JP5107786B2 - Ledランプ - Google Patents
Ledランプ Download PDFInfo
- Publication number
- JP5107786B2 JP5107786B2 JP2008113610A JP2008113610A JP5107786B2 JP 5107786 B2 JP5107786 B2 JP 5107786B2 JP 2008113610 A JP2008113610 A JP 2008113610A JP 2008113610 A JP2008113610 A JP 2008113610A JP 5107786 B2 JP5107786 B2 JP 5107786B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- led lamp
- metal layer
- led
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
10 基板
11,12 金属配線層
13a,13b 裏面金属層
14 貫通孔
15a,15b 内面金属層
16 保護層
17 開口
20 放熱部材
21 凹部
22 上面
23 通気孔
24 溝部
24a 環状部
24b 延出部
30 LEDモジュール
31 LED(発光ダイオード)
32,33 リード
34 ワイヤ
35 樹脂パッケージ
40 キャップ
50 端子
Claims (2)
- 基板と、
上記基板の表面に搭載された複数の発光ダイオードと、
上記基板の表面に形成され、上記複数の発光ダイオードに接続された金属配線層と、
上記基板の裏面に取り付けられた放熱部材と、
を備えるLEDランプであって、
上記基板の裏面には裏面金属層が形成されており、
上記基板には厚み方向に貫通する複数の貫通孔が形成されており、
上記貫通孔の内面には、上記金属配線層および上記裏面金属層の双方に接続された内面金属層が形成されており、
上記貫通孔の内部は空洞となっているとともに、
上記放熱部材は、上記基板の裏面と対向する面に形成された溝部を有しており、
上記貫通孔の少なくとも一部が、上記基板の厚み方向視に上記溝部と重なるように、上記溝部が形成されていることを特徴とする、LEDランプ。 - 上記複数の貫通孔は、上記発光ダイオードを囲むように配置されている、請求項1に記載のLEDランプ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008113610A JP5107786B2 (ja) | 2008-04-24 | 2008-04-24 | Ledランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008113610A JP5107786B2 (ja) | 2008-04-24 | 2008-04-24 | Ledランプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009267008A JP2009267008A (ja) | 2009-11-12 |
JP5107786B2 true JP5107786B2 (ja) | 2012-12-26 |
Family
ID=41392493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008113610A Expired - Fee Related JP5107786B2 (ja) | 2008-04-24 | 2008-04-24 | Ledランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5107786B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5685865B2 (ja) * | 2010-09-02 | 2015-03-18 | 住友ベークライト株式会社 | 光源装置 |
JP5685864B2 (ja) * | 2010-09-02 | 2015-03-18 | 住友ベークライト株式会社 | 光源装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006011239A (ja) * | 2004-06-29 | 2006-01-12 | Kyocera Corp | 液晶表示装置 |
JP4798432B2 (ja) * | 2005-11-21 | 2011-10-19 | ミネベア株式会社 | 面状照明装置 |
-
2008
- 2008-04-24 JP JP2008113610A patent/JP5107786B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009267008A (ja) | 2009-11-12 |
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