JP5050656B2 - Method for manufacturing circuit-formed substrate - Google Patents

Method for manufacturing circuit-formed substrate Download PDF

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JP5050656B2
JP5050656B2 JP2007141524A JP2007141524A JP5050656B2 JP 5050656 B2 JP5050656 B2 JP 5050656B2 JP 2007141524 A JP2007141524 A JP 2007141524A JP 2007141524 A JP2007141524 A JP 2007141524A JP 5050656 B2 JP5050656 B2 JP 5050656B2
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squeegee
paste
via hole
prepreg sheet
substrate
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JP2008300391A (en
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俊和 近藤
敏昭 竹中
幸弘 平石
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明はパソコン、移動体通信機器、ビデオカメラ等の各種電子機器に用いられる回路形成基板の製造方法に関するものである。   The present invention relates to a method of manufacturing a circuit-formed substrate used in various electronic devices such as a personal computer, a mobile communication device, and a video camera.

近年、電子機器の高機能化・高密度化に伴い、電子機器を構成する電子部品は、ますます小型化・高集積化・高速化・高機能化の傾向にあり、これらの要求に対応するために、回路形成基板も様々な形態が提案され、実用化されてきている。   In recent years, as electronic devices have higher functionality and higher density, the electronic components that make up electronic devices are becoming increasingly smaller, more integrated, faster, and more functional. Therefore, various forms of circuit forming substrates have been proposed and put into practical use.

特に、多層化の際に内層基板や銅箔を接着させる接着層に直接、導電性ペーストを充填した後に積層一体化する技術が確立されたことにより、ドリル加工および金属めっきによる貫通スルーホールを必要とすることなく、任意の層間をＩＶＨ（インナーステイシャル・バイア・ホール）で電気的に接続することが可能となった。   In particular, a through-hole is required for drilling and metal plating because the technology for stacking and integrating the conductive paste directly after filling the adhesive layer that adheres the inner layer substrate and copper foil when multilayering is established. Thus, any layer can be electrically connected by IVH (inner-stabilized via hole).

従来の回路形成基板の製造についての一例を図５〜図９を用いて説明する。   An example of manufacturing a conventional circuit forming substrate will be described with reference to FIGS.

はじめに図５（ａ）に示すようにプリプレグシート２の両面にフィルム７をラミネートする。次に図５（ｂ）に示すようにレーザ加工等の方法によりビア穴８を加工し、ビア穴形成済みプリプレグ５を得る。さらに図５（ｃ）に示すようにペースト４をビア穴８に充填する。ペースト４は導電性を付与するために銅等の金属粒子をエポキシ樹脂等の熱硬化性樹脂に混練したものである。次に図５（ｄ）に示すようにフィルム７を剥離する。フィルム７はプリプレグシート２の表面の樹脂分がわずかに溶融して接着されているだけであるので、容易にはがすことができる。剥離後は図５（ｄ）に示すようにフィルム７の厚み分だけペースト４が突出したような形状になる。そして図５（ｅ）に示すように銅箔９をプリプレグシート２の上下に配置して、真空熱プレス装置等を用いて加熱加圧し、プリプレグシート２を溶融し成型硬化させ図５（ｆ）の状態にするとともにペースト４を圧縮して、プリプレグシート２と上下２枚の銅箔９をペースト４で電気的に接続する。その後に図５（ｇ）に示すように銅箔９を所望の形状にエッチングして回路１０を形成し、両面の回路形成基板を得る。   First, as shown in FIG. 5A, films 7 are laminated on both surfaces of the prepreg sheet 2. Next, as shown in FIG. 5B, the via hole 8 is processed by a method such as laser processing to obtain the prepreg 5 in which the via hole has been formed. Further, as shown in FIG. 5C, the paste 4 is filled into the via hole 8. The paste 4 is obtained by kneading metal particles such as copper in a thermosetting resin such as an epoxy resin in order to impart conductivity. Next, the film 7 is peeled off as shown in FIG. The film 7 can be easily peeled off because the resin content on the surface of the prepreg sheet 2 is only slightly melted and bonded. After peeling, the paste 4 protrudes by the thickness of the film 7 as shown in FIG. Then, as shown in FIG. 5 (e), the copper foils 9 are arranged above and below the prepreg sheet 2 and heated and pressurized using a vacuum hot press apparatus or the like to melt and mold and cure the prepreg sheet 2. FIG. The paste 4 is compressed and the prepreg sheet 2 and the upper and lower copper foils 9 are electrically connected by the paste 4. Thereafter, as shown in FIG. 5G, the copper foil 9 is etched into a desired shape to form a circuit 10 to obtain a circuit-formed substrate on both sides.

ここで用いたプリプレグシート２は図６に示すとおり、補強材としてのガラス繊維織布に熱硬化性樹脂を含浸して半硬化状態にしたシート状の材料であるプリプレグ１を裁断して得られたものである。ガラス繊維織布の製造時の材料流れ方向（以下、ＭＤ方向と称す。なおＭＤはＭａｃｈｉｎｅ Ｄｉｒｅｃｔｉｏｎの略）を図中にＭＤ方向として示す。通常の回路形成基板の製造においては図６に示すようにプリプレグシート２の長手方向を図中のＭＤ方向と直交するようにプリプレグ１を裁断する場合が多い。理由は回路形成基板を製造する業者の要求するプリプレグシート２のサイズすなわち前記業者が採用しているワークサイズが規格化されたガラス繊維織布の横幅を２分割するサイズを基本に考えられており、各業者は図６に示すプリプレグシート２の短手方向の長さを調整することで自社の工程および顧客ニーズに合うように調整を施している。   As shown in FIG. 6, the prepreg sheet 2 used here is obtained by cutting a prepreg 1 which is a sheet-like material obtained by impregnating a glass fiber woven fabric as a reinforcing material with a thermosetting resin. It is a thing. The material flow direction (hereinafter referred to as the MD direction) at the time of manufacturing the glass fiber woven fabric is indicated as the MD direction in the drawing. MD is an abbreviation for Machine Direction. In the manufacture of a normal circuit forming substrate, the prepreg 1 is often cut so that the longitudinal direction of the prepreg sheet 2 is orthogonal to the MD direction in the drawing as shown in FIG. The reason is considered based on the size of the prepreg sheet 2 required by the manufacturer of the circuit forming board, that is, the size of the glass fiber woven fabric with the standardized work size divided into two. Each supplier adjusts the length of the prepreg sheet 2 shown in FIG. 6 in the short direction so as to meet the company's process and customer needs.

裁断されたプリプレグシート２は表面にフィルム７を貼り付け、ビア穴８を加工した後、図７に示すようにスキージ３を用いた印刷法により印刷用の版枠６を介してビア穴８にペースト４を充填する。版枠６はプリプレグシート２よりも一回り小さい開口部を有しており、ビア穴８形成済みプリプレグ５の周囲をこの開口部で抑えるようにビア穴８形成済みプリプレグ５と版枠６の開口部を位置合わせして配置する。この工程においては、スキージ３のサイズや設備全体の大きさ等の問題もあり、図６に示すようにプリプレグシート２を長手方向に投入し、さらに印刷のスキージ３の進行方向も長手方向とすることが標準となっていた。   The cut prepreg sheet 2 is attached with a film 7 on the surface, and after processing the via hole 8, the via hole 8 is formed through the printing plate frame 6 by a printing method using the squeegee 3 as shown in FIG. Fill with paste 4. The plate frame 6 has an opening that is slightly smaller than the prepreg sheet 2, and the openings of the prepreg 5 with the via hole 8 and the plate frame 6 are held around the prepreg 5 with the via hole 8 formed therein. Align and place the parts. In this process, there are also problems such as the size of the squeegee 3 and the size of the entire equipment. As shown in FIG. 6, the prepreg sheet 2 is loaded in the longitudinal direction, and the traveling direction of the printing squeegee 3 is also the longitudinal direction. Was the standard.

次に図８を用いて補強材としてのガラス繊維織布１１の製造法について説明する。一般に知られている織布の製造と同じく、縦糸１２に対して横糸１３を織り込んでいくことでガラス繊維織布１１が得られる。縦糸１２は図中のＭＤ方向にテンションが加わっており、ガラス繊維織布１１の断面を見たときに縦糸１２は一直線に伸びており横糸１３が上下に配置されている。図９に示すようにＭＤ方向と直交する断面を観察した際には横糸１３は縦糸１２の上下を縫うような曲がった形状になる。以上の説明は一般的な平織りの例であるが、他の織り方法についても同様である。   Next, the manufacturing method of the glass fiber woven fabric 11 as a reinforcing material is demonstrated using FIG. The glass fiber woven fabric 11 is obtained by weaving the weft yarn 13 into the warp yarn 12 in the same manner as the production of a generally known woven fabric. The warp yarn 12 is tensioned in the MD direction in the figure, and when the cross section of the glass fiber woven fabric 11 is viewed, the warp yarn 12 extends in a straight line and the weft yarn 13 is arranged vertically. As shown in FIG. 9, when the cross section perpendicular to the MD direction is observed, the weft 13 is bent so as to sew the upper and lower sides of the warp 12. The above description is an example of a general plain weave, but the same applies to other weaving methods.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
特開平６−２６８３４５号公報 As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-6-268345

しかしながら、前記の従来の回路形成基板の製造法では、図５（ｂ）におけるビア穴８が小径化した場合に、ビア穴８に対してペースト４を均一に充填することが困難なものとなり、その結果、各層の回路１０を電気的に接続するビア穴８の電気抵抗にばらつきが生じるという課題を有していた。   However, in the conventional method for manufacturing a circuit forming substrate, when the via hole 8 in FIG. 5B is reduced in diameter, it becomes difficult to uniformly fill the via hole 8 with the paste 4. As a result, there is a problem that variations occur in the electrical resistance of the via holes 8 that electrically connect the circuits 10 of the respective layers.

その要因を、発明者は実験試作を繰り返し、解析を実施した結果において以下のように
見出した。 The inventor found the following factors in the results of repeating the trial manufacture and analysis.

すなわち、プリプレグ１の補強材であるガラス繊維織布１１のＭＤ方向と、導電性ペースト充填工程でのスキージ３の移動方向が略直交している場合は、スキージ３の移動方向に沿ったプリプレグシート２の断面を見ると図１０に示すとおり、縦糸１２に対してたるみをもって上下に追従した形で横糸１３が流れ方向に存在した状態でエポキシなどの樹脂１４が含浸されるが横糸１３のたるみによって生じた部分に凹凸が残った状態となる。この方向にスキージ３をプリプレグシート２にフィルム７を介して接触した状態で移動させると、横糸１３のたるみによって生じたプリプレグシート２の凹凸でスキージ３の上下動作が大きくスキージ３の追従性が不安定となることで、充填圧力が不均一となり、接続抵抗がばらつく場合があった。   That is, when the MD direction of the glass fiber woven fabric 11 that is the reinforcing material of the prepreg 1 and the moving direction of the squeegee 3 in the conductive paste filling step are substantially orthogonal, the prepreg sheet along the moving direction of the squeegee 3 When the cross section of FIG. 2 is seen, as shown in FIG. 10, the resin 14 such as epoxy is impregnated in the state in which the weft 13 is present in the flow direction with a slack with respect to the warp 12. Unevenness remains in the generated part. If the squeegee 3 is moved in this direction in contact with the prepreg sheet 2 via the film 7, the up-and-down movement of the squeegee 3 is large due to the unevenness of the prepreg sheet 2 caused by the slack of the weft 13, and the followability of the squeegee 3 is poor. Due to the stability, the filling pressure becomes non-uniform and the connection resistance may vary.

本発明は、前記従来の課題を解決するもので、電気抵抗値のばらつきが小さいビア穴８形成を可能とした回路形成基板の製造方法を提供することを目的とする。   An object of the present invention is to solve the above-mentioned conventional problems, and to provide a method of manufacturing a circuit-formed substrate that enables the formation of via holes 8 with small variations in electrical resistance values.

前記従来の課題を解決するために、本発明の回路形成基板の製造方法は、基板材料の補強材を製造する際のＭＤ方向とペーストを充填する工程でのスキージの移動方向が略平行であるという構成を有する。この構成により、スキージの移動方向に対してプリプレグシートの凹凸が小さくなり、導電性ペースト充填量の安定性を改善することができ、高品質な回路形成基板の製造が容易に行えるものである。   In order to solve the above-mentioned conventional problems, in the method of manufacturing a circuit board according to the present invention, the MD direction when manufacturing the reinforcing material of the substrate material is substantially parallel to the moving direction of the squeegee in the step of filling the paste. It has the structure of. With this configuration, the unevenness of the prepreg sheet is reduced with respect to the moving direction of the squeegee, the stability of the conductive paste filling amount can be improved, and a high-quality circuit-formed substrate can be easily manufactured.

また本発明の回路形成基板の製造方法で用いるスキージゴムはゴム弾性を有するものであり、この構成により、プリプレグシートにスキージの移動方向と垂直な方向に多少の凹凸があっても、スキージはその形状に追従することができる。その結果、導電性ペースト充填量の安定性を改善することができ、高品質な回路形成基板の製造が容易に行えるものである。   In addition, the squeegee rubber used in the method for producing a circuit-forming board of the present invention has rubber elasticity. With this configuration, even if the prepreg sheet has some unevenness in the direction perpendicular to the moving direction of the squeegee, the squeegee has its shape. Can follow. As a result, the stability of the conductive paste filling amount can be improved, and the production of a high-quality circuit-formed substrate can be easily performed.

本発明の回路形成基板の製造方法によれば、プリプレグシートのビア穴に対する導電性ペースト充填量のばらつきを改善することができ、電気抵抗値のばらつきが小さい高品質な層間接続を行うことができる。   According to the method for manufacturing a circuit-formed substrate of the present invention, it is possible to improve the dispersion of the conductive paste filling amount with respect to the via hole of the prepreg sheet, and to perform high-quality interlayer connection with a small variation in electrical resistance value. .

以下本発明を実施するための最良の形態について、図面を参照しながら説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

（実施の形態１）
図１に本発明の実施の形態１におけるプリプレグシート２の製造方法について示す。プリプレグシート２は図１に示すとおり、補強材としてのガラス繊維織布に熱硬化性樹脂を含浸して半硬化状態にしたシート状の材料であるプリプレグ１を裁断して得られたものである。ガラス繊維織布の製造時の材料流れ方向を図中にＭＤ方向として示す。通常の回路形成基板の製造においては図１に示すようにプリプレグシート２の長手方向を図中のＭＤ方向と直交するようにプリプレグ１を裁断する場合が多い。理由は回路形成基板を製造する業者の要求するプリプレグシート２のサイズすなわち前記業者が採用しているワークサイズが規格化されたガラス繊維織布の横幅を２分割するサイズを基本に考えられており、各業者は図１に示すプリプレグシート２の短手方向の長さを調整することで自社の工程および顧客ニーズに合うように調整を施している。 (Embodiment 1)
FIG. 1 shows a method for manufacturing prepreg sheet 2 in Embodiment 1 of the present invention. As shown in FIG. 1, the prepreg sheet 2 is obtained by cutting a prepreg 1 which is a sheet-like material in which a glass fiber woven fabric as a reinforcing material is impregnated with a thermosetting resin to be in a semi-cured state. . The material flow direction during the production of the glass fiber woven fabric is shown as the MD direction in the figure. In the production of a normal circuit forming substrate, the prepreg 1 is often cut so that the longitudinal direction of the prepreg sheet 2 is orthogonal to the MD direction in the drawing as shown in FIG. The reason is considered based on the size of the prepreg sheet 2 required by the manufacturer of the circuit forming board, that is, the size of the glass fiber woven fabric with the standardized work size divided into two. Each supplier adjusts the length of the prepreg sheet 2 shown in FIG. 1 in the short direction so as to meet their own process and customer needs.

このガラス繊維織布１１の製造法は、従来例で説明したのと同様の方法によるものである。すなわち図８において、縦糸１２に対して横糸１３を織り込んでいくことでガラス繊維織布１１が得られるものであり、ここでのＭＤ方向である縦糸１２方向にテンションが加わっている。そのためＭＤ方向に織り込まれている縦糸１２はたるみなく剛直な状態になる。   The manufacturing method of the glass fiber woven fabric 11 is based on the same method as described in the conventional example. That is, in FIG. 8, the glass fiber woven fabric 11 is obtained by weaving the weft yarn 13 into the warp yarn 12, and tension is applied in the warp yarn 12 direction which is the MD direction here. Therefore, the warp yarn 12 woven in the MD direction is in a rigid state without sagging.

プリプレグ１から裁断されたプリプレグシート２に対しては、従来例で説明したのと同様にフィルム７がラミネートされ、さらにビア穴８が形成される。   The prepreg sheet 2 cut from the prepreg 1 is laminated with a film 7 in the same manner as described in the conventional example, and a via hole 8 is formed.

次に、図２に示すようにスキージ３を用いた印刷法により印刷用の版枠６を介してビア穴８にペースト４を充填する。ここで使用するスキージ３はゴム弾性を有するスキージゴムからなるものである。版枠６はプリプレグシート２よりも一回り小さい開口部を有しており、ビア穴形成済みプリプレグ５の周囲をこの開口部で抑えるようにビア穴形成済みプリプレグ５と版枠６の開口部を位置合わせして配置する。この場合、プリプレグシート２のＭＤ方向とスキージ３の移動方向を一致させる。   Next, as shown in FIG. 2, the paste 4 is filled into the via hole 8 through the printing plate frame 6 by a printing method using the squeegee 3. The squeegee 3 used here is made of squeegee rubber having rubber elasticity. The plate frame 6 has an opening that is slightly smaller than the prepreg sheet 2, and the openings of the via hole formed prepreg 5 and the plate frame 6 are formed so as to suppress the periphery of the via hole formed prepreg 5 with this opening. Align and place. In this case, the MD direction of the prepreg sheet 2 and the moving direction of the squeegee 3 are matched.

次にビア穴８にペースト４を充填したプリプレグシート２の表面のフィルム７を剥離し、このプリプレグシート２の上下に銅箔を配置して、真空熱プレス装置を用いて加熱加圧し、プリプレグシート２を溶融硬化するとともにペースト４を圧縮してプリプレグシート２の上下の銅箔を電気的に接続する。その後、銅箔を所望の形状にエッチングして回路を形成し、両面の回路形成基板を得る。   Next, the film 7 on the surface of the prepreg sheet 2 in which the via hole 8 is filled with the paste 4 is peeled off, copper foils are arranged on the upper and lower sides of the prepreg sheet 2, and heated and pressurized using a vacuum hot press apparatus, and the prepreg sheet 2 is melt-cured and the paste 4 is compressed to electrically connect the upper and lower copper foils of the prepreg sheet 2. Thereafter, the copper foil is etched into a desired shape to form a circuit to obtain a double-sided circuit forming substrate.

本実施の形態では以上説明したように、ガラス繊維織布１１の製造時のＭＤ方向とペースト４充填工程でのスキージ３の移動方向が略平行すなわち同一方向である。発明者の試作検討において、このような方式でペースト４充填を行った場合には、従来例で問題となったプリプレグシート２の層間電気接続のばらつきが改善された。図３にその結果の一例を示す。   In the present embodiment, as described above, the MD direction at the time of manufacturing the glass fiber woven fabric 11 and the moving direction of the squeegee 3 in the paste 4 filling step are substantially parallel, that is, the same direction. In the inventor's trial production, when the paste 4 was filled in this way, the variation in the interlayer electrical connection of the prepreg sheet 2 which was a problem in the conventional example was improved. FIG. 3 shows an example of the result.

すなわち、従来例ではガラス繊維織布１１の製造時のＭＤ方向とスキージ３の移動方向は略垂直であり、ペースト４充填時のスキージ３の移動方向とたるみをもった横糸１３の方向が同じであるために、スキージ３が基材の凹凸に追従できず充填圧力が不均一になっていたが、本実施の形態では図３（ａ）に示すようにガラス繊維織布１１の製造時のＭＤ方向とスキージ３の移動方向は略平行である。そのためスキージ３の移動方向はたるみをもった横糸１３によって生じる凹凸の方向に対して略垂直方向であり、さらにテンションが加えられたことによってたるみなく剛直な状態である縦糸１２の方向と一致するものである。その結果スキージ３の略垂直方向の凹凸に対してはスキージ３が有する弾性によりその凹凸形状に変形して追従することができる。またスキージ３の移動方向に対しては、プリプレグシート２はテンションが加えられたことによってたるみなく剛直な状態である縦糸１２のために凹凸が小さなものであるので、スキージ３の上下動も小さなものとなる。従ってスキージ３は、図３（ｂ）に示すようにプリプレグシート２に接触した際に発生する変形状態を保ったまま移動することができ、プリプレグシート２の凹凸への追従性が安定した。その結果、図４に示すように充填圧力が均一に加えられるようになり安定した接続抵抗が得られることを確認した。   That is, in the conventional example, the movement direction of the squeegee 3 and the MD direction at the time of manufacturing the glass fiber woven fabric 11 are substantially perpendicular, and the movement direction of the squeegee 3 when filling the paste 4 is the same as the direction of the weft 13 with slack. For this reason, the squeegee 3 cannot follow the unevenness of the base material, and the filling pressure is non-uniform, but in this embodiment, as shown in FIG. The direction and the moving direction of the squeegee 3 are substantially parallel. Therefore, the moving direction of the squeegee 3 is substantially perpendicular to the direction of the unevenness caused by the weft 13 having a slack, and further coincides with the direction of the warp 12 which is in a rigid state without slack due to the applied tension. It is. As a result, the unevenness in the substantially vertical direction of the squeegee 3 can be deformed to follow the uneven shape due to the elasticity of the squeegee 3. Also, with respect to the moving direction of the squeegee 3, the prepreg sheet 2 has small unevenness due to the warp 12 which is in a rigid state due to the tension applied, so that the vertical movement of the squeegee 3 is also small. It becomes. Accordingly, the squeegee 3 can be moved while maintaining the deformed state generated when it contacts the prepreg sheet 2 as shown in FIG. 3 (b), and the followability to the unevenness of the prepreg sheet 2 is stabilized. As a result, it was confirmed that the filling pressure was uniformly applied as shown in FIG. 4 and a stable connection resistance was obtained.

以上述べた実施の形態で基板材料すなわちプリプレグとして説明した材料の例としては、通常のガラス繊維織布あるいは不織布に熱硬化性樹脂を含浸しＢステージ化したものを広い範囲で用いることが可能でガラス繊維の代わりにアラミド等の有機繊維を採用することもできる。不織布の製造においてもＭＤ方向に配向している繊維はたるみ無く剛直な構造となり、本発明の効果が得られる。   As an example of the material described as the substrate material, that is, the prepreg in the above-described embodiment, a normal glass fiber woven fabric or non-woven fabric impregnated with a thermosetting resin and made into a B-stage can be used in a wide range. Organic fibers such as aramid can be used instead of glass fibers. Even in the production of a nonwoven fabric, fibers oriented in the MD direction have a rigid structure without sagging, and the effects of the present invention can be obtained.

また、熱硬化性樹脂以外に焼結することによりリジットな基板となる無機系の材料を用いることも可能である。   It is also possible to use an inorganic material that becomes a rigid substrate by sintering other than the thermosetting resin.

また、織布と不織布を混成した材料、例えば２枚のガラス繊維の間にガラス繊維不織布を挟み込んだような材料を補強材として用いることも可能である。   Further, a material in which a woven fabric and a nonwoven fabric are mixed, for example, a material in which a glass fiber nonwoven fabric is sandwiched between two glass fibers, can be used as a reinforcing material.

また、本発明の実施の形態で熱硬化性樹脂と記述した部分の熱硬化性樹脂の例としては、エポキシ系樹脂、エポキシ・メラミン系樹脂、不飽和ポリエステル系樹脂、フェノール系樹脂、ポリイミド系樹脂、シアネート系樹脂、シアン酸エステル系樹脂、ナフタレン系樹脂、ユリア系樹脂、アミノ系樹脂、アルキド系樹脂、ケイ素系樹脂、フラン系樹脂、ポリウレタン系樹脂、アミノアルキド系樹脂、アクリル系樹脂、フッ素系樹脂、ポリフェニレンエーテル系樹脂、シアネートエステル系樹脂等の単独、あるいは２種以上混合した熱硬化性樹脂組成物あるいは熱可塑樹脂で変性された熱硬化性樹脂組成物を用いることができ、必要に応じて難燃剤や無機充填剤の添加も可能である。   In addition, examples of the thermosetting resin in the portion described as the thermosetting resin in the embodiment of the present invention include an epoxy resin, an epoxy / melamine resin, an unsaturated polyester resin, a phenol resin, and a polyimide resin. , Cyanate resin, cyanate ester resin, naphthalene resin, urea resin, amino resin, alkyd resin, silicon resin, furan resin, polyurethane resin, aminoalkyd resin, acrylic resin, fluorine resin Resin, polyphenylene ether resin, cyanate ester resin, etc. can be used alone, or two or more thermosetting resin compositions or thermosetting resin compositions modified with thermoplastic resins can be used as required. In addition, flame retardants and inorganic fillers can be added.

また、両面板を実施の形態で説明したが、必要に応じて同様の工程を繰り返すことで多層板を製造することも可能であり、ペーストを充填したプリプレグで多層回路形成基板を貼り合わせる等の工法も採用できる。   Although the double-sided board has been described in the embodiment, it is also possible to manufacture a multilayer board by repeating the same steps as necessary, such as bonding a multilayer circuit forming substrate with a prepreg filled with paste. Construction methods can also be adopted.

また、層間接続手段として導電性ペーストを用いて説明したが、導電性ペーストとしては銅粉等の導電性粒子を硬化剤を含む熱硬化性樹脂に混練したものの他に、導電性粒子と熱プレス時に基板材料中に排出されてしまうような適当な粘度の高分子材料、あるいは溶剤等を混練したもの等多種の組成が利用可能である。   In addition, although the conductive paste has been described as the interlayer connection means, the conductive paste is not limited to the conductive particles such as copper powder kneaded with the thermosetting resin containing the curing agent, and the conductive particles and the hot press. Various compositions such as a polymer material having an appropriate viscosity that is sometimes discharged into the substrate material, or a kneaded solvent or the like can be used.

以上述べたように、本発明の回路形成基板の製造方法によれば、電気抵抗値のばらつきが小さい高品質な層間接続を行うことができるので、各種電子機器用として有用であり、産業上の利用可能性は大といえる。   As described above, according to the method for manufacturing a circuit-formed substrate of the present invention, high-quality interlayer connection with small variation in electrical resistance value can be performed, which is useful for various electronic devices and industrially. The availability is great.

本発明の実施の形態１のプリプレグシートの製造方法を示す斜視図The perspective view which shows the manufacturing method of the prepreg sheet | seat of Embodiment 1 of this invention. 本発明の実施の形態１のペースト充填工程を示す斜視図及び断面図The perspective view and sectional drawing which show the paste filling process of Embodiment 1 of this invention 本発明の実施の形態１のペースト充填工程を示す斜視図及び断面図The perspective view and sectional drawing which show the paste filling process of Embodiment 1 of this invention 本発明と従来例における電気抵抗値を示す図The figure which shows the electrical resistance value in this invention and a prior art example 従来例における回路形成基板の製造工程を示す断面図Sectional drawing which shows the manufacturing process of the circuit formation board in a prior art example 従来例におけるプリプレグシートの製造方法を示す斜視図The perspective view which shows the manufacturing method of the prepreg sheet | seat in a prior art example 従来例におけるペースト充填工程を示す斜視図The perspective view which shows the paste filling process in a prior art example 従来例におけるガラス繊維織布の製造法を示す斜視図The perspective view which shows the manufacturing method of the glass fiber woven fabric in a prior art example 同断面図Cross section 従来例におけるペースト充填工程を示す断面図Sectional drawing which shows the paste filling process in a prior art example

符号の説明Explanation of symbols

１ プリプレグ
２ プリプレグシート
３ スキージ
４ ペースト
５ ビア穴形成済みプリプレグ
６ 版枠
７ フィルム
８ ビア穴
９ 銅箔
１０ 回路
１１ ガラス繊維織布
１２ 縦糸
１３ 横糸
１４ 樹脂 DESCRIPTION OF SYMBOLS 1 Prepreg 2 Prepreg sheet 3 Squeegee 4 Paste 5 Via hole formation prepreg 6 Plate frame 7 Film 8 Via hole 9 Copper foil 10 Circuit 11 Glass fiber woven fabric 12 Warp yarn 13 Weft yarn 14 Resin

Claims (2)

織布からなる補強材を有する基板材料にフィルム状材料を貼り付ける工程と、前記フィルム状材料が貼り付けられた基板材料にビア穴を加工する工程と、前記ビア穴が加工されたフィルム状材料が貼り付けられた基板材料の表面にゴム弾性を有するスキージを移動させることによって前記ビア穴にペーストを充填する工程を含み、前記補強材はテンションが加えられた縦糸に対して横糸を織り込んで製造されたものであり、前記基板材料の補強材を製造する際のＭＤ方向と前記ペーストを充填する工程でのスキージの移動方向が略平行であることを特徴とする回路形成基板の製造方法。 A step of attaching a film-like material to a substrate material having a reinforcing material made of woven fabric, a step of processing a via hole in the substrate material to which the film-like material is attached, and a film-like material in which the via hole is processed A step of filling the via hole with a paste by moving a squeegee having rubber elasticity on the surface of the substrate material to which the material is attached, and the reinforcing material is manufactured by weaving a weft yarn against a warped yarn to which a tension is applied A method of manufacturing a circuit-formed substrate, wherein the MD direction when manufacturing the reinforcing material of the substrate material and the moving direction of the squeegee in the step of filling the paste are substantially parallel. ビア穴にペーストを充填する工程の後、フィルム状材料を基板材料から剥離する工程と、前記基板材料の上下に銅箔を配置しそれを加熱加圧する工程を備えたことを特徴とする請求項１に記載の回路形成基板の製造方法。 The method comprising the steps of peeling the film-like material from the substrate material after the step of filling the via hole with the paste, and placing and heating the copper foil above and below the substrate material. 2. A method for manufacturing a circuit forming substrate according to 1.
JP2007141524A 2007-05-29 2007-05-29 Method for manufacturing circuit-formed substrate Expired - Fee Related JP5050656B2 (en)

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