JP5096672B2 - Chip resistor and manufacturing method thereof - Google Patents

Chip resistor and manufacturing method thereof Download PDF

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JP5096672B2
JP5096672B2 JP2005334140A JP2005334140A JP5096672B2 JP 5096672 B2 JP5096672 B2 JP 5096672B2 JP 2005334140 A JP2005334140 A JP 2005334140A JP 2005334140 A JP2005334140 A JP 2005334140A JP 5096672 B2 JP5096672 B2 JP 5096672B2
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insulating substrate
long side
electrode
film
resistive film
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JP2007142165A (en
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将記 米田
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Rohm Co Ltd
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Priority to EP06811508A priority patent/EP1950771A1/en
Priority to PCT/JP2006/320195 priority patent/WO2007043516A1/en
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Priority to TW095137603A priority patent/TW200731297A/en
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本発明は，耐サージ特性に優れたチップ抵抗器と，その製造方法とに関するものである。   The present invention relates to a chip resistor excellent in surge resistance and a manufacturing method thereof.

一般に，チップ抵抗器は，平面視で長方形に構成した絶縁基板の上面に，抵抗膜を，前記長方形の長手方向に延びるように形成する一方，前記絶縁基板のうちその長方形の長手方向の両端における短辺側面の各々に，半田付け用の端子電極を，当該端子電極が前記抵抗膜の両端に対して前記絶縁基板の上面に形成した上面電極を介して電気的に接続するように形成して，この両端子電極においてプリント回路基板等に対して半田付け実装するという構成にしていることは周知の通りである。   In general, in a chip resistor, a resistive film is formed on the upper surface of an insulating substrate configured in a rectangular shape in plan view so as to extend in the longitudinal direction of the rectangle. A terminal electrode for soldering is formed on each of the short side surfaces so that the terminal electrode is electrically connected to both ends of the resistance film via an upper surface electrode formed on the upper surface of the insulating substrate. As is well known, the two terminal electrodes are configured to be soldered to a printed circuit board or the like.

この周知構成のチップ抵抗器において，前記抵抗膜の発熱による前記絶縁基板における熱膨張・収縮は，その長方形の長手方向において大きいのにかかわらず，前記長方形の長手方向の両端における短辺側面に端子電極を設けて，この両端子電極にて半田付け実装するように構成していることにより，この両端子電極による半田付け箇所に，前記大きい熱膨張・収縮による熱応力が，繰り返して作用することに加えて，半田付けの面積が狭いから，この半田付け部分に半田付け外れが発生するおそれが大きいという問題があった。   In this well-known chip resistor, the thermal expansion / contraction in the insulating substrate due to the heat generation of the resistive film is large in the longitudinal direction of the rectangle, but the terminals on the short side surfaces at both ends in the longitudinal direction of the rectangle. By providing electrodes and soldering mounting with both terminal electrodes, the thermal stress due to the large thermal expansion / contraction repeatedly acts on the soldered portions with both terminal electrodes. In addition, since the soldering area is small, there has been a problem that there is a high possibility that the soldering will be removed at this soldering portion.

そこで，先行技術としての特許文献１は，前記したように平面視で長方形に構成した絶縁基板の上面に，抵抗膜を，幅広にして，前記長方形の長手方向と直角方向に延びるように形成する一方，前記絶縁基板のうち，その長方形の長手方向と直角方向の両端における長辺側面に，前記抵抗膜の両端に対する半田付け用の端子電極を，当該長辺側面の略全長にわたって延びるように形成したチップ抵抗器を提案している。 Therefore, in Patent Document 1 as the prior art, as described above, the resistive film is formed on the upper surface of the insulating substrate configured to be rectangular in plan view so as to extend in a direction perpendicular to the longitudinal direction of the rectangle. On the other hand, terminal electrodes for soldering to both ends of the resistance film are formed so as to extend over substantially the entire length of the long side surface on the long side surfaces at both ends of the insulating substrate in the direction perpendicular to the longitudinal direction of the rectangle. A chip resistor is proposed.

この先行技術における構成によると，前記絶縁基板におけるその長方形の長手方向と直角方向についての熱膨張・収縮は，その長方形の長手方向についての熱膨張・収縮より小さいことに加えて，前記端子電極による半田付けの面積が，当該端子電極を長辺側面に形成することによって大幅に増大するから，前記半田付け部分に半田付け外れが発生するおそれを確実に低減することができる。
特開平１１−１１１５０５号公報 According to this prior art configuration, the thermal expansion / contraction of the insulating substrate in the direction perpendicular to the longitudinal direction of the rectangle is smaller than the thermal expansion / contraction in the longitudinal direction of the rectangle. Since the soldering area is greatly increased by forming the terminal electrode on the side surface of the long side, it is possible to reliably reduce the possibility that the soldering will be detached from the soldered portion.
JP-A-11-111505

しかし，その反面，前記先行技術においては，幅広の抵抗膜が延びる方向は，長方形における長手方向と直角方向であることにより，この抵抗膜において電流が流れる経路の長さは，当該抵抗膜が長方形における長手方向に延びている場合よりも短いから，抵抗膜における耐サージ特性が低く，換言すると，耐サージ特性の向上を図ることができないという問題があった。   However, in the above prior art, the direction in which the wide resistive film extends is perpendicular to the longitudinal direction of the rectangle, so that the length of the path through which current flows in the resistive film is rectangular. This is shorter than the case of extending in the longitudinal direction of the film, so that the surge resistance of the resistive film is low. In other words, the surge resistance cannot be improved.

また，前記先行技術においては，抵抗膜に対してその幅方向に延びるトリミング溝を刻設することによって，当該抵抗膜における抵抗値を所定にするように調節する場合に，前記トリミング溝を，抵抗膜における幅広の方向に長くして刻設するか，トリミング溝の本数を多くしなければならず，これに長い時間が必要になるから，これだけ前記トリミング溝を刻設することに要するコストのアップを招来することも問題であった。   Further, in the prior art, when the trimming groove extending in the width direction is formed in the resistance film so that the resistance value in the resistance film is adjusted to a predetermined value, the trimming groove The length of the film in the wide direction must be engraved or the number of trimming grooves must be increased, and this requires a long time. This increases the cost required for engraving the trimming grooves. It was also a problem to invite.

本発明は，これらの問題を解消したチップ抵抗器と，その製造方法とを提供することを技術的課題とするものである。   An object of the present invention is to provide a chip resistor that solves these problems and a method of manufacturing the same.

この技術的課題を達成するため本発明におけるチップ抵抗器は，請求項１に記載したように，
「平面視で長方形にした絶縁基板と，この絶縁基板の上面に形成した抵抗膜と，前記絶縁基板の上面に形成されると共に前記抵抗膜の接続部が重なる一対の上面電極と，前記絶縁基板においてその長方形の長手方向に延びる左右両長辺側面に，前記上面電極に電気的に接続するように形成した一対の端子電極とから成るチップ抵抗器において，
前記上面電極の各々は，前記絶縁基板における上面のうち当該絶縁基板における長辺側面に隣接する部分に形成されており，この上面電極は，当該上面電極における前記抵抗膜の長辺に沿った方向の幅を前記抵抗膜の接続部における前記絶縁基板の長辺に沿った方向の幅よりも大きくした状態で前記絶縁基板の長辺側面に沿って帯状に長く延びる形態である一方，
前記抵抗膜の一端には，前記両上面電極のうち一方の上面電極への前記接続部が，前記抵抗膜の他端には，他方の上面電極への前記接続部が各々一体に設けられ，これら両接続部は，その各々における上面電極に対して，前記絶縁基板における長方形の長手方向に沿って互いに適宜距離を隔てた部位において接続されており，
前記抵抗膜のうち前記接続部の間の部分は，
前記絶縁基板の長手方向に折り返される部分と前記絶縁基板の短手方向に折り返される部分とが連続したつづら折りになっている」
ことを特徴としている。 In order to achieve this technical problem, a chip resistor according to the present invention is as described in claim 1.
"An insulating substrate which is rectangular in plan view, a resistive film formed on the upper surface of the insulating substrate, a pair of upper surface electrode connecting portion of the formed on the upper surface of the insulating substrate Rutotomoni the resistive film overlap, the insulating substrate In the chip resistor comprising a pair of terminal electrodes formed so as to be electrically connected to the upper surface electrodes on both the left and right long side surfaces extending in the longitudinal direction of the rectangle,
Each of the upper surface electrodes is formed on a portion of the upper surface of the insulating substrate adjacent to the long side surface of the insulating substrate , and the upper surface electrode is in a direction along the long side of the resistance film of the upper surface electrode. While the width of the resistor film is longer than the width in the direction along the long side of the insulating substrate in the connection portion of the resistance film, the strip extends long along the side of the long side of the insulating substrate ,
Wherein the one end of the resistor film, wherein the connection to one of the upper electrode, of the two upper electrode is the other end of the resistance film, the connection to the other of the upper electrode are each integrally provided, These two connecting portions are connected to the upper surface electrode in each of them at a site that is appropriately spaced along the longitudinal direction of the rectangle of the insulating substrate,
The portion of the resistive film between the connecting portions is
The portion folded back in the longitudinal direction of the insulating substrate and the portion folded back in the short direction of the insulating substrate are continuously spelled.
It is characterized by that.

本発明におけるチップ抵抗器は，請求項２に記載したように，
「前記請求項１の記載において，前記抵抗膜における両接続部のうち一方の接続部は，前記絶縁基板において前記両長辺側面と直角方向の両短辺側面のうち一方の短辺側面に隣接した部位に位置され，他方の接続部は，他方の短辺側面に隣接した部位に位置されている。」
ことを特徴としている。 The chip resistor according to the present invention is as described in claim 2,
“In the first aspect of the present invention, one of the connection portions of the resistive film is adjacent to one of the short side surfaces of the short side surfaces perpendicular to the long side surfaces of the insulating substrate. The other connecting portion is located in a portion adjacent to the other short side surface. "
It is characterized by that.

本発明におけるチップ抵抗器は，請求項３に記載したように，
「前記請求項１又は２の記載において，前記抵抗膜における両接続部が，細幅に形成されている。」
ことを特徴としている。 The chip resistor according to the present invention is as described in claim 3,
“In the first or second aspect of the present invention, both connecting portions of the resistive film are formed with a narrow width .”
It is characterized by that.

更に，本発明におけるチップ抵抗器は，請求項４，５に記載したように，
「前記請求項１〜３のいずれかの記載において，前記抵抗膜におけるつづら折りの一部又は全部は，前記抵抗膜に対するトリミング加工により形成されている。」
ことを特徴としている。
これに加えて，本発明におけるチップ抵抗器は，請求項６に記載したように，
「前記請求項１〜３のいずれかの記載において，前記絶縁基板における上面のうち当該絶縁基板における一方の長辺側面に隣接する部分には，前記両上面電極を形成しない部分が部分的に設けられている。」
ことを特徴としている。 Furthermore, the chip resistor according to the present invention is as described in claims 4 and 5,
"In any of the foregoing description claims 1-3, wherein the put the resistive film Ruth Dzura folding Rino some or all are formed by trimming with respect to the resistive film."
It is characterized by that.
In addition to this, the chip resistor according to the present invention, as described in claim 6,
“A portion of the upper surface of the insulating substrate adjacent to one long side surface of the insulating substrate is partially provided with a portion where the upper surface electrodes are not formed. "
It is characterized by that.

次に，本発明における製造方法は，請求項７に記載したように，
「平面視で長方形にした絶縁基板の上面に抵抗膜を形成する工程と，前記絶縁基板の上面に前記抵抗膜の接続部が重なる一対の上面電極を形成する工程と，前記絶縁基板においてその長方形の長手方向に延びる左右両長辺側面の各々に端子電極を形成する工程とを備えて成るチップ抵抗器の製造方法において，
前記各上面電極を形成する工程が，前記絶縁基板における上面のうち当該絶縁基板における長辺側面に隣接する部分にこの長辺側面に沿って帯状に延びるようにして形成する工程であり，
前記上面電極は，当該上面電極における前記抵抗膜の長辺に沿った方向の幅を前記抵抗膜の接続部における前記絶縁基板の長辺に沿った方向の幅よりも大きくした状態に形成されており，
前記抵抗膜を形成する工程が，
当該抵抗膜の一端に前記両上面電極のうち一方の上面電極への前記接続部を，当該抵抗膜の他端に他方の上面電極への前記接続部を各々一体に設け，両接続部を，前記絶縁基板における長方形の長手方向に沿って互いに適宜距離を隔てた部位においてその各々の上面電極に接続する工程と，
前記抵抗膜をつづら折りを備えた形態にして形成する工程とを含んでおり，
前記つづら折りは，前記絶縁基板の長手方向に折り返される部分と，前記絶縁基板の短手方向に折り返される部分とが連続している」
ことを特徴としている。 Next, the manufacturing method in the present invention is as described in claim 7,
“A step of forming a resistance film on the upper surface of the insulating substrate that is rectangular in plan view; a step of forming a pair of upper surface electrodes on which the connection portions of the resistance film overlap the upper surface of the insulating substrate; A step of forming a terminal electrode on each of the left and right long side surfaces extending in the longitudinal direction of the chip resistor,
The step of forming each upper surface electrode is a step of forming the upper surface of the insulating substrate so as to extend in a band shape along the long side surface in a portion adjacent to the long side surface of the insulating substrate,
The upper surface electrode is formed in a state where the width of the upper surface electrode in the direction along the long side of the resistance film is larger than the width of the connection portion of the resistance film in the direction along the long side of the insulating substrate. And
Forming the resistive film comprises:
The connection to one of the upper electrode of the two upper electrode to one end of the resistance film, provided on the other end of the resistor film in each integrally the connection to the other of the upper electrode, both connections, Connecting to each of the upper surface electrodes at an appropriate distance from each other along the longitudinal direction of the rectangle in the insulating substrate;
Includes a step of forming by the resistive film Wotsu Dzura folding Rio with form,
Before tough Dzura folding rehearsal, the portion that is folded back in the longitudinal direction of the insulating substrate, the lateral direction in the folded Ru portion of the insulating substrate is continuous. "
It is characterized by that.

前記請求項１に記載した構成にすることで，プリント回路基板等に対する実装に際しての半田付けを，長方形にした絶縁基板のうち二つの長辺側面に形成した端子電極において行うことにより，半田付けの面積を増大できるとともに，前記絶縁基板における熱膨張・収縮によって前記半田付け部に作用する熱ストレスを低減できるから，前記半田付け部分に半田付け外れが発生するおそれを確実に低減することができる。   With the configuration described in claim 1, soldering when mounting on a printed circuit board or the like is performed on the terminal electrodes formed on the two long side surfaces of the rectangular insulating substrate. The area can be increased, and the thermal stress acting on the soldering portion due to thermal expansion / contraction in the insulating substrate can be reduced, so that it is possible to reliably reduce the possibility that soldering will be removed at the soldering portion.

その一方で，抵抗膜は，当該抵抗膜の一端に前記両上面電極のうち一方の上面電極への接続部を，当該抵抗膜の他端に他方の上面電極への接続部を各々一体に設け，両接続部を，前記絶縁基板における長方形の長手方向に沿って互いに適宜距離を隔てた部位においてその各々の上面電極に接続する一方，前記抵抗膜を，直列接続の二つのつづら折りに構成したことにより，この抵抗膜における電流経路の長さを，当該抵抗膜を長方形の長手方向と直角の方向に延びるように形成する場合よりも，当該抵抗膜の両端に一体に設けた前記両接続部を長手方向に適宜距離を隔てた部位においてその各々の上面電極に接続する分だけ増大できるから，耐サージ特性を向上することができ，しかも，前記抵抗膜における電流経路が長い分だけ，この抵抗膜に刻設するトリミング溝の長さを短く，トリミング溝の本数を少なくできるから，トリミング溝を刻設することに要するコストを低減できる。 On the other hand, the resistance film is integrally provided with a connection portion to one of the upper surface electrodes at one end of the resistance film and a connection portion to the other upper surface electrode at the other end of the resistance film. , configure both connections, while connected to the upper surface electrode of each of the sites at a suitable distance from each other along the rectangular longitudinal direction of the insulating substrate, the resistive film, the Ri two zigzag series connection As a result, the length of the current path in the resistive film is set so that the resistance film is formed so as to extend in a direction perpendicular to the longitudinal direction of the rectangle. Since the portion can be increased by the amount connected to each upper surface electrode at an appropriate distance in the longitudinal direction, surge resistance can be improved, and the current path in the resistive film can be increased. resistance The length of the trimming groove engraved on short, because it reduces the number of trimming groove, it is possible to reduce the cost required to engraved trimming groove.

しかも，両上面電極を帯状にして，これに抵抗膜と一体の接続部を接続するという構成であることにより，前記抵抗膜から上面電極及び端子電極を介しての放熱性を，例えば，前記上面電極に絶縁基板の長手方向と直角方向に延びる延長部を一体に設けてこの延長部に抵抗膜と一体の接続部を重ね接続するというように構成した場合よりも，大幅に促進できるから，チップ抵抗器における過負荷特性（ＳＴＯＬ評価）を確実に向上できる。   In addition, since both upper surface electrodes are formed in a strip shape and a connection portion integrated with the resistance film is connected to the belt, heat dissipation from the resistance film through the upper surface electrode and the terminal electrode can be achieved, for example, The chip can be greatly promoted compared to the case where an extension extending in a direction perpendicular to the longitudinal direction of the insulating substrate is integrally provided on the electrode, and the connecting portion integrated with the resistance film is overlapped and connected to the extension. The overload characteristic (STOL evaluation) in the resistor can be reliably improved.

この場合，請求項２に記載したように，一方の接続部を，前記絶縁基板における一方の短辺側面に隣接した部位に，他方の接続部を，他方の短辺側面に隣接した部位に各々位置することにより，前記抵抗膜における電流経路を，絶縁基板が長方形であることを利用してより長くできるから，前記した効果を助長できる。   In this case, as described in claim 2, one connection portion is disposed at a portion adjacent to one short side surface of the insulating substrate, and the other connection portion is disposed at a portion adjacent to the other short side surface. By being positioned, the current path in the resistive film can be made longer by utilizing the rectangular shape of the insulating substrate, and thus the above-described effect can be promoted.

また，前記抵抗膜を，直列接続の二つのつづら折りに構成して，その両端を前記請求項３に記載したように，両上面電極に対する接続部を細幅にすることにより，その電流経路がより長くなるから，耐サージ特性の更なる向上を図ることができる。 Further, the resistive film, and configured to Ri two zigzag series connection, both ends thereof as described in claim 3, by a connection to both the upper electrode to narrow their current paths Therefore, surge resistance can be further improved.

また，請求項７に記載した製造方法によると，前記した機能を有するチップ抵抗器を低コストで製造することができる。 Moreover, according to the manufacturing method described in claim 7 , a chip resistor having the above-described function can be manufactured at low cost.

以下，本発明の実施の形態を図面について説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１〜図３は，本発明における第１の実施の形態によるチップ抵抗器を示す。   1 to 3 show a chip resistor according to a first embodiment of the present invention.

この第１の実施の形態によるチップ抵抗器１は，少なくとも，セラミック等の耐熱絶縁体にて平面視で長辺がＬで短辺がＷの長方形のチップ型に構成した絶縁基板２と，この絶縁基板２の上面のうちその長方形の長手方向の左右両側に形成した一対の上面電極３，４と，前記絶縁基板２の上面のうち前記両上面電極３，４の間の部分にその長方形の長手方向に延びるように形成した抵抗膜５と，前記絶縁基板２の長方形における二つの長辺側面２ａ，２ｂに当該長辺側面２ａ，２ｂの全長にわたって延びるように形成した半田付け用の端子電極６，７と，前記絶縁基板２における下面のうち前記二つの長辺側面２ａ，２ｂの隣接する部分にこの二つの長辺側面２ａ，２ｂに沿って延びるように形成した一対の下面電極８，９と，前記絶縁基板２の上面に前記抵抗膜５の全体を覆うように形成したガラス又は合成樹脂によるカバーコート１０とによって構成されている。   The chip resistor 1 according to the first embodiment includes at least an insulating substrate 2 configured as a rectangular chip type having a long side L and a short side W in a plan view with a heat-resistant insulator such as ceramic. A pair of upper surface electrodes 3, 4 formed on both the left and right sides of the rectangular longitudinal direction of the upper surface of the insulating substrate 2, and a rectangular shape between the upper surface electrodes 3, 4 of the upper surface of the insulating substrate 2. A resistive film 5 formed so as to extend in the longitudinal direction, and a terminal electrode for soldering formed on the two long side surfaces 2a, 2b in the rectangle of the insulating substrate 2 so as to extend over the entire length of the long side surfaces 2a, 2b. 6 and 7 and a pair of lower surface electrodes 8 formed to extend along the two long side surfaces 2a and 2b in adjacent portions of the two long side surfaces 2a and 2b of the lower surface of the insulating substrate 2. 9 and the insulating substrate It is constituted by a cover coating 10 by forming glass or a synthetic resin as the upper surface to cover the whole of the resistance film 5.

なお，前記両上面電極３，４，前記抵抗膜５，及び前記両下面電極８，９の各々は，その材料ペーストのスクリーン印刷とその後における焼成とで形成され，また，前記両端子電極６，７は，材料ペースト塗布とその後における焼成とで形成され，更にまた，前記カバーコート１０は，材料ペーストのスクリーン印刷とその後における乾燥又は焼成とで形成される。   Each of the upper surface electrodes 3, 4, the resistance film 5, and the lower surface electrodes 8, 9 is formed by screen printing of the material paste and subsequent firing, and both the terminal electrodes 6, 6 are formed. 7 is formed by application of a material paste and subsequent baking, and the cover coat 10 is formed by screen printing of the material paste and subsequent drying or baking.

そして，前記各上面電極３，４は，前記絶縁基板２における上面のうち当該絶縁基板２における長辺側面２ａ，２ｂに隣接する部分に，この長辺側面２ａ，２ｂに沿って帯状に延びるように形成されており，前記両端子電極６，７は，前記上面電極３，４及び前記下面電極８，９の各々に対して重なり接続されている。   Each of the upper surface electrodes 3 and 4 extends in a band shape along the long side surfaces 2a and 2b in a portion of the upper surface of the insulating substrate 2 adjacent to the long side surfaces 2a and 2b. The terminal electrodes 6 and 7 are connected to the upper surface electrodes 3 and 4 and the lower surface electrodes 8 and 9 so as to overlap each other.

一方，前記抵抗膜５の一端には，前記両上面電極３，４のうち一方の上面電極３への細幅状の接続部５ａが，前記抵抗膜５の他端には，他方の上面電極４への細幅状の接続部５ｂが各々一体に設けられ，これら両接続部５ａ，５ｂを，その各々に対する上面電極３，４に対して，前記絶縁基板２における長方形の長手方向に沿って互いに適宜距離Ｓを隔てた部位において重なり接続するように構成している。   On the other hand, one end of the resistance film 5 has a narrow connection portion 5a to one of the upper surface electrodes 3 and 4, and the other upper surface electrode has the other end of the resistance film 5. 4 are provided integrally with each other, and both the connecting portions 5a and 5b are arranged along the longitudinal direction of the rectangle of the insulating substrate 2 with respect to the upper surface electrodes 3 and 4 for the respective connecting portions 5a and 5b. It is configured to be overlapped and connected at portions separated from each other by a distance S as appropriate.

本実施の形態において，前記抵抗膜５のうちその両端における接続部５ａ，５ｂ間の部分は，当該抵抗膜５を，スクリーン印刷とその後における焼成にて形成した後において，図１に示すように，絶縁基板２の短手方向に長い入り込み溝５ｃと絶縁基板の長手方向に長い入り込み溝５ｄとをレーザ光線の照射等のトリミング加工にて刻設することによって，前記絶縁基板２の長手方向に折り返される部分と前記絶縁基板２の短手方向に折り返される部分とが連続したつづら折りに形成されている。 In the present embodiment, the portion between the connection portions 5a and 5b at both ends of the resistance film 5 is formed by screen printing and subsequent firing as shown in FIG. The intrusion groove 5c long in the short direction of the insulating substrate 2 and the long intrusion groove 5d in the longitudinal direction of the insulating substrate 2 are engraved by trimming such as laser beam irradiation in the longitudinal direction of the insulating substrate 2. The folded portion and the portion folded in the short direction of the insulating substrate 2 are formed in a continuous spell fold.

なお，前記両入り込み溝５ｃ，５ｄのうちいずれか一方又は両方は，当該入り込み溝の刻設によって，前記抵抗膜５における抵抗値が所定の許容範囲内に入るようにするというトリミング調整を兼ねている。
この場合，前記上面電極３，４のうち一方の上面電極４は，図１，後述する図４及び図５に示すように，他方の上面電極３よりも短くすることにより，前記絶縁基板２における上面のうち当該絶縁基板２における一方の長辺側面２ｂに隣接する部分には，前記一方の上面電極４を形成しないという構成にしている。 One or both of the both entering grooves 5c and 5d also serve as trimming adjustment so that the resistance value in the resistance film 5 falls within a predetermined allowable range by engraving the entering groove. Yes.
In this case, one upper surface electrode 4 of the upper surface electrodes 3 and 4 is made shorter than the other upper surface electrode 3 as shown in FIG. 1 and FIGS. The upper surface electrode 4 is not formed on a portion of the upper surface adjacent to the one long side surface 2b of the insulating substrate 2.

前記抵抗膜５を，前記したように，直列接続の二つのつづら折りを形成することは, 前記トリミング加工による方法に限らず，当該抵抗膜５をスクリーン印刷するときに同時に一本又は複数本の入り込み溝を設けることによってつづら折りに形成したり，或いは, スクリーン印刷するときに設ける入り込み溝と，前記トリミング加工による入り込み溝との組み合わせによってつづら折りに形成したりすることができる。 The resistance film 5, as mentioned above, that two zigzag Rio form of series connection is not limited to the method according to the trimming, simultaneously one or a plurality of when the resistance film 5 is screen-printed It is possible to form a zigzag fold by providing a recess groove, or to form a zigzag fold by combining the entering groove provided for screen printing and the entering groove formed by the trimming process.

なお，図示していないが，前記各上面電極３，４のうちカバーコート１０にて被覆されていない部分の表面，前記各端子電極６，７の表面，及び前記各下面電極８，９の表面には，半田等のように半田接合性に優れた金属によるメッキ層が形成されている。   Although not shown, the surfaces of the upper surface electrodes 3 and 4 that are not covered with the cover coat 10, the surfaces of the terminal electrodes 6 and 7, and the surfaces of the lower surface electrodes 8 and 9. A plating layer made of a metal having excellent solder bonding properties such as solder is formed.

この構成のチップ抵抗器１は，プリント回路基板等に対する半田付けを，長方形にした絶縁基板２のうち二つの長辺側面２ａ，２ｂに形成した端子電極６，７において行うことにより，半田付けの面積を増大することができるとともに，熱膨張・収縮によって前記半田付け部に作用する熱ストレスが低減できる。   The chip resistor 1 having this configuration is soldered by performing soldering to a printed circuit board or the like on the terminal electrodes 6 and 7 formed on the two long side surfaces 2a and 2b of the rectangular insulating substrate 2. The area can be increased, and the thermal stress acting on the soldering portion due to thermal expansion / contraction can be reduced.

その一方で，抵抗膜５は，当該抵抗膜５の一端に前記両上面電極３，４のうち一方の上面電極３への接続部５ａを，当該抵抗膜５の他端に他方の上面電極４への接続部５ｂを各々一体に設け，この両接続部５ａ，５ｂを，前記絶縁基板２における長方形の長手方向に沿って互いに適宜距離Ｓを隔てた部位においてその各々の上面電極３，４に接続するという構成であることにより，この抵抗膜５における電流経路の長さを，当該抵抗膜５を長方形の長手方向と直角の方向に延びるように形成する場合よりも，当該抵抗膜５の両端に一体に設けた前記両接続部５ａ，５ｂを長手方向に適宜距離Ｓを隔てた部位においてその各々の上面電極３，４に接続する分だけ増大することができる。   On the other hand, the resistance film 5 is connected to one end of the resistance film 5 at one end of the upper surface electrodes 3, 4, and the other upper surface electrode 4 at the other end of the resistance film 5. The connecting portions 5b are integrally provided, and both the connecting portions 5a and 5b are connected to the respective upper surface electrodes 3 and 4 at a portion separated from each other by a distance S along the longitudinal direction of the rectangle in the insulating substrate 2. Because of the configuration of connection, the length of the current path in the resistance film 5 is set so that both ends of the resistance film 5 are longer than when the resistance film 5 is formed to extend in a direction perpendicular to the longitudinal direction of the rectangle. The connecting portions 5a and 5b provided integrally with each other can be increased by connecting them to the respective upper surface electrodes 3 and 4 at a portion that is appropriately separated by a distance S in the longitudinal direction.

この場合において，前記抵抗膜５のうち両接続部５ａ，５ｂ間の部分を，前記したように，直列接続の二つのつづら折りに構成することにより，その電流経路の長さを大幅に長 In this case, both the connection portion 5a of the resistor film 5, the portion between 5b, as described above, by configuring the Ri two zigzag series connected, substantially the length of the length of the current path

特に，この電流経路の長さは，抵抗膜５を前記したように，直列接続の二つのつづら折りに構成することに加えて，両端における両接続部５ａ，５ｂを細幅状に構成することにより，より長くすることができる。 In particular, the length of the current path, the resistor film 5 as described above, in addition to configuring the Ri two zigzag series connected to constitute two connection parts 5a at both ends, and 5b the slender It can be made longer.

図４は，参考例のチップ抵抗器１′を示す。 FIG. 4 shows a chip resistor 1 'of a reference example .

このチップ抵抗器１′は，前記抵抗膜５の両端における両接続部５ａ，５ｂのうち一方の接続部５ａを，絶縁基板２における両長辺側面２ａ，２ｂと直角方向に延びる両短辺側面２ｃ，２ｄのうち一方の短辺側面２ｃに隣接した部位に，他方の接続部５ｂを，他方の短辺側面２ｄに隣接した部位に各々に位置することにより，この両接続部５ａ，５ｂの相互間における距離Ｓを増大したものであり，その他の構成は，前記第１の実施の形態と同様である。   The chip resistor 1 ′ is configured such that one of the connection portions 5 a and 5 b at both ends of the resistance film 5 is connected to one of the short side surfaces extending in a direction perpendicular to the long side surfaces 2 a and 2 b of the insulating substrate 2. 2c and 2d, the other connecting portion 5b is located at a portion adjacent to the other short side surface 2d at the portion adjacent to one short side surface 2c. The distance S between them is increased, and the other configuration is the same as that of the first embodiment.

この構成によると，前記抵抗膜５における電流経路の長さを，前記図１〜図３の場合よりも更に増大できるから，前記した効果を助長できる。   According to this configuration, the length of the current path in the resistance film 5 can be further increased as compared with the case of FIGS.

前記した構成のチップ抵抗器１，１′の製造に際しては，以下に述べる方法を採用することが好ましい。   In manufacturing the chip resistors 1 and 1 'having the above-described configuration, it is preferable to employ the method described below.

この製造方法は，先ず，図５に示すように，長方形のチップ型にした絶縁基板２の上面に，帯状にした一対の上面電極３，４を，材料ペーストのスクリーン印刷及び焼成にて形成する工程と，図６に示すように，前記絶縁基板２の下面に，その両長辺側面２ａ，２ｂに沿って延びる一対の下面電極８，９を，材料ペーストのスクリーン印刷及び焼成にて形成する工程と，図７に示すように，前記絶縁基板２における上面のうち前記両上面電極３，４の間の部分に，抵抗膜５を，その両端を一体に設けた接続部５ａ，５ｂが前記両上面電極３，４に対して重なり接続するように，材料ペーストのスクリーン印刷及び焼成にて形成する工程とを備えている。   In this manufacturing method, first, as shown in FIG. 5, a pair of upper electrodes 3 and 4 in the form of strips are formed on the upper surface of a rectangular chip-shaped insulating substrate 2 by screen printing and baking of a material paste. As shown in FIG. 6, a pair of lower surface electrodes 8 and 9 extending along the long side surfaces 2a and 2b are formed on the lower surface of the insulating substrate 2 by screen printing and baking of a material paste. As shown in FIG. 7, the connecting portions 5a and 5b, in which the resistance film 5 is integrally provided at both ends of the upper surface of the insulating substrate 2 between the upper surface electrodes 3 and 4, are integrally provided. A step of forming the material paste by screen printing and baking so as to overlap and connect to the upper surface electrodes 3 and 4.

これら三つの各工程は，前記下面電極８，９を形成する工程に次いで前記上面電極を形成する工程を行い，次いで前記抵抗膜５を形成する工程を行うようにするか，或いは，前記下面電極８，９を形成する工程に次いで前記前記抵抗膜５を形成する工程を行い，次いで，前記上面電極３，４を形成する等のように，適宜入れ換えることができる。   In each of these three steps, the step of forming the upper surface electrode after the step of forming the lower surface electrodes 8, 9 is performed, and then the step of forming the resistance film 5 is performed. The step of forming the resistance film 5 can be performed after the step of forming 8, 9 and then the upper surface electrodes 3, 4 can be formed.

本発明の製造方法は，次に，前記抵抗膜５に，当該抵抗膜５における抵抗値をその両端に接続の両上面電極３，４に通電用プローブを接触して測定しながら，図８に示すように，入り込み溝５ｃ，５ｄをトリミング加工にて刻設することにより，その抵抗値が所定値になるようにトリミング調整する工程を備えている。   In the manufacturing method of the present invention, next, the resistance value of the resistance film 5 is measured on the resistance film 5 by contacting the upper surface electrodes 3 and 4 connected to both ends thereof with an energizing probe as shown in FIG. As shown in the figure, there is a step of trimming adjustment so that the resistance value becomes a predetermined value by engraving the entering grooves 5c and 5d by trimming.

本発明の製造方法は，次に，図９に示すように，前記絶縁基板２の上面に前記抵抗膜５を覆うカバーコート１０を，材料ペーストのスクリーン印刷と，その後における乾燥又は焼成にて形成する工程と，図１０に示すように，前記絶縁基板２における両長辺側面２ａ，２ｂに端子電極６，７を，材料ペーストの塗布及び焼成にて前記各上面電極３，４と前記各下面電極８，９との両方に一部が重なり接続するように形成する工程と，前記上面電極３，４，前記端子電極６，７及び前記下面電極８，９の表面にバレルメッキ処理等にて金属メッキ層を形成する工程とを備えている。   In the manufacturing method of the present invention, next, as shown in FIG. 9, a cover coat 10 covering the resistance film 5 is formed on the upper surface of the insulating substrate 2 by screen printing of a material paste and subsequent drying or baking. As shown in FIG. 10, the terminal electrodes 6 and 7 are applied to the long side surfaces 2a and 2b of the insulating substrate 2, and the upper surface electrodes 3 and 4 and the lower surface are formed by applying and baking a material paste. A process of forming a part of the electrodes 8 and 9 so as to be partially overlapped with each other, and barrel plating on the surfaces of the upper surface electrodes 3, 4, the terminal electrodes 6, 7 and the lower surface electrodes 8, 9. Forming a metal plating layer.

これらの各工程を経ることにより，前記した構成のチップ抵抗器１，１′を低コストで製造することができる。   Through these steps, the chip resistors 1 and 1 'having the above-described configuration can be manufactured at a low cost.

第１の実施の形態によるチップ抵抗器を示す平面図である。It is a top view which shows the chip resistor by 1st Embodiment. 図１のII−II視断面図である。FIG. 2 is a sectional view taken along line II-II in FIG. 1. 図１のIII −III 視断面図である。FIG. 3 is a sectional view taken along line III-III in FIG. 1. 参考例を示す平面図である。It is a top view which shows a reference example . 第１の製造工程を示す斜視図である。It is a perspective view which shows a 1st manufacturing process. 第２の製造工程を示す斜視図である。It is a perspective view which shows a 2nd manufacturing process. 第３の製造工程を示す斜視図である。It is a perspective view which shows a 3rd manufacturing process. 第４の製造工程を示す斜視図である。It is a perspective view which shows a 4th manufacturing process. 第５の製造工程を示す斜視図である。It is a perspective view which shows a 5th manufacturing process. 第６の製造工程を示す斜視図である。It is a perspective view which shows a 6th manufacturing process.

符号の説明Explanation of symbols

１，１′ チップ抵抗器
２ 絶縁基板
２ａ，２ｂ 絶縁基板の長辺側面
２ｃ，２ｄ 絶縁基板の短辺側面
３，４ 上面電極
５ 抵抗膜
５ａ，５ｂ 抵抗膜の接続部
５ｃ，５ｄ 入り込み溝
６，７ 端子電極
８，９ 下面電極
１０ カバーコート 1, 1 'Chip resistor 2 Insulating substrate 2a, 2b Insulating substrate long side surface 2c, 2d Insulating substrate short side surface 3, 4 Upper surface electrode 5 Resistive film 5a, 5b Resistive film connecting part 5c, 5d Inlet groove 6 , 7 Terminal electrode 8,9 Bottom electrode 10 Cover coat

Claims (7)

平面視で長方形にした絶縁基板と，この絶縁基板の上面に形成した抵抗膜と，前記絶縁基板の上面に形成されると共に前記抵抗膜の接続部が重なる一対の上面電極と，前記絶縁基板においてその長方形の長手方向に延びる左右両長辺側面に，前記上面電極に電気的に接続するように形成した一対の端子電極とから成るチップ抵抗器において，
前記上面電極の各々は，前記絶縁基板における上面のうち当該絶縁基板における長辺側面に隣接する部分に形成されており，この上面電極は，当該上面電極における前記抵抗膜の長辺に沿った方向の幅を前記抵抗膜の接続部における前記絶縁基板の長辺に沿った方向の幅よりも大きくした状態で前記絶縁基板の長辺側面に沿って帯状に長く延びる形態である一方，
前記抵抗膜の一端には，前記両上面電極のうち一方の上面電極への前記接続部が，前記抵抗膜の他端には，他方の上面電極への前記接続部が各々一体に設けられ，これら両接続部は，その各々における上面電極に対して，前記絶縁基板における長方形の長手方向に沿って互いに適宜距離を隔てた部位において接続されており，
前記抵抗膜のうち前記接続部の間の部分は，
前記絶縁基板の長手方向に折り返される部分と前記絶縁基板の短手方向に折り返される部分とが連続したつづら折りになっていることを特徴とするチップ抵抗器。 An insulating substrate which is rectangular in plan view, a resistive film formed on the upper surface of the insulating substrate, a pair of upper surface electrode connecting portion of the formed on the upper surface of the insulating substrate Rutotomoni the resistive film overlap, in the insulating substrate In a chip resistor comprising a pair of terminal electrodes formed so as to be electrically connected to the upper surface electrodes on the left and right long side surfaces extending in the longitudinal direction of the rectangle,
Each of the upper surface electrodes is formed on a portion of the upper surface of the insulating substrate adjacent to the long side surface of the insulating substrate , and the upper surface electrode is in a direction along the long side of the resistance film of the upper surface electrode. While the width of the resistor film is longer than the width in the direction along the long side of the insulating substrate in the connection portion of the resistance film, the strip extends long along the side of the long side of the insulating substrate ,
Wherein the one end of the resistor film, wherein the connection to one of the upper electrode, of the two upper electrode is the other end of the resistance film, the connection to the other of the upper electrode are each integrally provided, These two connecting portions are connected to the upper surface electrode in each of them at a site that is appropriately spaced along the longitudinal direction of the rectangle of the insulating substrate,
The portion of the resistive film between the connecting portions is
A chip resistor characterized in that a portion folded in the longitudinal direction of the insulating substrate and a portion folded in the short direction of the insulating substrate are continuously folded . 前記請求項１の記載において，前記抵抗膜における両接続部のうち一方の接続部は，前記絶縁基板において前記両長辺側面と直角方向の両短辺側面のうち一方の短辺側面に隣接した部位に位置され，他方の接続部は，他方の短辺側面に隣接した部位に位置されていることを特徴とするチップ抵抗器。   The connection portion according to claim 1, wherein one of the connection portions of the resistive film is adjacent to one of the short side surfaces of the short side surfaces perpendicular to the long side surfaces of the insulating substrate. A chip resistor, wherein the chip resistor is located at a part, and the other connecting portion is located at a part adjacent to the side surface of the other short side. 前記請求項１又は２の記載において，前記抵抗膜における両接続部が，細幅に形成されていることを特徴とするチップ抵抗器。   3. The chip resistor according to claim 1, wherein both connection portions of the resistance film are formed with a narrow width. 前記請求項１〜３のいずれかの記載において，前記抵抗膜におけるつづら折りの全部は，前記抵抗膜に対するトリミング加工により形成されていることを特徴とするチップ抵抗器。 In any of the foregoing description claims 1-3, wherein the Ruth Dzura folding Rino all put to the resistive film, chip resistor, characterized in that it is formed by trimming with respect to the resistive film. 前記請求項１〜３のいずれかの記載において，前記抵抗膜におけるつづら折りの一部は，前記抵抗膜に対するトリミング加工により形成されていることを特徴とするチップ抵抗器。 In any of the foregoing description claims 1-3, wherein the Ruth Dzura folding Rino part put in the resistive film, chip resistor, characterized in that it is formed by trimming with respect to the resistive film. 前記請求項１〜３のいずれかの記載において，前記絶縁基板における上面のうち当該絶縁基板における一方の長辺側面に隣接する部分には，前記両上面電極を形成しない部分が部分的に設けられていることを特徴とするチップ抵抗器。   4. The method according to claim 1, wherein a portion of the upper surface of the insulating substrate adjacent to one long side surface of the insulating substrate is partially provided with a portion not forming the upper surface electrodes. Chip resistor characterized by the above. 平面視で長方形にした絶縁基板の上面に抵抗膜を形成する工程と，前記絶縁基板の上面に前記抵抗膜の接続部が重なる一対の上面電極を形成する工程と，前記絶縁基板においてその長方形の長手方向に延びる左右両長辺側面の各々に端子電極を形成する工程とを備えて成るチップ抵抗器の製造方法において，
前記各上面電極を形成する工程が，前記絶縁基板における上面のうち当該絶縁基板における長辺側面に隣接する部分にこの長辺側面に沿って帯状に延びるようにして形成する工程であり，
前記上面電極は，当該上面電極における前記抵抗膜の長辺に沿った方向の幅を前記抵抗膜の接続部における前記絶縁基板の長辺に沿った方向の幅よりも大きくした状態に形成されており，
前記抵抗膜を形成する工程が，
当該抵抗膜の一端に前記両上面電極のうち一方の上面電極への前記接続部を，当該抵抗膜の他端に他方の上面電極への前記接続部を各々一体に設け，両接続部を，前記絶縁基板における長方形の長手方向に沿って互いに適宜距離を隔てた部位においてその各々の上面電極に接続する工程と，
前記抵抗膜をつづら折りを備えた形態にして形成する工程とを含んでおり，
前記つづら折りは，前記絶縁基板の長手方向に折り返される部分と，前記絶縁基板の短手方向に折り返される部分とが連続していることを特徴とするチップ抵抗器の製造方法。 Forming a resistive film on the upper surface of the insulating substrate which is rectangular in plan view, forming a pair of upper surface electrode connecting portions of the resistive film on the upper surface of the insulating substrate overlap, the rectangle of the said insulating substrate Forming a terminal electrode on each of the left and right long side surfaces extending in the longitudinal direction.
The step of forming each upper surface electrode is a step of forming the upper surface of the insulating substrate so as to extend in a band shape along the long side surface in a portion adjacent to the long side surface of the insulating substrate,
The upper surface electrode is formed in a state where the width of the upper surface electrode in the direction along the long side of the resistance film is larger than the width of the connection portion of the resistance film in the direction along the long side of the insulating substrate. And
Forming the resistive film comprises:
The connection to one of the upper electrode of the two upper electrode to one end of the resistance film, provided on the other end of the resistor film in each integrally the connection to the other of the upper electrode, both connections, Connecting to each of the upper surface electrodes at an appropriate distance from each other along the longitudinal direction of the rectangle in the insulating substrate;
Includes a step of forming by the resistive film Wotsu Dzura folding Rio with form,
Before tough Dzura folding rehearsal, the a portion to be folded back in the longitudinal direction of the insulating substrate, the manufacturing method of the chip resistor, characterized in that the short direction on folded Ru portion of the insulating substrate is continuous.
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