JP5089767B2 - 圧力センサパッケージ - Google Patents
圧力センサパッケージ Download PDFInfo
- Publication number
- JP5089767B2 JP5089767B2 JP2010505537A JP2010505537A JP5089767B2 JP 5089767 B2 JP5089767 B2 JP 5089767B2 JP 2010505537 A JP2010505537 A JP 2010505537A JP 2010505537 A JP2010505537 A JP 2010505537A JP 5089767 B2 JP5089767 B2 JP 5089767B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- pressure
- chip
- pressure sensor
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Description
10 ケーシング
10a 受圧端面
10b 円環状突起
11 凹面
12 受圧導入凹部
13 チップ収納凹部
14 リードフレーム
14a 内端部
14b 外端部
15 導通ワイヤ
20 圧力センサチップ
30 封止樹脂
31 Oリング受面
Claims (2)
- 合成樹脂製のケーシング、
このケーシングの受圧端面に、深さ方向に順に形成した、液圧導入凹部と、圧力センサチップを収納するチップ収納凹部、
上記ケーシングにインサート成形され、内端部が上記液圧導入凹部から露見した状態で上記チップ収納凹部の周辺部に臨み、外端部がケーシング外部に臨むリードフレーム、
上記チップ収納凹部に収納された圧力センサチップと上記リードフレームの内端部とを導通させる導通ワイヤ、及び
上記チップ収納凹部に充填され、圧力センサチップ及び導通ワイヤを封止する封止樹脂、
を有する防水圧力センサパッケージにおいて、
上記チップ収納凹部及び上記液圧導入凹部は平面略矩形をなしていること、
上記液圧導入凹部は、このチップ収納凹部の対角線を一辺とする大きさの、上記チップ収納凹部とは位相を異ならせた平面略矩形をなしていること、
上記チップ収納凹部の周辺部に臨ませたリードフレームの上記内端部が上記液圧導入凹部のコーナー部に露出していること、及び
ケーシングの上記受圧端面に、平面円形で中心部が最も深い滑らかな回転対称凹面を形成し、この回転対称凹面に上記液圧導入凹部を形成したこと、
を特徴とする圧力センサパッケージ。 - 請求項1に記載の圧力センサパッケージにおいて、リードフレームの上記外端部はケーシングの上記受圧端面の反対側の信号取出端面に露出している圧力センサパッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010505537A JP5089767B2 (ja) | 2008-03-24 | 2009-03-13 | 圧力センサパッケージ |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008075422 | 2008-03-24 | ||
JP2008075422 | 2008-03-24 | ||
PCT/JP2009/054934 WO2009119349A1 (ja) | 2008-03-24 | 2009-03-13 | 圧力センサパッケージ |
JP2010505537A JP5089767B2 (ja) | 2008-03-24 | 2009-03-13 | 圧力センサパッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009119349A1 JPWO2009119349A1 (ja) | 2011-07-21 |
JP5089767B2 true JP5089767B2 (ja) | 2012-12-05 |
Family
ID=41113547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010505537A Active JP5089767B2 (ja) | 2008-03-24 | 2009-03-13 | 圧力センサパッケージ |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5089767B2 (ja) |
WO (1) | WO2009119349A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015121560A (ja) * | 2009-11-19 | 2015-07-02 | 大日本印刷株式会社 | センサデバイス及びその製造方法 |
US9476898B2 (en) | 2009-11-19 | 2016-10-25 | Dai Nippon Printing Co., Ltd. | Sensor device and manufacturing method thereof |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6297392B2 (ja) * | 2014-04-08 | 2018-03-20 | アルプス電気株式会社 | 圧力検出装置 |
JP6255517B2 (ja) * | 2014-12-24 | 2017-12-27 | 株式会社フジクラ | 圧力センサおよび圧力センサモジュール |
CN109855789B (zh) * | 2019-01-10 | 2021-12-24 | 北京机械设备研究所 | 一种用于监测水下小型航行器表面压力的传感器 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6273132A (ja) * | 1985-09-27 | 1987-04-03 | Citizen Watch Co Ltd | 圧力センサユニツト |
JPH033212U (ja) * | 1989-05-29 | 1991-01-14 | ||
JPH11160176A (ja) * | 1997-11-28 | 1999-06-18 | Yamatake Corp | 圧力検出装置 |
JP2001272296A (ja) * | 2000-03-23 | 2001-10-05 | Denso Corp | 圧力センサ |
JP2005308666A (ja) * | 2004-04-26 | 2005-11-04 | Hitachi Ltd | 圧力検出装置の検出部構造 |
JP2007192790A (ja) * | 2005-12-22 | 2007-08-02 | Citizen Miyota Co Ltd | 半導体圧力センサ |
JP2007285750A (ja) * | 2006-04-13 | 2007-11-01 | Denso Corp | 圧力センサ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3003212U (ja) * | 1994-01-28 | 1994-10-18 | 日本精機株式会社 | 圧力検出器 |
-
2009
- 2009-03-13 JP JP2010505537A patent/JP5089767B2/ja active Active
- 2009-03-13 WO PCT/JP2009/054934 patent/WO2009119349A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6273132A (ja) * | 1985-09-27 | 1987-04-03 | Citizen Watch Co Ltd | 圧力センサユニツト |
JPH033212U (ja) * | 1989-05-29 | 1991-01-14 | ||
JPH11160176A (ja) * | 1997-11-28 | 1999-06-18 | Yamatake Corp | 圧力検出装置 |
JP2001272296A (ja) * | 2000-03-23 | 2001-10-05 | Denso Corp | 圧力センサ |
JP2005308666A (ja) * | 2004-04-26 | 2005-11-04 | Hitachi Ltd | 圧力検出装置の検出部構造 |
JP2007192790A (ja) * | 2005-12-22 | 2007-08-02 | Citizen Miyota Co Ltd | 半導体圧力センサ |
JP2007285750A (ja) * | 2006-04-13 | 2007-11-01 | Denso Corp | 圧力センサ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015121560A (ja) * | 2009-11-19 | 2015-07-02 | 大日本印刷株式会社 | センサデバイス及びその製造方法 |
US9476898B2 (en) | 2009-11-19 | 2016-10-25 | Dai Nippon Printing Co., Ltd. | Sensor device and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009119349A1 (ja) | 2011-07-21 |
WO2009119349A1 (ja) | 2009-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5089767B2 (ja) | 圧力センサパッケージ | |
US7412895B2 (en) | Semiconductor pressure sensor and die for molding a semiconductor pressure sensor | |
CN104246465B (zh) | 压力检测装置及其生产方法 | |
KR100697404B1 (ko) | 물리량 검출 장치 및 물리량 검출 수단 저장 케이스 | |
US11402274B2 (en) | Temperature sensor device | |
CN104395722A (zh) | 压力检测装置 | |
KR20050076590A (ko) | 케이스 내에 포함된 압력 센서 | |
US8307714B1 (en) | Dual port pressure sensor | |
US9021689B2 (en) | Method of making a dual port pressure sensor | |
JP5472211B2 (ja) | 磁気式検出装置 | |
JP2007139517A (ja) | 圧力センサの製造方法並びに圧力センサ及び圧力センサの実装方法 | |
JP5039208B2 (ja) | 圧力センサパッケージ及びその製造方法 | |
JP2014206514A (ja) | 圧力センサ | |
JP6373104B2 (ja) | 半導体圧力センサ及び半導体圧力センサ取付構造体 | |
JP2008286627A (ja) | 圧力センサ | |
US7768124B2 (en) | Semiconductor sensor having a flat mounting plate with banks | |
JP2014081271A (ja) | 圧力センサ | |
JP5720419B2 (ja) | 差圧・圧力測定装置 | |
JP4717088B2 (ja) | 半導体圧力センサ装置の製造方法 | |
JP2017142169A (ja) | 圧力センサ及びその製造方法 | |
WO2017098797A1 (ja) | 圧力センサ | |
JP2009192447A (ja) | 圧力センサ | |
JP7286090B2 (ja) | トルクセンサ用ホールic基板の固定構造 | |
KR20160147503A (ko) | 압력센서장치 및 그 제조방법 | |
JP6549467B2 (ja) | 保護ケース、振動センサおよびその製造方法、ならびに脈拍測定装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120313 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120424 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120904 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120911 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150921 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5089767 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |