JP5052295B2 - シリコンエッチングによるサーマルインクジェットプリントヘッドの処理加工 - Google Patents
シリコンエッチングによるサーマルインクジェットプリントヘッドの処理加工 Download PDFInfo
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- JP5052295B2 JP5052295B2 JP2007290373A JP2007290373A JP5052295B2 JP 5052295 B2 JP5052295 B2 JP 5052295B2 JP 2007290373 A JP2007290373 A JP 2007290373A JP 2007290373 A JP2007290373 A JP 2007290373A JP 5052295 B2 JP5052295 B2 JP 5052295B2
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- 238000005530 etching Methods 0.000 title claims description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title description 37
- 229910052710 silicon Inorganic materials 0.000 title description 37
- 239000010703 silicon Substances 0.000 title description 37
- 238000012545 processing Methods 0.000 title description 9
- 239000000758 substrate Substances 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 38
- 238000002161 passivation Methods 0.000 claims description 38
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 230000000873 masking effect Effects 0.000 claims description 8
- 239000005368 silicate glass Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 135
- 239000002184 metal Substances 0.000 description 29
- 229910052751 metal Inorganic materials 0.000 description 29
- 230000008569 process Effects 0.000 description 27
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 17
- 229920005591 polysilicon Polymers 0.000 description 17
- 239000004020 conductor Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910016570 AlCu Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910004490 TaAl Inorganic materials 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002304 perfume Substances 0.000 description 1
- 239000000575 pesticide Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002685 pulmonary effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Weting (AREA)
Description
図1は、シリコン基板30の表面34を示す。基板の表面上で、酸化シリコン40の薄膜(約1000Å)が成長する。液滴発生器の構成要素に関して、この層40は、最終的にトランジスタ18(図8)のゲート誘電体層を画定することから、以下、ゲート酸化物層又は「GOX」層40として識別される。
12 カートリッジ
14 インクチャンバ
16 熱変換器
18 トランジスタ
30 基板
32 トレンチ
34 基板表面
36 スリット
40 GOX層
42 ポリシリコン層
44 PSG層
50 境界
54 パッシベーション層
56、58 金属層
I インク流
Claims (6)
- トランジスタ(18)と当該トランジスタ(18)に接続された熱変換器(16)とを有する液滴発生器を担持する基板(30)の表面(34)の部分に制御されたエッチングをするために該表面をマスキングする方法であって、
境界内でエッチングのために前記表面の部分が曝されるように、該基板表面に、該表面の部分の境界(150)を画定する端部を有するパターンで酸化物層(40)を提供し、
前記酸化物層(40)の一部をパターン化し、前記基板(30)に担持される前記トランジスタ(18)のゲートを画定し、
前記端部に近接する前記酸化物層(40)をパッシベーション材料(154)で被覆し、当該パッシベーション材料(154)が、前記熱変換器(16)も保護のために被覆し、
前記パッシベーション材料(154)および前記酸化物層(40)が、前記エッチングのマスクとして機能する、方法。 - 前記基板(30)の前記表面の部分を、該表面の部分のエッチングの前に除去されるリンシリケートガラス層(144)で一時的に被覆することを含む、請求項1記載の方法。
- トランジスタ(18)と当該トランジスタ(18)に接続された熱変換器(16)とを有する液滴発生器を担持する基板(230)の表面(234)の部分に制御されたエッチングをするために該表面をマスキングする方法であって、
境界内でエッチングのために前記表面の部分が曝されるように、該基板表面に、該表面の部分の境界(250)を画定する端部を有するパターンで酸化物層(240)を提供し、
前記酸化物層(240)の一部をパターン化し、前記基板(230)に担持される前記トランジスタ(18)のゲートを画定し、
前記酸化物層(240)の前記端部をパッシベーション材料(254)で被覆し、当該パッシベーション材料(154)が、前記熱変換器(16)も保護のために被覆し、
前記パッシベーション材料(254)および前記酸化物層(240)が、前記エッチングのマスクとして機能する、方法。 - 基板(30、230)と、該基板を横切ってインクが移動するトレンチ(132、232)と、当該基板(30、230)によって担持され且つ該基板(30、230)からインク液滴(22)を噴出する液滴発生器とを含み、前記液滴発生器が、トランジスタ(18)と当該トランジスタ(18)に接続された熱変換器(16)とを有する、多層のサーマルインクジェットプリントヘッド(10)を製造する方法であって、
前記基板(30、230)上に、前記トランジスタ(18)のゲートと、エッチングのための前記トレンチを画定するマスクとの両方として供される酸化物層(40、240)を設けること、及び
前記トレンチをエッチングすること、
を含む、方法。 - 前記トレンチ(132)の境界(150)を画定する端部に近接する前記酸化物層(40)をパッシベーション材料(154)で被覆することを含み、前記パッシベーション材料(154)が前記液滴発生器の熱変換器(16)も被覆して保護し、前記パッシベーション材料(154)及び前記酸化物層(40)が、前記マスクとして機能する、請求項4記載の方法。
- 前記トレンチ(232)の境界(250)を画定する、前記酸化物層(240)の前記端部をパッシベーション材料(254)で被覆することを含み、前記パッシベーション材料(254)が前記液滴発生器の熱変換器(16)も被覆して保護し、前記パッシベーション材料(254)及び前記酸化物層(240)が、前記マスクとして機能する、請求項4記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/932,055 US7160806B2 (en) | 2001-08-16 | 2001-08-16 | Thermal inkjet printhead processing with silicon etching |
US09/932055 | 2001-08-16 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002237607A Division JP4141200B2 (ja) | 2001-08-16 | 2002-08-16 | 液滴発生器層を有する基板のエッチング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008066746A JP2008066746A (ja) | 2008-03-21 |
JP5052295B2 true JP5052295B2 (ja) | 2012-10-17 |
Family
ID=25461700
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002237607A Expired - Fee Related JP4141200B2 (ja) | 2001-08-16 | 2002-08-16 | 液滴発生器層を有する基板のエッチング方法 |
JP2007290373A Expired - Fee Related JP5052295B2 (ja) | 2001-08-16 | 2007-11-08 | シリコンエッチングによるサーマルインクジェットプリントヘッドの処理加工 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002237607A Expired - Fee Related JP4141200B2 (ja) | 2001-08-16 | 2002-08-16 | 液滴発生器層を有する基板のエッチング方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7160806B2 (ja) |
EP (2) | EP1284189B1 (ja) |
JP (2) | JP4141200B2 (ja) |
DE (2) | DE60229597D1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003224269A (ja) * | 2001-10-26 | 2003-08-08 | Hewlett Packard Co <Hp> | 集積回路を製造するための装置および方法 |
US6885083B2 (en) * | 2002-10-31 | 2005-04-26 | Hewlett-Packard Development Company, L.P. | Drop generator die processing |
US6881606B2 (en) * | 2003-03-18 | 2005-04-19 | Micron Technology, Inc. | Method for forming a protective layer for use in packaging a semiconductor die |
US9259932B2 (en) * | 2011-05-27 | 2016-02-16 | Hewlett-Packard Development Company, L.P. | Assembly to selectively etch at inkjet printhead |
EP3237214B1 (en) * | 2015-04-10 | 2021-06-02 | Hewlett-Packard Development Company, L.P. | Removing an inclined segment of a metal conductor while forming printheads |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
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US3575740A (en) * | 1967-06-08 | 1971-04-20 | Ibm | Method of fabricating planar dielectric isolated integrated circuits |
JPS5357123U (ja) | 1976-10-19 | 1978-05-16 | ||
US4435898A (en) * | 1982-03-22 | 1984-03-13 | International Business Machines Corporation | Method for making a base etched transistor integrated circuit |
US4719477A (en) * | 1986-01-17 | 1988-01-12 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
US4947192A (en) * | 1988-03-07 | 1990-08-07 | Xerox Corporation | Monolithic silicon integrated circuit chip for a thermal ink jet printer |
US5122812A (en) * | 1991-01-03 | 1992-06-16 | Hewlett-Packard Company | Thermal inkjet printhead having driver circuitry thereon and method for making the same |
US5159353A (en) * | 1991-07-02 | 1992-10-27 | Hewlett-Packard Company | Thermal inkjet printhead structure and method for making the same |
US5211806A (en) * | 1991-12-24 | 1993-05-18 | Xerox Corporation | Monolithic inkjet printhead |
DE4214555C2 (de) * | 1992-04-28 | 1996-04-25 | Eastman Kodak Co | Elektrothermischer Tintendruckkopf |
US5387314A (en) * | 1993-01-25 | 1995-02-07 | Hewlett-Packard Company | Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining |
US5308442A (en) * | 1993-01-25 | 1994-05-03 | Hewlett-Packard Company | Anisotropically etched ink fill slots in silicon |
US5635966A (en) * | 1994-01-11 | 1997-06-03 | Hewlett-Packard Company | Edge feed ink delivery thermal inkjet printhead structure and method of fabrication |
AUPN623895A0 (en) * | 1995-10-30 | 1995-11-23 | Eastman Kodak Company | A manufacturing process for lift print heads with nozzle rim heaters |
JPH09156103A (ja) * | 1995-12-08 | 1997-06-17 | Hitachi Koki Co Ltd | インク噴射記録ヘッドとその製造方法および記録装置 |
US5790154A (en) * | 1995-12-08 | 1998-08-04 | Hitachi Koki Co., Ltd. | Method of manufacturing an ink ejection recording head and a recording apparatus using the recording head |
JPH09226126A (ja) * | 1995-12-22 | 1997-09-02 | Hitachi Koki Co Ltd | インク噴射記録ヘッド |
US6543884B1 (en) * | 1996-02-07 | 2003-04-08 | Hewlett-Packard Company | Fully integrated thermal inkjet printhead having etched back PSG layer |
US5699462A (en) * | 1996-06-14 | 1997-12-16 | Hewlett-Packard Company | Total internal reflection optical switches employing thermal activation |
EP0999934B1 (en) | 1997-07-15 | 2005-10-26 | Silver Brook Research Pty, Ltd | A thermally actuated ink jet |
US6019907A (en) * | 1997-08-08 | 2000-02-01 | Hewlett-Packard Company | Forming refill for monolithic inkjet printhead |
US6322201B1 (en) * | 1997-10-22 | 2001-11-27 | Hewlett-Packard Company | Printhead with a fluid channel therethrough |
US6132032A (en) * | 1999-08-13 | 2000-10-17 | Hewlett-Packard Company | Thin-film print head for thermal ink-jet printers |
JP2001353700A (ja) * | 2000-06-12 | 2001-12-25 | Olympus Optical Co Ltd | マイクロマシン製造方法及びエッチング停止層 |
US6412919B1 (en) * | 2000-09-05 | 2002-07-02 | Hewlett-Packard Company | Transistor drop ejectors in ink-jet print heads |
US6675476B2 (en) * | 2000-12-05 | 2004-01-13 | Hewlett-Packard Development Company, L.P. | Slotted substrates and techniques for forming same |
-
2001
- 2001-08-16 US US09/932,055 patent/US7160806B2/en not_active Expired - Lifetime
-
2002
- 2002-08-09 DE DE60229597T patent/DE60229597D1/de not_active Expired - Lifetime
- 2002-08-09 EP EP02255596A patent/EP1284189B1/en not_active Expired - Fee Related
- 2002-08-09 DE DE60237935T patent/DE60237935D1/de not_active Expired - Lifetime
- 2002-08-09 EP EP08075629A patent/EP1992489B1/en not_active Expired - Lifetime
- 2002-08-16 JP JP2002237607A patent/JP4141200B2/ja not_active Expired - Fee Related
-
2006
- 2006-11-29 US US11/564,782 patent/US7521267B2/en not_active Expired - Fee Related
-
2007
- 2007-11-08 JP JP2007290373A patent/JP5052295B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7521267B2 (en) | 2009-04-21 |
JP2003163199A (ja) | 2003-06-06 |
JP2008066746A (ja) | 2008-03-21 |
US20030036279A1 (en) | 2003-02-20 |
US7160806B2 (en) | 2007-01-09 |
EP1284189B1 (en) | 2008-10-29 |
EP1992489B1 (en) | 2010-10-06 |
EP1284189A1 (en) | 2003-02-19 |
EP1992489A3 (en) | 2008-12-03 |
EP1992489A2 (en) | 2008-11-19 |
JP4141200B2 (ja) | 2008-08-27 |
DE60229597D1 (de) | 2008-12-11 |
DE60237935D1 (de) | 2010-11-18 |
US20070084824A1 (en) | 2007-04-19 |
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