JPH0639958A - Fluorine resin-laminated sheet, circuit board and multi-layer circuit board - Google Patents
Fluorine resin-laminated sheet, circuit board and multi-layer circuit boardInfo
- Publication number
- JPH0639958A JPH0639958A JP21733192A JP21733192A JPH0639958A JP H0639958 A JPH0639958 A JP H0639958A JP 21733192 A JP21733192 A JP 21733192A JP 21733192 A JP21733192 A JP 21733192A JP H0639958 A JPH0639958 A JP H0639958A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- prepreg
- longitudinal direction
- base material
- fluorine resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、フツ素樹脂積層板と、
この積層板の上下両面に金属箔が設けられてなる回路基
板と、さらにこの基板から作製される回路板を内層回路
板とした多層回路基板とに関するものである。BACKGROUND OF THE INVENTION The present invention relates to a fluororesin laminate,
The present invention relates to a circuit board in which metal foils are provided on both upper and lower surfaces of this laminated board, and a multilayer circuit board in which a circuit board produced from this board is an inner layer circuit board.
【０００２】[0002]
【従来の技術】従来より、ガラスクロスなどの長尺状繊
維基材にフツ素樹脂を含浸させ、これを矩形状にしたプ
リプレグを、所要枚数重ね合わせて、加熱加圧により融
着一体化して得られるフツ素樹脂積層板は、低誘電率材
料として知られ、その上下両面に金属箔を設けた回路基
板や、この基板より作製した回路板を内層回路板とした
多層回路基板などは、電子機器、通信機器、コンピユ―
タなどの高周波域利用機器などの種々の産業分野に利用
されている。2. Description of the Related Art Conventionally, a long fiber base material such as glass cloth is impregnated with fluorine resin, and a required number of rectangular prepregs are superposed and fused and integrated by heating and pressing. The obtained fluorine resin laminated board is known as a low dielectric constant material, and circuit boards with metal foils on both upper and lower surfaces of the board and multilayer circuit boards in which the circuit board produced from this board is an inner layer circuit board are Equipment, communication equipment, computer
It is used in a variety of industrial fields such as high frequency devices such as computers.
【０００３】ところで、近年のプリント配線板に対する
性能向上の要求は厳しく、たとえば、機器の小型化のた
め、配線密度（実装密度）を高めることもその一つであ
り、そのためプリント配線板の寸法変化率の一層の低減
が求められている。By the way, in recent years, demands for performance improvement of printed wiring boards are strict, and for example, increasing the wiring density (mounting density) in order to downsize the equipment is one of them, and therefore the dimensional change of the printed wiring board. Further reduction of the rate is required.
【０００４】[0004]
【発明が解決しようとする課題】しかるに、上記従来の
フツ素樹脂積層板やその回路基板などは、その作製工程
中に加わる熱によつて、縦横いずれかの方向の寸法変化
が大きくなり、特に多層回路基板においてその傾向が著
しく、プリント配線板の高性能化に伴う要求特性を十分
に満足させるものではなかつた。However, in the above-mentioned conventional fluorocarbon resin laminated board and its circuit board, the dimensional change in either the vertical or horizontal direction becomes large due to the heat applied during the manufacturing process. This tendency is remarkable in a multilayer circuit board, and it has not been able to sufficiently satisfy the required characteristics accompanying the high performance of a printed wiring board.
【０００５】本発明は、このような事情に鑑み、寸法変
化率、つまり板材として用いるプリプレグの初期寸法に
対する変化率が、縦横でほぼ同じであつて、かつ縦横の
寸法変化率が共に小さいフツ素樹脂積層板やその回路基
板などを提供することを目的としている。In view of the above circumstances, the present invention provides a fluorine material in which the dimensional change rate, that is, the change rate with respect to the initial dimension of a prepreg used as a plate material is substantially the same in the vertical and horizontal directions, and the vertical and horizontal dimensional change rates are both small. It is intended to provide a resin laminated plate and a circuit board thereof.
【０００６】[0006]
【課題を解決するための手段】本発明者らは、上記の目
的を達成するため、鋭意検討した結果、フツ素樹脂積層
板やその回路基板などの作製に用いられるプリプレグ
は、樹脂含浸時に基材長手方向に張力がかかり、同方向
に伸びた状態になつており、これを樹脂含浸後縦横どち
らかが基材長手方向に沿うように矩形状に裁断，成形し
て、その所要枚数をすべて同方向に積層一体化すると、
縦横どちらかが大きく熱収縮してしまうものであること
がわかつた。Means for Solving the Problems The inventors of the present invention have conducted extensive studies in order to achieve the above object, and as a result, have found that a prepreg used for producing a fluorine resin laminated plate or a circuit board thereof is The tension is applied in the longitudinal direction of the material, and it is stretched in the same direction. After impregnating this with resin, it is cut and shaped into a rectangular shape so that either the length or width is along the longitudinal direction of the base material, and the required number of sheets are all When laminated and integrated in the same direction,
It was discovered that either the vertical or horizontal direction would undergo large thermal contraction.
【０００７】そこで、この知見をもとに、所要枚数のプ
リプレグの積層に際し、基材長手方向が隣接層間で縦横
交互となるように重ね合わせて、熱収縮による寸法変化
への影響を低減するようにしてみたところ、寸法変化率
が縦横でほぼ同じで、かつ縦横の寸法変化率が共に小さ
いフツ素樹脂積層板やその回路基板などが得られること
を見い出し、本発明を完成するに至つた。[0007] Therefore, based on this knowledge, when laminating a required number of prepregs, it is possible to reduce the influence on the dimensional change due to heat shrinkage by overlapping the base materials so that the longitudinal directions of the base materials alternate between the adjacent layers. As a result, they have found that a fluorine resin laminated plate or a circuit board thereof, which has substantially the same dimensional change rate in the vertical and horizontal directions and a small dimensional change rate in both the vertical and horizontal directions, has completed the present invention.
【０００８】すなわち、本発明の第１は、長尺状繊維基
材にフツ素樹脂を含浸させてなるプリプレグ原反から、
縦横どちらかが基材長手方向に沿う矩形状のプリプレグ
を成形し、その所要枚数を、隣接層間で、基材長手方向
が縦横交互となるように重ね合わせて、融着一体化して
なるフツ素樹脂積層板に係るものであり、また本発明の
第２は、上記のフツ素樹脂積層板の上下両面に金属箔が
設けられてなる回路基板に係るものである。That is, the first aspect of the present invention is to use a prepreg raw material obtained by impregnating a long fiber base material with a fluorine resin,
A fluorine formed by forming a rectangular prepreg whose length or width is along the longitudinal direction of the base material, and stacking the required number of sheets so that the longitudinal direction of the base material alternates between the longitudinal and lateral directions, and fusing together. The present invention relates to a resin laminated plate, and the second aspect of the present invention relates to a circuit board in which metal foils are provided on the upper and lower surfaces of the fluorine resin laminated plate.
【０００９】さらに、本発明の第３は、上記第２の発明
に係る回路基板を用いて作製した内層回路板と、その上
下両面に上記第１の発明で用いたのと同様の矩形状のプ
リプレグを介して設けた金属箔とからなる多層回路基板
であつて、かつ上記のプリプレグは、内層回路板を構成
する最外層のプリプレグとの間で、基材長手方向が縦横
交互となるようにされている多層回路基板に係るもので
ある。Furthermore, a third aspect of the present invention is an inner layer circuit board produced by using the circuit board according to the second aspect of the present invention, and the upper and lower surfaces thereof have the same rectangular shape as that used in the first aspect of the present invention. A multilayer circuit board comprising a metal foil provided via a prepreg, and the prepreg is such that the longitudinal direction of the base material alternates vertically and horizontally with the prepreg of the outermost layer constituting the inner layer circuit board. The present invention relates to a multi-layer circuit board.
【００１０】[0010]
【発明の構成・作用】以下、本発明を、図面を参考にし
て説明する。図１（Ａ）は、プリプレグ原反から矩形状
のプリプレグを裁断，成形する態様を示す平面図、
（Ｂ）はこの矩形状のプリプレグを用いて得たフツ素樹
脂積層板とその上下両面に金属箔が設けられた回路基
板、さらに（Ｃ）は上記基板を用いて作製した多層回路
板である。The present invention will be described below with reference to the drawings. FIG. 1 (A) is a plan view showing a mode in which a rectangular prepreg is cut and molded from a prepreg original fabric,
(B) is a circuit board having a fluorine resin laminated plate obtained by using this rectangular prepreg and metal foils provided on both upper and lower surfaces thereof, and (C) is a multilayer circuit board produced using the above substrate. .
【００１１】（Ａ）において、長尺状繊維基材２に通常
その幅方向（ＴＤ方向）には張力を加えず、長手方向
（ＭＤ方向）にのみ張力を加えた状態で、フツ素樹脂３
を含浸させて、プリプレグ原反１を得、これより縦方向
（ｘ方向）と横方向（ｙ方向）の長さが等しく、かつ縦
横どちらか（ここでは縦方向）が基材長手方向に沿う正
方形状のプリプレグ１ａを、複数枚、裁断，成形する。In (A), the fluororesin 3 is usually applied to the long fiber base material 2 without applying tension in its width direction (TD direction) but in its longitudinal direction (MD direction).
Is impregnated to obtain a prepreg raw fabric 1 from which the length in the longitudinal direction (x direction) and the transverse direction (y direction) are equal, and either the longitudinal direction or the lateral direction (here, the longitudinal direction) is along the longitudinal direction of the base material. A plurality of square prepregs 1a are cut and formed.
【００１２】長尺状繊維基材２としては、ガラス繊維、
アスベスト繊維、アルミナ繊維、ボロン繊維、窒化ホウ
素繊維、シリコ―ンカ―バイド繊維などのほか、ポリテ
トラフルオロエチレン繊維、超高分子量ポリエチレン繊
維、芳香族ポリエステル繊維などの有機繊維からなる織
布や不織布などが用いられる。厚さは、特に限定されな
いが、通常５０〜３００μｍ程度である。As the long fiber base material 2, glass fiber,
In addition to asbestos fibers, alumina fibers, boron fibers, boron nitride fibers, silicone carbide fibers, etc., woven and non-woven fabrics made of organic fibers such as polytetrafluoroethylene fibers, ultra high molecular weight polyethylene fibers, aromatic polyester fibers, etc. Is used. The thickness is not particularly limited, but is usually about 50 to 300 μm.
【００１３】フツ素樹脂３としては、ポリテトラフルオ
ロエチレン（ＰＴＦＥ）、テトラフルオロエチレン・パ
―フルオロアルキルビニルエ―テル共重合体（ＰＦ
Ａ）、テトラフルオロエチレンヘキサフルオロプロピレ
ン共重合体（ＦＥＰ）などの１種または２種以上を使用
でき、特にＰＴＦＥ７０〜９５重量％とＰＦＡおよび／
またはＦＥＰ３０〜５重量％との混合物を用いるのが好
ましい。As the fluorine resin 3, polytetrafluoroethylene (PTFE), tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PF) is used.
A), tetrafluoroethylene hexafluoropropylene copolymer (FEP) and the like can be used alone or in combination of two or more, and especially PTFE 70 to 95% by weight and PFA and / or
Alternatively, it is preferable to use a mixture with 30 to 5% by weight of FEP.
【００１４】フツ素樹脂３の含浸率、すなわちプリプレ
グ原反１の重量（長尺状繊維基材２と含浸フツ素樹脂３
との合計の重量）をｍ0 、長尺状繊維基材２の重量をｍ
1 としたとき、〔（ｍ0 −ｍ1 ）／ｍ0 〕×１００で表
される値として、通常５５〜８５重量％程度であるのが
望ましい。The impregnation rate of the fluorine resin 3, that is, the weight of the prepreg original fabric 1 (the long fiber base material 2 and the impregnated fluorine resin 3
And the weight of the long fiber base material 2 is m 0 .
When it is set to 1 , it is preferable that the value represented by [(m 0 −m 1 ) / m 0 ] × 100 is usually about 55 to 85% by weight.
【００１５】（Ｂ）において、上記のプリプレグ１ａ
を、隣接層間で、基材長手方向が縦横交互となるように
４枚重ね合わせ、これを加熱加圧により融着一体化し
て、本発明のフツ素樹脂積層板１０とする。ここで、上
記のプリプレグ１ａにあらかじめ基材長手方向（ＭＤ方
向）と幅方向（ＴＤ方向）との識別を容易にするための
適宜の処理、たとえば方向性を示す耐熱性有色インキを
印刷処理しておくと、上記交互の重ね合わせを容易に行
うことができる。In (B), the above prepreg 1a
Are laminated so that the longitudinal direction of the base material alternates vertically and horizontally between adjacent layers, and they are fused and integrated by heating and pressing to obtain a fluorine resin laminated plate 10 of the present invention. Here, the prepreg 1a is preliminarily subjected to an appropriate treatment for facilitating the discrimination between the longitudinal direction (MD direction) and the width direction (TD direction) of the base material, for example, a heat-resistant colored ink exhibiting directionality is printed. If so, the above-mentioned alternate superposition can be easily performed.
【００１６】また、上記の如く重ね合わせたプリプレグ
１ａの上下両面側に、さらにフツ素樹脂接着シ―ト４ａ
を介して金属箔５ａを配設し、これらを上記プリプレグ
１ａと一緒に加熱加圧して融着一体化することにより、
両面側に金属箔５ａを有する本発明の回路基板１１とす
る。Further, a fluorine resin adhesive sheet 4a is further provided on the upper and lower surfaces of the prepreg 1a which are superposed as described above.
By arranging the metal foil 5a through the above, and heating and pressing these together with the prepreg 1a to fuse and integrate them,
The circuit board 11 of the present invention has the metal foils 5a on both sides.
【００１７】フツ素樹脂接着シ―ト４ａは、プリプレグ
原反１のフツ素樹脂と同様のもの、つまりＰＴＦＥ、Ｐ
ＦＡ、ＦＥＰなどの厚さが通常１５〜１００μｍのもの
が用いられるが、場合により省くこともできる。金属箔
５ａは、銅箔、アルミニウム箔、ニツケル箔、ステンレ
ス鋼箔などの厚さが通常１８〜７０μｍのものが用いら
れる。加熱加圧の条件は、プリプレグ１ａや接着シ―ト
４ａの樹脂分を溶融しうる温度で、通常１０〜５０Kg／
cm2 程度の圧力とする。The fluorine resin adhesive sheet 4a is the same as the fluorine resin of the prepreg original fabric 1, that is, PTFE and P.
The thickness of FA, FEP or the like is usually 15 to 100 μm, but it may be omitted depending on the case. As the metal foil 5a, a copper foil, an aluminum foil, a nickel foil, a stainless steel foil or the like having a thickness of usually 18 to 70 μm is used. The heating and pressing conditions are such that the resin content of the prepreg 1a and the adhesive sheet 4a can be melted, usually 10 to 50 kg /
The pressure should be about cm 2 .
【００１８】（Ｃ）において、上記の回路基板１１を用
い、その両面の金属箔５ａをパタ―ン加工して回路板１
２を作製したのち、この回路板１２の上下両面側に、プ
リプレグ１ａを介して別の金属箔５ｂを配設し、かつ回
路板１２とプリプレグ１ａとの間およびプリプレグ１ａ
と金属箔５ｂとの間にそれぞれフツ素樹脂接着シ―ト４
ｂを介在させ、これらを一緒に加熱加圧して融着一体化
することにより、内層回路板１２と外層用金属箔５ｂを
有する本発明の多層回路基板１３とする。In FIG. 1C, the circuit board 1 is formed by patterning the metal foils 5a on both sides of the circuit board 11 described above.
After preparing 2, the other metal foils 5b are arranged on the upper and lower sides of the circuit board 12 via the prepreg 1a, and between the circuit board 12 and the prepreg 1a and the prepreg 1a.
And fluorocarbon resin adhesive sheet 4 between the metal foil 5b and the metal foil 5b, respectively.
By interposing b, and heating and pressing them together to fuse and integrate them, the multilayer circuit board 13 of the present invention having the inner layer circuit board 12 and the outer layer metal foil 5b is obtained.
【００１９】内層回路板１２の作製において、金属箔５
ａのパタ―ン加工は、通常のプリント回路板の製造と同
様に、剥離現像型、溶剤現像型、アルカリ現像型などの
フオトレジストを用いて行える。たとえば、回路基板１
１の金属箔５ａ表面にアルカリ現像型フオトレジスト層
を形成し、その上からフオトマスクを介してパタ―ン状
に露光し、ついでフオトレジストの未露光部分をアルカ
リ現像液にて溶解除去して金属箔５ａを部分的に露出さ
せたのち、金属箔５ａの露出部を化学的エツチングによ
り除去し、最後にフオトレジストの露光部を溶剤により
除去すれば、フオトレジストの露光パタ―ンの金属回路
を有する回路板１２が得られる。In the production of the inner layer circuit board 12, the metal foil 5
The patterning of a can be performed by using a photoresist of peeling development type, solvent development type, alkali development type or the like, as in the production of ordinary printed circuit boards. For example, circuit board 1
1. Form an alkali-development type photoresist layer on the surface of the metal foil 5a of No. 1 and then expose it in a pattern through a photo mask, and then dissolve and remove the unexposed portion of the photoresist with an alkali developing solution. After partially exposing the foil 5a, the exposed portion of the metal foil 5a is removed by chemical etching, and finally, the exposed portion of the photoresist is removed by a solvent, whereby the metal circuit of the exposed pattern of the photoresist is formed. The circuit board 12 which has is obtained.
【００２０】この回路板１２の上下両面側に設けられる
プリプレグ１ａは、回路板１２を構成する最外層のプリ
プレグ１ａとの間で、基材長手方向が縦横交互となるよ
うに重ね合わせることが必要で、こうすることにより融
着一体化時の縦横どちらかへの熱収縮をうまく抑制でき
る。また、回路板１２の上下両面側にそれぞれ２枚以上
のプリプレグ１ａを設ける場合は、回路基板１１の作製
の場合と同様に、隣接層間で、基材長手方向が縦横交互
となるようにするのがよい。The prepregs 1a provided on both the upper and lower sides of the circuit board 12 must be overlapped with the outermost prepregs 1a constituting the circuit board 12 so that the longitudinal direction of the base material alternates vertically and horizontally. By doing so, thermal contraction in either the vertical or horizontal direction at the time of fusion and integration can be effectively suppressed. When two or more prepregs 1a are provided on each of the upper and lower sides of the circuit board 12, as in the case of manufacturing the circuit board 11, the longitudinal directions of the base material are alternated between adjacent layers. Is good.
【００２１】回路板１２とプリプレグ１ａとの間および
プリプレグ１ａと金属箔５ｂとの間にそれぞれ設けるフ
ツ素樹脂接着シ―ト４ｂは、前記のフツ素樹脂接着シ―
ト４ａと同様のものを使用でき、その厚さは、１５〜１
００μｍであるのがよい。なお、この接着シ―ト４ｂ
は、必ずしも用いなくともよい。また、金属箔５ｂは、
前記の金属箔５ａと全く同様のものを使用できる。加熱
加圧の条件は、プリプレグ１ａや接着シ―ト４ｂの樹脂
分を溶融しうる温度で、通常１０〜５０Kg／cm2程度の
圧力とすればよい。The fluorine resin adhesive sheet 4b provided between the circuit board 12 and the prepreg 1a and between the prepreg 1a and the metal foil 5b is the fluorine resin adhesive sheet described above.
The same as that of the grate 4a can be used, and the thickness is 15 to 1
It is preferably 00 μm. In addition, this adhesive sheet 4b
Need not necessarily be used. Also, the metal foil 5b is
The same metal foil 5a as described above can be used. Conditions of heat and pressure, the prepreg 1a and adhesive sheet - at a temperature capable of melting the resin content of the preparative 4b, may be usually 10 to 50 kg / cm 2 pressure of about.
【００２２】このようにして作製される多層回路基板１
３を用いて、その両面の金属箔５ｂに、内層回路板１２
の作製の場合と同様の手法でパタ―ン加工を施して、所
望の回路パタ―ンを形成することにより、内外層に回路
パタ―ンを有する多層回路板を得ることができる。The multilayer circuit board 1 produced in this way
3 on the metal foil 5b on both sides of the inner layer circuit board 12
By performing a patterning process in the same manner as in the case of (1) to form a desired circuit pattern, a multilayer circuit board having circuit patterns in the inner and outer layers can be obtained.
【００２３】なお、上記の図１では、プリプレグ原反１
から正方形状のプリプレグ１ａを得ているが、図２に示
すように、長方形状のプリプレグ１ｂ，１ｃを得るよう
にしてもよい。この場合、一方のプリプレグ１ｂは縦方
向（ｘ方向）が基材長手方向（ＭＤ方向）に沿うよう
に、他方のプリプレグ１ｃは横方向（ｙ方向）が基材長
手方向に沿うように〔つまり、縦方向が基材幅方向（Ｔ
Ｄ方向）に沿うように〕、それぞれ裁断，成形し、この
２種のプリプレグ１ｂ，１ｃを交互に重ね合わせ、前記
同様の一体化処理を施すことにより、隣接層間で基材長
手方向が縦横交互となる、図１と同様のフツ素樹脂積層
板１０、回路基板１１および多層回路基板１３を作製す
ることができる。In the above-mentioned FIG. 1, the prepreg original fabric 1
Although a square prepreg 1a is obtained from the above, rectangular prepregs 1b and 1c may be obtained as shown in FIG. In this case, one prepreg 1b has its longitudinal direction (x direction) aligned with the longitudinal direction of the base material (MD direction), and the other prepreg 1c has its lateral direction (y direction) aligned with the longitudinal direction of the base material [that is, , The vertical direction is the base material width direction (T
Along the D direction)], each of the two prepregs 1b and 1c is cut and molded, and the two types of prepregs 1b and 1c are alternately overlapped with each other, and the same integration treatment as described above is performed. It is possible to produce the same fluororesin laminated plate 10, circuit board 11 and multilayer circuit board 13 as shown in FIG.
【００２４】[0024]
【発明の効果】以上のように、本発明においては、長尺
状繊維基材にフツ素樹脂を含浸させてなるプリプレグ原
反から、縦横どちらかが基材長手方向に沿う矩形状のプ
リプレグを成形して、その所要枚数を隣接層間などで基
材長手方向が縦横交互となるように重ね合わせて融着一
体化させるようにしたことにより、寸法変化率が縦横で
ほぼ同じであつて、かつ縦横の寸法変化率が共に小さい
フツ素樹脂積層板、回路基板および多層回路基板を得る
ことができる。As described above, in the present invention, a prepreg raw material obtained by impregnating a long fiber base material with a fluorine resin is used to form a rectangular prepreg whose length or width is along the base material longitudinal direction. By molding and fusing the required number of sheets so that the longitudinal direction of the base material alternates between the adjacent layers in the vertical direction and the horizontal direction, the dimensional change rate is substantially the same in the vertical and horizontal directions, and It is possible to obtain a fluororesin laminate, a circuit board, and a multi-layer circuit board having a small vertical and horizontal dimensional change rate.
【００２５】[0025]
【実施例】つぎに、本発明の実施例を記載して、より具
体的に説明する。EXAMPLES Next, examples of the present invention will be described to more specifically describe.
【００２６】実施例１ ＜内層回路板の作製＞厚さが５０μｍの長尺状ガラスク
ロス〔日東紡（株）製のＷＥＡ０５Ｅ〕に、ポリテトラ
フルオロエチレンデイスパ―ジヨン〔三井・デユポン・
フロロケミカル（株）製の３４４３−Ｊ〕を含浸率７７
重量％で含浸したプリプレグ原反より、縦横同寸の正方
形状のプリプレグを裁断，成形した。Example 1 <Preparation of Inner Layer Circuit Board> A long glass cloth having a thickness of 50 μm (WEA05E manufactured by Nitto Boseki Co., Ltd.) was added to a polytetrafluoroethylene dispersion (Mitsui Deyupon).
Fluorochemical Co., Ltd. 3443-J] impregnation rate 77
From the prepreg original fabric impregnated with the weight%, a square prepreg having the same length and width was cut and molded.
【００２７】この正方形状のプリプレグを、ガラスクロ
スの長手方向（ＭＤ方向）が基板の縦方向（ｘ方向）、
つぎに同方向が基板の横方向（ｙ方向）と、交互になる
ように、４枚重ね合わせ、その上下両面に厚さ５０μｍ
のＰＴＦＥシ―ト、つぎに厚さ３５μｍの銅箔〔古河・
サ―キツトフオイル（株）製の電解銅箔〕を配置し、こ
れらを３９０℃，圧力５０Kg／cm2 で３０分間加熱加圧
して、内層用回路基板を得た。つぎに、この基板の銅箔
をアルカリ現像型フオトレジストを用いてパタ―ン加工
して、内層回路板を作製した。In this square prepreg, the longitudinal direction (MD direction) of the glass cloth is the longitudinal direction (x direction) of the substrate,
Next, four sheets are stacked so that the same direction is alternated with the lateral direction (y direction) of the substrate, and the thickness is 50 μm on both upper and lower sides.
PTFE sheet, and then 35 μm thick copper foil [Furukawa
Electrolytic copper foil manufactured by Sarkitto Oil Co., Ltd.] was placed, and these were heated and pressed at 390 ° C. and a pressure of 50 kg / cm 2 for 30 minutes to obtain an inner layer circuit board. Next, the copper foil of this substrate was patterned using an alkali-developable photoresist to produce an inner layer circuit board.
【００２８】＜多層回路板の作製＞この内層回路板の上
下両面に、厚さ２５μｍのＦＥＰシ―ト〔東レ（株）
製〕、つぎに内層回路板を構成する最外層のプリプレグ
との間でガラスクロスの長手方向（ＭＤ方向）が縦横交
互する同上プリプレグ、さらに厚さ２５μｍのＦＥＰシ
―トを介して、厚さ１８μｍの銅箔〔古河・サ―キツト
フオイル（株）製の電解銅箔〕を配置し、これらを温度
３００℃，圧力１０Kg／cm2 で３０分間加熱加圧して、
多層回路基板を得た。<Preparation of Multi-Layered Circuit Board> On the upper and lower surfaces of this inner layer circuit board, a FEP sheet having a thickness of 25 μm [Toray Industries, Inc.]
Then, the prepreg in which the longitudinal direction (MD direction) of the glass cloth alternates longitudinally and transversely with the prepreg of the outermost layer constituting the inner layer circuit board, and further, through a FEP sheet having a thickness of 25 μm, 18 μm copper foil [electrolytic copper foil manufactured by Furukawa-Sakittofu Oil Co., Ltd.] is placed, and these are heated and pressurized at a temperature of 300 ° C. and a pressure of 10 kg / cm 2 for 30 minutes,
A multilayer circuit board was obtained.
【００２９】つぎに、この基板の銅箔をアルカリ現像型
フオトレジストを用いてパタ―ン加工して、多層回路板
を作製した。この多層回路板は、用いたプリプレグの原
寸に比べ、縦横の寸法変化率が共に−０．０４％という
非常に小さい値であつた。Next, the copper foil of this substrate was patterned using an alkali developing type photoresist to prepare a multilayer circuit board. This multilayer circuit board had a very small vertical and horizontal dimensional change rate of -0.04% as compared with the original size of the prepreg used.
【００３０】比較例１ 多層回路板の作製において、内層回路板の上下両面に配
置するプリプレグを、内層回路板を構成する最外層のプ
リプレグとの間でガラスクロスの長手方向（ＭＤ方向）
が同方向となるようにした以外は、実施例１と同様にし
て、多層回路板を作製した。この回路板は、横方向の寸
法変化率が−０．０４％であつたのに対し、縦方向の寸
法変化率が０．０８％と大きかつた。Comparative Example 1 In the production of a multilayer circuit board, the prepregs arranged on both upper and lower surfaces of the inner layer circuit board and the outermost layer of the prepreg forming the inner layer circuit board are in the longitudinal direction (MD direction) of the glass cloth.
A multilayer circuit board was produced in the same manner as in Example 1 except that the directions were in the same direction. This circuit board had a large dimensional change rate of −0.04% in the horizontal direction, while having a large dimensional change rate of 0.08% in the vertical direction.
【００３１】比較例２ 内層回路板の作製において、４枚のプリプレグをガラス
クロスの長手方向（ＭＤ方向）が同方向となるように重
ね合わせた以外は、実施例１と同様にして、多層回路板
を作製した。この回路板は、横方向の寸法変化率が−
０．０５％であつたのに対し、縦方向の寸法変化率が
０．１０％と大きかつた。Comparative Example 2 A multilayer circuit was prepared in the same manner as in Example 1 except that four prepregs were laminated so that the longitudinal direction (MD direction) of the glass cloth was the same in the production of the inner layer circuit board. A plate was made. This circuit board has a lateral dimensional change rate of −
While it was 0.05%, the dimensional change rate in the longitudinal direction was as large as 0.10%.
【００３２】比較例３ 内層回路板の作製において、４枚のプリプレグをガラス
クロスの長手方向（ＭＤ方向）が同方向となるように重
ね合わせ、かつ多層回路板の作製において、内層回路板
の上下両面に配置するプリプレグを、内層回路板を構成
する最外層のプリプレグとの間でガラスクロスの長手方
向（ＭＤ方向）が同方向となるようにした以外は、実施
例１と同様にして、多層回路板を作製した。この回路板
は、横方向の寸法変化率が−０．０４％であつたのに対
し、縦方向の寸法変化率が０．１２％と非常に大きかつ
た。Comparative Example 3 In the production of the inner layer circuit board, four prepregs were superposed so that the longitudinal direction (MD direction) of the glass cloth was the same direction, and in the production of the multilayer circuit board, the inner layer circuit board was placed above and below. In the same manner as in Example 1, except that the prepregs arranged on both sides were made to have the same longitudinal direction (MD direction) of the glass cloth as that of the prepreg of the outermost layer constituting the inner layer circuit board. A circuit board was produced. This circuit board had a lateral dimensional change rate of -0.04%, while the longitudinal dimensional change rate was 0.12%, which was very large.
【図１】本発明のフツ素樹脂積層板、回路基板および多
層回路基板の説明図で、（Ａ）はプリプレグ原反から矩
形状のプリプレグを裁断，成形する態様を示す平面図、
（Ｂ）はこの矩形状のプリプレグを用いて得たフツ素樹
脂積層板とその両面に金属箔が設けられた回路基板を示
す断面図、（Ｃ）は上記回路基板を用いて作製した多層
回路基板を示す断面図である。FIG. 1 is an explanatory view of a fluorine resin laminated plate, a circuit board and a multilayer circuit board of the present invention, (A) is a plan view showing a mode of cutting and molding a rectangular prepreg from a prepreg raw fabric,
(B) is a cross-sectional view showing a fluorine resin laminated plate obtained by using this rectangular prepreg and a circuit board provided with metal foils on both surfaces thereof, (C) is a multilayer circuit produced by using the circuit board. It is sectional drawing which shows a board | substrate.
【図２】本発明のプリプレグ原反から矩形状のプリプレ
グを裁断，成形する別の態様を示す平面図である。FIG. 2 is a plan view showing another mode of cutting and molding a rectangular prepreg from the prepreg original fabric of the present invention.
１ プリプレグ原反 １ａ，１ｂ，１ｃ 矩形状のプリプレグ ２ 長尺状繊維基材 ３ フツ素樹脂 ５ａ，５ｂ 金属箔 １０ フツ素樹脂積層板 １１ 回路基板 １２ 内層回路板 １３ 多層回路基板 ＭＤ方向 基材長手方向 ＴＤ方向 基材幅方向 ｘ方向 矩形状のプリプレグ（ないし積層板および基
板）の縦方向 ｙ方向 矩形状のプリプレグ（ないし積層板および基
板）の横方向1 prepreg original fabric 1a, 1b, 1c rectangular prepreg 2 long fiber base material 3 fluorine resin 5a, 5b metal foil 10 fluorine resin laminated plate 11 circuit board 12 inner layer circuit board 13 multilayer circuit board MD direction base material Longitudinal direction TD direction Base material width direction x direction Longitudinal direction of rectangular prepreg (or laminated plate and substrate) y direction Horizontal direction of rectangular prepreg (or laminated plate and substrate)
───────────────────────────────────────────────────── フロントページの続き (72)発明者 江里口 冬樹 大阪府茨木市下穂積１丁目１番２号 日東 電工株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Fuyuki Eriguchi 1-2-1, Shimohozumi, Ibaraki City, Osaka Prefecture Nitto Denko Corporation
Claims (4)
てなるプリプレグ原反から、縦横どちらかが基材長手方
向に沿う矩形状のプリプレグを成形し、その所要枚数
を、隣接層間で、基材長手方向が縦横交互となるように
重ね合わせて、融着一体化してなるフツ素樹脂積層板。1. A rectangular prepreg formed by impregnating a long-sized fiber base material with a fluorocarbon resin to form a rectangular prepreg whose length or width is in the longitudinal direction of the base material. Then, a fluororesin laminated plate is obtained by stacking and fusing and unifying the base materials so that the longitudinal directions of the base materials alternate in the vertical and horizontal directions.
下両面に金属箔が設けられてなる回路基板。2. A circuit board provided with metal foils on the upper and lower surfaces of the fluororesin laminate according to claim 1.
した内層回路板と、その上下両面に請求項１に記載の矩
形状のプリプレグを介して設けた金属箔とからなる多層
回路基板であつて、かつ上記のプリプレグは、内層回路
板を構成する最外層のプリプレグとの間で、基材長手方
向が縦横交互となるようにされている多層回路基板。3. A multilayer circuit board comprising an inner layer circuit board produced by using the circuit board according to claim 2 and metal foils provided on both upper and lower surfaces thereof with the rectangular prepreg according to claim 1 interposed therebetween. The prepreg is a multilayer circuit board in which the longitudinal direction of the base material alternates vertically and horizontally with the prepreg of the outermost layer that constitutes the inner circuit board.
て、内層回路板の上下両面側に設けられるプリプレグが
それぞれ２枚以上からなり、各プリプレグは、隣接層間
で、基材長手方向が縦横交互となるようにされている多
層回路基板。4. The multilayer circuit board according to claim 3, wherein two or more prepregs are provided on each of the upper and lower sides of the inner layer circuit board, and each prepreg has a longitudinal direction of the base material alternated between adjacent layers. Multilayer circuit board that is designed to be.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21733192A JPH0639958A (en) | 1992-07-22 | 1992-07-22 | Fluorine resin-laminated sheet, circuit board and multi-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21733192A JPH0639958A (en) | 1992-07-22 | 1992-07-22 | Fluorine resin-laminated sheet, circuit board and multi-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0639958A true JPH0639958A (en) | 1994-02-15 |
Family
ID=16702508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21733192A Pending JPH0639958A (en) | 1992-07-22 | 1992-07-22 | Fluorine resin-laminated sheet, circuit board and multi-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639958A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1551210A1 (en) * | 2003-05-19 | 2005-07-06 | Matsushita Electric Industrial Co., Ltd. | Circuit formation substrate manufacturing method and circuit formation substrate material |
| JP2008300391A (en) * | 2007-05-29 | 2008-12-11 | Panasonic Corp | Method of manufacturing circuit formation substrate |
-
1992
- 1992-07-22 JP JP21733192A patent/JPH0639958A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1551210A1 (en) * | 2003-05-19 | 2005-07-06 | Matsushita Electric Industrial Co., Ltd. | Circuit formation substrate manufacturing method and circuit formation substrate material |
| EP1551210A4 (en) * | 2003-05-19 | 2009-11-11 | Panasonic Corp | Circuit formation substrate manufacturing method and circuit formation substrate material |
| US8069557B2 (en) | 2003-05-19 | 2011-12-06 | Panasonic Corporation | Method of manufacturing circuit forming board |
| JP2008300391A (en) * | 2007-05-29 | 2008-12-11 | Panasonic Corp | Method of manufacturing circuit formation substrate |
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