description of the movement of the moving plates 20A and 20B will be omitted, and the movement of the pressure heads 6A and 6B will be described below.

始動前は図３（ａ）に示すように、研磨テープ２１Ａ、２１Ｂが加圧ヘッド６Ａ、６Ｂによって加圧ヘッド受け板３０に圧接した状態にある。スピンドル２に基板１をチャックさせ、スピンドル２が回転すると、加圧ヘッド６Ａ、６Ｂは矢印Ａ方向に移動し、図３（ｂ）を経て図３（ｃ）の状態になる。即ち、図３（ａ）から（ｂ）の動作においては、加圧ヘッド６Ａ、６Ｂは研磨テープ２１Ａ、２１Ｂを介してテーパ部３１Ａ、３１Ｂを滑って徐々に基板１側に近づき、テーパ部３３Ａ、３３Ｂに達すると研磨テープ２１Ａ、２１Ｂは基板１に接する。 Before starting, as shown in FIG. 3A, the polishing tapes 21A and 21B are in pressure contact with the pressure head receiving plate 30 by the pressure heads 6A and 6B. When the substrate 2 is chucked by the spindle 2 and the spindle 2 rotates, the pressure heads 6A and 6B move in the direction of the arrow A, and the state shown in FIG. That is, in the operation of FIGS. 3A to 3B, the pressure heads 6A and 6B slide on the taper portions 31A and 31B through the polishing tapes 21A and 21B and gradually approach the substrate 1 side, and the taper portion 33A. , 33B, the polishing tapes 21A, 21B come into contact with the substrate 1.

このように、研磨テープ２１Ａ、２１Ｂはテーパ部３１Ａ、３１Ｂに沿って移動して基板１に圧接するので、加圧ヘッド６Ａ、６Ｂによって基板１が傷付くことがない。また加圧ヘッド６Ａ、６Ｂが矢印Ａ方向に移動する動作によって研磨テープ２１Ａ、２１Ｂは基板１上に移動させられ、従来の矢印Ｅ，Ｆ及びＧ方向の無駄な動作がないので、生産性の向上が図れる。 Thus, since the polishing tapes 21A and 21B move along the taper portions 31A and 31B and are pressed against the substrate 1, the substrate 1 is not damaged by the pressure heads 6A and 6B. Further, the polishing tapes 21A and 21B are moved onto the substrate 1 by the movement of the pressure heads 6A and 6B in the direction of the arrow A, and there is no unnecessary movement in the directions of the arrows E, F and G in the conventional manner. Improvement can be achieved.

続いて図３（ｄ）に示すように、加圧ヘッド６Ａ、６Ｂは矢印Ｂ及びＣ方向に複数回往復移動させる。これにより、基板１の両面は研磨テープ２１Ａ、２１Ｂによって研磨されて平滑化される。研磨終了後は、図３（ｅ）（ｆ）に示すように、加圧ヘッド受け板３０の方向（矢印Ｄ方向）に移動させられる。これにより、図３（ｅ）に示すように、研磨テープ２１Ａ、２１Ｂがテーパ部３３Ａ、３３Ｂに当接した後は、テーパ部３１Ａ、３１Ｂに沿って外側に移動し、研磨テープ２１Ａ、２１Ｂは基板１より離れ、図３（ｆ）の状態となる。 Subsequently, as shown in FIG. 3D, the pressure heads 6A and 6B are reciprocated a plurality of times in the directions of arrows B and C. Thereby, both surfaces of the substrate 1 are polished and smoothed by the polishing tapes 21A and 21B. After the polishing, as shown in FIGS. 3E and 3F, the pressure head receiving plate 30 is moved in the direction (arrow D direction). As a result, as shown in FIG. 3 (e), after the polishing tapes 21A and 21B come into contact with the tapered portions 33A and 33B, the polishing tapes 21A and 21B move outward along the tapered portions 31A and 31B. It is separated from the substrate 1 and is in the state of FIG.

なお、上記実施の形態は、基板１の両面を研磨する場合について説明したが、基板１の片面のみを加圧ヘッド６Ａ側の研磨テープ２１Ａで研磨する場合にも適用できることは言うまでもない。この場合は、加圧ヘッド６Ｂ及び研磨テープ２１Ｂは無いので、当然ながら、加圧ヘッド受け板３０にはテーパ部３１Ａのみを形成すれば良いことは言うまでもない。また加圧ヘッド６Ａ、６Ｂとして、回転ドラム７Ａ、７Ｂを用いた場合について説明したが、回転しないパッドを用いてもよい。 Although the above embodiment has been described for the case where both surfaces of the substrate 1 are polished, it is needless to say that the present invention can also be applied to the case where only one surface of the substrate 1 is polished with the polishing tape 21A on the pressure head 6A side. In this case, since there is no pressure head 6B and polishing tape 21B, it goes without saying that only the taper portion 31A needs to be formed on the pressure head receiving plate 30. Moreover, although the case where the rotating drums 7A and 7B are used as the pressure heads 6A and 6B has been described, a pad that does not rotate may be used.

本発明の基板表面加工装置の一実施の形態を示す一部断面側面図である。It is a partial cross section side view showing one embodiment of a substrate surface processing apparatus of the present invention. 基板と加圧ヘッド受け板との関係を示す正面図である。It is a front view which shows the relationship between a board | substrate and a pressurization head receiving plate. 加圧ヘッドの動作工程を示す説明図である。It is explanatory drawing which shows the operation | movement process of a pressurization head. 従来の基板表面加工装置の一部断面側面図である。It is a partial cross section side view of the conventional board | substrate surface processing apparatus. 加圧ヘッドの基板に対する平行度調整機構の断面拡大図である。It is a cross-sectional enlarged view of the parallelism adjustment mechanism with respect to the board | substrate of a pressure head.

符号の説明Explanation of symbols

１基板
２スピンドル
３Ａ、３Ｂ加圧装置
６Ａ、６Ｂ加圧ヘッド
７Ａ、７Ｂ回転ドラム
８Ａ、８Ｂ加圧ドラム
１０Ａ、１０Ｂ支軸固定板
１１Ａ、１１Ｂ支持板
２０Ａ、２０Ｂ移動板
２１Ａ、２１Ｂ研磨テープ
３０加圧ヘッド受け板
３１Ａ、３１Ｂテーパ部
３２先端部
３３Ａ、３３Ｂテーパ部 1 Substrate 2 Spindle 3A, 3B Pressure device 6A, 6B Pressure head 7A, 7B Rotating drum 8A, 8B Pressure drum 10A, 10B Support shaft fixing plate 11A, 11B Support plate 20A, 20B Moving plate 21A, 21B Polishing tape 30 Pressure head receiving plates 31A, 31B Tapered portion 32 Tip portions 33A, 33B Tapered portion

Claims

スピンドルにチャックされて回転する基板に研磨テープを圧接させて研磨する加圧ヘッドと、スピンドルにチャックされた基板の外周外側で装置の固定部に固定され、加工前には前記加圧ヘッドを受ける加圧ヘッド受け板とを備えた基板表面加工装置において、前記加圧ヘッド受け板は、厚さが基板より厚く、基板側に向けて先細のテーパ部が形成され、先端部の厚さは基板より細く形成され、かつ基板の表面の延長線上のテーパ部から先端部までの長さは、加圧ヘッドの幅より短く形成され、前記加圧ヘッドで圧接された研磨テープは、前記加圧ヘッド受け板に沿って移動して前記基板に圧接することを特徴とする基板表面加工装置。 A pressure head for polishing by pressing a polishing tape against a rotating substrate chucked by a spindle, and a fixed portion of the apparatus outside the outer periphery of the substrate chucked by the spindle, and receiving the pressure head before processing In the substrate surface processing apparatus provided with the pressure head receiving plate, the pressure head receiving plate is thicker than the substrate, a tapered portion is formed toward the substrate side, and the tip portion has a thickness of the substrate. The polishing tape formed to be narrower and the length from the taper portion to the tip portion on the extended line of the surface of the substrate is shorter than the width of the pressure head, and the polishing tape pressed by the pressure head is the pressure head. A substrate surface processing apparatus which moves along a receiving plate and presses against the substrate.