JP5126711B2 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
- Publication number
- JP5126711B2 JP5126711B2 JP2007235502A JP2007235502A JP5126711B2 JP 5126711 B2 JP5126711 B2 JP 5126711B2 JP 2007235502 A JP2007235502 A JP 2007235502A JP 2007235502 A JP2007235502 A JP 2007235502A JP 5126711 B2 JP5126711 B2 JP 5126711B2
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- JP
- Japan
- Prior art keywords
- bonding
- laser
- laser beam
- semiconductor chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75261—Laser
- H01L2224/75263—Laser in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Description
第1に、レーザ加熱手段は、光源からのレーザ光を集束する集光手段を有するものとする。
第2に、集光手段によるレーザ光の集光点をボンディングヘッド内部の負圧を付与される空部に設ける。
2......基板
3......ボンディングツール
4......ボンディングヘッド
5......空部
6......レーザ加熱装置
7......吸引通路
8......吸引装置
9......光ファイバ
10.....レーザ出射口
11.....集光レンズ
12.....集光点
13.....載置ステージ
14.....レーザ発振器
15.....遮蔽板
16.....ホルダ
17.....反射鏡
18.....反射検出器
19.....吸着孔
20.....レーザ光
Claims (1)
- 電子部品を吸着保持するボンディングツールを有するボンディングヘッドと、
ボンディングツールに保持された電子部品にボンディングヘッドの内側からレーザ光を照射して加熱するレーザ加熱手段とを備えたボンディング装置において、
レーザ加熱手段は光源からのレーザ光を集束する集光手段を有し、
集光手段によるレーザ光の集光点をボンディングヘッド内部の負圧を付与される空部に設けたことを特徴とするボンディング装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007235502A JP5126711B2 (ja) | 2007-09-11 | 2007-09-11 | ボンディング装置 |
US12/207,128 US8168920B2 (en) | 2007-09-11 | 2008-09-09 | Bonding device |
TW097134814A TWI403378B (zh) | 2007-09-11 | 2008-09-11 | 接合裝置 |
KR1020080089885A KR101475953B1 (ko) | 2007-09-11 | 2008-09-11 | 본딩 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007235502A JP5126711B2 (ja) | 2007-09-11 | 2007-09-11 | ボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009070906A JP2009070906A (ja) | 2009-04-02 |
JP5126711B2 true JP5126711B2 (ja) | 2013-01-23 |
Family
ID=40606881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007235502A Active JP5126711B2 (ja) | 2007-09-11 | 2007-09-11 | ボンディング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5126711B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6064388B2 (ja) * | 2012-06-28 | 2017-01-25 | 澁谷工業株式会社 | ボンディングヘッド |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0671135B2 (ja) * | 1989-01-26 | 1994-09-07 | 富士電機株式会社 | Icチップのはんだ付け方法 |
JPH02280961A (ja) * | 1989-04-19 | 1990-11-16 | Agency Of Ind Science & Technol | Icチップのはんだ付け方法 |
JP3303832B2 (ja) * | 1999-04-01 | 2002-07-22 | 日本電気株式会社 | フリップチップボンダー |
-
2007
- 2007-09-11 JP JP2007235502A patent/JP5126711B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009070906A (ja) | 2009-04-02 |
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