JP5073230B2 - 支持ピン - Google Patents
支持ピン Download PDFInfo
- Publication number
- JP5073230B2 JP5073230B2 JP2006169535A JP2006169535A JP5073230B2 JP 5073230 B2 JP5073230 B2 JP 5073230B2 JP 2006169535 A JP2006169535 A JP 2006169535A JP 2006169535 A JP2006169535 A JP 2006169535A JP 5073230 B2 JP5073230 B2 JP 5073230B2
- Authority
- JP
- Japan
- Prior art keywords
- support pin
- upper support
- hot plate
- hole
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003028 elevating effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 17
- 239000011521 glass Substances 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
また、上部支持ピンと下部支持ピンとをユニバーサルジョイントで連結してもよい。
上部支持ピン12aが摺動自在に挿通され、さらに上部支持ピン12aの上部にはガイド14の上端に係止して下方へ落下するのを防止する係止部15が形成されている。
とに分割し、それぞれを独立させているため、下部支持ピン12bが下降した位置にある場合でも上部支持ピン12aの上端が貫通孔11から突出したまま残ってしまうことも考えられるが、スプリング19を介装することで、それを防止できる。
Claims (2)
- 載置台に形成した貫通孔に対して出没可能とされた支持ピンにおいて、この支持ピンは互いに独立した上部支持ピンと下部支持ピンに分割され、前記上部支持ピンは載置台の貫通孔に保持され、前記上部支持ピンの下部と前記下部支持ピンの上部は筒体内に収められ、前記下部支持ピンは昇降機構に取り付けられ、更に前記上部支持ピンの下端には受け部材が設けられ、前記下部支持ピンの上端には前記上部支持ピンの下端を吸着するマグネットが設けられた支持ピンであって、
前記上部支持ピンは前記筒体内のブッシュを通って摺動し、前記受け部材は前記筒体内を摺動し、前記下部支持ピンは前記筒体内の空間を昇降することを特徴とする支持ピン。 - 請求項1に記載の支持ピンにおいて、前記上部支持ピンの下端に設けられる受け部材は下部支持ピンよりも大径であることを特徴とする支持ピン。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006169535A JP5073230B2 (ja) | 2006-06-20 | 2006-06-20 | 支持ピン |
TW096117381A TW200807607A (en) | 2006-06-20 | 2007-05-16 | Supporting pin |
CN2007101086940A CN101093815B (zh) | 2006-06-20 | 2007-06-18 | 支承销 |
KR1020070059327A KR100892554B1 (ko) | 2006-06-20 | 2007-06-18 | 지지핀 |
US11/820,715 US7975997B2 (en) | 2006-06-20 | 2007-06-20 | Supporting pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006169535A JP5073230B2 (ja) | 2006-06-20 | 2006-06-20 | 支持ピン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008004575A JP2008004575A (ja) | 2008-01-10 |
JP5073230B2 true JP5073230B2 (ja) | 2012-11-14 |
Family
ID=38991956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006169535A Expired - Fee Related JP5073230B2 (ja) | 2006-06-20 | 2006-06-20 | 支持ピン |
Country Status (5)
Country | Link |
---|---|
US (1) | US7975997B2 (ja) |
JP (1) | JP5073230B2 (ja) |
KR (1) | KR100892554B1 (ja) |
CN (1) | CN101093815B (ja) |
TW (1) | TW200807607A (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101539681B1 (ko) * | 2008-12-11 | 2015-07-27 | 엘아이지인베니아 주식회사 | 기판지지장치 및 기판지지장치 어셈블리 |
JP2012151407A (ja) * | 2011-01-21 | 2012-08-09 | Ushio Inc | ワークステージおよびこのワークステージを使った露光装置 |
FR2988401B1 (fr) * | 2012-03-23 | 2014-04-25 | Snecma Propulsion Solide | Outillage de maintien pour traitement thermique de pieces metalliques |
US20130287529A1 (en) * | 2012-04-27 | 2013-10-31 | Applied Materials, Inc. | Method and apparatus for independent wafer handling |
TWI729101B (zh) | 2016-04-02 | 2021-06-01 | 美商應用材料股份有限公司 | 用於旋轉料架基座中的晶圓旋轉的設備及方法 |
DE102016212780A1 (de) | 2016-07-13 | 2018-01-18 | Siltronic Ag | Vorrichtung zur Handhabung einer Halbleiterscheibe in einem Epitaxie-Reaktor und Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht |
KR102030471B1 (ko) * | 2017-07-25 | 2019-10-14 | 세메스 주식회사 | 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛 |
US10953503B2 (en) * | 2018-10-05 | 2021-03-23 | Compagnie Plastic Omnium | Vehicle body part rack with lateral supports able to rotate the vehicle body part |
JP2021097162A (ja) * | 2019-12-18 | 2021-06-24 | 東京エレクトロン株式会社 | 基板処理装置及び載置台 |
CN115176338A (zh) * | 2020-02-28 | 2022-10-11 | 玛特森技术公司 | 用于热处理***的支撑结构 |
TW202221833A (zh) * | 2020-10-19 | 2022-06-01 | 日商東京威力科創股份有限公司 | 載置台及基板處理裝置 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2439854A (en) * | 1946-04-25 | 1948-04-20 | Daniel J Lipski | Jack stand |
US2906490A (en) * | 1956-04-09 | 1959-09-29 | Inland Steel Products Company | Telescopic jack post |
JP3249765B2 (ja) * | 1997-05-07 | 2002-01-21 | 東京エレクトロン株式会社 | 基板処理装置 |
DE2823765A1 (de) * | 1977-06-14 | 1979-01-04 | Cotron Electronics Ltd | Vorrichtung zum abschneiden von leitungen |
US4200272A (en) * | 1978-06-12 | 1980-04-29 | Bcira | Holder for irregularly shaped articles |
JPS5954237A (ja) * | 1982-09-22 | 1984-03-29 | Hitachi Ltd | 基板ホルダ |
US6093364A (en) * | 1989-03-08 | 2000-07-25 | Fortex, Inc. | Method for producing a biaxially oriented open-ended container |
IT1258561B (it) * | 1992-03-18 | 1996-02-27 | Sapim Amada Spa | Dispositivo di supporto per lastre in fase di punzonatura e operazionidi deformazione plastica in genere |
US5501762A (en) * | 1994-06-07 | 1996-03-26 | Marquip, Inc. | Hot plate for corrugated paperboard double facer |
JP3028462B2 (ja) * | 1995-05-12 | 2000-04-04 | 東京エレクトロン株式会社 | 熱処理装置 |
US5766409A (en) * | 1996-07-17 | 1998-06-16 | Marquip, Inc. | Apparatus for leveling and supporting the hot plates in a double backer for corrugated paperboard |
US6250619B1 (en) * | 1998-02-03 | 2001-06-26 | Cna Manufacturing Systems, Inc. | Clamp suitable for use at high temperatures in a flexible tooling apparatus |
GB9808998D0 (en) * | 1998-04-28 | 1998-06-24 | Imi Norgren Ltd | Supporting apparatus |
JP3149398B2 (ja) * | 1998-06-16 | 2001-03-26 | 株式会社アドバンスト・ディスプレイ | 液晶パネル製造装置および方法 |
JP2000012655A (ja) | 1998-06-17 | 2000-01-14 | Tokyo Electron Ltd | 基板の保持装置 |
US6029966A (en) * | 1998-10-13 | 2000-02-29 | Hertz; Allen D. | Flexible, self conforming, workpiece support system |
KR100493011B1 (ko) * | 1998-10-13 | 2005-08-01 | 삼성전자주식회사 | 디스크 사이트에 결합되어 있는 슬라이드 핀을 갖춘 웨이퍼 핸들러 시스템 |
US6775904B1 (en) * | 1999-07-16 | 2004-08-17 | Siemens Aktiengesellschaft | Supporting pin for supporting substrates in automatic equipment units |
US6550988B2 (en) * | 2000-10-30 | 2003-04-22 | Dainippon Screen Mfg., Co., Ltd. | Substrate processing apparatus |
US6497403B2 (en) * | 2000-12-28 | 2002-12-24 | Memc Electronic Materials, Inc. | Semiconductor wafer holder |
JP2002231708A (ja) * | 2001-01-30 | 2002-08-16 | Tokyo Electron Ltd | 塗布膜処理装置および塗布膜処理方法 |
US20050000450A1 (en) * | 2001-10-16 | 2005-01-06 | Iizuka Hachishiro | Treatment subject elevating mechanism, and treating device using the same |
JP2003197721A (ja) * | 2001-12-26 | 2003-07-11 | Ulvac Japan Ltd | 基板支持用昇降ピン及びこれを用いた多室型成膜装置 |
JP2003218003A (ja) | 2002-01-21 | 2003-07-31 | Toray Ind Inc | 基板加熱装置 |
KR20040055254A (ko) * | 2002-12-20 | 2004-06-26 | 엘지.필립스 엘시디 주식회사 | 박막증착에 사용되는 반응챔버 |
JP3989384B2 (ja) * | 2003-02-07 | 2007-10-10 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP4354243B2 (ja) * | 2003-04-21 | 2009-10-28 | 東京エレクトロン株式会社 | 被処理体の昇降機構及び処理装置 |
US6953188B2 (en) * | 2003-08-08 | 2005-10-11 | Rain Mountain Llc | Flexible jaw universal vise |
FR2865953B1 (fr) * | 2004-02-10 | 2006-08-04 | Airbus France | Procede et dispositif de prehension et maintien localise d'un panneau mince, flexible, en particulier de forme complexe |
US8365682B2 (en) * | 2004-06-01 | 2013-02-05 | Applied Materials, Inc. | Methods and apparatus for supporting substrates |
US20050269757A1 (en) * | 2004-06-04 | 2005-12-08 | Robin Stevenson | Reconfigurable clamp for a flexible manufacturing system |
-
2006
- 2006-06-20 JP JP2006169535A patent/JP5073230B2/ja not_active Expired - Fee Related
-
2007
- 2007-05-16 TW TW096117381A patent/TW200807607A/zh not_active IP Right Cessation
- 2007-06-18 CN CN2007101086940A patent/CN101093815B/zh not_active Expired - Fee Related
- 2007-06-18 KR KR1020070059327A patent/KR100892554B1/ko not_active IP Right Cessation
- 2007-06-20 US US11/820,715 patent/US7975997B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI332245B (ja) | 2010-10-21 |
JP2008004575A (ja) | 2008-01-10 |
US7975997B2 (en) | 2011-07-12 |
CN101093815B (zh) | 2010-04-21 |
US20080124207A1 (en) | 2008-05-29 |
CN101093815A (zh) | 2007-12-26 |
KR100892554B1 (ko) | 2009-04-09 |
TW200807607A (en) | 2008-02-01 |
KR20070120890A (ko) | 2007-12-26 |
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