JP5140413B2 - Mounting substrate and LED light source device including the mounting substrate - Google Patents

Mounting substrate and LED light source device including the mounting substrate Download PDF

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JP5140413B2
JP5140413B2 JP2007339958A JP2007339958A JP5140413B2 JP 5140413 B2 JP5140413 B2 JP 5140413B2 JP 2007339958 A JP2007339958 A JP 2007339958A JP 2007339958 A JP2007339958 A JP 2007339958A JP 5140413 B2 JP5140413 B2 JP 5140413B2
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led chip
mounting substrate
component mounting
led
light source
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JP2009164210A (en
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豊 秋庭
郁夫 桧山
哲豊 紺野
清美 中村
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Hitachi Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting substrate improving the manufacturing yield and the mounting reliability of an LED light source device, and also to provide an LED light source device including the mounting substrate. <P>SOLUTION: On a component mounting surface 11a of the mounting substrate 11, an inclination preventive structure 20 which is in a square shape in top-surface view is formed projectingly, and an LED chip 10 in an inverted quadranglar pyramid shape is fixed in a square-shaped opening portion 20a. Even if the LED chip 10 is inclined to a normal of the component mounting surface 11a, the inclination preventive structure 20 suppresses a larger inclination to suppress a decrease in light extraction efficiency of the LED chip 10, thereby improving the manufacturing yield and mounting reliability of the LED light source device constituted including the LED chip 10. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

本発明は、電子部品が実装される実装基板と、この実装基板にＬＥＤチップが固着されてなる、液晶表示装置用のＬＥＤ光源装置に関するものである。   The present invention relates to a mounting substrate on which electronic components are mounted, and an LED light source device for a liquid crystal display device in which an LED chip is fixed to the mounting substrate.

近年、表示装置として、ＣＲＴ（Cathode Ray Tube）に代わって、発光型のプラズマディスプレイパネルや非発光型の液晶表示装置の使用が多くなっている。   In recent years, instead of CRT (Cathode Ray Tube), a light-emitting plasma display panel or a non-light-emitting liquid crystal display device is increasingly used as a display device.

このうち、液晶表示装置は、透過型の光変調素子として液晶パネルを用い、その裏面に照明装置（バックライト装置とも呼ぶ）を備えて光を液晶パネルに照射する。そして、液晶パネルはバックライト装置から照射された光の透過率を制御することにより画像を形成する。   Among these, the liquid crystal display device uses a liquid crystal panel as a transmissive light modulation element, and includes a lighting device (also referred to as a backlight device) on the back surface to irradiate the liquid crystal panel with light. The liquid crystal panel forms an image by controlling the transmittance of the light emitted from the backlight device.

このように、液晶表示装置には液晶パネルを照明するバックライト装置が必要となり、ＬＥＤ（Light Emitting Diode）チップを光源としたＬＥＤ光源装置をバックライト装置として使用する場合がある。
ＬＥＤ光源装置はＬＥＤチップの発光を光源とする装置であり、例えば特許文献１には、傾斜した側面を有し、光の取り出し効率を向上したＬＥＤチップに関する技術が開示されている。
特開２００７−１７３５３４号公報（図２参照） Thus, the liquid crystal display device needs a backlight device for illuminating the liquid crystal panel, and an LED light source device using an LED (Light Emitting Diode) chip as a light source may be used as the backlight device.
An LED light source device is a device that uses light emitted from an LED chip as a light source. For example, Patent Document 1 discloses a technique related to an LED chip having inclined side surfaces and improving light extraction efficiency.
JP 2007-173534 A (see FIG. 2)

ＬＥＤ光源装置は、ＬＥＤチップを実装基板の部品実装面に固着して構成されるが、例えば特許文献１に開示されるＬＥＤチップの場合、発光層からの光取り出し面が、斜めの側面形状を有して逆四角錐台の形状に形成され、光取り出し効率を向上させている。この場合、ＬＥＤチップを実装基板の部品実装面に固着する底面の面積が、発光面の面積より小さくなるため、ＬＥＤチップを部品実装面に固着するときに傾きやすいという問題がある。また、ＬＥＤチップの表面に形成される電極パッドと部品実装面に形成される電極パターンを接続するボンディングの工程時にＬＥＤチップに加わる荷重、衝撃などで、ＬＥＤチップが傾いてしまうという問題もある。   The LED light source device is configured by fixing the LED chip to the component mounting surface of the mounting substrate. For example, in the case of the LED chip disclosed in Patent Document 1, the light extraction surface from the light emitting layer has an oblique side surface shape. It is formed in the shape of an inverted quadrangular pyramid to improve the light extraction efficiency. In this case, since the area of the bottom surface for fixing the LED chip to the component mounting surface of the mounting substrate is smaller than the area of the light emitting surface, there is a problem that the LED chip tends to tilt when the LED chip is fixed to the component mounting surface. In addition, there is a problem that the LED chip is inclined due to a load, an impact, or the like applied to the LED chip during the bonding process for connecting the electrode pad formed on the surface of the LED chip and the electrode pattern formed on the component mounting surface.

ＬＥＤチップが傾くと、ＬＥＤチップの光の取り出し構造が変化し、光取り出し効率が低下するため、結果としてＬＥＤチップを含んで構成されるＬＥＤ光源装置の輝度が低下する。このように輝度が低下したＬＥＤ光源装置は、製造工程における工程不良品としてカウントされることから、ＬＥＤ光源装置の製造歩留まりが低下する。更には、ＬＥＤチップ実装後の信頼性も低下、或いは劣化し易くなる。   When the LED chip is tilted, the light extraction structure of the LED chip is changed and the light extraction efficiency is lowered. As a result, the brightness of the LED light source device including the LED chip is lowered. Thus, since the LED light source device in which the brightness | luminance fell is counted as a process defect product in a manufacturing process, the manufacture yield of an LED light source device falls. Furthermore, the reliability after mounting the LED chip is likely to decrease or deteriorate.

そこで本発明は、ＬＥＤ光源装置の製造歩留まりや実装信頼性を向上できる実装基板、及びこの実装基板を含んでなるＬＥＤ光源装置を提供することを課題とする。   Then, this invention makes it a subject to provide the mounting substrate which can improve the manufacture yield and mounting reliability of a LED light source device, and the LED light source device which comprises this mounting substrate.

前記課題を解決するため、本発明は、ＬＥＤチップを固着する実装基板の部品実装面に凸状に、電極パターンからなる傾倒防止構造を備えることを特徴とした。 In order to solve the above-described problems, the present invention is characterized in that a tilt prevention structure including an electrode pattern is provided on a component mounting surface of a mounting substrate to which an LED chip is fixed.

本発明によると、ＬＥＤ光源装置の製造歩留まりや実装信頼性を向上可能な実装基板、及びこの実装基板を含んでなるＬＥＤ光源装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the mounting substrate which can improve the manufacture yield and mounting reliability of an LED light source device, and the LED light source device which comprises this mounting substrate can be provided.

以下、本発明を実施するための最良の形態について、適宜図を参照して詳細に説明する。   Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings as appropriate.

《第１の実施形態》
図１は第１の実施形態に係る実装基板を備えるＬＥＤ光源を示す図であって、（ａ）は、斜視図、（ｂ）は、図１の（ａ）におけるＸ１−Ｘ１断面図である。
図１の（ａ）に示すように、例えば図示しない液晶表示装置を照明するバックライト装置に使用されるＬＥＤ光源装置（以下、ＬＥＤ光源と称する）１は、長尺の実装基板１１に、複数のＬＥＤチップ１０が長手方向に沿って並列に固着され、その発光面１０ａの側にレンズ１２が備わる構成である。 << First Embodiment >>
1A and 1B are diagrams showing an LED light source including a mounting substrate according to the first embodiment, in which FIG. 1A is a perspective view and FIG. 1B is a cross-sectional view taken along line X1-X1 in FIG. .
As shown in FIG. 1A, for example, an LED light source device (hereinafter referred to as an LED light source) 1 used in a backlight device that illuminates a liquid crystal display device (not shown) includes a plurality of long mounting boards 11. The LED chips 10 are fixed in parallel along the longitudinal direction, and the lens 12 is provided on the light emitting surface 10a side.

実装基板１１の部品実装面１１ａに並列に固着される複数のＬＥＤチップ１０は、ボンディング等によって部品実装面１１ａに形成される電極パターン１１ｂと接続され、ＬＥＤチップ１０には電極パターン１１ｂを介して電流／電圧が供給されて、ＬＥＤチップ１０の発光面１０ａが発光する。実装基板１１は、例えば低熱抵抗で光の反射率が高いセラミック基板を用いる。   The plurality of LED chips 10 fixed in parallel to the component mounting surface 11a of the mounting substrate 11 are connected to an electrode pattern 11b formed on the component mounting surface 11a by bonding or the like, and the LED chip 10 is connected to the LED chip 10 via the electrode pattern 11b. The current / voltage is supplied, and the light emitting surface 10a of the LED chip 10 emits light. For example, a ceramic substrate having a low thermal resistance and a high light reflectance is used as the mounting substrate 11.

図１の（ｂ）に示すように、ＬＥＤチップ１０は、その底面１０ｄがダイボンディング材１３を介して実装基板１１の部品実装面１１ａに固着され、ＬＥＤチップ１０の発光面１０ａに形成される電極パッド１０ｂは、ボンディングワイヤ１１ｃを介して、実装基板１１に形成される電極パターン１１ｂとボンディング工程等で接続される。そして、ＬＥＤチップ１０が発光する光を適度に散乱させるためのレンズ１２が、部品実装面１１ａを覆うように備わる。   As shown in FIG. 1B, the bottom surface 10d of the LED chip 10 is fixed to the component mounting surface 11a of the mounting substrate 11 via the die bonding material 13, and is formed on the light emitting surface 10a of the LED chip 10. The electrode pad 10b is connected to the electrode pattern 11b formed on the mounting substrate 11 through a bonding wire 11c in a bonding process or the like. A lens 12 for appropriately scattering light emitted from the LED chip 10 is provided so as to cover the component mounting surface 11a.

第１の実施形態においては、発光する光の取り出し効率を高めたＬＥＤチップ１０として、上面視が矩形の発光面１０ａの背面側に発光層１０ｃが形成され、発光面１０ａの側から底面１０ｄの側に向かって下すぼみの略逆四角錐台を形成する斜めの形状の側面（以下、傾斜側面と称する）１０ｅを有して、光取り出し効率を向上させたＬＥＤチップ１０を使用する。この場合、実装基板１１の部品実装面１１ａに固着する底面１０ｄの面積は、発光面１０ａの面積より小さく、ＬＥＤチップ１０を部品実装面１１ａに固着した場合に、部品実装面１１ａの法線に対する傾きに対して不安定になり、ＬＥＤチップ１０が部品実装面１１ａの法線に対して傾き易いという問題がある。   In the first embodiment, a light emitting layer 10c is formed on the back side of the light emitting surface 10a that is rectangular in top view as the LED chip 10 with improved extraction efficiency of emitted light, and the bottom surface 10d from the light emitting surface 10a side is formed. The LED chip 10 having an obliquely shaped side surface (hereinafter referred to as an inclined side surface) 10e that forms a substantially inverted quadrangular truncated pyramid that is recessed toward the side and having improved light extraction efficiency is used. In this case, the area of the bottom surface 10d fixed to the component mounting surface 11a of the mounting substrate 11 is smaller than the area of the light emitting surface 10a, and when the LED chip 10 is fixed to the component mounting surface 11a, the normal to the component mounting surface 11a is obtained. There is a problem that the LED chip 10 is unstable with respect to the inclination, and the LED chip 10 is easily inclined with respect to the normal line of the component mounting surface 11a.

そこで、第１の実施形態は、部品実装面１１ａに固着されるＬＥＤチップ１０の、部品実装面１１ａの法線に対する傾きを抑制する傾倒防止構造２０を、実装基板１１の部品実装面１１ａに凸状に形成する。   Therefore, in the first embodiment, the anti-tilt structure 20 that suppresses the inclination of the LED chip 10 fixed to the component mounting surface 11a with respect to the normal line of the component mounting surface 11a is projected on the component mounting surface 11a of the mounting substrate 11. To form.

例えば、図示しない液晶表示装置のＬＥＤ光源１に使用されるＬＥＤチップ１０は、上部の発光面１０ａは約３００μｍ四方の矩形であり、厚みは約３００μｍである。ＬＥＤチップ１０の側面形状は、発光面１０ａ側の厚さ約５０〜１５０μｍまでは、断面形状が発光面１０ａと同等の略直方体の側面であり、発光層１０ｃはこの直方体の内部に形成される。直方体の側面の、発光面１０ａと反対側の端部から底面１０ｄまでは、底面１０ｄに向かって下すぼみになるように傾斜側面１０ｅが形成される。そして、この傾斜側面１０ｅによって、ＬＥＤチップ１０には逆四角錐台が形成される。   For example, the LED chip 10 used for the LED light source 1 of a liquid crystal display device (not shown) has an upper light emitting surface 10a having a rectangular shape of about 300 μm and a thickness of about 300 μm. The side surface shape of the LED chip 10 is a substantially rectangular parallelepiped side surface having a cross-sectional shape equivalent to that of the light emitting surface 10a up to a thickness of about 50 to 150 μm on the light emitting surface 10a side, and the light emitting layer 10c is formed inside the rectangular parallelepiped. . An inclined side surface 10e is formed from the end of the rectangular parallelepiped on the side opposite to the light emitting surface 10a to the bottom surface 10d so as to be recessed toward the bottom surface 10d. The inclined side surface 10e forms an inverted square frustum on the LED chip 10.

このように形成されるＬＥＤチップ１０が、実装基板１１の部品実装面１１ａに実装されると、発光面１０ａの外に約２５０〜１５０μｍの厚で形成される傾斜側面１０ｅからも効率よく光が取り出せる。また、略逆四角錐台を形成する傾斜側面１０ｅは、例えば部品実装面１１ａの法線の方向に対して約１０〜３０°前後に傾斜したものがある。このように、ＬＥＤチップ１０の側面を傾斜させることにより、発光層１０ｃが発光する光が、ＬＥＤチップ１０の内部で全反射される確率が低下し、ＬＥＤチップ１０の内部からの光取り出し効率を向上できる。
なお、前記の、ＬＥＤチップ１０の寸法を示す具体的な数値は、一例を示したものに過ぎず、第１の実施形態に適用するＬＥＤチップ１０を限定するものではない。 When the LED chip 10 thus formed is mounted on the component mounting surface 11a of the mounting substrate 11, light is efficiently emitted from the inclined side surface 10e formed with a thickness of about 250 to 150 μm outside the light emitting surface 10a. I can take it out. In addition, the inclined side surface 10e forming a substantially inverted quadrangular pyramid is, for example, inclined about 10 to 30 ° with respect to the normal direction of the component mounting surface 11a. Thus, by inclining the side surface of the LED chip 10, the probability that the light emitted from the light emitting layer 10 c is totally reflected inside the LED chip 10 decreases, and the light extraction efficiency from the inside of the LED chip 10 is reduced. It can be improved.
In addition, the specific numerical value which shows the dimension of the said LED chip 10 is only what showed an example, and does not limit the LED chip 10 applied to 1st Embodiment.

そして、第１の実施形態においては、約３００μｍの厚みを有するＬＥＤチップ１０を固着する実装基板１１の部品実装面１１ａに、約５０〜１００μｍの厚みの凸状に傾倒防止構造２０を形成する。   In the first embodiment, the tilt prevention structure 20 is formed in a convex shape having a thickness of about 50 to 100 μm on the component mounting surface 11 a of the mounting substrate 11 to which the LED chip 10 having a thickness of about 300 μm is fixed.

図２は、傾倒防止構造を示す図であって、（ａ）は実装基板を部品実装面の側から見た図、（ｂ）は、図２の（ａ）におけるＸ２−Ｘ２断面図、（ｃ）は、ＬＥＤチップを実装基板に固着した状態を示す図である。
図２の（ａ）に示すように、第１の実施形態に係る傾倒防止構造２０は、実装基板１１の部品実装面１１ａを、例えば上面視でロ字型にレジストで被覆して形成する。レジストは、約１０〜２０μｍの厚みで部品実装面１１ａを被覆することから、レジストを積層して、約５０〜１００μｍの厚みの傾倒防止構造２０を形成することができる。
また、感光性レジストを用いることにより、厚みを約２００μｍまで増加させた傾倒防止構造２０を高精度で形成（ＵＶ加工）する場合もある。 2A and 2B are diagrams showing a tilt prevention structure, in which FIG. 2A is a view of the mounting board viewed from the component mounting surface side, FIG. 2B is a cross-sectional view taken along line X2-X2 in FIG. c) is a diagram showing a state in which the LED chip is fixed to the mounting substrate.
As shown in FIG. 2A, the tilt prevention structure 20 according to the first embodiment is formed by covering the component mounting surface 11a of the mounting substrate 11 with a resist in a square shape when viewed from the top, for example. Since the resist covers the component mounting surface 11a with a thickness of about 10 to 20 μm, the tilt prevention structure 20 with a thickness of about 50 to 100 μm can be formed by laminating the resist.
In some cases, by using a photosensitive resist, the anti-tilt structure 20 having a thickness increased to about 200 μm is formed with high accuracy (UV processing).

ロ字型の開口部２０ａは、略逆四角錐台の形状に形成される、ＬＥＤチップ１０の底面１０ｄ（図１の（ｂ）参照）が入り込む面積を有し、ＬＥＤチップ１０が部品実装面１１ａの法線に対して傾いたときに、傾斜側面１０ｅが実装基板１１に固着しないようにＬＥＤチップ１０を支持できる大きさとすれば、限定する値ではなく、適宜設定すればよい。
また、ロ字型の枠の幅は、例えば傾倒防止構造２０が、実装基板１１の部品実装面１１ａに形成される電極パターン１１ｂと接触しないように、適宜設定すればよい。 The square-shaped opening 20a has an area into which the bottom surface 10d of the LED chip 10 (see FIG. 1B) is formed, and is formed in a substantially inverted quadrangular pyramid shape. As long as the LED chip 10 can be supported so that the inclined side surface 10e does not adhere to the mounting substrate 11 when tilted with respect to the normal line 11a, the value is not limited and may be set as appropriate.
Further, the width of the letter-shaped frame may be appropriately set so that, for example, the tilt prevention structure 20 does not contact the electrode pattern 11b formed on the component mounting surface 11a of the mounting substrate 11.

そして、図２の（ｂ）に示すように傾倒防止構造２０のロ字型の開口部２０ａに、ダイボンディング材１３を塗布して、傾倒防止構造２０の開口部２０ａにＬＥＤチップ１０を固着する。
ダイボンディング材１３は、例えば銀ペースト、或いはアルミナ粒子などを含む反射率の高いものが好適であるが、実装基板１１としてセラミック基板を使用する場合は、セラミック基板に含まれるアルミナによって、ＬＥＤチップ１０が発光する光が反射されることから、透明なダイボンディング材１３であってもよい。 Then, as shown in FIG. 2B, the die bonding material 13 is applied to the square-shaped opening 20 a of the tilt prevention structure 20, and the LED chip 10 is fixed to the opening 20 a of the tilt prevention structure 20. .
The die bonding material 13 is preferably a material having high reflectivity including, for example, silver paste or alumina particles. However, when a ceramic substrate is used as the mounting substrate 11, the LED chip 10 is made of alumina contained in the ceramic substrate. Since the light emitted from is reflected, the transparent die bonding material 13 may be used.

そして図２の（ｃ）に示すように、ＬＥＤチップ１０は、傾倒防止構造２０の開口部２０ａに傾斜側面１０ｅが接触する形で支持され、固着される。例えば傾斜側面１０ｅが形成される厚み部分が約２００μｍのとき、傾倒防止構造２０の厚みを約５０〜１００μｍとしたことで、傾倒防止構造２０より発光面１０ａ側の傾斜側面１０ｅから取り出された光Ｌを、効率よくＬＥＤチップ１０の発光面１０ａの側に反射して取り出すことができ、実装基板１１も含めたＬＥＤチップ１０からの光Ｌの取り出し効率を高めることができる。このとき、傾斜側面１０ｅから取り出された光Ｌを、傾倒防止構造２０でも効率よく反射するため、傾倒防止構造２０を高反射率の白レジストで形成している。   As shown in FIG. 2C, the LED chip 10 is supported and fixed so that the inclined side surface 10e contacts the opening 20a of the anti-tilt structure 20. For example, when the thickness portion on which the inclined side surface 10e is formed is about 200 μm, the light extracted from the inclined side surface 10e on the light emitting surface 10a side from the tilt preventing structure 20 by setting the thickness of the tilt preventing structure 20 to about 50 to 100 μm. L can be efficiently reflected and extracted to the light emitting surface 10 a side of the LED chip 10, and the extraction efficiency of the light L from the LED chip 10 including the mounting substrate 11 can be increased. At this time, in order to efficiently reflect the light L extracted from the inclined side surface 10e even by the anti-tilt structure 20, the anti-tilt structure 20 is formed of a high reflectance white resist.

図３は、図２の（ａ）のＸ２−Ｘ２断面図に基づいてＬＥＤチップの状態を示す図であって、（ａ）は、ＬＥＤチップが傾いた状態を示す図、（ｂ）は、傾倒防止構造が構成されていない場合にＬＥＤチップが傾いた状態を比較例として示す図、（ｃ）は、ボンディングの工程におけるＬＥＤチップが傾いた状態を示す図である。
図３の（ａ）に示すように、ＬＥＤチップ１０を実装基板１１の部品実装面１１ａに固着する工程で、ＬＥＤチップ１０が部品実装面１１ａの法線に対して傾いても、傾倒防止構造２０によって傾きが抑えられ、傾きの大きさを抑制することができる。このように、ＬＥＤチップ１０の傾きの大きさが抑制されることで、傾斜側面１０ｅの、傾きの下側になる側（図中左側）から、光Ｌを取り出すことができるとともに、光Ｌを例えば白レジストからなる傾倒防止構造２０で発光面１０ａの側に反射でき、ＬＥＤチップ１０の光Ｌの取り出し効率の低下を抑制できる。 3A and 3B are diagrams showing the state of the LED chip based on the X2-X2 cross-sectional view of FIG. 2A, wherein FIG. 3A is a diagram showing a state in which the LED chip is tilted, and FIG. The figure which shows the state which the LED chip inclined as a comparative example when the inclination prevention structure is not comprised, (c) is a figure which shows the state which the LED chip inclined in the process of bonding.
As shown in FIG. 3A, even if the LED chip 10 is tilted with respect to the normal of the component mounting surface 11a in the step of fixing the LED chip 10 to the component mounting surface 11a of the mounting substrate 11, the tilt prevention structure The inclination is suppressed by 20, and the magnitude of the inclination can be suppressed. Thus, by suppressing the magnitude of the inclination of the LED chip 10, the light L can be extracted from the inclined side surface 10 e on the lower side (left side in the figure) of the inclination, and the light L can be extracted. For example, the tilt prevention structure 20 made of white resist can be reflected toward the light emitting surface 10a, and the reduction in the light L extraction efficiency of the LED chip 10 can be suppressed.

このことによって、例えば複数のＬＥＤチップ１０が、部品実装面１１ａの法線に対して傾いて固着されるＬＥＤ光源１（図１の（ａ）参照）であっても、ＬＥＤ光源１は規定の輝度を得ることができ、製造工程における工程不良品としてカウントされるＬＥＤ光源１を少なくすることができる。すなわち、実装基板１１に傾倒防止構造２０を形成するという第１の実施形態によって、ＬＥＤ光源１の製造歩留まりを向上できるという優れた効果を奏する。また、同時にＬＥＤチップ１０の実装信頼性（ワイヤーボンディング部、ダイボンディング部など）を向上させている。   As a result, for example, even if the LED light source 1 (see FIG. 1A) in which the plurality of LED chips 10 are fixedly tilted with respect to the normal line of the component mounting surface 11a, the LED light source 1 is defined. Luminance can be obtained and the number of LED light sources 1 counted as defective products in the manufacturing process can be reduced. That is, according to the first embodiment in which the tilt prevention structure 20 is formed on the mounting substrate 11, there is an excellent effect that the manufacturing yield of the LED light source 1 can be improved. At the same time, the mounting reliability (wire bonding part, die bonding part, etc.) of the LED chip 10 is improved.

一方、傾倒防止構造２０が構成されていない場合、ＬＥＤチップ１０が部品実装面１１ａの法線に対して傾くと、図３の（ｂ）に比較例として示すように、傾斜側面１０ｅが実装基板１１の部品実装面１１ａに固着する状態も発生する。このように、ＬＥＤチップ１０の傾斜側面１０ｅが実装基板１１の部品実装面１１ａに固着すると、ボンディングワイヤ１１ｃ（図１の（ｂ）参照）の接続が困難になる。ボンディングワイヤ１１ｃが接続できた場合でも、発光面１０ａからの光の取出し方向が変化し、かつ部品実装面１１ａに固着した側面から光Ｌを取り出すことができないため、ＬＥＤチップ１０の光Ｌの取り出し効率が低下する。   On the other hand, when the tilt prevention structure 20 is not configured, when the LED chip 10 is tilted with respect to the normal line of the component mounting surface 11a, the tilted side surface 10e is mounted on the mounting board as shown in FIG. 3B as a comparative example. 11 is also fixed to the component mounting surface 11a. As described above, when the inclined side surface 10e of the LED chip 10 is fixed to the component mounting surface 11a of the mounting substrate 11, it becomes difficult to connect the bonding wires 11c (see FIG. 1B). Even when the bonding wire 11c can be connected, the light extraction direction from the light emitting surface 10a changes and the light L cannot be extracted from the side surface fixed to the component mounting surface 11a. Efficiency is reduced.

したがって、例えば複数のＬＥＤチップ１０が傾いて固着されるＬＥＤ光源１（図１の（ａ）参照）は規定の輝度を得ることができなくなる。結果として、製造工程における工程不良品としてカウントされるＬＥＤ光源１が多くなる。すなわち、ＬＥＤ光源１の製造歩留まりが低下する。   Therefore, for example, the LED light source 1 (see FIG. 1A) to which the plurality of LED chips 10 are fixedly tilted cannot obtain a prescribed luminance. As a result, the number of LED light sources 1 counted as defective products in the manufacturing process increases. That is, the manufacturing yield of the LED light source 1 is reduced.

また、ＬＥＤチップ１０が部品実装面１１ａの法線に対して傾くことなく実装基板１１に固着された場合であっても、図３の（ｃ）に示すようにＬＥＤチップ１０の発光面１０ａの電極パッド１０ｂと実装基板１１に形成される電極パターン１１ｂをボンディングワイヤ１１ｃで接続するボンディングの工程において、ボンディングマシンＢがＬＥＤチップ１０に加える打撃（荷重）によって、ＬＥＤチップ１０が部品実装面１１ａの法線に対して傾く場合がある。   Further, even when the LED chip 10 is fixed to the mounting substrate 11 without being inclined with respect to the normal line of the component mounting surface 11a, as shown in FIG. In the bonding step of connecting the electrode pad 10b and the electrode pattern 11b formed on the mounting substrate 11 with the bonding wire 11c, the LED chip 10 is placed on the component mounting surface 11a by the impact (load) applied to the LED chip 10 by the bonding machine B. May tilt with respect to normal.

すなわち、ＬＥＤチップ１０の発光面１０ａに形成される電極パッド１０ｂは、発光面１０ａの端部に形成され、ボンディングマシンＢは電極パッド１０ｂにボンディングワイヤ１１ｃを接続するため、発光面１０ａの端部を打撃することになる。図３の（ｃ）に示すように、ＬＥＤチップ１０の傾斜側面１０ｅは発光面１０ａの側から下すぼみに略逆四角錐台形状に形成されることから、発光面１０ａの端部に打撃が加わるとＬＥＤチップ１０は部品実装面１１ａの法線に対して傾きやすい。
このような場合であっても、実装基板１１に傾倒防止構造２０を形成し、ＬＥＤチップ１０を支持することで、ＬＥＤチップ１０の傾きの大きさを抑制することができ、ＬＥＤ光源１（図１の（ａ）参照）の製造歩留まりを向上できる。 That is, the electrode pad 10b formed on the light emitting surface 10a of the LED chip 10 is formed at the end of the light emitting surface 10a, and the bonding machine B connects the bonding wire 11c to the electrode pad 10b. Will be hit. As shown in FIG. 3 (c), the inclined side surface 10e of the LED chip 10 is formed in a substantially inverted quadrangular truncated pyramid shape from the light emitting surface 10a side to the bottom, so that the end of the light emitting surface 10a is hit. When added, the LED chip 10 tends to tilt with respect to the normal of the component mounting surface 11a.
Even in such a case, by forming the tilt prevention structure 20 on the mounting substrate 11 and supporting the LED chip 10, the magnitude of the tilt of the LED chip 10 can be suppressed, and the LED light source 1 (FIG. 1) (see (a)) can be improved.

《変形例１−１》
以上、第１の実施形態について説明したが、第１の実施形態は発明の趣旨を変更しない範囲において、変形例が考えられる。
図４は、第１の実施形態に係る変形例１−１を示す図であって、（ａ）は、傾倒防止構造を部品実装面の側から見た図、（ｂ）は、図４の（ａ）におけるＸ３−Ｘ３断面図である。
図４の（ａ）に示すように、変形例１−１においては、実装基板１１の部品実装面１１ａに形成される傾倒防止構造２０を、例えば４つの角が非連続なロ字型に形成する。このようにロ字型の４つの角を非連続にすることで、図４の（ｂ）に示すようにＬＥＤチップ１０を開口部２０ａに固着したときに、傾倒防止構造２０の開口部２０ａに塗布されたダイボンディング材１３が、４つの角から開口部２０ａの外側に排出される。
なお、傾倒防止構造２０を、４つの角が非連続なロ字型に形成する場合に、傾倒防止構造２０を短く形成し、例えばＬＥＤチップ１０の傾斜側面１０ｅを４点で支持する構成としてもよい。さらに、短い傾倒防止構造２０を、例えば上面視でロ字型に一定間隔に点在して、ＬＥＤチップ１０の傾斜側面１０ｅを、多点で支持する構成としてもよい。 << Modification 1-1 >>
The first embodiment has been described above, but the first embodiment can be modified within a range that does not change the gist of the invention.
4A and 4B are diagrams showing a modified example 1-1 according to the first embodiment, in which FIG. 4A is a view of the tilt prevention structure as viewed from the component mounting surface side, and FIG. 4B is a view of FIG. It is X3-X3 sectional drawing in (a).
As shown in FIG. 4A, in the modified example 1-1, the anti-tilt structure 20 formed on the component mounting surface 11a of the mounting board 11 is formed in, for example, a square shape with four corners being discontinuous. To do. By making the four corners of the square shape discontinuous in this way, when the LED chip 10 is fixed to the opening 20a as shown in FIG. 4B, the opening 20a of the tilt prevention structure 20 is fixed. The applied die bonding material 13 is discharged from the four corners to the outside of the opening 20a.
In the case where the tilt prevention structure 20 is formed in a square shape with four corners being discontinuous, the tilt prevention structure 20 may be formed short, for example, to support the tilted side surface 10e of the LED chip 10 at four points. Good. Furthermore, it is good also as a structure which supports the inclination side surface 10e of the LED chip 10 at multiple points | pieces, for example, by having the short inclination prevention structure 20 dotted at regular intervals in a square shape in the top view.

このことによって、図４の（ｂ）に示すように、開口部２０ａにＬＥＤチップ１０を固着したときに、ダイボンディング材１３が、想像線（二点鎖線）で示すようにＬＥＤチップ１０の傾斜側面１０ｅに沿って発光面１０ａの側に溢れることがなく、傾斜側面１０ｅに付着するダイボンディング材１３を少なくできる。
傾斜側面１０ｅに付着するダイボンディング材１３は、傾斜側面１０ｅから取り出される光Ｌを遮断することから、傾斜側面１０ｅにダイボンディング材１３が付着すると、ＬＥＤチップ１０からの光Ｌの取り出し効率が低下する。
すなわち、図４の（ａ）に示すように、傾倒防止構造２０を４つの角が非連続なロ字型に形成することで、傾斜側面１０ｅに付着するダイボンディング材１３を減らすことができ、ＬＥＤチップ１０の光Ｌの取り出し効率を高めることができる。 Accordingly, as shown in FIG. 4B, when the LED chip 10 is fixed to the opening 20a, the die bonding material 13 is inclined by the LED chip 10 as indicated by an imaginary line (two-dot chain line). The die bonding material 13 adhering to the inclined side surface 10e can be reduced without overflowing to the light emitting surface 10a side along the side surface 10e.
The die bonding material 13 adhering to the inclined side surface 10e blocks the light L extracted from the inclined side surface 10e. Therefore, when the die bonding material 13 adheres to the inclined side surface 10e, the extraction efficiency of the light L from the LED chip 10 decreases. To do.
That is, as shown in FIG. 4A, by forming the anti-tilt structure 20 in a square shape with four corners discontinuous, the die bonding material 13 attached to the inclined side surface 10e can be reduced, The extraction efficiency of the light L of the LED chip 10 can be increased.

《変形例１−２》
図５は、図１の（ａ）におけるＸ１−Ｘ１断面図に基づいて、第１の実施形態に係る変形例１−２を示す図である。
変形例１−２においては、図５に示すように、傾倒防止構造２０を側面視で２層になるように形成した。
すなわち、実装基板１１の部品実装面１１ａを、例えば白レジストで被覆して下側傾倒防止構造２０１を形成する。そして、下側傾倒防止構造２０１に上側傾倒防止構造２０２を形成する白レジストを積層する。このようにして、側面視で２層の傾倒防止構造２０を構成する。そして、図５に示すように、下側傾倒防止構造２０１と上側傾倒防止構造２０２によって、傾倒防止構造２０の開口部２０ａの周囲に傾斜を構成する。 << Modification 1-2 >>
FIG. 5 is a diagram illustrating a modified example 1-2 according to the first embodiment based on the X1-X1 cross-sectional view in FIG.
In Modification 1-2, as shown in FIG. 5, the tilt prevention structure 20 is formed in two layers in a side view.
In other words, the component mounting surface 11a of the mounting substrate 11 is covered with, for example, white resist to form the lower tilt prevention structure 201. Then, a white resist that forms the upper tilt prevention structure 202 is laminated on the lower tilt prevention structure 201. In this way, the two-layer tilt prevention structure 20 is configured in a side view. Then, as shown in FIG. 5, an inclination is formed around the opening 20 a of the tilt prevention structure 20 by the lower tilt prevention structure 201 and the upper tilt prevention structure 202.

前記したように、第１の実施形態に係るＬＥＤ光源１（図１の（ｂ）参照）においては、略逆四角錐台の形状の傾斜側面１０ｅを有するＬＥＤチップ１０の使用を想定している。
そこで、変形例１−２においては、ＬＥＤチップ１０の傾斜側面１０ｅの傾斜と略同等の傾斜を、傾倒防止構造２０の開口部２０ａの周囲に形成することを特徴とする。
このように、開口部２０ａの周囲に、ＬＥＤチップ１０の傾斜側面１０ｅの傾斜と略同等の傾斜を形成することで、傾倒防止構造２０はＬＥＤチップ１０を面（線）で支持することができ、より確実にＬＥＤチップ１０の傾きを抑制できるという優れた効果を奏する。 As described above, in the LED light source 1 according to the first embodiment (see FIG. 1B), it is assumed that the LED chip 10 having the inclined side surface 10e having a substantially inverted quadrangular pyramid shape is used. .
Therefore, Modification 1-2 is characterized in that an inclination substantially equal to the inclination of the inclined side surface 10e of the LED chip 10 is formed around the opening 20a of the anti-tilt structure 20.
In this manner, by forming an inclination substantially equal to the inclination of the inclined side surface 10e of the LED chip 10 around the opening 20a, the tilt prevention structure 20 can support the LED chip 10 with a surface (line). An excellent effect is obtained that the inclination of the LED chip 10 can be more reliably suppressed.

《変形例１−３》
図６は、図１の（ａ）におけるＸ１−Ｘ１断面図に基づいて、第１の実施形態の変形例１−３を示す図であり、（ａ）は、配線パターンで傾倒防止構造を形成する図、（ｂ）は、配線パターンをメッキして傾倒防止構造を形成する図、（ｃ）は、配線パターンを白レジストで被覆して傾倒防止構造を形成する図である。
変形例１−３においては、図６の（ａ）〜（ｃ）に示すように、実装基板１１の部品実装面１１ａに形成する傾倒防止用配線パターン１１ｄで傾倒防止構造２０を形成する。
なお、この傾倒防止用配線パターン１１ｄは、電極パターン１１ｂなどと同時に形成してもよい。 << Modification 1-3 >>
FIG. 6 is a view showing a modified example 1-3 of the first embodiment based on the X1-X1 cross-sectional view in FIG. 1A, and FIG. 6A shows a tilt prevention structure formed by a wiring pattern. FIG. 4B is a diagram for forming a tilt prevention structure by plating a wiring pattern, and FIG. 4C is a diagram for forming a tilt prevention structure by covering the wiring pattern with a white resist.
In Modification 1-3, as shown in FIGS. 6A to 6C, the tilt prevention structure 20 is formed by the tilt prevention wiring pattern 11 d formed on the component mounting surface 11 a of the mounting board 11.
The tilt prevention wiring pattern 11d may be formed simultaneously with the electrode pattern 11b and the like.

傾倒防止用配線パターン１１ｄは、実装基板１１の部品実装面１１ａに高い寸法精度でパターンを形成できることから、例えば図２の（ａ）に示すように上面視でロ字型の傾倒防止構造２０を形成する場合、開口部２０ａ（図２の（ａ）参照）の大きさ（面積）を高い寸法精度で形成できる。すなわち、開口部２０ａに固着されるＬＥＤチップ１０の底面１０ｄの面積に対応した開口部２０ａの大きさ（面積）を有する傾倒防止構造２０を形成できる。
例えば図６の（ａ）に示すように、開口部２０ａの面積をＬＥＤチップ１０の底面１０ｄの面積と略等しくすることで、ＬＥＤチップ１０の傾きをより確実に抑制できるという優れた効果を奏する。
このように、開口部２０ａの面積をＬＥＤチップ１０の底面１０ｄの面積と略等しく形成することで、ＬＥＤチップ１０を実装基板１１に固着するときに、傾斜側面１０ｅが傾倒防止用配線パターン１１ｄの開口部２０ａに近づく（或いは、接触する）構造となるため、ＬＥＤチップ１０の傾倒防止効果が大きくなる。同時に、傾斜側面１０ｅと傾倒防止用配線パターン１１ｄの間に介在するダイボンディング材１３の厚みが薄くなることから、ＬＥＤチップ１０から傾倒防止用配線パターン１１ｄを介した実装基板１１への放熱特性も向上する。 Since the inclination preventing wiring pattern 11d can form a pattern with high dimensional accuracy on the component mounting surface 11a of the mounting substrate 11, for example, as shown in FIG. When formed, the size (area) of the opening 20a (see FIG. 2A) can be formed with high dimensional accuracy. That is, the tilt prevention structure 20 having the size (area) of the opening 20a corresponding to the area of the bottom surface 10d of the LED chip 10 fixed to the opening 20a can be formed.
For example, as shown in FIG. 6A, by making the area of the opening 20 a substantially equal to the area of the bottom surface 10 d of the LED chip 10, there is an excellent effect that the inclination of the LED chip 10 can be more reliably suppressed. .
Thus, by forming the area of the opening 20a substantially equal to the area of the bottom surface 10d of the LED chip 10, when the LED chip 10 is fixed to the mounting substrate 11, the inclined side surface 10e becomes the inclination preventing wiring pattern 11d. Since the structure approaches (or contacts) the opening 20a, the effect of preventing the LED chip 10 from being tilted is increased. At the same time, since the thickness of the die bonding material 13 interposed between the inclined side surface 10e and the inclination preventing wiring pattern 11d is reduced, the heat radiation characteristic from the LED chip 10 to the mounting substrate 11 via the inclination preventing wiring pattern 11d is also achieved. improves.

実装基板１１としてセラミック基板を使用する場合、例えば薄膜電極からなる傾倒防止用配線パターン１１ｄでは、約５μｍの厚みを有する凸部からなる傾倒防止構造２０を形成でき、厚膜電極からなる傾倒防止用配線パターン１１ｄでは、約１０〜２０μｍの厚みを有する凸部からなる傾倒防止構造２０を形成できる。   When a ceramic substrate is used as the mounting substrate 11, for example, in the tilt prevention wiring pattern 11 d made of a thin film electrode, the tilt prevention structure 20 made of a convex portion having a thickness of about 5 μm can be formed, and for tilt prevention made of a thick film electrode. In the wiring pattern 11d, it is possible to form the anti-tilt structure 20 composed of convex portions having a thickness of about 10 to 20 μm.

さらに、傾倒防止用配線パターン１１ｄによって傾倒防止構造２０を形成する場合、傾倒防止構造２０を厚くするために、例えば図６の（ｂ）に示すように傾倒防止用配線パターン１１ｄの表面にメッキ層１１ｄ１を形成するようにメッキ処理して傾倒防止構造２０を形成してもよいし、図６の（ｃ）に示すように、傾倒防止用配線パターン１１ｄを例えば白レジスト１１ｄ２で被覆して傾倒防止構造２０を形成してもよい。   Further, when the tilt preventing structure 20 is formed by the tilt preventing wiring pattern 11d, in order to make the tilt preventing structure 20 thick, for example, as shown in FIG. 6B, a plating layer is formed on the surface of the tilt preventing wiring pattern 11d. The tilt preventing structure 20 may be formed by plating so as to form 11d1, or as shown in FIG. 6C, the tilt preventing wiring pattern 11d is covered with, for example, a white resist 11d2 to prevent tilting. Structure 20 may be formed.

このように、実装基板１１の表面に傾倒防止用配線パターン１１ｄで傾倒防止構造２０を形成し、傾倒防止用配線パターン１１ｄの表面にメッキ層１１ｄ１を形成する、又は傾倒防止用配線パターン１１ｄの表面を例えば白レジスト１１ｄ２で被覆するように処理することで、高い寸法精度で傾倒防止構造２０を形成できるとともに、傾倒防止構造２０の厚みを厚くできるという優れた効果を奏する。   In this manner, the tilt prevention structure 20 is formed on the surface of the mounting substrate 11 with the tilt prevention wiring pattern 11d, and the plating layer 11d1 is formed on the surface of the tilt prevention wiring pattern 11d, or the surface of the tilt prevention wiring pattern 11d. For example, the anti-tilt structure 20 can be formed with high dimensional accuracy and the thickness of the anti-tilt structure 20 can be increased.

《変形例１−４》
図７は、図１の（ａ）におけるＸ１−Ｘ１断面図に基づいて、第１の実施形態に係る変形例１−４を示す図である。変形例１−４は、実装基板１１としてガラスエポキシ基板（ＦＰＣ基板などでもよい）を使用する場合に対応する変形例である。図７に示すように、ガラスエポキシ基板からなる実装基板１１には放熱用のスルーホール１１ｅが部品実装面１１ａの側から裏側に貫通し、スルーホール１１ｅを介して放熱用銅箔（パターン）１１ｆが部品実装面１１ａの側と裏側を連結している。そして、ＬＥＤチップ１０は、ダイボンディング材１３を介して部品実装面１１ａ側の放熱用銅箔１１ｆに固着され、放熱用銅箔１１ｆによってＬＥＤチップ１０の発熱を放熱する高放熱構造の構成である。 << Modification 1-4 >>
FIG. 7 is a diagram illustrating a modified example 1-4 according to the first embodiment based on the X1-X1 cross-sectional view in FIG. Modification 1-4 is a modification corresponding to the case where a glass epoxy substrate (an FPC substrate or the like) is used as the mounting substrate 11. As shown in FIG. 7, a heat dissipation through hole 11e penetrates the mounting board 11 made of a glass epoxy substrate from the component mounting surface 11a side to the back side, and the heat dissipation copper foil (pattern) 11f is passed through the through hole 11e. Connects the component mounting surface 11a side and the back side. The LED chip 10 is fixed to the heat-dissipating copper foil 11f on the component mounting surface 11a side via the die bonding material 13, and has a high heat dissipation structure that dissipates heat generated by the LED chip 10 by the heat-dissipating copper foil 11f. .

そして、変形例１−４においては、放熱用銅箔１１ｆの表面の一部をレジスト（例えば白レジスト）で被覆するように傾倒防止構造２０を形成する。傾倒防止構造２０の形状は、例えば図２の（ａ）に示すように上面視でロ字型とし、開口部２０ａにＬＥＤチップ１０を固着し、支持する構成とする。
なお、上面視のロ字型は、例えば、傾倒防止構造２０が上面視でロ字型に一定間隔で点在して、ＬＥＤチップ１０の傾斜側面１０ｅを、多点で支持する構成であってもよい。
このように、放熱用銅箔１１ｆの表面をレジストで被覆するように傾倒防止構造２０を形成することで、実装基板１１としてガラスエポキシ基板を使用する場合にも、ＬＥＤチップ１０の傾きを抑制できるという優れた効果を奏する。 And in the modification 1-4, the tilt prevention structure 20 is formed so that a part of surface of the copper foil 11f for heat dissipation may be coat | covered with a resist (for example, white resist). For example, as shown in FIG. 2A, the shape of the tilt prevention structure 20 is a rectangular shape in a top view, and the LED chip 10 is fixed to and supported by the opening 20a.
In addition, the B shape in the top view is, for example, a configuration in which the tilt prevention structure 20 is dotted in a square shape in the top view and supports the inclined side surface 10e of the LED chip 10 at multiple points. Also good.
Thus, by forming the tilt prevention structure 20 so that the surface of the heat radiating copper foil 11f is covered with a resist, the tilt of the LED chip 10 can be suppressed even when a glass epoxy substrate is used as the mounting substrate 11. There is an excellent effect.

《第２の実施形態》
次に、本発明の第２の実施形態について説明する。
図８は、第２の実施形態を示す図であって、（ａ）は、実装基板を部品実装面の側から見た図、（ｂ）は、図８の（ａ）におけるＸ４−Ｘ４断面図にＬＥＤチップを固着したＬＥＤ光源を示す図、（ｃ）は、凹部に固着されるＬＥＤチップが傾いた状態を示す図、（ｄ）は、凹部にＬＥＤチップが固着される状態を示す図である。
なお、図８の（ａ）、（ｂ）において、図１の（ｂ）に示す構成と同等の部材には同じ符号を付し、説明は適宜省略する。 << Second Embodiment >>
Next, a second embodiment of the present invention will be described.
8A and 8B are views showing the second embodiment, where FIG. 8A is a view of the mounting board viewed from the component mounting surface side, and FIG. 8B is a cross section taken along the line X4-X4 in FIG. The figure which shows the LED light source which fixed the LED chip to a figure, (c) is a figure which shows the state in which the LED chip fixed to a recessed part inclines, (d) is a figure which shows the state in which an LED chip is fixed to a recessed part It is.
8A and 8B, members equivalent to those shown in FIG. 1B are denoted by the same reference numerals, and description thereof is omitted as appropriate.

図８の（ａ）に示すように、第２の実施形態においては、実装基板１１の部品実装面１１ａに、上面視が略矩形の凹部３０を形成し、図８の（ｂ）に示すように、凹部３０にダイボンディング材１３を介してＬＥＤチップ１０を固着する。
図８の（ａ）に示すように凹部３０は、上面視で略矩形で、その面積は略逆四角錐台の形状に形成されるＬＥＤチップ１０の傾斜側面１０ｅの底面１０ｄ（図８の（ｂ）参照）が入り込む面積とすればよい。 As shown in FIG. 8A, in the second embodiment, the component mounting surface 11a of the mounting substrate 11 is formed with a concave portion 30 having a substantially rectangular top view, as shown in FIG. 8B. In addition, the LED chip 10 is fixed to the recess 30 via the die bonding material 13.
As shown in FIG. 8A, the recess 30 is substantially rectangular in top view, and the area thereof is the bottom surface 10d of the inclined side surface 10e of the LED chip 10 formed in the shape of a substantially inverted truncated pyramid (see FIG. The area into which b) refers) may enter.

また、例えば傾斜側面１０ｅ（図８の（ｂ）参照）の厚みが約２００μｍの場合、凹部３０の深さは、約５０〜１００μｍとすればよいが、この値は限定される値ではなく、凹部３０に固着されるＬＥＤチップ１０の大きさに対応して適宜設定すればよい。   For example, when the thickness of the inclined side surface 10e (see FIG. 8B) is about 200 μm, the depth of the recess 30 may be about 50 to 100 μm, but this value is not a limited value. What is necessary is just to set suitably according to the magnitude | size of the LED chip 10 fixed to the recessed part 30. FIG.

図８の（ｂ）に示すように、実装基板１１の部品実装面１１ａに形成される凹部３０にＬＥＤチップ１０が固着される場合、例えば実装基板１１にＬＥＤチップ１０を固着する工程やボンディング工程等で、ＬＥＤチップ１０が部品実装面１１ａの法線に対して傾いても、図８の（ｃ）に示すように凹部３０の周囲によって、ＬＥＤチップ１０の部品実装面１１ａの法線に対する傾きの大きさが抑制される。すなわち、部品実装面１１ａと凹部３０の段差によって傾倒防止構造が形成されている。このことによって、例えば図３の（ａ）に示す第１の実施形態と同様の効果を得ることができる。   As shown in FIG. 8B, when the LED chip 10 is fixed to the recess 30 formed on the component mounting surface 11 a of the mounting substrate 11, for example, a step of bonding the LED chip 10 to the mounting substrate 11 or a bonding step. Even if the LED chip 10 is inclined with respect to the normal line of the component mounting surface 11a, the inclination of the LED chip 10 with respect to the normal line of the component mounting surface 11a depends on the periphery of the recess 30 as shown in FIG. The size of is suppressed. That is, a tilt prevention structure is formed by the step between the component mounting surface 11 a and the recess 30. As a result, for example, the same effect as that of the first embodiment shown in FIG.

なお、実装基板１１に凹部３０を形成する方法として、例えば機械加工の場合は切削加工やレーザ加工が考えられる。切削加工やレーザ加工は、高い寸法精度で実装基板１１を加工できることから、凹部３０の開口部の面積と凹部３０の深さを、ＬＥＤチップ１０の寸法に対して高い寸法精度で加工することができる。実装基板１１をセラミック基板とした場合、基材形成時に凹部３０を同時に形成することもできる。
結果として、例えば図８の（ｄ）に示すように、ＬＥＤチップ１０を凹部３０に固着したときに、凹部３０の周囲とＬＥＤチップ１０の傾斜側面１０ｅとの間隙が０に近くなるように加工することで、ＬＥＤチップ１０の傾きを確実に抑制できるという優れた効果を奏する。 In addition, as a method of forming the recessed part 30 in the mounting substrate 11, for example, in the case of machining, cutting or laser machining can be considered. Since cutting and laser processing can process the mounting substrate 11 with high dimensional accuracy, the area of the opening of the recess 30 and the depth of the recess 30 can be processed with high dimensional accuracy with respect to the size of the LED chip 10. it can. When the mounting substrate 11 is a ceramic substrate, the recess 30 can be formed simultaneously with the formation of the base material.
As a result, for example, as shown in FIG. 8D, when the LED chip 10 is fixed to the recess 30, the gap between the periphery of the recess 30 and the inclined side surface 10e of the LED chip 10 is processed to be close to zero. By doing this, an excellent effect that the inclination of the LED chip 10 can be surely suppressed is produced.

《変形例２−１》
図９は、第２の実施形態に係る変形例２−１を示す図であって、（ａ）は、実装基板を部品実装面の側から見た図、（ｂ）は、図９の（ａ）におけるＸ５−Ｘ５断面図にＬＥＤチップを固着した状態を示す図である。 << Modification 2-1 >>
FIGS. 9A and 9B are diagrams showing a modified example 2-1 according to the second embodiment, in which FIG. 9A is a view of the mounting board viewed from the component mounting surface side, and FIG. It is a figure which shows the state which adhered the LED chip to X5-X5 sectional drawing in a).

図９の（ａ）に示すように、第２の実施形態に係る変形例２−１においては、実装基板１１の部品実装面１１ａに厚みが約５０〜１００μｍになるように、例えば紫外線（ＵＶ光）で硬化する感光性レジスト１１ｇをベタパターンで形成後、上面視でロ字型のパターンマスク上面側からＵＶ光を照射し、感光性レジスト１１ｇを硬化させて凹部３０を形成する。
なお、パターンマスクは、例えば感光性レジスト１１ｇの、ＵＶ光で硬化する部分を、上面視でロ字型に一定間隔で点在するように形成するパターンマスクであってもよい。 As shown in FIG. 9A, in the modified example 2-1 according to the second embodiment, the component mounting surface 11a of the mounting board 11 has, for example, ultraviolet rays (UV) so that the thickness is about 50 to 100 μm. The photosensitive resist 11g that is cured by light) is formed in a solid pattern, and then UV light is irradiated from the upper surface side of the square-shaped pattern mask when viewed from above, thereby curing the photosensitive resist 11g to form the recess 30.
The pattern mask may be, for example, a pattern mask that is formed such that portions of the photosensitive resist 11g that are cured by UV light are scattered in a square shape in a top view.

このように感光性レジスト１１ｇを実装基板１１に塗布して、ＵＶ光で硬化して実装基板１１を被覆する方法（フォトエッチング）は、高い寸法精度で凹部３０を形成できることから、凹部３０の開口部の面積と凹部３０の深さを、ＬＥＤチップ１０の寸法に対して高い寸法精度で加工することができる。
したがって、例えば図９の（ｂ）に示すように、ＬＥＤチップ１０を凹部３０に固着したときに、凹部３０の周囲とＬＥＤチップ１０の傾斜側面１０ｅとの間隙が０に近くなるように加工することができ、ＬＥＤチップ１０の、部品実装面１１ａの法線に対する傾きを確実に抑制できるという優れた効果を奏する。 Thus, the method (photoetching) which coat | covers the mounting substrate 11 by apply | coating the photosensitive resist 11g to the mounting substrate 11, and hardening | curing with UV light (photoetching) can form the recessed part 30 with high dimensional accuracy. The area of the part and the depth of the recess 30 can be processed with high dimensional accuracy with respect to the dimension of the LED chip 10.
Therefore, for example, as shown in FIG. 9B, when the LED chip 10 is fixed to the recess 30, the gap between the periphery of the recess 30 and the inclined side surface 10e of the LED chip 10 is processed to be close to zero. The LED chip 10 has an excellent effect that the inclination of the LED chip 10 with respect to the normal of the component mounting surface 11a can be reliably suppressed.

また、感光性レジスト１１ｇにＵＶ光を照射して感光性レジスト１１ｇを硬化する場合、感光性レジスト１１ｇは、図９の（ｂ）に示すように部品実装面１１ａの側から広がるように傾斜を持って硬化する。このことによって、感光性レジスタ１１ｇに形成される凹部３０の周囲は、図９の（ｂ）に示すように、部品実装面１１ａの側が狭くなるように傾斜して形成される。   When the photosensitive resist 11g is cured by irradiating the photosensitive resist 11g with UV light, the photosensitive resist 11g is inclined so as to spread from the component mounting surface 11a side as shown in FIG. 9B. Hold and cure. As a result, as shown in FIG. 9B, the periphery of the recess 30 formed in the photosensitive register 11g is inclined so that the component mounting surface 11a side is narrowed.

第２の実施形態に係るＬＥＤ光源１（図８の（ｂ）参照）においては、略逆四角錐台の形状の傾斜側面１０ｅを有するＬＥＤチップ１０を使用する。
したがって、変形例２−１においては、図９の（ｂ）に示すように、凹部３０の周囲の傾斜で、ＬＥＤチップ１０の傾斜側面１０ｅを面（線）で支持することができ、確実にＬＥＤチップ１０の、部品実装面１１ａの法線に対する傾きを抑制できるという優れた効果を奏する。 In the LED light source 1 according to the second embodiment (see FIG. 8B), the LED chip 10 having the inclined side surface 10e having a substantially inverted quadrangular pyramid shape is used.
Therefore, in the modified example 2-1, as shown in FIG. 9B, the inclined side surface 10e of the LED chip 10 can be supported by the surface (line) with the inclination around the recess 30, and reliably There is an excellent effect that the inclination of the LED chip 10 with respect to the normal of the component mounting surface 11a can be suppressed.

また、変形例２−１に係るフォトエッチングは、傾倒防止構造２０の形状を自由に設計できることから、傾倒防止構造２０の形状を変更してもよい。図９の（ｃ）は、変形例２−１に係る傾倒防止構造の別の形状を実装基板の部品実装面の側から見た図である。
例えば図９の（ｃ）に示すように、感光性レジスト１１ｇからなる傾倒防止構造２０を、略十字型に配置して形成してもよい。このように傾倒防止構造２０を形成することで、ＬＥＤチップ１０の傾斜側面１０ｅと傾倒防止構造２０が接する面が小さくなって、傾斜側面１０ｅから取り出す光Ｌが遮断される領域が小さくなり、ＬＥＤチップ１０の光Ｌの取り出し効率を高めることができる。
なお、感光性レジスト１１ｇで硬化させて形成される凹部３０は、硬化した感光性レジスト１１ｇが、例えばロ字型に一定間隔で点在して形成され、ＬＥＤチップ１０の傾斜側面１０ｅを、多点で支持する形状でもよい。
その他、ＬＥＤチップ１０の傾きを防止できる形状であれば、傾倒防止構造２０の形状は限定しない。 In addition, since the photoetching according to the modified example 2-1 can freely design the shape of the tilt prevention structure 20, the shape of the tilt prevention structure 20 may be changed. (C) of FIG. 9 is the figure which looked at another shape of the tilt prevention structure which concerns on modification 2-1 from the component mounting surface side of the mounting substrate.
For example, as shown in FIG. 9C, the anti-tilt structure 20 made of the photosensitive resist 11g may be formed in a substantially cross shape. By forming the tilt prevention structure 20 in this way, the surface where the inclined side surface 10e of the LED chip 10 and the tilt prevention structure 20 are in contact with each other is reduced, and the area where the light L taken out from the inclined side surface 10e is blocked is reduced. The extraction efficiency of the light L of the chip 10 can be increased.
The concave portions 30 formed by curing with the photosensitive resist 11g are formed by, for example, forming the cured photosensitive resist 11g in a square shape at regular intervals, and forming the inclined side surface 10e of the LED chip 10 in a large number. The shape supported by a point may be sufficient.
In addition, as long as the shape of the LED chip 10 can be prevented, the shape of the tilt prevention structure 20 is not limited.

以上説明したように、本発明においては、逆四角錐台の形状で光の取り出し効率を高めたＬＥＤチップを使用する場合であっても、ＬＥＤチップを安定して実装基板に固着し、ＬＥＤチップの、部品実装面の法線に対する傾きを抑制できる。
このことによって、本発明は、ＬＥＤチップの傾きによる光の取り出し効率の低下を抑制でき、ＬＥＤチップを含んで構成されるＬＥＤ光源の製造歩留まりや実装信頼性を高めることができる。
なお、本発明は、ＬＥＤチップに限定されず、他の電子部品にも適用できる。 As described above, in the present invention, the LED chip is stably fixed to the mounting substrate even when the LED chip having the inverted quadrangular pyramid shape and having the improved light extraction efficiency is used. The inclination with respect to the normal of the component mounting surface can be suppressed.
Accordingly, the present invention can suppress a decrease in light extraction efficiency due to the inclination of the LED chip, and can improve the manufacturing yield and mounting reliability of the LED light source including the LED chip.
The present invention is not limited to the LED chip, but can be applied to other electronic components.

第１の実施形態に係る実装基板を備えるＬＥＤ光源を示す図であって、（ａ）は、斜視図、（ｂ）は、図１の（ａ）におけるＸ１−Ｘ１断面図である。It is a figure which shows the LED light source provided with the mounting substrate which concerns on 1st Embodiment, Comprising: (a) is a perspective view, (b) is X1-X1 sectional drawing in (a) of FIG. 傾倒防止構造を示す図であって、（ａ）は実装基板を部品実装面の側から見た図、（ｂ）は、図２の（ａ）におけるＸ２−Ｘ２断面図、（ｃ）は、ＬＥＤチップを実装基板に固着した状態を示す図である。It is a figure which shows a tilt prevention structure, (a) is the figure which looked at the mounting board | substrate from the component mounting surface side, (b) is X2-X2 sectional drawing in (a) of FIG. 2, (c), It is a figure which shows the state which adhered the LED chip to the mounting board | substrate. 図２の（ａ）のＸ２−Ｘ２断面図に基づいてＬＥＤチップの状態を示す図であって、（ａ）は、ＬＥＤチップが傾いた状態を示す図、（ｂ）は、傾倒防止構造が構成されていない場合にＬＥＤチップが傾いた状態を比較例として示す図、（ｃ）は、ボンディングの工程におけるＬＥＤチップが傾いた状態を示す図である。It is a figure which shows the state of an LED chip based on X2-X2 sectional drawing of (a) of FIG. 2, Comprising: (a) is a figure which shows the state which the LED chip inclined, (b) is a structure which has a tilt prevention structure. The figure which shows the state which the LED chip inclined when not comprised as a comparative example, (c) is a figure which shows the state which the LED chip inclined in the process of bonding. 第１の実施形態に係る変形例１−１を示す図であって、（ａ）は、傾倒防止構造を部品実装面の側から見た図、（ｂ）は、図４の（ａ）におけるＸ３−Ｘ３断面図である。It is a figure which shows the modification 1-1 which concerns on 1st Embodiment, Comprising: (a) is the figure which looked at the tilt prevention structure from the component mounting surface side, (b) is in (a) of FIG. It is X3-X3 sectional drawing. 図１の（ａ）におけるＸ１−Ｘ１断面図に基づいて、第１の実施形態に係る変形例１−２を示す図である。It is a figure which shows the modification 1-2 which concerns on 1st Embodiment based on X1-X1 sectional drawing in (a) of FIG. 図１の（ａ）におけるＸ１−Ｘ１断面図に基づいて、第１の実施形態に係る変形例１−３を示す図であり、（ａ）は、配線パターンで傾倒防止構造を形成する図、（ｂ）は、配線パターンをメッキして傾倒防止構造を形成する図、（ｃ）は、配線パターンを白レジストで被覆して傾倒防止構造を形成する図である。FIG. 8 is a diagram illustrating a modified example 1-3 according to the first embodiment based on the X1-X1 cross-sectional view in FIG. 1A, and FIG. (B) is a figure which forms an anti-tilt structure by plating a wiring pattern, and (c) is a figure which forms an anti-tilt structure by covering the wiring pattern with a white resist. 図１の（ａ）におけるＸ１−Ｘ１断面図に基づいて、第１の実施形態に係る変形例１−４を示す図である。It is a figure which shows the modification 1-4 which concerns on 1st Embodiment based on X1-X1 sectional drawing in (a) of FIG. 第２の実施形態を示す図であって、（ａ）は、実装基板を部品実装面の側から見た図、（ｂ）は、図８の（ａ）におけるＸ４−Ｘ４断面図にＬＥＤチップを固着したＬＥＤ光源を示す図、（ｃ）は、凹部に固着されるＬＥＤチップが傾いた状態を示す図、（ｄ）は、凹部にＬＥＤチップが固着される状態を示す図である。It is a figure which shows 2nd Embodiment, (a) is the figure which looked at the mounting board | substrate from the component mounting surface side, (b) is X4-X4 sectional drawing in (a) of FIG. The figure which shows the LED light source which adhere | attached LED, (c) is a figure which shows the state in which the LED chip fixed to a recessed part inclines, (d) is a figure which shows the state in which an LED chip is fixed to a recessed part. 第２の実施形態に係る変形例２−１を示す図であって、（ａ）は、実装基板を部品実装面の側から見た図、（ｂ）は、図９の（ａ）におけるＸ５−Ｘ５断面図にＬＥＤチップを固着した状態を示す図である。It is a figure which shows the modified example 2-1 which concerns on 2nd Embodiment, Comprising: (a) is the figure which looked at the mounting substrate from the component mounting surface side, (b) is X5 in (a) of FIG. -It is a figure which shows the state which adhered the LED chip to X5 sectional drawing.

符号の説明Explanation of symbols

１ ＬＥＤ光源（ＬＥＤ光源装置）
１０ ＬＥＤチップ（電子部品）
１０ａ 発光面
１０ｃ 発光層
１０ｄ 底面
１０ｅ 傾斜側面
１１ 実装基板
１１ａ 部品実装面
１１ｄ 傾倒防止用配線パターン（傾倒防止構造）
１３ ダイボンディング材
２０ 傾倒防止構造
３０ 凹部（傾倒防止構造） 1 LED light source (LED light source device)
10 LED chip (electronic component)
10a Light emitting surface 10c Light emitting layer 10d Bottom surface 10e Inclined side surface 11 Mounting substrate 11a Component mounting surface 11d Tilt prevention wiring pattern (tilt prevention structure)
13 Die Bonding Material 20 Tilt Prevention Structure 30 Recess (Tilt Prevention Structure)

Claims (2)

ＬＥＤチップが、ダイボンディング材を介して部品実装面に固着される実装基板であって、
前記部品実装面に固着される前記ＬＥＤチップの、前記部品実装面の法線に対する傾きを抑制するとともに、固着された前記ＬＥＤチップの側面から取り出された光を反射可能に構成される傾倒防止構造が、前記ＬＥＤチップの底面が固着される周囲の前記部品実装面に凸状に、前記部品実装面に形成される電極パターンで形成されることを特徴とする実装基板。 The LED chip is a mounting substrate that is fixed to the component mounting surface via a die bonding material,
An inclination preventing structure configured to suppress the inclination of the LED chip fixed to the component mounting surface with respect to the normal line of the component mounting surface and to reflect the light extracted from the side surface of the fixed LED chip. However, the mounting board is formed with an electrode pattern formed on the component mounting surface in a convex shape on the component mounting surface around which the bottom surface of the LED chip is fixed. 請求項１に記載の実装基板を含んでなるＬＥＤ光源装置であって、
前記ＬＥＤチップは、発光面の背面側に、前記発光面より小さな面積で形成される前記底面で、前記実装基板に固着され、
前記発光面から前記底面に向かって下すぼみになる傾斜側面から取り出される光を前記傾倒防止構造で反射することを特徴とするＬＥＤ光源装置。 An LED light source device comprising the mounting substrate according to claim 1 ,
The LED chip is fixed to the mounting substrate on the back side of the light emitting surface, with the bottom surface formed with a smaller area than the light emitting surface,
The LED light source device, wherein the light extracted from the inclined side surface that becomes a depression from the light emitting surface toward the bottom surface is reflected by the tilt prevention structure.
JP2007339958A 2007-12-28 2007-12-28 Mounting substrate and LED light source device including the mounting substrate Expired - Fee Related JP5140413B2 (en)

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