JP5112410B2 - Soldering structure - Google Patents

Soldering structure Download PDF

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JP5112410B2
JP5112410B2 JP2009261068A JP2009261068A JP5112410B2 JP 5112410 B2 JP5112410 B2 JP 5112410B2 JP 2009261068 A JP2009261068 A JP 2009261068A JP 2009261068 A JP2009261068 A JP 2009261068A JP 5112410 B2 JP5112410 B2 JP 5112410B2
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lead wire
circuit board
housing
soldering
lead
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JP2011108784A (en
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喜彦 藤田
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アール・ビー・コントロールズ株式会社
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  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

本発明は、弾性変形し得る帯状の導線を湾曲させた状態で回路基板の端子部に半田付けする半田付け構造に関する。   The present invention relates to a soldering structure for soldering to a terminal portion of a circuit board in a state where a belt-like lead wire that can be elastically deformed is bent.

平板状のモジュールから出力用の１対の導線が突設されており、そのモジュールに筐体を取り付け、筐体内の回路基板に導線を電気的に接続することが行われている（例えば、特許文献１、特許文献２参照）。   A pair of conductors for output are projected from a flat module, and a housing is attached to the module, and the conductors are electrically connected to a circuit board in the housing (for example, patents). Reference 1 and Patent Reference 2).

このうち、特許文献２には、板状の金属材料を曲げ加工して導線の先端を弾性力で把持する把持部を形成し、その把持部に導線の先端を差し込むことによって導線を把持部に対して電気的に接続する構成が示されている。   Among these, in Patent Document 2, a plate-shaped metal material is bent to form a gripping portion that grips the tip of the conducting wire with an elastic force, and the lead wire is inserted into the gripping portion so that the conducting wire becomes a gripping portion. An arrangement for electrical connection is shown.

特開２０００−６８５４２号公報（図３）JP 2000-68542 A (FIG. 3) 特開２００９−２４６０３９号公報（図５）JP 2009-246039 A (FIG. 5)

上記特許文献２に記載されたものでは、導線の先端を把持部に差し込むだけで接続が行われるので、一見優れているように思えるが、確実に導線の先端を把持させるためには導線の突出長さを正確に管理する必要がある。また、弾性力で導線の先端を把持しているだけであるので、接触不良が発生しやすいという不具合がある。さらに、導線を把持部に挿入する際に、導線の先端と把持部との間の摩擦力が挿入時の抵抗となり、導線がたわんでしまって確実に導線の先端が把持部に挿入されにくいという不具合もある。   In the above-mentioned Patent Document 2, it seems that the connection is made simply by inserting the leading end of the conducting wire into the gripping portion. It is necessary to manage the length accurately. Moreover, since only the tip of the conducting wire is gripped by the elastic force, there is a problem that poor contact is likely to occur. Furthermore, when inserting the lead wire into the grip portion, the frictional force between the tip of the lead wire and the grip portion becomes resistance during insertion, and the lead wire is bent and the tip of the lead wire is surely not easily inserted into the grip portion. There are also defects.

これらの不具合はすべて把持部で導線の先端を把持することによって電気的に接続する構成を採用することによって生じている。そこで、導線の先端を半田付けすればこれらの不具合はすべて解消される。ところが、半田付け作業は筐体の開口部分から行わなければならないのに対して導線はその反対側から筐体内に挿入される。そのため、筐体内に挿入された導線を湾曲させた状態で導線の先端を半田付けすることになる。   All of these problems are caused by adopting a configuration in which the gripping portion is electrically connected by gripping the tip of the conducting wire. Therefore, all of these problems can be solved by soldering the tip of the conducting wire. However, the soldering operation must be performed from the opening portion of the housing, whereas the conductive wire is inserted into the housing from the opposite side. Therefore, the leading end of the conducting wire is soldered in a state where the conducting wire inserted into the housing is curved.

導線は弾性変形するので、湾曲させて半田付けすると、導線の復元力は導線の先端を半田付けした部分から離そうとする方向に作用する。とくに半田付けする部分が回路基板表面に被着された銅箔であると、銅箔ごと回路基板から剥離するおそれが生じる。   Since the conducting wire is elastically deformed, when it is bent and soldered, the restoring force of the conducting wire acts in a direction to separate the tip of the conducting wire from the soldered portion. In particular, if the part to be soldered is a copper foil deposited on the surface of the circuit board, the copper foil may be peeled off from the circuit board.

そこで本発明は、上記の問題点に鑑み、導線の先端を半田付けすることにより回路基板に接続しても導線の復元力が半田付け部に作用しない半田付け構造を提供することを課題とする。   In view of the above problems, an object of the present invention is to provide a soldering structure in which the restoring force of the conducting wire does not act on the soldering portion even when connected to the circuit board by soldering the tip of the conducting wire. .

上記課題を解決するために本発明による半田付け構造は、筐体に格納された回路基板の上面に端子部が形成されており、帯状の弾性変形し得る導線を回路基板の裏側から筐体内に挿通し、回路基板の上側で導線を湾曲させて、導線の先端を回路基板の端子部に半田付けする半田付け構造において、導線の先端が端子部に接触する状態で湾曲状態を保持し、導線の復元力が半田付け部に作用しないようにする導線保持部を、回路基板と筐体とのうちのいずれか一方に設けたことを特徴とする。   In order to solve the above-described problems, the soldering structure according to the present invention has a terminal portion formed on the upper surface of a circuit board housed in a housing, and a strip-like elastically deformable lead wire is inserted into the housing from the back side of the circuit board. In a soldering structure in which the lead wire is bent through the upper side of the circuit board and the tip of the lead wire is soldered to the terminal portion of the circuit board, the bent state is maintained with the tip of the lead wire contacting the terminal portion. A conductive wire holding portion that prevents the restoring force from acting on the soldering portion is provided on one of the circuit board and the housing.

導線を湾曲させた状態で半田付けすると導線は復元しようとするが、その復元力は導線保持部が受けて、半田付け部には復元力が作用しない。   When the conductor is soldered in a curved state, the conductor tries to restore, but the restoring force is received by the conductor holding portion, and the restoring force does not act on the soldering portion.

具体的には、上記端子部の近傍に位置して門型の部材を回路基板に取り付けて導線保持部とし、導線をこの門型の部材をくぐらせて端子部に半田付けしてもよい。   Specifically, a gate-shaped member located near the terminal portion may be attached to the circuit board to form a conductive wire holding portion, and the conductive wire may be passed through the gate-shaped member and soldered to the terminal portion.

また、導線を内部に挿入するための開口が筐体に形成されており、この開口から導線を挿入すると導線の先端が突き当たる庇部を設けて導線保持部とし、この庇部で導線を湾曲させて端子部に半田付けしてもよい。   In addition, an opening for inserting the lead wire is formed in the housing, and when the lead wire is inserted from the opening, a hook portion that abuts the tip of the lead wire is provided as a lead wire holding portion, and the lead wire is bent at the hook portion. The terminal portion may be soldered.

あるいは、導線を内部に挿入するための開口が筐体に形成されており、この開口から導線を挿入すると導線を湾曲させるようにガイドするガイド部を設けて導線保持部とし、このガイド部で導線を湾曲した状態で保持した状態で端子部に半田付けしてもよい。   Alternatively, an opening for inserting the conducting wire is formed in the housing, and when the conducting wire is inserted from this opening, a guide portion that guides the conducting wire to be bent is provided as a conducting wire holding portion. May be soldered to the terminal portion while being held in a curved state.

以上の説明から明らかなように、本発明によれば、導線の復元力は導線保持部が受けて半田付け部に作用しないので、復元力によって半田付け部分が剥がれるなどの不具合が生じない。   As is clear from the above description, according to the present invention, the restoring force of the conducting wire is received by the conducting wire holding portion and does not act on the soldering portion, so that a problem such as peeling of the soldering portion by the restoring force does not occur.

本発明の一実施の形態の構成を示す図The figure which shows the structure of one embodiment of this invention 第１の実施の形態における分解斜視図Exploded perspective view in the first embodiment 導線の湾曲状態を示す断面図Sectional drawing which shows the bending state of conducting wire 第２の実施の形態における分解斜視図Exploded perspective view in the second embodiment 導線の湾曲状態を示す断面図Sectional drawing which shows the bending state of conducting wire 第３の実施の形態における分解斜視図Exploded perspective view of the third embodiment 導線の湾曲状態を示す断面図Sectional drawing which shows the bending state of conducting wire

図１を参照して、１は板状の発電モジュールであり、この発電モジュールの裏面に後述する回路基板を内蔵した筐体２が両面テープ２２によって取り付けられている。２１は筐体２の蓋である。   With reference to FIG. 1, reference numeral 1 denotes a plate-shaped power generation module, and a housing 2 containing a circuit board described later is attached to the back surface of the power generation module by a double-sided tape 22. Reference numeral 21 denotes a lid of the housing 2.

図２及び図３を参照して、発電モジュール１の裏面には１対の導線１１が、発電モジュール１の裏面に対してほぼ直角方向に突出している。この導線は帯状に形成されており、先端部１２以外は絶縁材料で被覆されている。また、図示の状態で自立できる強度を有しているとともに、後述するように弾性変形させて湾曲させることができる。筐体２内には回路基板３が格納されている。この回路基板３には導線１１が挿通される開口３２が形成されており、筐体２の底面に形成された開口２０に挿入された導線をさらに開口３２に挿入することにより導線１１の先端部１２は回路基板の上側に突出するように構成されている。   With reference to FIG. 2 and FIG. 3, a pair of conducting wires 11 protrude from the back surface of the power generation module 1 in a direction substantially perpendicular to the back surface of the power generation module 1. This conducting wire is formed in a band shape and is covered with an insulating material except for the tip portion 12. Moreover, it has the intensity | strength which can become independent in the state of illustration, and can be made to be elastically deformed and curved so that it may mention later. A circuit board 3 is stored in the housing 2. The circuit board 3 is formed with an opening 32 through which the conducting wire 11 is inserted. By inserting the conducting wire inserted into the opening 20 formed in the bottom surface of the housing 2 into the opening 32, the tip end portion of the conducting wire 11 is formed. 12 is configured to protrude above the circuit board.

回路基板３にはこの先端部１２が半田付けされる端子部３１が形成されている。そして、本実施の形態では、開口３２と端子部３１との間に門型のジャンパー端子４を導線保持部として設けた。このジャンパー端子は回路基板３に取り付けられる図示しない他の電子部品とともに実装され、予め回路基板３に半田付けされている。ただし、本発明ではこのジャンパー端子４は他のいずれの電子部品に対しても電気的に接続しないか、あるいは端子部３１に対して電気的に接続することが望ましい。   The circuit board 3 is formed with a terminal portion 31 to which the tip portion 12 is soldered. In the present embodiment, the gate-type jumper terminal 4 is provided as the conducting wire holding portion between the opening 32 and the terminal portion 31. This jumper terminal is mounted together with other electronic components (not shown) attached to the circuit board 3 and soldered to the circuit board 3 in advance. However, in the present invention, it is desirable that the jumper terminal 4 is not electrically connected to any other electronic component or is electrically connected to the terminal portion 31.

導線１１の先端部１２を端子部３１に半田付けする際には、導線１１を湾曲させて先端部１２をジャンパー端子４にくぐらせて、図３に示す状態にする。この状態では、導線１１は湾曲しているため元の真っ直ぐな状態に復元しようとするが、その復元はジャンパー端子４によって抑制される。すなわち、導線１１の復元力はジャンパー端子４が受けることになる。そのため、導線１１から手を離しても先端部１２は端子部３１に接触したままの状態で保持される。その状態で半田付けを行い、先端部１２を端子部３１に半田付けし、その後筐体２内に樹脂を注入して最後に蓋２１を筐体２に取り付けて半田付け作業を完了する。なお、Ｓは半田である。   When soldering the distal end portion 12 of the conducting wire 11 to the terminal portion 31, the conducting wire 11 is bent so that the distal end portion 12 passes through the jumper terminal 4 to obtain the state shown in FIG. 3. In this state, since the lead wire 11 is curved, an attempt is made to restore the original straight state, but the restoration is suppressed by the jumper terminal 4. That is, the restoring force of the conducting wire 11 is received by the jumper terminal 4. For this reason, the tip 12 is held in contact with the terminal 31 even when the conductor 11 is released. Soldering is performed in this state, the tip end portion 12 is soldered to the terminal portion 31, resin is then injected into the housing 2, and finally the lid 21 is attached to the housing 2 to complete the soldering operation. Note that S is solder.

上記実施の形態ではジャンパー端子４を導線保持部としたが、その他の構成として、例えば図４及び図５に示す構成でもよい。この構成では、導線保持部として庇部５を筐体２と一体に形成した。この庇部５は１対の導線１１に対しておのおの同じ方向に設けられており、開口２０を通って導線１１が筐体２内に挿入されると先端部１２がこの庇部５に突き当たる。先端部１２は一方向にしか湾曲できないように規制されるので、必然的に端子部３１側に向かって湾曲する。なお、回路基板３に１対の突起部３３を設けた。この突起部３３は回路基板３を筐体２内に取り付けた際に、庇部５の下方の空間５１に係合して回路基板３の位置決めを行うものである。この実施に形態では、図５に示すように、導線１１の復元力は庇部５によって受けられて、半田付け部に影響することはない。   In the above-described embodiment, the jumper terminal 4 is used as the conductor holding portion. However, as other configurations, for example, the configurations shown in FIGS. 4 and 5 may be used. In this configuration, the flange portion 5 is formed integrally with the housing 2 as a lead wire holding portion. The flanges 5 are provided in the same direction with respect to the pair of conductors 11, and when the conductors 11 are inserted into the housing 2 through the openings 20, the leading end 12 abuts against the flanges 5. Since the distal end portion 12 is restricted so that it can be bent only in one direction, it inevitably bends toward the terminal portion 31 side. A pair of protrusions 33 is provided on the circuit board 3. When the circuit board 3 is mounted in the housing 2, the protrusion 33 engages with the space 51 below the flange part 5 to position the circuit board 3. In this embodiment, as shown in FIG. 5, the restoring force of the conducting wire 11 is received by the flange portion 5 and does not affect the soldering portion.

上記２つの実施の形態では、導線１１を湾曲させるには手作業によって導線１１を湾曲させる必要がある。そこで、図６及び図７に示すように、筐体２に導線保持部としてガイド部６を形成した。このガイド部６は、図７に示すように内側にガイド面６１が形成されており、導線１１が開口２０から挿入されると、ガイド面２０に沿って導線１１が湾曲され、導線１１の挿入が完了した時点で先端部１２が端子部３１に当接するように構成されている。この実施の形態でも湾曲した導線１１の復元力はガイド部６が受けるので半田付け部には復元力は作用しない。   In the above two embodiments, in order to bend the conducting wire 11, it is necessary to bend the conducting wire 11 manually. Therefore, as shown in FIGS. 6 and 7, a guide portion 6 is formed as a conductor holding portion in the housing 2. As shown in FIG. 7, the guide portion 61 has a guide surface 61 formed on the inside thereof. When the conducting wire 11 is inserted from the opening 20, the conducting wire 11 is bent along the guide surface 20, and the conducting wire 11 is inserted. The tip 12 is configured to come into contact with the terminal 31 at the time when the process is completed. Also in this embodiment, since the restoring force of the curved conductor 11 is received by the guide portion 6, the restoring force does not act on the soldering portion.

なお、本発明は上記した形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更を加えてもかまわない。   In addition, this invention is not limited to an above-described form, You may add a various change in the range which does not deviate from the summary of this invention.

１ 発電モジュール
２ 筐体
３ 回路基板
４ ジャンパー端子
５ 庇部
６ ガイド部
１１ 導線
１２ 先端部
２０ ガイド面
２０ 開口
２２ 両面テープ
３１ 端子部
３２ 開口
３３ 突起部
５１ 空間
６１ ガイド面 DESCRIPTION OF SYMBOLS 1 Power generation module 2 Case 3 Circuit board 4 Jumper terminal 5 Grow part 6 Guide part 11 Conductor 12 Lead part 20 Guide surface 20 Opening 22 Double-sided tape 31 Terminal part 32 Opening 33 Protrusion part 51 Space 61 Guide surface

Claims (4)

筐体に格納された回路基板の上面に端子部が形成されており、帯状の弾性変形し得る導線を回路基板の裏側から筐体内に挿通し、回路基板の上側で導線を湾曲させて、導線の先端を回路基板の端子部に半田付けする半田付け構造において、導線の先端が端子部に接触する状態で湾曲状態を保持し、導線の復元力が半田付け部に作用しないようにする導線保持部を、回路基板と筐体とのうちのいずれか一方に設けたことを特徴とする半田付け構造。   A terminal part is formed on the upper surface of the circuit board stored in the housing, and a strip-like elastically deformable conductor is inserted into the housing from the back side of the circuit board, and the conductor is bent on the upper side of the circuit board. In the soldering structure in which the tip of the wire is soldered to the terminal portion of the circuit board, the lead wire is held so that the lead wire is kept in a curved state in contact with the terminal portion and the restoring force of the lead wire does not act on the soldering portion. A soldering structure, wherein the portion is provided on one of a circuit board and a housing. 上記端子部の近傍に位置して門型の部材を回路基板に取り付けて導線保持部とし、導線をこの門型の部材をくぐらせて端子部に半田付けすることを特徴とする請求項１に記載の半田付け構造。   2. A gate-shaped member located near the terminal portion is attached to a circuit board to form a lead wire holding portion, and the lead wire is passed through the gate-shaped member and soldered to the terminal portion. The described soldering structure. 導線を内部に挿入するための開口が筐体に形成されており、この開口から導線を挿入すると導線の先端が突き当たる庇部を設けて導線保持部とし、この庇部で導線を湾曲させて端子部に半田付けすることを特徴とする請求項１に記載の半田付け構造。   An opening for inserting the lead wire is formed in the housing, and when the lead wire is inserted from this opening, a hook part that abuts the tip of the lead wire is provided as a lead wire holding part, and the lead wire is bent at this hook part to be a terminal The soldering structure according to claim 1, wherein the soldering structure is soldered to the portion. 導線を内部に挿入するための開口が筐体に形成されており、この開口から導線を挿入すると導線を湾曲させるようにガイドするガイド部を設けて導線保持部とし、このガイド部で導線を湾曲した状態で保持した状態で端子部に半田付けすることを特徴とする請求項１に記載の半田付け構造。
An opening for inserting the lead into the housing is formed in the housing, and a guide is provided to guide the lead to bend when the lead is inserted through the opening to serve as a lead holding part, and the lead is bent at this guide. The soldering structure according to claim 1, wherein the soldering structure is soldered to the terminal portion while being held in a state where the soldering is performed.
JP2009261068A 2009-11-16 2009-11-16 Soldering structure Expired - Fee Related JP5112410B2 (en)

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