JP5030530B2 - 発光素子アレイおよび紙葉類の認識装置 - Google Patents
発光素子アレイおよび紙葉類の認識装置 Download PDFInfo
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- JP5030530B2 JP5030530B2 JP2006294518A JP2006294518A JP5030530B2 JP 5030530 B2 JP5030530 B2 JP 5030530B2 JP 2006294518 A JP2006294518 A JP 2006294518A JP 2006294518 A JP2006294518 A JP 2006294518A JP 5030530 B2 JP5030530 B2 JP 5030530B2
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Description
図11は、受光素子に特公平5−31865号公報などに示される構成の電荷蓄積型リニアイメージセンサを用いた場合のタイミング図の一例を示したものである。図11を参照して、まずLED49aをオンして蓄積を開始し、オフした直後にスタートパルスを入力してLED49aによる信号を出力する。LED49aの信号出力が終了した後、LED49b、LED49cのそれぞれの信号を出力して1ラインの読み込みを行なうことができる。
Claims (6)
- 互いに異なる波長の光を発し、電極に電気的に接続される第1発光素子および第2発光素子と、
一方向に開放され、樹脂により充填される第1室および第2室を含む1つの基材とを備え、
前記第1発光素子および前記第2発光素子は、それぞれ前記第1室および前記第2室に分離して配置され、前記樹脂により覆われる、発光素子アレイ。 - 前記第1室を充填する前記樹脂と、前記第2室を充填する前記樹脂との間で、材質または硬度が異なる、請求項1に記載の発光素子アレイ。
- 前記第1発光素子は、主発光波長570nm未満の波長の光を発し、前記第2発光素子は、主発光波長570nm以上980nm以下の波長の光を発する、請求項1または請求項2に記載の発光素子アレイ。
- 請求項1から請求項3のいずれか1項に記載の発光素子アレイが用いられた紙葉類の認識装置であって、
紙葉類に光を照射する照明装置と、
前記照明装置から出射され、前記紙葉類を透過または反射した光を導くためのレンズアレイと、
前記レンズアレイにより導かれた光を受光する受光素子とを備え、
前記照明装置は、長手状に延び入射された光を前記紙葉類に向けて出射させる光拡散層が形成された導光体と、前記導光体の長手方向の少なくとも一方の端面付近に配置された前記発光素子アレイとを含む、紙葉類の認識装置。 - 前記樹脂は、前記第1発光素子および前記第2発光素子から発せられた光を出射し、凹形状を有する出射面を含み、
前記発光素子アレイは、前記端面と接触するように設けられる、請求項4に記載の紙葉類の認識装置。 - 発光波長の異なる前記第1発光素子および前記第2発光素子を、順次切り替えて点灯させる、請求項4または請求項5に記載の紙葉類の認識装置。
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JP2006294518A JP5030530B2 (ja) | 2006-10-30 | 2006-10-30 | 発光素子アレイおよび紙葉類の認識装置 |
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JP2008112301A JP2008112301A (ja) | 2008-05-15 |
JP5030530B2 true JP5030530B2 (ja) | 2012-09-19 |
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Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US8088066B2 (en) | 2007-10-24 | 2012-01-03 | Invuity, Inc. | Blade insert illuminator |
US11382711B2 (en) | 2008-08-13 | 2022-07-12 | Invuity, Inc. | Cyclo olefin polymer and copolymer medical devices |
US8317693B2 (en) * | 2008-08-13 | 2012-11-27 | Invuity, Inc. | Cyclo olefin polymer and copolymer medical devices |
US9282878B2 (en) | 2008-08-13 | 2016-03-15 | Invuity, Inc. | Cyclo olefin polymer and copolymer medical devices |
JP5203289B2 (ja) * | 2009-05-12 | 2013-06-05 | 株式会社ヴィーネックス | ライン光源ユニット及び紙葉類の読取装置 |
KR101364848B1 (ko) | 2009-12-28 | 2014-02-19 | 케논 콤포넨트 가부시키가이샤 | 밀착형 이미지 센서 유닛, 및 그것을 사용한 화상 판독 장치 |
JP5139507B2 (ja) | 2010-12-10 | 2013-02-06 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニット、及び、画像読取装置 |
JP5204207B2 (ja) | 2010-12-17 | 2013-06-05 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニットおよびそれを用いた画像読取装置 |
JP5244952B2 (ja) * | 2010-12-21 | 2013-07-24 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニット、及び、画像読取装置 |
JP5384471B2 (ja) | 2010-12-28 | 2014-01-08 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニット、及び、画像読取装置 |
JP5400188B2 (ja) | 2011-05-11 | 2014-01-29 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニットおよびそれを用いた画像読取装置、画像形成装置 |
JP5384707B2 (ja) | 2011-08-09 | 2014-01-08 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニット及びこれを用いた画像読取装置 |
JP5518953B2 (ja) | 2011-08-09 | 2014-06-11 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニットおよび画像読取装置 |
JP5536150B2 (ja) | 2011-08-09 | 2014-07-02 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニット及び画像読取装置 |
JP5750080B2 (ja) * | 2012-04-17 | 2015-07-15 | 株式会社ヴィーネックス | 紫外光照射ユニット及びその実装方法 |
JP6292016B2 (ja) * | 2014-05-13 | 2018-03-14 | 沖電気工業株式会社 | 鑑別装置及び媒体取引装置 |
JP7185423B2 (ja) * | 2018-06-08 | 2022-12-07 | 株式会社ヴィーネックス | 導光体及びそれを用いた光学ラインセンサ、並びに、導光体の製造方法 |
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JPH07105185B2 (ja) * | 1987-05-15 | 1995-11-13 | オムロン株式会社 | 光電スイッチ |
JP2999680B2 (ja) * | 1994-12-06 | 2000-01-17 | 日本板硝子株式会社 | 棒状照明装置およびそれを用いた原稿読み取り装置 |
JP2003046726A (ja) * | 2001-07-30 | 2003-02-14 | Kanegafuchi Chem Ind Co Ltd | 紙葉類の印刷パターン読取装置 |
JP4684588B2 (ja) * | 2004-07-28 | 2011-05-18 | 株式会社ヴィーネックス | 紙葉類の認識装置 |
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