JP5043480B2 - プリント基板加工機 - Google Patents
プリント基板加工機 Download PDFInfo
- Publication number
- JP5043480B2 JP5043480B2 JP2007065313A JP2007065313A JP5043480B2 JP 5043480 B2 JP5043480 B2 JP 5043480B2 JP 2007065313 A JP2007065313 A JP 2007065313A JP 2007065313 A JP2007065313 A JP 2007065313A JP 5043480 B2 JP5043480 B2 JP 5043480B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- dot
- character
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Numerical Control (AREA)
Description
d ドット
Claims (1)
- プリント基板を加工領域に区分し、複数のドットで構成される文字の前記ドット位置情報を文字毎に記憶した記憶装置を備え、加工プログラムに記載された加工しようとする穴の位置情報と文字列および該文字列の位置情報とに基づいてパルス状のレーザ光をワークに照射し、前記ワークに穴および文字を加工するようにしたプリント基板加工機において、
前記文字列を構成する各文字の前記各ドットの各中心座標を前記穴を加工する加工座標系の座標に変換する座標変換手段を設け、
加工に先立ち、前記文字列を構成する各文字の前記各ドットの各中心座標を前記穴を加工する加工座標系の座標に変換し、
前記各ドットがいずれの加工領域に含まれるかを確認し、
前記加工プログラムの前記各ドットが含まれる加工領域の穴加工座標の記述部に前記各ドットの変換後の座標を追加し、
前記各ドットを前記穴とみなして加工すること
を特徴とするプリント基板加工機。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007065313A JP5043480B2 (ja) | 2007-03-14 | 2007-03-14 | プリント基板加工機 |
TW097101293A TWI409009B (zh) | 2007-03-14 | 2008-01-14 | Printing substrate processing machine |
KR1020080009399A KR101380696B1 (ko) | 2007-03-14 | 2008-01-30 | 프린트 기판 가공기 |
CN2008100741130A CN101266478B (zh) | 2007-03-14 | 2008-02-14 | 印刷电路板加工机 |
US12/034,317 US7933675B2 (en) | 2007-03-14 | 2008-02-20 | Machining apparatus for drilling printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007065313A JP5043480B2 (ja) | 2007-03-14 | 2007-03-14 | プリント基板加工機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008221301A JP2008221301A (ja) | 2008-09-25 |
JP5043480B2 true JP5043480B2 (ja) | 2012-10-10 |
Family
ID=39761593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007065313A Expired - Fee Related JP5043480B2 (ja) | 2007-03-14 | 2007-03-14 | プリント基板加工機 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7933675B2 (ja) |
JP (1) | JP5043480B2 (ja) |
KR (1) | KR101380696B1 (ja) |
CN (1) | CN101266478B (ja) |
TW (1) | TWI409009B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102348527B (zh) | 2009-04-15 | 2014-07-09 | 三菱电机株式会社 | 激光加工方法以及激光加工装置 |
CN102266958B (zh) * | 2011-07-07 | 2012-11-28 | 上海交通大学 | 基于制孔设备坐标系确定的柔性导轨孔群加工方法 |
CN105307395B (zh) * | 2014-07-14 | 2018-06-12 | 深港产学研基地 | Pcb板信息采集设备 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04339581A (ja) * | 1991-05-16 | 1992-11-26 | Nec Corp | レーザマーキング装置 |
JPH05293677A (ja) * | 1992-04-20 | 1993-11-09 | Fujitsu Ltd | レーザ刻印装置 |
US5985680A (en) * | 1997-08-08 | 1999-11-16 | Applied Materials, Inc. | Method and apparatus for transforming a substrate coordinate system into a wafer analysis tool coordinate system |
CN1124917C (zh) * | 1997-12-26 | 2003-10-22 | 三菱电机株式会社 | 激光加工装置 |
DE19782307B4 (de) | 1997-12-26 | 2006-11-30 | Mitsubishi Denki K.K. | Laserbearbeitungsgerät |
JP3052928B2 (ja) * | 1998-04-01 | 2000-06-19 | 日本電気株式会社 | レーザ加工装置 |
JP3495359B2 (ja) * | 2001-12-21 | 2004-02-09 | コニカミノルタホールディングス株式会社 | 感光材料へのマーキング方法 |
JP4143334B2 (ja) * | 2002-05-24 | 2008-09-03 | 日立ビアメカニクス株式会社 | プリント基板穴明け用レーザ加工機の制御方法 |
JP3822188B2 (ja) * | 2002-12-26 | 2006-09-13 | 日立ビアメカニクス株式会社 | 多重ビームレーザ穴あけ加工装置 |
JP2005007471A (ja) * | 2003-06-16 | 2005-01-13 | Ricoh Unitechno Co Ltd | レーザマーカの印字制御方法 |
JP2005066653A (ja) * | 2003-08-26 | 2005-03-17 | Gijutsu Transfer Service:Kk | レーザマーキング装置およびレーザマーキング方法 |
JP2005101305A (ja) * | 2003-09-25 | 2005-04-14 | Sumitomo Heavy Ind Ltd | 無機窒化物部材のマーキング方法および無機窒化物部材 |
JP4363954B2 (ja) * | 2003-10-23 | 2009-11-11 | サンクス株式会社 | レーザマーキング装置 |
JP2005313204A (ja) * | 2004-04-28 | 2005-11-10 | Sunx Ltd | レーザ孔形成装置、レーザ加工装置及びレーザ孔形成方法 |
-
2007
- 2007-03-14 JP JP2007065313A patent/JP5043480B2/ja not_active Expired - Fee Related
-
2008
- 2008-01-14 TW TW097101293A patent/TWI409009B/zh not_active IP Right Cessation
- 2008-01-30 KR KR1020080009399A patent/KR101380696B1/ko not_active IP Right Cessation
- 2008-02-14 CN CN2008100741130A patent/CN101266478B/zh not_active Expired - Fee Related
- 2008-02-20 US US12/034,317 patent/US7933675B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI409009B (zh) | 2013-09-11 |
US20080223833A1 (en) | 2008-09-18 |
KR20080084573A (ko) | 2008-09-19 |
US7933675B2 (en) | 2011-04-26 |
CN101266478A (zh) | 2008-09-17 |
TW200843580A (en) | 2008-11-01 |
CN101266478B (zh) | 2012-01-25 |
JP2008221301A (ja) | 2008-09-25 |
KR101380696B1 (ko) | 2014-04-03 |
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