JP5071558B2 - 回路モジュール - Google Patents
回路モジュール Download PDFInfo
- Publication number
- JP5071558B2 JP5071558B2 JP2010542078A JP2010542078A JP5071558B2 JP 5071558 B2 JP5071558 B2 JP 5071558B2 JP 2010542078 A JP2010542078 A JP 2010542078A JP 2010542078 A JP2010542078 A JP 2010542078A JP 5071558 B2 JP5071558 B2 JP 5071558B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- circuit board
- electronic component
- generating electronic
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
該放熱部材の前記回路基板との対向面は凹凸の面と成していて、前記放熱部材の前記対向面における凸部の先端面が前記電子部品間の前記回路基板面に直接または放熱媒介部材を介して接触し、かつ、前記対向面における凹部の壁面が直接または放熱媒介部材を介して前記凹部内に収まる前記発熱電子部品に面接触することにより、該発熱電子部品の熱および該発熱電子部品の熱により温められる前記回路基板の熱を前記放熱部材を介して外部に放熱する構成と成し、該放熱部材で覆われる前記回路基板面にはレジスト膜が形成されており、前記放熱部材の前記凸部が対向する位置に前記レジスト膜の無いレジスト欠落部が設けられており、前記放熱部材の前記凸部は前記レジスト欠落部の回路基板面に接触している構成をもって課題を解決する手段としている。
2 非発熱電子部品
3 放熱部材
4 回路基板
5 凸部
6 凹部
7 放熱シート
8 孔部
11 凹部内凸部
Claims (3)
- 回路基板の片面または両面に、電気回路を構成する一つ以上の発熱電子部品を含む複数の電子部品が互いに間隔を介して配置されており、前記回路基板面の少なくとも前記発熱電子部品と該発熱電子部品以外の電子部品とを含む複数の電子部品の配置領域周辺を含む領域を、その片面側または両面側から覆う放熱部材が設けられ、
該放熱部材の前記回路基板との対向面は凹凸の面と成していて、前記放熱部材の前記対向面における凸部の先端面が前記電子部品間の前記回路基板面に直接または放熱媒介部材を介して接触し、かつ、前記対向面における凹部の壁面が直接または放熱媒介部材を介して前記凹部内に収まる前記発熱電子部品に面接触することにより、該発熱電子部品の熱および該発熱電子部品の熱により温められる前記回路基板の熱を前記放熱部材を介して外部に放熱する構成と成し、該放熱部材で覆われる前記回路基板面にはレジスト膜が形成されており、前記放熱部材の前記凸部が対向する位置に前記レジスト膜の無いレジスト欠落部が設けられており、前記放熱部材の前記凸部は前記レジスト欠落部の回路基板面に接触していることを特徴とする回路モジュール。 - 放熱部材は、少なくとも発熱電子部品が配置される回路基板面の裏面側の回路基板面における前記発熱電子部品が配置される領域に対応する領域を覆い、該回路基板面に直接または放熱媒介部材を介して接触していることを特徴とする請求項1記載の回路モジュール。
- 回路基板には、発熱電子部品が設けられている部位に貫通の孔部が形成されており、
放熱部材は少なくとも発熱電子部品配置領域の裏面側の回路基板面を覆い、前記放熱部材の凸部が前記孔部を通して前記発熱電子部品に直接または放熱媒介部材を介し接触していることを特徴とする請求項1記載の回路モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010542078A JP5071558B2 (ja) | 2008-12-12 | 2009-11-30 | 回路モジュール |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008317102 | 2008-12-12 | ||
JP2008317102 | 2008-12-12 | ||
JP2010542078A JP5071558B2 (ja) | 2008-12-12 | 2009-11-30 | 回路モジュール |
PCT/JP2009/070116 WO2010067725A1 (ja) | 2008-12-12 | 2009-11-30 | 回路モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010067725A1 JPWO2010067725A1 (ja) | 2012-05-17 |
JP5071558B2 true JP5071558B2 (ja) | 2012-11-14 |
Family
ID=42242714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010542078A Expired - Fee Related JP5071558B2 (ja) | 2008-12-12 | 2009-11-30 | 回路モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110235278A1 (ja) |
EP (1) | EP2361005A4 (ja) |
JP (1) | JP5071558B2 (ja) |
CN (1) | CN102246616A (ja) |
WO (1) | WO2010067725A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11540424B2 (en) | 2018-09-14 | 2022-12-27 | Mitsubishi Electric Corporation | Electric power converter |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140118954A1 (en) * | 2011-06-28 | 2014-05-01 | Telefonaktiebolaget L M Ericsson (Publ) | Electronic device with heat-dissipating structure |
JP5733260B2 (ja) * | 2012-04-09 | 2015-06-10 | 株式会社村田製作所 | 電源モジュール |
JP2014063930A (ja) | 2012-09-21 | 2014-04-10 | Hitachi Automotive Systems Ltd | 電子制御装置 |
US9627741B2 (en) | 2013-06-04 | 2017-04-18 | Panasonic Intellectual Property Management Co., Ltd. | Wireless module and wireless device |
WO2014206460A1 (en) * | 2013-06-26 | 2014-12-31 | Telefonaktiebolaget L M Ericsson (Publ) | Switched mode power supply module and method of manufacturing the same |
JP2015080059A (ja) * | 2013-10-16 | 2015-04-23 | 株式会社リコー | 熱伝導部品、熱伝導構造体、電子部品モジュール、電子機器 |
JP6402512B2 (ja) * | 2014-07-02 | 2018-10-10 | セイコーエプソン株式会社 | 電気光学モジュールおよび電子機器 |
KR20160090144A (ko) * | 2015-01-21 | 2016-07-29 | 주식회사 아모그린텍 | 방열 시트 일체형 안테나 모듈 |
JP2016171101A (ja) * | 2015-03-11 | 2016-09-23 | Amテクノワークス株式会社 | 放熱基板の製造方法および放熱基板 |
JPWO2016163135A1 (ja) * | 2015-04-08 | 2017-04-27 | 三菱電機株式会社 | 電子モジュール及び電子装置 |
KR101609642B1 (ko) * | 2015-07-10 | 2016-04-08 | 주식회사 아모그린텍 | Nfc 안테나 일체형 방열시트 및 이를 구비하는 휴대단말기 |
JP6419125B2 (ja) * | 2016-10-05 | 2018-11-07 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
CN106507651B (zh) * | 2016-12-30 | 2019-11-29 | 韩端科技(深圳)有限公司 | 电子设备 |
JP2018142055A (ja) * | 2017-02-27 | 2018-09-13 | Necプラットフォームズ株式会社 | ヒートシンク、回路基板、及び無線通信装置 |
US10638643B2 (en) * | 2017-11-14 | 2020-04-28 | Canon Kabushiki Kaisha | Electronic device |
JP7127498B2 (ja) * | 2018-11-09 | 2022-08-30 | 住友電装株式会社 | 放熱部材及び電気接続箱 |
JP7172471B2 (ja) * | 2018-11-09 | 2022-11-16 | 住友電装株式会社 | 基板構造体 |
WO2020202939A1 (ja) * | 2019-03-29 | 2020-10-08 | デクセリアルズ株式会社 | 5g通信用アンテナアレイ、アンテナ構造、ノイズ抑制熱伝導シート及び熱伝導シート |
JP2020167667A (ja) * | 2019-03-29 | 2020-10-08 | デクセリアルズ株式会社 | 5g通信用アンテナアレイ、アンテナ構造、ノイズ抑制熱伝導シート及び熱伝導シート |
JP7154428B2 (ja) * | 2019-09-09 | 2022-10-17 | 三菱電機株式会社 | 電力変換装置および電力変換装置の製造方法 |
WO2021080016A1 (ja) * | 2019-10-25 | 2021-04-29 | 株式会社デンソー | 半導体モジュールを含む電子装置 |
AU2022253413A1 (en) * | 2021-04-06 | 2023-09-21 | Samsung Electronics Co., Ltd. | Electronic device including heat dissipation structure |
GB2611028A (en) * | 2021-09-17 | 2023-03-29 | Aptiv Tech Ltd | A method of fitting a cooling device to a circuit board and a circuit board cooling device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273554A (ja) * | 2002-03-15 | 2003-09-26 | Bosch Automotive Systems Corp | 電子ユニット |
JP2005129820A (ja) * | 2003-10-27 | 2005-05-19 | Mitsubishi Electric Corp | 電子回路装置 |
JP2006294754A (ja) * | 2005-04-07 | 2006-10-26 | Denso Corp | 電子装置の放熱構造 |
JP2008198860A (ja) * | 2007-02-14 | 2008-08-28 | Nec Corp | 小型携帯端末機器の冷却手段 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109318A (en) * | 1990-05-07 | 1992-04-28 | International Business Machines Corporation | Pluggable electronic circuit package assembly with snap together heat sink housing |
FR2730894B3 (fr) * | 1995-02-21 | 1997-03-14 | Thomson Csf | Procede de fabrication d'une carte electronique a refroidissement par conduction thermique |
FR2766967A1 (fr) * | 1997-07-31 | 1999-02-05 | Scps | Dispositif de dissipation thermique et/ou protection electromagnetique pour cartes et composants electroniques |
JP2928236B1 (ja) * | 1998-07-23 | 1999-08-03 | 米沢日本電気株式会社 | 発熱素子の放熱部材 |
TW484344B (en) * | 1998-10-26 | 2002-04-21 | Taiyo Yuden Kk | Hybrid module |
JP2001257489A (ja) | 2000-03-13 | 2001-09-21 | Sony Corp | 放熱構造及び放熱方法並びにこの放熱構造を備える電子機器 |
US6665184B2 (en) * | 2001-07-13 | 2003-12-16 | Lytron, Inc. | Tapered cold plate |
US7023699B2 (en) * | 2002-06-10 | 2006-04-04 | Visteon Global Technologies, Inc. | Liquid cooled metal thermal stack for high-power dies |
TWI251916B (en) * | 2003-08-28 | 2006-03-21 | Phoenix Prec Technology Corp | Semiconductor assembled heat sink structure for embedding electronic components |
JP4684730B2 (ja) * | 2004-04-30 | 2011-05-18 | シャープ株式会社 | 高周波半導体装置、送信装置および受信装置 |
US20060002092A1 (en) * | 2004-07-02 | 2006-01-05 | Tyco Electronics Power Systems, Inc., A Nevada Corporation | Board mounted heat sink using edge plating |
JP4473141B2 (ja) * | 2005-01-04 | 2010-06-02 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
US7310233B2 (en) * | 2005-01-28 | 2007-12-18 | Tyco Electronics Power Systems | Apparatus and method for transferring heat from an electrical module |
JP4789997B2 (ja) * | 2008-11-20 | 2011-10-12 | 三菱電機株式会社 | 電子基板装置 |
-
2009
- 2009-11-30 EP EP09831829.8A patent/EP2361005A4/en not_active Withdrawn
- 2009-11-30 CN CN2009801497273A patent/CN102246616A/zh active Pending
- 2009-11-30 WO PCT/JP2009/070116 patent/WO2010067725A1/ja active Application Filing
- 2009-11-30 JP JP2010542078A patent/JP5071558B2/ja not_active Expired - Fee Related
-
2011
- 2011-06-09 US US13/156,493 patent/US20110235278A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273554A (ja) * | 2002-03-15 | 2003-09-26 | Bosch Automotive Systems Corp | 電子ユニット |
JP2005129820A (ja) * | 2003-10-27 | 2005-05-19 | Mitsubishi Electric Corp | 電子回路装置 |
JP2006294754A (ja) * | 2005-04-07 | 2006-10-26 | Denso Corp | 電子装置の放熱構造 |
JP2008198860A (ja) * | 2007-02-14 | 2008-08-28 | Nec Corp | 小型携帯端末機器の冷却手段 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11540424B2 (en) | 2018-09-14 | 2022-12-27 | Mitsubishi Electric Corporation | Electric power converter |
Also Published As
Publication number | Publication date |
---|---|
WO2010067725A1 (ja) | 2010-06-17 |
CN102246616A (zh) | 2011-11-16 |
EP2361005A4 (en) | 2014-06-18 |
JPWO2010067725A1 (ja) | 2012-05-17 |
US20110235278A1 (en) | 2011-09-29 |
EP2361005A1 (en) | 2011-08-24 |
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