JP5121576B2 - 遠隔制御用受光装置および電子機器 - Google Patents
遠隔制御用受光装置および電子機器 Download PDFInfo
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- JP5121576B2 JP5121576B2 JP2008139821A JP2008139821A JP5121576B2 JP 5121576 B2 JP5121576 B2 JP 5121576B2 JP 2008139821 A JP2008139821 A JP 2008139821A JP 2008139821 A JP2008139821 A JP 2008139821A JP 5121576 B2 JP5121576 B2 JP 5121576B2
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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Description
樹脂封止型受光素子110は、ガイドフレーム111によって多連状に繋がれている。
図1Aないし図3Cに基づいて、本実施の形態に係る遠隔制御用受光装置について説明する。
図4Aおよび図4Bに基づいて、本実施の形態に係る遠隔制御用受光装置について説明する。
図5に基づいて、本実施の形態に係る遠隔制御用受光装置の貫通穴および舌片端部の関係を実施の形態3として説明する。なお、実施の形態1での貫通穴35hおよび舌片端部34に適用した場合について説明するが、実施の形態2の場合にも同様に適用できる。
本実施の形態に係る電子機器(不図示)は、遠隔制御用受光装置を備える電子機器であって、遠隔制御用受光装置は、実施の形態1ないし実施の形態3に係る遠隔制御用受光装置1である。したがって、生産性および信頼性が高い電子機器を安価に製造することが可能となる。
10 樹脂封止型受光素子
11 リードフレーム
12 受光素子チップ
12b 絶縁性接着剤
13 集積回路チップ
13b 導電性接着剤
13t 電極
14 ワイヤ
15 リード部
16 樹脂封止部
16f 入射面
16p 先端面
16r 裏面
16s 側面
16t リード導出面
17 レンズ部
30 シールドケース
31d 受光素子チップ対向部
31f 入射面対向部
31p 先端面対向部
31s 側面対向部
32p 先端面対向延長部
32s 側面対向延長部
33 第1嵌合部
34 舌片端部
34f 外側突出部
34s 内側突出部
35 枠状部
35h 貫通穴
36 第2嵌合部
37 枠状部
37h 貫通穴
38 舌片端部
38f 外側突出部
38s 内側突出部
40 フック部
41 折り曲げ用貫通穴
42 放熱用貫通穴
43 屈曲縁取り部
44 ケース耳部
Claims (14)
- 受光素子チップを樹脂封止した樹脂封止部および該樹脂封止部から導出されたリード部を有する樹脂封止型受光素子と、該樹脂封止型受光素子を囲んで電磁シールドを行うシールドケースとを備える遠隔制御用受光装置であって、
前記樹脂封止部は、前記受光素子チップへ光を入射させる入射面と、該入射面に隣接し前記リード部が導出されるリード導出面と、前記入射面および前記リード導出面に隣接する一対の側面と、前記入射面に隣接し前記リード導出面の反対側に位置する先端面と、前記入射面の反対側に位置する裏面とを備え、
前記シールドケースは、前記入射面に対向する入射面対向部と、前記側面に対向する一対の側面対向部と、前記先端面に対向する先端面対向部と、前記側面対向部から前記樹脂封止部の側面に沿って延長され前記側面対向部より細く形成された側面対向延長部に形成された第1嵌合部と、前記先端面対向部から延長された先端面対向延長部の一部を延長方向と交差する方向に延長して形成された第2嵌合部とを備え、
前記先端面対向延長部は、折り曲げられて前記裏面に対向し、前記第1嵌合部および前記第2嵌合部は、相互に嵌合させてあること
を特徴とする遠隔制御用受光装置。 - 請求項1に記載の遠隔制御用受光装置であって、
前記第1嵌合部は、折り曲げられた舌片状の舌片端部を備え、前記第2嵌合部は、前記舌片端部が前記樹脂封止部の方から挿入された貫通穴を有する枠状部を備えること
を特徴とする遠隔制御用受光装置。 - 請求項1に記載の遠隔制御用受光装置であって、
前記第2嵌合部は、折り曲げられた舌片状の舌片端部を備え、前記第1嵌合部は、前記舌片端部が前記樹脂封止部の方から挿入された貫通穴を有する枠状部を備えること
を特徴とする遠隔制御用受光装置。 - 請求項3に記載の遠隔制御用受光装置であって、
前記樹脂封止型受光素子を実装先の配線基板へ固定して保持するフック部を備え、該フック部は、前記側面対向延長部を前記第1嵌合部からさらに延長して形成されていること
を特徴とする遠隔制御用受光装置。 - 請求項2ないし請求項4のいずれか一つに記載の遠隔制御用受光装置であって、
前記舌片端部は、波状に折り曲げられていること
を特徴とする遠隔制御用受光装置。 - 請求項5に記載の遠隔制御用受光装置であって、
前記舌片端部は、前記側面対向部の外側表面に対して外側へ突出させた外側突出部を根元側に有し、該外側突出部は前記貫通穴に嵌合させてあること
を特徴とする遠隔制御用受光装置。 - 請求項6に記載の遠隔制御用受光装置であって、
前記舌片端部は、前記側面対向部の内側表面に対して樹脂封止部の方へ突出させた内側突出部を前記外側突出部に隣接して有し、前記内側突出部は前記樹脂封止部を挟む構成としてあること
を特徴とする遠隔制御用受光装置。 - 請求項6または請求項7記載の遠隔制御用受光装置であって、
前記貫通穴の開口形状は、嵌合された前記外側突出部に対応する側が円弧状とされていること
を特徴とする遠隔制御用受光装置。 - 請求項6または請求項7記載の遠隔制御用受光装置であって、
前記貫通穴の開口形状は、嵌合された前記外側突出部に対応する側が直線状とされていること
を特徴とする遠隔制御用受光装置。 - 請求項1ないし請求項9のいずれか一つに記載の遠隔制御用受光装置であって、
前記先端面対向延長部は、前記先端面対向部との境界に折り曲げ用貫通穴を備えること
を特徴とする遠隔制御用受光装置。 - 請求項10に記載の遠隔制御用受光装置であって、
前記先端面対向延長部は、前記折り曲げ用貫通穴と同一形状の放熱用貫通穴を備えること
を特徴とする遠隔制御用受光装置。 - 請求項1ないし請求項11のいずれか一つに記載の遠隔制御用受光装置であって、
前記先端面対向延長部は、前記裏面の端部に対応させて屈曲され縁取りされた屈曲縁取り部を備えること
を特徴とする遠隔制御用受光装置。 - 請求項1ないし請求項12のいずれか一つに記載の遠隔制御用受光装置であって、
前記側面対向部は、前記側面対向部から延長されて前記側面と交差する方向で前記裏面の延長方向に突出されたケース耳部を備え、該ケース耳部は対向する一対の前記側面に対して前記先端面からの位置を相互に異ならせてあること
を特徴とする遠隔制御用受光装置。 - 遠隔制御用受光装置を備える電子機器であって、
前記遠隔制御用受光装置は、請求項1ないし請求項13のいずれか一つに記載の遠隔制御用受光装置であること
を特徴とする電子機器。
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JP5121576B2 true JP5121576B2 (ja) | 2013-01-16 |
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USD740453S1 (en) | 2013-06-27 | 2015-10-06 | Cree, Inc. | Light emitter unit |
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JPH0710502Y2 (ja) * | 1989-10-09 | 1995-03-08 | シャープ株式会社 | リモコン用受光装置 |
JP2504872Y2 (ja) * | 1990-11-13 | 1996-07-24 | シャープ株式会社 | リモコン受光ユニット用ハウジング |
JPH0888494A (ja) * | 1994-09-20 | 1996-04-02 | Sharp Corp | リモコン用受光素子およびその製造方法 |
JPH0984162A (ja) * | 1995-09-14 | 1997-03-28 | Sharp Corp | リモコン受光ユニット |
JP2958693B2 (ja) * | 1998-01-28 | 1999-10-06 | ローム株式会社 | 半導体光学装置のシールド器具 |
JP3778795B2 (ja) * | 2000-11-14 | 2006-05-24 | シャープ株式会社 | 受光ユニットを備えた電気機器 |
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