JP5097627B2 - 真空処理装置 - Google Patents
真空処理装置 Download PDFInfo
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- JP5097627B2 JP5097627B2 JP2008168053A JP2008168053A JP5097627B2 JP 5097627 B2 JP5097627 B2 JP 5097627B2 JP 2008168053 A JP2008168053 A JP 2008168053A JP 2008168053 A JP2008168053 A JP 2008168053A JP 5097627 B2 JP5097627 B2 JP 5097627B2
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- vacuum
- vacuum processing
- processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Description
101 大気側ブロック
102 真空側ブロック
103a,103b,103c,104 処理ユニット
105 搬送ユニット
108 筐体
109 カセット台
111 位置合わせ部
113,113′ ロック室
201 基準位置
202 予備ポート
300 冷却媒体供給ユニット
301 冷却水IN側配管
302 冷却水OUT側配管
303 コネクタ部
304 冷却水供給・排出管路
305 開口
Claims (3)
- 内部が減圧される処理室を有する複数の真空処理容器と、前記真空容器の下方に配置され前記処理室内部を排気する排気装置と、前記複数の真空処理容器が周囲に着脱可能に連結されて配置され減圧されたその内部に処理対象の試料を搬送するための真空搬送ロボットが配置された真空搬送容器と、この真空搬送容器の前方側に連結されその前面側に前記試料が収納されたカセットが載せられる複数のカセット台が配置されて大気圧下の内部で前記試料が搬送される大気搬送容器とを有し、その前方側部分を構成して前記大気搬送容器を含む大気側ブロックと後方側部分を構成して前記複数の真空処理容器と前記真空搬送容器とを含む真空側ブロックとを備えた真空処理装置であって、
前記大気搬送容器の前記大気圧下の内部の空間に配置され前方から見て左右方向に延びるレールに沿って移動して該大気搬送容器の内部で前記試料を搬送する大気搬送ロボットと、前記大気搬送容器の前記レールの左または右の一端側}に配置され回転する台を有し前記試料が載せられた前記台を回転して前記試料の中心及び前記試料に予め形成された切り欠きの位置を所定のものに調節する位置合わせ機と、この位置合わせ機の直下方で当該位置合わせ機と床面との間に配置され前記複数の真空処理容器に供給または排出される流体の通流を調節する調節器とを備え、
この調節器は、前記位置合わせ機の直下方の床面を通り上下方向に延びて前記流体が供給または排出される配管の各々と前記床面の上方でコネクタを介して連結された供給用配管及び排出用配管と、これら配管の各々の上に配置され前記流体が前記供給量配管から前記複数の真空処理容器に向けて前記分岐して分配されるまたは前記複数の真空処理容器からの冷媒が前記排出用配管に合流する複数の分配器と、これらの分配器の各々と前記複数の真空処理容器の各々との間でこれらと連結され前記冷媒が内部を流れる複数の分岐管であって前記コネクタと前記床面との間に配置された複数の分岐管が配置された真空処理容器。
- 請求項1に記載の真空処理装置であって、前記流体は前記複数の真空処理容器またはその内部の試料台の冷却用液体である真空処理装置。
- 請求項1または2に記載の真空処理装置であって、前記真空前記搬送容器は上方から見て多角形の平面形を有しその複数の辺に前記真空処理容器が連結され、前記大気搬送容器は、前記位置合わせ機が配置された前記左または右の一端側の端部の位置が後方に配置された前記真空側ブロックの前記一端側の端部の位置に合わせて配置され且つ前記内部の空間に上下方向に大気の流れを形成するファンと、前記大気搬送容器の上部に配置されて前記ファンまたは前記大気搬送ロボットの動作を調節する制御ユニットとを備え、前記大気搬送容器の内部の前記一端側に配置された前記位置合わせ機の直下方に前記調節器を備えた真空処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008168053A JP5097627B2 (ja) | 2008-06-27 | 2008-06-27 | 真空処理装置 |
KR1020080080620A KR101092510B1 (ko) | 2008-06-27 | 2008-08-18 | 진공처리장치 |
US12/203,168 US8100620B2 (en) | 2008-06-27 | 2008-09-03 | Vacuum processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008168053A JP5097627B2 (ja) | 2008-06-27 | 2008-06-27 | 真空処理装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010010398A JP2010010398A (ja) | 2010-01-14 |
JP2010010398A5 JP2010010398A5 (ja) | 2011-09-08 |
JP5097627B2 true JP5097627B2 (ja) | 2012-12-12 |
Family
ID=41447675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008168053A Active JP5097627B2 (ja) | 2008-06-27 | 2008-06-27 | 真空処理装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8100620B2 (ja) |
JP (1) | JP5097627B2 (ja) |
KR (1) | KR101092510B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8586638B2 (en) | 2003-11-27 | 2013-11-19 | Shiseido Company, Ltd | Parakeratosis inhibitor and skin preparation for external use |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110269314A1 (en) * | 2010-04-30 | 2011-11-03 | Applied Materials, Inc. | Process chambers having shared resources and methods of use thereof |
KR102497795B1 (ko) * | 2016-07-04 | 2023-02-09 | 세메스 주식회사 | 기판 처리 장치 |
US11107713B2 (en) * | 2019-05-29 | 2021-08-31 | Taiwan Semiconductor Manufacturing Company Ltd. | Conveying system and method for operating the same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4852516A (en) * | 1986-05-19 | 1989-08-01 | Machine Technology, Inc. | Modular processing apparatus for processing semiconductor wafers |
US6312525B1 (en) * | 1997-07-11 | 2001-11-06 | Applied Materials, Inc. | Modular architecture for semiconductor wafer fabrication equipment |
TW442891B (en) * | 1998-11-17 | 2001-06-23 | Tokyo Electron Ltd | Vacuum processing system |
US7032614B2 (en) * | 2000-11-03 | 2006-04-25 | Applied Materials, Inc. | Facilities connection box for pre-facilitation of wafer fabrication equipment |
JP2004006665A (ja) * | 2002-02-20 | 2004-01-08 | Tokyo Electron Ltd | 真空処理装置 |
SG115630A1 (en) * | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock |
JP4522795B2 (ja) * | 2003-09-04 | 2010-08-11 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
JP4426343B2 (ja) * | 2004-03-08 | 2010-03-03 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
JP4961893B2 (ja) * | 2006-08-23 | 2012-06-27 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
-
2008
- 2008-06-27 JP JP2008168053A patent/JP5097627B2/ja active Active
- 2008-08-18 KR KR1020080080620A patent/KR101092510B1/ko active IP Right Grant
- 2008-09-03 US US12/203,168 patent/US8100620B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8586638B2 (en) | 2003-11-27 | 2013-11-19 | Shiseido Company, Ltd | Parakeratosis inhibitor and skin preparation for external use |
Also Published As
Publication number | Publication date |
---|---|
JP2010010398A (ja) | 2010-01-14 |
US20090324367A1 (en) | 2009-12-31 |
KR20100002018A (ko) | 2010-01-06 |
KR101092510B1 (ko) | 2011-12-13 |
US8100620B2 (en) | 2012-01-24 |
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