JP4997785B2

JP4997785B2 - Automotive electronics circuit module

Info

Publication number: JP4997785B2
Application number: JP2006039713A
Authority: JP
Inventors: 貴史高田
Original assignee: Denso Corp
Current assignee: Denso Corp
Priority date: 2006-02-16
Filing date: 2006-02-16
Publication date: 2012-08-08
Anticipated expiration: 2026-02-16
Also published as: JP2007216836A

Description

本発明は、車載用電子機器回路モジュールに関する。 The present invention relates to an in-vehicle electronic device circuit module.

特開平６−２１６６６JP-A-6-21666

ＥＣＵやセンサを周辺回路とともに搭載した車載用電子機器回路モジュールは、回路部品と該回路部品が構成する機器回路の入出力用のコネクタとが基板上に実装され、さらにその基板モジュールが筐体に収容された構造が一般的である。筐体の密閉度が低いと、筐体外からダスト（特に、導電性のダストが問題である）や水滴が侵入し、回路の故障や誤動作を招きやすくなる。また、水蒸気を含んだ外気が筐体内に漏入する環境下では、筐体がさらされる外気温の変動により回路上に結露を生ずることがあり、同様の不具合につながる。集積回路（特に、ＣＰＵやマイコンを構成するＬＳＩ）や、クロック回路等の要部をなす水晶ないしセラミック製の発振子は結露に対する耐性が弱く、より慎重な配慮が必要である。 An in-vehicle electronic device circuit module in which an ECU and a sensor are mounted together with peripheral circuits has a circuit component and an input / output connector for the device circuit that the circuit component constitutes mounted on a substrate. Contained structures are common. If the sealing degree of the casing is low, dust (especially conductive dust is a problem) and water droplets enter from the outside of the casing, and the circuit is liable to malfunction or malfunction. Further, in an environment where outside air containing water vapor leaks into the housing, condensation may occur on the circuit due to fluctuations in the outside air temperature to which the housing is exposed, leading to similar problems. An integrated circuit (in particular, an LSI that constitutes a CPU or a microcomputer) and a crystal or ceramic oscillator that forms a main part of a clock circuit or the like have low resistance to dew condensation and need to be more carefully considered.

筐体の密閉度を高めるために通常、筐体を構成する本体と蓋との間など、密閉性の弱い部分にシール部材を配置して封止することが行なわれている。しかし、この構造はシール部材が必要な分だけ部品点数が増大し、組み立て工数も要する問題がある。特に、筐体のコネクタ開口用の切欠きとコネクタとの隙間は、湿気や埃等のリーク部になりやすいが、シールを介した嵌合構造は複雑化しやすく、シーラントによる充填密封構造は製造能率が甚だ悪い問題がある。また、特許文献１のごとく、蓋と筐体本体とをシール不介在の直接圧接構造とし、圧接密封の困難なコネクタを排除して端子金具を個別に筐体と一体成形することで、密閉性を高めた構造も提案もあるが、入出力の端子数が増大した場合は、コネクタを用いないので配線接続が甚だ面倒になる、致命的な欠点がある。 In order to increase the sealing degree of the casing, usually, sealing is performed by disposing a sealing member in a weakly sealing portion such as between the main body constituting the casing and the lid. However, this structure has a problem that the number of parts increases as much as the sealing member is required, and the number of assembly steps is also required. In particular, the gap between the connector notch for opening the connector and the connector is likely to become a leaking part such as moisture or dust, but the fitting structure through the seal is likely to be complicated, and the filling and sealing structure with the sealant is a manufacturing efficiency. There is a bad problem. In addition, as in Patent Document 1, the lid and the housing body are directly press-contacted with no seal, and the terminal fittings are individually molded integrally with the housing by eliminating the connectors that are difficult to press-contact and seal. There are also structures and proposals that increase the number of terminals, but when the number of input / output terminals increases, there is a fatal defect that wiring connection becomes very troublesome because no connector is used.

本発明の課題は、コネクタによる配線接続が可能であり、かつ、シール部材を用いることなく、必要な部品を結露や埃侵入等から確実に保護することができる筐体構造を有した車載用電子機器回路モジュールを提供することにある。 It is an object of the present invention to provide an in-vehicle electronic device having a housing structure that can be connected by a connector and can reliably protect necessary components from dew condensation and dust intrusion without using a seal member. It is to provide an equipment circuit module.

課題を解決するための手段及び発明の効果Means for Solving the Problems and Effects of the Invention

上記の課題を解決するため、本発明の第一の車載用電子機器回路モジュールは、
車載用電子機器の回路部品と該回路部品が構成する機器回路の入出力用のコネクタとが基板の第一主表面上に実装された基板モジュールと、前記基板モジュールを収容する筐体とを備え、
前記基板モジュールは、前記基板の第一主表面上の予め定められた基準方向における一方の端部に前記コネクタが実装され、該コネクタへの端子接続口が前記筐体の周壁部に形成された切欠内に露出する一方、
前記筐体は、前記基板の第一主表面側を覆う第一本体と、同じく第二主表面側を覆う第二本体とに分割形成され、前記第二本体の底部内面には、前記基板との間に底部空間を形成する形で該基板を第二主表面側にて支持する底部側支持部が形成されるとともに、前記回路部品に含まれる保護対象部品の配置領域として、前記基板の第一主表面上にて前記コネクタの配置領域とは排他的に保護領域が定められ、当該保護領域の上方空間を結露保護空間として区画する保護区画壁が前記第一本体の天面部内面から前記基板の前記第一主表面に向けて突出形成され、
さらに、前記基板を前記底部側支持部にて第二主表面側から支持しつつ、前記保護区画壁の先端面を第一主表面に直接的に密着圧接させた状態にて、前記第一本体と前記第二本体とを結合する本体結合部を備えてなり、
前記機器回路に含まれる配線部は、前記保護区画壁又は前記底部側支持部との当接位置において、前記基板の当該当接側と反対側の主表面を引き回される迂回配線部を有し、
前記第一本体は前記天面部周縁から立ち下がるとともに、前記基板の第一主表面の周縁部に先端面が直接的に密着圧接される第一側周壁部と、前記基板の第一主表面上にて前記第一側周壁部から内側に張り出す形で前記コネクタの周囲に沿うように配置されるコネクタ周囲空間区画壁と、該コネクタ周囲空間区画壁と、前記第一側周壁部のうち、当該コネクタ周囲空間区画壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とに囲まれた主空間を、前記基板の第一主表面の区画分割に対応した複数の空間に仕切る補助仕切壁が設けられていて、
前記補助仕切壁は、前記基準方向と交差する向きにおいて前記第一側周壁部の片側から、その反対側にまたがる形で前記主空間を分割するように形成されてなり、該補助仕切壁の先端面が前記基板の第一主表面に密着圧接されるとともに、該補助仕切壁と、前記第一側周壁部のうち、当該補助仕切壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とを前記保護区画壁として、その内部が前記結露保護空間とされ、
前記迂回配線部は、前記保護区画壁又は前記底部側支持部が前記基板を圧接する前記基板の圧接側を避けて、前記基板の反対側の主表面に引き回されて設けられていることを特徴とする。
同じく、本発明の第二の車載用電子機器回路モジュールは、
車載用電子機器の回路部品と該回路部品が構成する機器回路の入出力用のコネクタとが基板の第一主表面上に実装された基板モジュールと、前記基板モジュールを収容する筐体とを備え、
前記基板モジュールは、前記基板の第一主表面上の予め定められた基準方向における一方の端部に前記コネクタが実装され、該コネクタへの端子接続口が前記筐体の周壁部に形成された切欠内に露出する一方、
前記筐体は、前記基板の第一主表面側を覆う第一本体と、同じく第二主表面側を覆う第二本体とに分割形成され、前記第二本体の底部内面には、前記基板との間に底部空間を形成する形で該基板を第二主表面側にて支持する底部側支持部が形成されるとともに、前記回路部品に含まれる保護対象部品の配置領域として、前記基板の第一主表面上にて前記コネクタの配置領域とは排他的に保護領域が定められ、当該保護領域の上方空間を結露保護空間として区画する保護区画壁が前記第一本体の天面部内面から前記基板の前記第一主表面に向けて突出形成され、
さらに、前記基板を前記底部側支持部にて第二主表面側から支持しつつ、前記保護区画壁の先端面を第一主表面に直接的に密着圧接させた状態にて、前記第一本体と前記第二本体とを結合する本体結合部を備えてなり、
前記基板は基板内部にも内部配線層を有するものであり、前記機器回路に含まれる配線部は、前記保護区画壁又は前記底部側支持部との当接位置において前記内部配線層を引き回される迂回配線部を有し、
前記第一本体は前記天面部周縁から立ち下がるとともに、前記基板の第一主表面の周縁部に先端面が直接的に密着圧接される第一側周壁部と、前記基板の第一主表面上にて前記第一側周壁部から内側に張り出す形で前記コネクタの周囲に沿うように配置されるコネクタ周囲空間区画壁と、該コネクタ周囲空間区画壁と、前記第一側周壁部のうち、当該コネクタ周囲空間区画壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とに囲まれた主空間を、前記基板の第一主表面の区画分割に対応した複数の空間に仕切る補助仕切壁が設けられていて、
前記補助仕切壁は、前記基準方向と交差する向きにおいて前記第一側周壁部の片側から、その反対側にまたがる形で前記主空間を分割するように形成されてなり、該補助仕切壁の先端面が前記基板の第一主表面に密着圧接されるとともに、該補助仕切壁と、前記第一側周壁部のうち、当該補助仕切壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とを前記保護区画壁として、その内部が前記結露保護空間とされていて、
前記迂回配線部は、前記保護区画壁又は前記底部側支持部が前記基板を圧接する前記基板の圧接位置を避けて、前記基板内部に前記内部配線層が引き回されるように設けられていることを特徴とする。 In order to solve the above problems, the first vehicle-mounted electronic device circuit module of the present invention is
A board module in which a circuit component of an in-vehicle electronic device and a connector for input / output of a device circuit formed by the circuit component are mounted on a first main surface of the board, and a housing that houses the board module ,
In the board module, the connector is mounted at one end in a predetermined reference direction on the first main surface of the board, and a terminal connection port to the connector is formed in the peripheral wall of the casing. While exposed in the notch,
The housing is divided and formed into a first main body that covers the first main surface side of the substrate and a second main body that also covers the second main surface side. A bottom-side support portion for supporting the substrate on the second main surface side so as to form a bottom space therebetween, and as a placement region for the protection target component included in the circuit component, A protective area is defined exclusively on the main surface from the connector arrangement area, and a protective partition wall that divides an upper space of the protective area as a dew condensation protective space from the inner surface of the top surface of the first main body to the substrate. Projecting toward the first main surface of the
Further, the first main body in a state where the front end surface of the protective partition wall is in direct contact pressure contact with the first main surface while the substrate is supported from the second main surface side by the bottom side support portion. And a main body coupling portion that couples the second main body,
The wiring portion included in the device circuit has a bypass wiring portion that is routed on the main surface of the substrate opposite to the contact side at the contact position with the protective partition wall or the bottom support portion. And
The first body falls from the periphery of the top surface portion, and a first side peripheral wall portion whose tip surface is in close contact pressure contact with the peripheral portion of the first main surface of the substrate, and on the first main surface of the substrate Connector surrounding space partition wall arranged so as to extend inward from the first side peripheral wall portion at the periphery of the connector, the connector peripheral space partition wall, and the first side peripheral wall portion, Auxiliary partitioning of the main space surrounded by the connector surrounding space partition wall and the portion along the peripheral edge of the board area on the side where the connector does not exist into a plurality of spaces corresponding to the division of the first main surface of the board There is a partition wall,
The auxiliary partition wall is formed so as to divide the main space so as to extend from one side of the first side peripheral wall portion to the opposite side in a direction intersecting the reference direction. The surface is in close contact pressure contact with the first main surface of the substrate and, along the auxiliary partition wall and the first side peripheral wall portion, along the peripheral edge of the substrate region on the side where the connector does not exist with the auxiliary partition wall as a boundary With the part as the protective partition wall, the inside is the condensation protection space,
The bypass wiring part is that the previous SL protected partition wall or the bottom side support portion while avoiding the pressure side of the substrate for pressing the substrate, is provided routed on the opposite side of the main surface of said substrate It is characterized by.
Similarly, the second vehicle-mounted electronic device circuit module of the present invention is
A board module in which a circuit component of an in-vehicle electronic device and a connector for input / output of a device circuit formed by the circuit component are mounted on a first main surface of the board, and a housing that houses the board module ,
In the board module, the connector is mounted at one end in a predetermined reference direction on the first main surface of the board, and a terminal connection port to the connector is formed in the peripheral wall of the casing. While exposed in the notch,
The housing is divided and formed into a first main body that covers the first main surface side of the substrate and a second main body that also covers the second main surface side. A bottom-side support portion for supporting the substrate on the second main surface side so as to form a bottom space therebetween, and as a placement region for the protection target component included in the circuit component, A protective area is defined exclusively on the main surface from the connector arrangement area, and a protective partition wall that divides an upper space of the protective area as a dew condensation protective space from the inner surface of the top surface of the first main body to the substrate. Projecting toward the first main surface of the
Further, the first main body in a state where the front end surface of the protective partition wall is in direct contact pressure contact with the first main surface while the substrate is supported from the second main surface side by the bottom side support portion. And a main body coupling portion that couples the second main body,
The substrate also has an internal wiring layer inside the substrate, and the wiring portion included in the device circuit is routed around the internal wiring layer at a contact position with the protective partition wall or the bottom side support portion. Have a detour wiring section
The first body falls from the periphery of the top surface portion, and a first side peripheral wall portion whose tip surface is in close contact pressure contact with the peripheral portion of the first main surface of the substrate, and on the first main surface of the substrate Connector surrounding space partition wall arranged so as to extend inward from the first side peripheral wall portion at the periphery of the connector, the connector peripheral space partition wall, and the first side peripheral wall portion, Auxiliary partitioning of the main space surrounded by the connector surrounding space partition wall and the portion along the peripheral edge of the board area on the side where the connector does not exist into a plurality of spaces corresponding to the division of the first main surface of the board There is a partition wall,
The auxiliary partition wall is formed so as to divide the main space so as to extend from one side of the first side peripheral wall portion to the opposite side in a direction intersecting the reference direction. The surface is in close contact pressure contact with the first main surface of the substrate and, along the auxiliary partition wall and the first side peripheral wall portion, along the peripheral edge of the substrate region on the side where the connector does not exist with the auxiliary partition wall as a boundary With the part as the protective partition wall, the inside is the condensation protection space,
The bypass wiring part, avoiding the pressure contact position of the substrate before Symbol protective partition wall or the bottom side support part is pressed against the substrate, wherein provided as the internal wiring layers are routed within said substrate It is characterized by being.

上記本発明の車載用電子機器回路モジュールにおいては、基板上にコネクタが設けられ、そのコネクタの開口が筐体周壁部に切欠きに露出する。コネクタと筐体（切欠）との間は、構造の簡略化のためシール非使用としたいが、前述のごとく、コネクタと筐体との隙間はシールなしで密閉圧接構造を実現することが難しい。しかし、本発明のごとく、筐体を第一本体と第二本体とに分割し、第二本体側の底部側支持部にて基板を第二主表面側から支持しつつ、天面部内面から基板の第一主表面に向けて突出形成された保護区画壁の先端面を第一主表面に直接的に密着圧接させ、その状態にて第一本体と第二本体とを結合保持する構造としたから、保護区画壁の内側に区画される基板上の保護領域、ひいては当該保護領域上に配置された保護対象部品は、コネクタと筐体との間の密閉性が悪くとも、湿気や埃等の侵入から保護することができる。これにより、コネクタによる配線接続が可能でありながら、シール部材を用いることなく、必要な部品を結露や埃侵入等から確実に保護することができ、ひいては部品保護性能が車載用電子機器回路モジュールを安価に実現することができる。 In the above-described in-vehicle electronic device circuit module of the present invention, a connector is provided on the substrate, and an opening of the connector is exposed in a cutout in the peripheral wall portion of the housing. Although the seal is not used between the connector and the housing (notch) for simplification of the structure, as described above, it is difficult to realize a hermetic pressure contact structure without sealing the gap between the connector and the housing. However, as in the present invention, the housing is divided into the first main body and the second main body, and the substrate is supported from the second main surface side by the bottom side support portion on the second main body side, while the substrate is formed from the top surface inner surface. The front end surface of the protective partition wall that protrudes toward the first main surface is directly in close contact pressure contact with the first main surface, and in this state, the first main body and the second main body are joined and held. Therefore, the protection area on the substrate that is partitioned inside the protection partition wall, and thus the protection target component disposed on the protection area, may be moisture or dust even if the sealing property between the connector and the housing is poor. Can protect against intrusion. As a result, it is possible to reliably protect the necessary parts from dew condensation, dust intrusion, etc. without using a seal member, while the wiring connection by the connector is possible. It can be realized at low cost.

なお、本発明においては、基板の第一主表面側が上となるよう水平に配置した状態を基準として表現を行なっているが、これは各部の位置関係の把握を容易にするための措置であって、上記表現に含まれる「上」「下」「底部」「天面」等の文言は、車載用電子機器回路モジュールの自動車への取り付け方向を限定するものではない。 In the present invention, the expression is made with reference to the state where the first main surface side of the substrate is horizontally arranged, but this is a measure for facilitating the understanding of the positional relationship of each part. Thus, the terms “upper”, “lower”, “bottom”, “top”, and the like included in the above expression do not limit the mounting direction of the in-vehicle electronic device circuit module to the automobile.

切欠内にコネクタを嵌め合わせる構造にする場合、コネクタ天面と切欠上面とは、第一本体と第二本体との組付け時に密着圧接構造とすることが可能であるが、切欠の内側面とコネクタの側面との間には上記組付け時の圧接力を作用させることは困難である。この場合、筐体の内部空間のうち、結露保護空間外に位置するコネクタ周囲空間は、切欠とコネクタの隙間を介して筐体外空間と連通する形となる。しかし、このような構造でも、基板に密着圧接される保護区画壁を設けることにより、その内側の結露保護空間にある部品を結露や埃付着から保護することができる。 When making the structure in which the connector is fitted in the notch, the connector top surface and the notch upper surface can be in close contact pressure contact structure when the first body and the second body are assembled. It is difficult to apply the pressure contact force at the time of assembly to the side surface of the connector. In this case, of the internal space of the housing, the connector peripheral space located outside the dew condensation protection space communicates with the space outside the housing through a gap between the notch and the connector. However, even in such a structure, by providing the protective partition wall that is in close contact with the substrate, it is possible to protect the components in the dew condensation protection space inside from the dew condensation and dust adhesion.

この場合、結露による誤動作が特に生じやすい集積回路部品や発振素子を結露保護対象部品として定めておくと効果的である。特に、集積度が高く端子数も多いＣＰＵ（あるいはマイコン）は結露保護空間に配置することが望ましい。他方、結露保護空間内に特に配置する必要のない部品（結露保護対象外部品）については、コネクタ周囲空間にて基板の第一主表面に実装することができる。結露保護対象外部品は、結露による誤動作の惧れが上記のＩＣよりも小さい部品であって、例えば、リレー、インダクタ、トランジスタ、ダイオードなどのディスクリート部品や、電源用レギュレータなどがこれに該当する。 In this case, it is effective to determine an integrated circuit component or an oscillation element that is likely to cause a malfunction due to condensation as a component to be protected against condensation. In particular, it is desirable to arrange a CPU (or microcomputer) having a high degree of integration and a large number of terminals in the condensation protection space. On the other hand, components that do not need to be particularly arranged in the condensation protection space (components that are not subject to condensation protection) can be mounted on the first main surface of the substrate in the connector surrounding space. The non-condensation protection target component is a component that is less likely to malfunction due to condensation than the above-described IC, and includes, for example, discrete components such as relays, inductors, transistors, and diodes, and power supply regulators.

第一本体は天面部周縁から立ち下がるとともに、基板の第一主表面の周縁部に先端面が直接的に密着圧接される第一側周壁部と、基板の第一主表面上にて第一側周壁部から内側に張り出す形でコネクタの周囲に沿うように配置されるコネクタ周囲空間区画壁とを有するものとして構成できる。そして、該コネクタ周囲空間区画壁と、第一側周壁部のうち、当該コネクタ周囲空間区画壁を境界としてコネクタが存在しない側の基板領域周縁に沿う部分とが保護区画壁を形成するように構成できる。この構成では、筐体周壁部をなす第一側周壁部を基板の周縁部に圧接することで、該第一側周壁部の一部が保護区画壁の一部として流用されるので、基板の周縁近傍まで保護領域を拡張でき、結露保護空間をより大きく確保することができるようになる。 The first main body falls from the periphery of the top surface portion, and the first side peripheral wall portion whose tip surface is in close contact pressure contact with the peripheral portion of the first main surface of the substrate, and the first main body on the first main surface of the substrate. It can comprise as a connector surrounding space partition wall arrange | positioned so that it may extend along the circumference | surroundings of a connector in the form protruded inside from a side surrounding wall part. Further, the connector surrounding space partition wall and a portion of the first side peripheral wall portion along the peripheral edge of the board region on the side where the connector does not exist with the connector surrounding space partition wall as a boundary form a protective partition wall. it can. In this configuration, a part of the first side peripheral wall portion is diverted as a part of the protective partition wall by pressing the first side peripheral wall portion forming the casing peripheral wall portion to the peripheral edge portion of the substrate. The protection area can be expanded to the vicinity of the periphery, and a larger condensation protection space can be secured.

また、第一本体は、天面部周縁から立ち下がるとともに、基板の第一主表面の周縁部に先端面が直接的に密着圧接される第一側周壁部と、基板の第一主表面上にて第一側周壁部から内側に張り出す形でコネクタの周囲に沿うように配置されるコネクタ周囲空間区画壁と、該コネクタ周囲空間区画壁と、第一側周壁部のうち、当該コネクタ周囲空間区画壁を境界としてコネクタが存在しない側の基板領域周縁に沿う部分とに囲まれた主空間を、基板の第一主表面の区画分割に対応した複数の空間に仕切る補助仕切壁を有したものとして構成することができる。補助仕切壁を設けることで、主空間を、結露保護空間を含む複数区間に分割でき、筐体内部の空間活用のバリエーションをさらに高めることができる。 In addition, the first main body falls from the periphery of the top surface portion, and on the first main surface of the substrate, the first side peripheral wall portion in which the front end surface is in close contact pressure contact with the peripheral portion of the first main surface of the substrate. Connector surrounding space partition wall arranged so as to extend inward from the first side peripheral wall portion, and surrounding the connector, and the connector peripheral space portion of the connector peripheral space partition wall and the first side peripheral wall portion Having an auxiliary partition wall that divides the main space surrounded by the partition wall and the portion along the periphery of the board area on the side where no connector exists into a plurality of spaces corresponding to the division of the first main surface of the board Can be configured. By providing the auxiliary partition wall, the main space can be divided into a plurality of sections including the dew condensation protection space, and variations in space utilization inside the housing can be further enhanced.

以下、本発明の実施の形態を、図面を用いて説明する。
図１は、本発明の一実施形態である車載用電子機器回路モジュール１の三面図であり、図２は分解斜視図、図３Ａは図１のＡ−Ａ断面図である。図３Ａに示すごとく、該車載用電子機器回路モジュール１は、車載用電子機器の回路部品６１（６１Ａと６１Ｂとを総称するものである），６２と該回路部品６１が構成する機器回路の入出力用のコネクタ４０とが基板４Ｓの第一主表面上に実装された基板モジュール４と、該基板モジュール４を収容する筐体５とを備える。一方の端部にコネクタ４０が実装され、図１に示すように、該コネクタ４０への端子接続口４０Ｐが筐体５の周壁部に形成された切欠２１内に露出する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a three-side view of an in-vehicle electronic device circuit module 1 according to an embodiment of the present invention, FIG. 2 is an exploded perspective view, and FIG. 3A is a cross-sectional view taken along line AA in FIG. As shown in FIG. 3A, the in-vehicle electronic device circuit module 1 includes circuit components 61 (61A and 61B) 61 of the in-vehicle electronic device and 62 and the input of the device circuit formed by the circuit component 61. The output connector 40 includes a board module 4 mounted on the first main surface of the board 4S, and a housing 5 that houses the board module 4. The connector 40 is mounted on one end, and the terminal connection port 40P to the connector 40 is exposed in the notch 21 formed in the peripheral wall portion of the housing 5 as shown in FIG.

図２に示すように、筐体５は、基板４Ｓの第一主表面側を覆う第一本体２と、同じく第二主表面側を覆う第二本体３とに分割形成されている。図３Ａに示すように、第二本体３の底部３ｃ内面には、基板４Ｓとの間に底部空間５３を形成する形で該基板４Ｓを第二主表面側にて支持する底部側支持部３３が形成される。また、回路部品６１に含まれる保護対象部品６１Ａ，６１Ｂの配置領域として、基板４Ｓの第一主表面上にてコネクタ４０の配置領域とは排他的に保護領域５２Ｊが定められ、当該保護領域５２Ｊの上方空間を結露保護空間５２として区画する保護区画壁２３，２ａ，２ｂが第一本体２の天面部２ｃ内面から基板４Ｓの第一主表面に向けて突出形成されている。また、基板４Ｓを底部側支持部３３にて第二主表面側から支持しつつ、保護区画壁２３，２ａ，２ｂの先端面を第一主表面に直接的に密着圧接させた状態にて、第一本体２と第二本体３とを結合する本体結合部５Ｆを備えている。 As shown in FIG. 2, the housing 5 is divided into a first main body 2 that covers the first main surface side of the substrate 4 </ b> S and a second main body 3 that also covers the second main surface side. As shown in FIG. 3A, on the inner surface of the bottom portion 3c of the second body 3, a bottom side support portion 33 that supports the substrate 4S on the second main surface side so as to form a bottom space 53 with the substrate 4S. Is formed. Further, as the arrangement area of the protection target components 61A and 61B included in the circuit component 61, a protection area 52J is defined exclusively on the first main surface of the substrate 4S from the arrangement area of the connector 40, and the protection area 52J Protective partition walls 23, 2 a, 2 b that partition the upper space as a dew condensation protective space 52 are formed so as to protrude from the inner surface of the top surface portion 2 c of the first body 2 toward the first main surface of the substrate 4 </ b> S. In addition, while supporting the substrate 4S from the second main surface side by the bottom side support portion 33, the front end surfaces of the protective partition walls 23, 2a, 2b are in direct contact pressure contact with the first main surface, A main body coupling portion 5F that couples the first main body 2 and the second main body 3 is provided.

基板４Ｓ上にコネクタ４０が設けられ、そのコネクタ４０の開口が筐体５周壁部の切欠２１に露出する。筐体５を第一本体２と第二本体３とに分割し、第二本体３側の底部側支持部３３にて基板４Ｓを第二主表面側から支持しつつ、天面部２ｃ内面から基板４Ｓの第一主表面に向けて突出形成された保護区画壁２３，２ａ，２ｂの先端面を第一主表面に直接的に密着圧接させ、その状態にて第一本体２と第二本体３とを結合保持させている。これにより、保護区画壁２３，２ａ，２ｂの内側に区画される基板４Ｓ上の保護領域５２Ｊ、ひいては当該保護領域５２Ｊ上に配置された保護対象部品６１Ａ，６１Ｂは、コネクタ４０と筐体５との間の密閉性が悪くとも、湿気や埃等の侵入から保護することができる。 A connector 40 is provided on the substrate 4S, and an opening of the connector 40 is exposed to the notch 21 in the peripheral wall portion of the housing 5. The housing 5 is divided into a first main body 2 and a second main body 3, and the substrate 4S is supported from the second main surface side by the bottom side support portion 33 on the second main body 3 side, and the substrate is formed from the inner surface of the top surface portion 2c. The front end surfaces of the protective partition walls 23, 2a, 2b formed to protrude toward the first main surface of 4S are brought into close contact pressure contact with the first main surface, and the first main body 2 and the second main body 3 are in that state. And are held together. Thereby, the protection region 52J on the substrate 4S partitioned inside the protection partition walls 23, 2a, 2b, and thus the protection target components 61A, 61B arranged on the protection region 52J, the connector 40, the housing 5, Even if the sealing performance between the two is poor, it is possible to protect against moisture and dust.

特に、切欠２１内にコネクタ４０を嵌め合わせる構造にする場合、コネクタ４０天面と切欠２１上面とは、第一本体２と第二本体３との組付け時に密着圧接構造とすることが可能であるが、切欠２１の内側面とコネクタ４０の側面との間には上記組付け時の圧接力を作用させることは困難である。この場合、筐体５の内部空間のうち、結露保護空間５２外に位置するコネクタ周囲空間５１は、切欠２１とコネクタ４０の隙間を介して筐体５外空間と連通する形となる。しかし、このような構造でも、基板４Ｓに密着圧接される保護区画壁２３，２ａ，２ｂを設けることにより、その内側の結露保護空間５２にある部品を結露や埃付着から保護することができる。 In particular, when the connector 40 is fitted in the notch 21, the top surface of the connector 40 and the upper surface of the notch 21 can be in a close contact pressure contact structure when the first main body 2 and the second main body 3 are assembled. However, it is difficult to apply the pressing force during the assembly between the inner side surface of the notch 21 and the side surface of the connector 40. In this case, of the internal space of the housing 5, the connector peripheral space 51 located outside the dew condensation protection space 52 is in communication with the external space of the housing 5 through the gap between the notch 21 and the connector 40. However, even in such a structure, by providing the protective partition walls 23, 2a, and 2b that are in close contact with the substrate 4S, it is possible to protect the components in the condensation protection space 52 inside from the condensation and dust adhesion.

第一本体２と第二本体３とは、いずれも樹脂成形品にて構成されている。基板４Ｓは周知のプリント配線基板であり、コネクタ４０は、基板４Ｓ上の配線部４５Ａ，Ｂに半田付け接続された入出力用の複数のコネクタピン４１と、該コネクタピン４１を覆う樹脂製のソケット４２とを有する。 The first main body 2 and the second main body 3 are both formed of a resin molded product. The board 4S is a well-known printed wiring board, and the connector 40 is made of a plurality of input / output connector pins 41 soldered to the wiring portions 45A and 45B on the board 4S, and a resin made to cover the connector pins 41. Socket 42.

保護対象部品６１Ａ，６１Ｂは、結露による誤動作が特に生じやすい集積回路部品や発振素子などの電子部品である。特に、集積度が高く端子数も多いＣＰＵ（あるいはマイコン）６１Ａは、結露等への保護配慮が特に重要であり、結露保護空間５２に優先的に配置される。なお、図１２に示すように、結露保護空間５２内に特に配置する必要のない結露保護対象外部品６１Ｃを、コネクタ周囲空間５１にて基板４Ｓの第一主表面に実装することも可能である。結露保護対象外部品６１Ｃは、結露による誤動作の惧れが上記のＩＣよりも小さい部品であって、例えば、リレー、インダクタ、トランジスタ、ダイオードなどのディスクリート部品や、電源用レギュレータなどがこれに該当する。 The protection target components 61A and 61B are electronic components such as integrated circuit components and oscillation elements that are particularly susceptible to malfunctions due to condensation. In particular, the CPU (or microcomputer) 61A having a high degree of integration and a large number of terminals is particularly important for protection against condensation and the like, and is preferentially disposed in the condensation protection space 52. As shown in FIG. 12, it is also possible to mount a non-condensation protection target component 61C that does not need to be placed in the dew condensation protection space 52 on the first main surface of the substrate 4S in the connector surrounding space 51. . The component 61C that is not subject to condensation protection is a component that is less likely to malfunction due to condensation than the above-described IC, and includes, for example, discrete components such as relays, inductors, transistors, and diodes, power supply regulators, and the like. .

図３Ａに戻り、筐体５の第二本体３は底部３ｃ周縁から立ち上がる第二側周壁部３ａ，３ｂを有する。基板４Ｓは、自身の周縁面にて第二側周壁部３ａ，３ｂの内周面に対し隙間嵌め形態で配置されている。このようにすると、基板４Ｓを第二本体３の内周面に圧入する構成よりも組み立てが容易である。しかし、基板４Ｓ周縁面では第二側周壁部３ａ，３ｂとの間に隙間形成されるので、第二本体３の底部空間５３の密閉性を確保するために、次のような構成が採用されている Returning to FIG. 3A, the second main body 3 of the housing 5 has second side peripheral wall portions 3a and 3b rising from the periphery of the bottom portion 3c. The board | substrate 4S is arrange | positioned by the clearance fit form with respect to the internal peripheral surface of 2nd side surrounding wall part 3a, 3b in the own peripheral surface. If it does in this way, an assembly is easier than the structure which press-fits the board | substrate 4S to the internal peripheral surface of the 2nd main body 3. FIG. However, since a gap is formed between the peripheral surface of the substrate 4S and the second side peripheral wall portions 3a and 3b, the following configuration is employed to ensure the sealing of the bottom space 53 of the second main body 3. ing

すなわち、底部側支持部３３を、第二側周壁部３ａ，３ｂよりも小さな高さにて基板４Ｓの第二主表面の周方向に沿って環状に形成する（図３Ｂも参照）。そして、突出方向先端面を基板４Ｓの第二主表面に密着圧接させ、底部空間５３の環状の底部側支持部３３に囲まれた部分を底部側副保護空間５３とする。このような構成の採用により、底部側副保護空間５３にも、結露保護の対象となる部品６２を配置することができる。この場合、底部側副保護空間５３内にて基板４Ｓの第二主表面に、回路部品６２を実装することとなる。なお、底部側支持部３３は、第二側周壁部３ａ，３ｂ内面に一体化されている（第二側周壁部３ａ，３ｂを内面側に階段状に形成する構成ともいえる）。ただし、底部側支持部３３を、第二側周壁部３ａ，３ｂとの間に一定の間隔をおいて配置される支持リブとすることも可能である。 That is, the bottom side support portion 33 is formed in an annular shape along the circumferential direction of the second main surface of the substrate 4S at a height smaller than the second side peripheral wall portions 3a and 3b (see also FIG. 3B). The front end surface in the protruding direction is brought into close pressure contact with the second main surface of the substrate 4 </ b> S, and a portion surrounded by the annular bottom side support portion 33 of the bottom space 53 is defined as a bottom side sub-protection space 53. By adopting such a configuration, it is possible to dispose a part 62 to be subject to condensation protection also in the bottom side sub-protection space 53. In this case, the circuit component 62 is mounted on the second main surface of the substrate 4S in the bottom side sub-protection space 53. In addition, the bottom part side support part 33 is integrated with 2nd side surrounding wall part 3a, 3b inner surface (it can be said that the 2nd side surrounding wall part 3a, 3b is formed in the inner surface side at step shape). However, the bottom side support part 33 can also be a support rib arranged with a certain distance between the second side peripheral wall parts 3a and 3b.

第一本体２は上記の第一側周壁部２ａ，２ｂと、基板４Ｓの第一主表面上にて第一側周壁部２ａ，２ｂから内側に張り出す形でコネクタ４０の周囲に沿うように配置されるコネクタ周囲空間区画壁２３とを有する。そして、該コネクタ周囲空間区画壁２３と、第一側周壁部２ａ，２ｂのうち、当該コネクタ周囲空間区画壁２３を境界としてコネクタ４０が存在しない側の基板領域周縁に沿う部分とが保護区画壁を形成している。この構成では、筐体５周壁部をなす第一側周壁部２ａ，２ｂを基板４Ｓの周縁部に圧接することで、該第一側周壁部２ａ，２ｂの一部が保護区画壁として流用されるので、基板４Ｓの周縁近傍まで保護領域５２Ｊを拡張でき、結露保護空間５２をより大きく確保することができるようになる。 The first main body 2 extends along the periphery of the connector 40 so as to protrude inward from the first side peripheral wall portions 2a and 2b on the first main surface of the substrate 4S and the first side peripheral wall portions 2a and 2b. And a connector surrounding space partition wall 23 to be disposed. The connector surrounding space partition wall 23 and the portion of the first side peripheral wall portions 2a and 2b along the peripheral edge of the board area on the side where the connector 40 does not exist with the connector surrounding space partition wall 23 as a boundary. Is forming. In this configuration, the first side peripheral wall portions 2a and 2b forming the peripheral wall portion of the housing 5 are pressed against the peripheral edge portion of the substrate 4S so that a part of the first side peripheral wall portions 2a and 2b is used as a protective partition wall. Therefore, the protection region 52J can be expanded to the vicinity of the peripheral edge of the substrate 4S, and the dew condensation protection space 52 can be secured larger.

次に、図２に示すように、本体結合部５Ｆは、第一側周壁部２ａ，２ｂと第二側周壁部３ａ，３ｂとの一方に形成される係合受け部２２と、他方に形成されるとともに、第一本体２が第二本体３から離脱する向きへの係合受け部２２の自身に対する相対移動を阻止するように該係合受け部２２と係合する係合部３２とを有する。具体的には、図４に示すように、第一側周壁部２ａ，２ｂの先端側が、第二側周壁部３ａ，３ｂの内側に挿入されるとともに、図２に示すように、係合受け部は第一側周壁部２ａ，２ｂの側面に形成された係合爪２２である。係合部３２は、該係合爪２２に対応する位置にて第二側周壁部３ａ，３ｂの先端面から突出するとともに、第一側周壁部２ａ，２ｂの高さ方向基端側にて係合爪２２と係合する。図１及び図２に示すように、係合部３２は係合爪２２を収容する収容孔３２ｗが形成された窓状形態をなし、係合部３２の突出方向先端側に位置する収容孔３２ｗの内縁に係合爪２２が係合するようになっている。図５に示すように、係合爪２２の外面は、第一側周壁部２ａ，２ｂの先端側にて係合部３２が弾性的に乗り越えることをガイドする傾斜面とされている。 Next, as shown in FIG. 2, the main body coupling portion 5 </ b> F is formed on the engagement receiving portion 22 formed on one of the first side peripheral wall portions 2 a and 2 b and the second side peripheral wall portions 3 a and 3 b and on the other side. And an engagement portion 32 that engages with the engagement receiving portion 22 so as to prevent relative movement of the engagement receiving portion 22 in the direction in which the first main body 2 is detached from the second main body 3. Have. Specifically, as shown in FIG. 4, the distal ends of the first side peripheral wall portions 2a and 2b are inserted inside the second side peripheral wall portions 3a and 3b, and as shown in FIG. The portion is an engaging claw 22 formed on the side surface of the first side peripheral wall portions 2a, 2b. The engaging portion 32 protrudes from the distal end surfaces of the second side peripheral wall portions 3a and 3b at positions corresponding to the engaging claws 22 and at the height direction base end side of the first side peripheral wall portions 2a and 2b. Engage with the engaging claw 22. As shown in FIGS. 1 and 2, the engaging portion 32 has a window-like shape in which an accommodating hole 32 w for accommodating the engaging claw 22 is formed, and the accommodating hole 32 w located on the distal end side in the protruding direction of the engaging portion 32. The engaging claw 22 is adapted to engage with the inner edge. As shown in FIG. 5, the outer surface of the engaging claw 22 is an inclined surface that guides the engagement portion 32 to move over elastically on the distal end side of the first side peripheral wall portions 2 a and 2 b.

第一本体２と第二本体３との間に基板４Ｓを配置して、保護区画壁２３，２ａ，２ｂの先端面を基板４Ｓの第一主表面に圧接しながら第一本体２と第二本体３とを相対的に接近させる。図５に示すように、係合部３２が弾性変形しつつ係合受け部２２を乗り越え、その後弾性復帰して該係合受け部２２と係合することにより、保護区画壁２３，２ａ，２ｂの基板４Ｓへの圧接状態を維持しつつ、第一本体２と第二本体３とが抜け止め結合される。係合部３２と係合受け部２２とを位置合わせしつつ第一本体２と第二本体３とを重ね合わせて加圧することにより、筐体５をなす第一本体２と第二本体３との組み立てを簡単に行なうことができる。 The substrate 4S is disposed between the first body 2 and the second body 3, and the first body 2 and the second body 2 are pressed while the front end surfaces of the protective partition walls 23, 2a, 2b are pressed against the first main surface of the substrate 4S. The main body 3 is relatively moved closer. As shown in FIG. 5, the engaging portion 32 gets over the engaging receiving portion 22 while being elastically deformed, and then elastically recovers and engages with the engaging receiving portion 22 to thereby protect the partition walls 23, 2a, 2b. The first main body 2 and the second main body 3 are connected to each other while being kept in pressure contact with the substrate 4S. The first main body 2 and the second main body 3 that form the housing 5 are obtained by overlapping and pressing the first main body 2 and the second main body 3 while aligning the engagement portion 32 and the engagement receiving portion 22. Can be easily assembled.

図３Ａに戻り、機器回路に含まれる配線部４５Ａ，４５Ｂは、保護区画壁（コネクタ周囲空間区画壁）２３との当接位置において、基板４Ｓの当該当接側と反対側の主表面を引き回される迂回配線部４５Ａを有する。このようにすることで、配線部４５Ａ，４５Ｂが保護区画壁（コネクタ周囲空間区画壁）２３又は底部側支持部３３との間で過度に挟圧されて断線する等の不具合を防止することができる。また、逆にいえば、配線部４５Ａ，４５Ｂの断線等の懸念がないため、保護区画壁（コネクタ周囲空間区画壁）２３又は底部側支持部３３と基板４Ｓとの圧接力を大幅に高めることができ、結露保護空間５２の密閉性をさらに高めることができる。 Returning to FIG. 3A, the wiring portions 45A and 45B included in the device circuit pull the main surface of the board 4S opposite to the contact side at the contact position with the protective partition wall (connector surrounding space partition wall) 23. It has a detour wiring section 45A that is rotated. By doing so, it is possible to prevent problems such as the wiring portions 45A and 45B being excessively pinched between the protective partition wall (connector surrounding space partition wall) 23 or the bottom side support portion 33 and being disconnected. it can. Conversely, since there is no concern about disconnection of the wiring portions 45A and 45B, the pressure contact force between the protective partition wall (connector surrounding space partition wall) 23 or the bottom support portion 33 and the substrate 4S is significantly increased. The sealing property of the condensation protection space 52 can be further enhanced.

ここでは、コネクタ４０と結露保護空間５２内の結露保護対象部品６１Ａ，６１Ｂとを接続する配線部４５Ａ，４５Ｂを横切る形で保護区画壁（コネクタ周囲空間区画壁）２３が配置されている。配線部４５Ｂは、コネクタ４０から保護領域５２Ｊ外にてビア４４を介して第一主表面側から迂回配線部４５Ａに導かれた後、保護区画壁（コネクタ周囲空間区画壁）２３を通過して保護領域５２Ｊ内に侵入する位置まで該迂回配線部４５Ａとして引き回し、該位置にて再びビア４４を介して第一主表面側の配線部４５Ｂに戻るように構成されている。ビア４４を用いて第一主表面側の配線部４５Ｂを第二主表面側の迂回配線部４５Ａに接続することで、保護区画壁（コネクタ周囲空間区画壁）２３が横切る位置でも配線部４５Ａを強い挟圧力から保護することができる。また、保護区画壁（コネクタ周囲空間区画壁）２３を通過すればビア４４により再び第一主表面側の配線部４５Ｂに接続することで、保護区画壁（コネクタ周囲空間区画壁）２３以外の領域では配線レイアウトを変更する必要性がなくなり、設計上の制約も少ない。特に、基板４Ｓ主表面上のパッドに半田バンプを介して部品側のパッドを接続する面実装型配線基板を採用する場合は波及効果が大きい。 Here, the protection partition wall (connector surrounding space partition wall) 23 is arranged across the wiring portions 45A and 45B that connect the connector 40 and the condensation protection target components 61A and 61B in the condensation protection space 52. The wiring portion 45B is guided from the connector 40 to the bypass wiring portion 45A from the first main surface side via the via 44 outside the protection region 52J, and then passes through the protection partition wall (connector surrounding space partition wall) 23. The detour wiring portion 45A is routed to the position where it enters the protection region 52J, and returns to the wiring portion 45B on the first main surface side via the via 44 again at this position. By using the via 44 to connect the wiring portion 45B on the first main surface side to the bypass wiring portion 45A on the second main surface side, the wiring portion 45A can be connected even at a position where the protective partition wall (connector surrounding space partition wall) 23 crosses. It can be protected from strong pinching pressure. In addition, if the protective partition wall (connector surrounding space partition wall) 23 is passed, it is connected to the wiring portion 45B on the first main surface side again by the via 44, so that an area other than the protective partition wall (connector surrounding space partition wall) 23 is obtained. Then, there is no need to change the wiring layout, and there are few design restrictions. In particular, when a surface-mounting type wiring board is used in which pads on the component side are connected to pads on the main surface of the board 4S via solder bumps, the ripple effect is great.

なお、図３Ｃに示すように、基板４Ｓ内部に内部配線層が設けられる場合、機器回路に含まれる配線部４５Ａ，４５Ｂは、保護区画壁２３又は底部側支持部３３との当接位置において内部配線層を引き回される迂回配線部４５Ａを有するものとすることもできる。この構成は、基板構造はやや複雑化するが、配線部４５Ａ，４５Ｂの断線を防止し、結露保護空間５２の密閉性をさらに高める効果は同様に達成できる。また、基板４Ｓの第一主表面側と第二主表面側とで保護区画壁（コネクタ周囲空間区画壁）２３と底部側支持部３３とが同じ位置で当接していても、配線部４５Ａを保護できる利点がある。 As shown in FIG. 3C, when the internal wiring layer is provided inside the substrate 4S, the wiring portions 45A and 45B included in the device circuit are located inside the contact position with the protective partition wall 23 or the bottom side support portion 33. It is also possible to have a detour wiring portion 45A routed around the wiring layer. In this configuration, although the substrate structure is slightly complicated, the disconnection of the wiring portions 45A and 45B can be prevented, and the effect of further improving the sealing property of the dew condensation protection space 52 can be similarly achieved. Even if the protective partition wall (connector surrounding space partition wall) 23 and the bottom side support portion 33 are in contact at the same position on the first main surface side and the second main surface side of the substrate 4S, the wiring portion 45A is connected. There is an advantage that can be protected.

機器回路に含まれる配線部を、保護区画壁又は底部側支持部との当接位置を含む部分での挟圧力から保護する他の態様としては、図３Ｄに示すように、当該当接位置を含む部分を、残余の部分よりも配線幅が広くされた補強配線部４５ｗとする方式が可能である。また、図８及び図９に示すように、保護区画壁２３，２４（符号２４は、後述の補助仕切壁である）の先端面に、機器回路に含まれる配線部４５Ａ，４５Ｂとの当接位置に、圧接力逃がし用のスリット６０を形成する方式を採用することもできる。この場合、圧接力逃がし用のスリット６０の高さは、配線部４５Ｂの厚みよりも５〜５０％程度小さくしておくことで、配線部４５Ｂとの当接位置においても適度な圧接状態を保つことができる。 As another mode for protecting the wiring part included in the device circuit from the clamping pressure at the part including the contact position with the protective partition wall or the bottom side support part, as shown in FIG. It is possible to adopt a method in which the included portion is a reinforcing wiring portion 45w having a wiring width wider than that of the remaining portion. Further, as shown in FIGS. 8 and 9, the front end surfaces of the protective partition walls 23 and 24 (reference numeral 24 is an auxiliary partition wall described later) are brought into contact with the wiring portions 45A and 45B included in the device circuit. It is also possible to adopt a method in which a slit 60 for pressure contact force relief is formed at the position. In this case, the height of the slit 60 for releasing the pressure contact force is kept about 5 to 50% smaller than the thickness of the wiring part 45B, so that an appropriate pressure contact state is maintained even at the contact position with the wiring part 45B. be able to.

以下、車載用電子機器回路モジュール１の種々の変形例について説明する。
図６に示す例では、第一本体２は、前述の第一側周壁部２ａ，２ｂ及びコネクタ周囲空間区画壁２３と、該コネクタ周囲空間区画壁２３と、第一側周壁部２ａ，２ｂのうち、当該コネクタ周囲空間区画壁２３を境界としてコネクタが存在しない側の基板領域周縁に沿う部分とに囲まれた主空間を、基板４Ｓの第一主表面の区画分割に対応した複数の空間に仕切る補助仕切壁２４を有したものとして構成している。補助仕切壁２４を設けることで、主空間を、結露保護空間５２を含む複数区間に分割でき、筐体５内部の空間活用のバリエーションをさらに高めることができる。 Hereinafter, various modifications of the in-vehicle electronic device circuit module 1 will be described.
In the example shown in FIG. 6, the first main body 2 includes the first side peripheral wall portions 2 a and 2 b and the connector peripheral space partition wall 23, the connector peripheral space partition wall 23, and the first side peripheral wall portions 2 a and 2 b. Among these, the main space surrounded by the peripheral area partition wall 23 of the connector and the portion along the peripheral edge of the board area on the side where no connector exists is a plurality of spaces corresponding to the division of the first main surface of the board 4S. The auxiliary partition wall 24 for partitioning is provided. By providing the auxiliary partition wall 24, the main space can be divided into a plurality of sections including the dew condensation protection space 52, and variations in space utilization inside the housing 5 can be further enhanced.

図７Ａはさらに詳細な構造を示す断面図であり、補助仕切壁２４は、基準方向Ｓと交差する向きにおいて第一側周壁部２ａ，２ｂの片側から、その反対側にまたがる形で主空間を分割するように形成されている。該補助仕切壁２４の先端面はを基板４Ｓの第一主表面に密着圧接されており、該補助仕切壁２４と、第一側周壁部２ａ，２ｂのうち、当該補助仕切壁２４を境界としてコネクタ４０が存在しない側の基板領域周縁に沿う部分とを保護区画壁として、その内部を結露保護空間５２Ａとしてある。このようにすると、コネクタ４０側から漏れ込む湿気や埃は、コネクタ周囲空間区画壁２３及び補助仕切壁２４の２つの壁部を経由してからその奥にある結露保護空間５２に到達する形となるので、結露や埃に対する保護機能を高めることができる。 FIG. 7A is a cross-sectional view showing a more detailed structure. The auxiliary partition wall 24 extends from the one side of the first side peripheral wall portions 2a and 2b to the opposite side in the direction intersecting the reference direction S. It is formed to divide. The front end surface of the auxiliary partition wall 24 is in close contact pressure contact with the first main surface of the substrate 4S, and the auxiliary partition wall 24 and the first side peripheral wall portions 2a and 2b are used as a boundary. A portion along the periphery of the substrate area on the side where the connector 40 does not exist is used as a protection partition wall, and the inside thereof is used as a dew condensation protection space 52A. In this way, moisture and dust leaking from the connector 40 side pass through the two wall portions of the connector surrounding space partition wall 23 and the auxiliary partition wall 24 and then reach the condensation protection space 52 in the back thereof. Therefore, the protection function against condensation and dust can be enhanced.

ここでは、コネクタ周囲空間区画壁２３と補助仕切壁２４と第一側周壁部２ａ，２ｂのそれらコネクタ周囲空間区画壁２３及び補助仕切壁２４の間に位置する部分とを保護区画壁として、その内部を第二の結露保護空間５２Ｂとしてあり、そのさらに奥にある（第一の）結露保護空間５２Ａへの保護効果が一層高められている。そして、結露保護空間５２Ａには、より高度の結露保護が必要なＣＰＵ６１Ａを含む回路部品が配置され、結露保護空間５２Ｂには、要求される結露保護レベルがそれよりは多少低い周辺ＩＣ６１Ｂ等が配置されている。 Here, the connector surrounding space partition wall 23, the auxiliary partition wall 24, and the portion located between the connector surrounding space partition wall 23 and the auxiliary partition wall 24 of the first side peripheral wall portions 2a and 2b are used as protective partition walls. The inside is the second dew condensation protection space 52B, and the protective effect on the (first) dew condensation protection space 52A located further inside is further enhanced. In the condensation protection space 52A, circuit components including a CPU 61A that requires a higher degree of condensation protection are arranged, and in the condensation protection space 52B, a peripheral IC 61B having a slightly lower condensation protection level required is arranged. Has been.

なお、図７Ａ及び図７Ｂに示すように、第二本体３の内側には、平面視にてコネクタ周囲空間区画壁２３の外側を取り囲む形態で、底部３ｃから突出する補助支持壁部３４が設けられている。補助支持壁部３４の先端面は、基板４Ｓの第二主表面側に密着圧接されている。 As shown in FIGS. 7A and 7B, an auxiliary support wall 34 that protrudes from the bottom 3 c is provided inside the second main body 3 so as to surround the outside of the connector surrounding space partition wall 23 in a plan view. It has been. The distal end surface of the auxiliary support wall 34 is in close contact pressure contact with the second main surface side of the substrate 4S.

次に、図１０の構成では、コネクタ周囲空間区画壁２３と、補助仕切壁２４と、第一側周壁部２ａ，２ｂのそれらコネクタ周囲空間区画壁２３及び補助仕切壁２４の間に位置する部分とが補助空間５２Ｂ’を区画しており、コネクタ周囲空間５１と補助空間５２Ｂ’とを連通させる連通隙間６０’が、コネクタ周囲空間区画壁２３の先端面と基板４Ｓの第一主表面との間に形成されている。このようにすると、コネクタ周囲空間５１から連通隙間６０’を介して該補助空間５２Ｂ’に漏入する含湿空気中の水蒸気を、結露保護空間５２に漏入する前に当該補助空間５２Ｂ’内にて凝結させることができ、結果的に、そのさらに奥にある結露保護空間５２への水蒸気侵入をより起こりにくくすることができる。 Next, in the configuration of FIG. 10, the connector surrounding space partition wall 23, the auxiliary partition wall 24, and the portions of the first side peripheral wall portions 2 a and 2 b that are located between the connector surrounding space partition wall 23 and the auxiliary partition wall 24. And the auxiliary space 52B ′ is defined, and a communication gap 60 ′ that connects the connector peripheral space 51 and the auxiliary space 52B ′ is formed between the front end surface of the connector peripheral space partition wall 23 and the first main surface of the substrate 4S. It is formed between. In this way, the water vapor in the moisture-containing air that leaks into the auxiliary space 52B ′ from the connector surrounding space 51 through the communication gap 60 ′ is introduced into the auxiliary space 52B ′ before leaking into the condensation protection space 52. As a result, it is possible to make water vapor intrusion into the dew condensation protection space 52 further deeper.

連通隙間６０’は、コネクタ周囲空間区画壁２３の先端部を一部区間切り欠いて形成されたスリット６０’とされている。連通隙間６０’を上記のようにスリット化することで、コネクタ周囲空間５１から補助空間５２Ｂ’内への水蒸気拡散を規制でき、補助空間５２Ｂ’内での水蒸気凝結も緩やかに進行させることができるので、結露保護空間５２に対する保護効果を一層高めることができる。この場合、スリット６０’をくぐる形で基板４Ｓの第一主表面上に配線部４５Ｂを引き回わすようにすれば、配線部４５Ｂの保護も同時に行なうことができる。 The communication gap 60 ′ is a slit 60 ′ formed by cutting out a part of the tip of the connector surrounding space partition wall 23. By slitting the communication gap 60 ′ as described above, water vapor diffusion from the connector surrounding space 51 into the auxiliary space 52B ′ can be regulated, and the water vapor condensation in the auxiliary space 52B ′ can also proceed slowly. Therefore, the protective effect for the condensation protection space 52 can be further enhanced. In this case, if the wiring part 45B is routed around the first main surface of the substrate 4S through the slit 60 ', the wiring part 45B can be protected at the same time.

一方、補助仕切壁は、図１３Ａ及び図１３Ｂに示すように、コネクタ周囲空間区画壁２３及び第一側周壁部２ａ，２ｂのいずれよりも内側において、基板４Ｓの第一主表面上に定められた閉領域に沿う周回仕切壁２４Ｓとすることもできる。そして、当該周回仕切壁２４Ｓを保護区画壁としてその内側空間を結露保護空間５２Ｓとすることができる。補助仕切壁をこのような周回仕切壁２４Ｓとすることで、その内側の結露保護空間５２Ｓは、全周にわたって、コネクタ周囲空間区画壁２３及び第一側周壁部２ａ，２ｂと周回仕切壁２４Ｓとにより二重に保護されるので、結露保護空間５２Ｓに対する保護効果をより高めることができる。この場合、コネクタ周囲空間区画壁２３と、第一側周壁部２ａ，２ｂのうち、当該コネクタ周囲空間区画壁２３を境界としてコネクタ４０が存在しない側の基板領域周縁に沿う部分とを、上記周回仕切壁２４Ｓとは別の第二の保護区画壁２３，２ａ，２ｂとし、該第二の保護区画壁２３，２ａ，２ｂと周回仕切壁２４Ｓとの間に位置する空間を第二の結露保護空間５２Ｂ’とすることができる。このようにすると、周回仕切壁２４Ｓの外側に隣接する空間が第二の結露保護空間５２Ｂ’となるので、そのさらに内側にある（第一の）結露保護空間５２への保護効果が一層高められる。 On the other hand, as shown in FIGS. 13A and 13B, the auxiliary partition wall is defined on the first main surface of the substrate 4S inside the connector surrounding space partition wall 23 and the first side peripheral wall portions 2a and 2b. It can also be set as the surrounding partition wall 24S along the closed area. And the surrounding partition wall 24S can be used as a protection partition wall, and the inner space can be used as the condensation protection space 52S. By setting the auxiliary partition wall as such a surrounding partition wall 24S, the dew condensation protection space 52S inside the connector surrounding space partition wall 23 and the first side peripheral wall portions 2a and 2b and the surrounding partition wall 24S Therefore, the protection effect on the condensation protection space 52S can be further enhanced. In this case, the connector surrounding space partition wall 23 and the portion of the first side peripheral wall portions 2a and 2b along the peripheral edge of the board region on the side where the connector 40 does not exist with the connector surrounding space partition wall 23 as a boundary A second protective partition wall 23, 2a, 2b separate from the partition wall 24S is used, and a space located between the second protective partition wall 23, 2a, 2b and the surrounding partition wall 24S is protected against second condensation. It can be a space 52B ′. In this way, the space adjacent to the outside of the surrounding partition wall 24S becomes the second dew condensation protection space 52B ′, so that the protection effect on the (first) dew condensation protection space 52 further inside is further enhanced. .

本発明の車載用電子機器回路モジュールの一例を示す三面図。FIG. 3 is a three-side view illustrating an example of an in-vehicle electronic device circuit module according to the present invention. 同じく分解斜視図。Similarly disassembled perspective view. 図１のＡ−Ａ断面図。AA sectional drawing of FIG. 図１の第二本体の平面図。The top view of the 2nd main body of FIG. 迂回配線部の変形例を示す断面図。Sectional drawing which shows the modification of a detour wiring part. 補強配線部の例を示す平面図。The top view which shows the example of a reinforcement wiring part. 図１のＢ−Ｂ断面図。BB sectional drawing of FIG. 本体結合部の作用説明図。Action | operation explanatory drawing of a main body coupling | bond part. 補助仕切壁の第一形成例を示す斜視図。The perspective view which shows the 1st example of formation of an auxiliary partition wall. 図６の構造を用いた車載用電子機器回路モジュールの例を示す断面図。Sectional drawing which shows the example of the vehicle-mounted electronic device circuit module using the structure of FIG. 図７Ａの構成に使用する第二本体部の平面図。The top view of the 2nd main-body part used for the structure of FIG. 7A. 補助仕切壁の第二形成例を示す斜視図。The perspective view which shows the 2nd example of formation of an auxiliary partition wall. 図８の構造を用いた車載用電子機器回路モジュールの例を示す断面図。Sectional drawing which shows the example of the vehicle-mounted electronic device circuit module using the structure of FIG. 補助仕切壁の第三形成例を示す斜視図。The perspective view which shows the 3rd example of formation of an auxiliary partition wall. 図１０の構造を用いた車載用電子機器回路モジュールの例を示す断面図。Sectional drawing which shows the example of the vehicle-mounted electronic device circuit module using the structure of FIG. 本発明の車載用電子機器回路モジュールの、別の変形例を示す断面図。Sectional drawing which shows another modification of the vehicle-mounted electronic device circuit module of this invention. 本発明の車載用電子機器回路モジュールの、さらに別の変形例を示す断面図。Sectional drawing which shows another modification of the vehicle-mounted electronic device circuit module of this invention. 図１３Ａの構成に使用する第一本体部の底面図。The bottom view of the 1st main-body part used for the structure of FIG. 13A.

符号の説明Explanation of symbols

１車載用電子機器回路モジュール
２第一本体
２ａ，２ｂ第一側周壁部
３ａ，３ｂ第二側周壁部
２ｃ天面部
３第二本体
３ｃ底部
４基板モジュール
４Ｓ基板
５筐体
５Ｆ本体結合部
２１切欠
２２係合受け部
２３コネクタ周囲空間区画壁
２４補助仕切壁
２４Ｓ周回仕切壁
３２係合部
３３底部側支持部
４０コネクタ
４０Ｐ端子接続口
４４ビア
４５Ａ，４５Ｂ配線部
４５Ａ迂回配線部
４５ｗ補強配線部
５２，５２Ｓ結露保護空間
５２Ａ（第一の）結露保護空間
５２Ｂ，５２Ｂ’ 第二の結露保護空間
５２Ｂ’ 補助空間
５２Ｊ保護領域
５３底部側副保護空間
６０スリット
６０’ 連通隙間（スリット）
６１（６１Ａ，６１Ｂ，６１Ｃ），６２回路部品 DESCRIPTION OF SYMBOLS 1 Vehicle-mounted electronic device circuit module 2 1st main body 2a, 2b 1st side surrounding wall part 3a, 3b 2nd side surrounding wall part 2c Top surface part 3 2nd main body 3c Bottom part 4 Substrate module 4S board | substrate 5 Case 5F Main body coupling | bond part 21 Notch DESCRIPTION OF SYMBOLS 22 Engagement part 23 Connector surrounding space partition wall 24 Auxiliary partition wall 24S Circumferential partition wall 32 Engagement part 33 Bottom side support part 40 Connector 40P Terminal connection port 44 Via 45A, 45B Wiring part 45A Detour wiring part 45w Reinforcement wiring part 52 , 52S Condensation protection space 52A (First) condensation protection space 52B, 52B ′ Second condensation protection space 52B ′ Auxiliary space 52J Protection area 53 Bottom side sub protection space 60 Slit 60 ′ Communication gap (slit)
61 (61A, 61B, 61C), 62 Circuit parts

Claims

車載用電子機器の回路部品と該回路部品が構成する機器回路の入出力用のコネクタとが基板の第一主表面上に実装された基板モジュールと、前記基板モジュールを収容する筐体とを備え、
前記基板モジュールは、前記基板の第一主表面上の予め定められた基準方向における一方の端部に前記コネクタが実装され、該コネクタへの端子接続口が前記筐体の周壁部に形成された切欠内に露出する一方、
前記筐体は、前記基板の第一主表面側を覆う第一本体と、同じく第二主表面側を覆う第二本体とに分割形成され、前記第二本体の底部内面には、前記基板との間に底部空間を形成する形で該基板を第二主表面側にて支持する底部側支持部が形成されるとともに、前記回路部品に含まれる保護対象部品の配置領域として、前記基板の第一主表面上にて前記コネクタの配置領域とは排他的に保護領域が定められ、当該保護領域の上方空間を結露保護空間として区画する保護区画壁が前記第一本体の天面部内面から前記基板の前記第一主表面に向けて突出形成され、
さらに、前記基板を前記底部側支持部にて第二主表面側から支持しつつ、前記保護区画壁の先端面を第一主表面に直接的に密着圧接させた状態にて、前記第一本体と前記第二本体とを結合する本体結合部を備えてなり、
前記機器回路に含まれる配線部は、前記保護区画壁又は前記底部側支持部との当接位置において、前記基板の当該当接側と反対側の主表面を引き回される迂回配線部を有し、
前記第一本体は前記天面部周縁から立ち下がるとともに、前記基板の第一主表面の周縁部に先端面が直接的に密着圧接される第一側周壁部と、前記基板の第一主表面上にて前記第一側周壁部から内側に張り出す形で前記コネクタの周囲に沿うように配置されるコネクタ周囲空間区画壁と、該コネクタ周囲空間区画壁と、前記第一側周壁部のうち、当該コネクタ周囲空間区画壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とに囲まれた主空間を、前記基板の第一主表面の区画分割に対応した複数の空間に仕切る補助仕切壁が設けられていて、
前記補助仕切壁は、前記基準方向と交差する向きにおいて前記第一側周壁部の片側から、その反対側にまたがる形で前記主空間を分割するように形成されてなり、該補助仕切壁の先端面が前記基板の第一主表面に密着圧接されるとともに、該補助仕切壁と、前記第一側周壁部のうち、当該補助仕切壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とを前記保護区画壁として、その内部が前記結露保護空間とされ、
前記迂回配線部は、前記保護区画壁又は前記底部側支持部が前記基板を圧接する前記基板の圧接側を避けて、前記基板の反対側の主表面に引き回されて設けられていることを特徴とする車載用電子機器回路モジュール。 A board module in which a circuit component of an in-vehicle electronic device and a connector for input / output of a device circuit formed by the circuit component are mounted on a first main surface of the board, and a housing that houses the board module ,
In the board module, the connector is mounted at one end in a predetermined reference direction on the first main surface of the board, and a terminal connection port to the connector is formed in the peripheral wall of the casing. While exposed in the notch,
The housing is divided and formed into a first main body that covers the first main surface side of the substrate and a second main body that also covers the second main surface side. A bottom-side support portion for supporting the substrate on the second main surface side so as to form a bottom space therebetween, and as a placement region for the protection target component included in the circuit component, A protective area is defined exclusively on the main surface from the connector arrangement area, and a protective partition wall that divides an upper space of the protective area as a dew condensation protective space from the inner surface of the top surface of the first main body to the substrate. Projecting toward the first main surface of the
Further, the first main body in a state where the front end surface of the protective partition wall is in direct contact pressure contact with the first main surface while the substrate is supported from the second main surface side by the bottom side support portion. And a main body coupling portion that couples the second main body,
The wiring portion included in the device circuit has a bypass wiring portion that is routed on the main surface of the substrate opposite to the contact side at the contact position with the protective partition wall or the bottom support portion. And
The first body falls from the periphery of the top surface portion, and a first side peripheral wall portion whose tip surface is in close contact pressure contact with the peripheral portion of the first main surface of the substrate, and on the first main surface of the substrate Connector surrounding space partition wall arranged so as to extend inward from the first side peripheral wall portion at the periphery of the connector, the connector peripheral space partition wall, and the first side peripheral wall portion, Auxiliary partitioning of the main space surrounded by the connector surrounding space partition wall and the portion along the peripheral edge of the board area on the side where the connector does not exist into a plurality of spaces corresponding to the division of the first main surface of the board There is a partition wall,
The auxiliary partition wall is formed so as to divide the main space so as to extend from one side of the first side peripheral wall portion to the opposite side in a direction intersecting the reference direction. The surface is in close contact pressure contact with the first main surface of the substrate and, along the auxiliary partition wall and the first side peripheral wall portion, along the peripheral edge of the substrate region on the side where the connector does not exist with the auxiliary partition wall as a boundary With the part as the protective partition wall, the inside is the condensation protection space,
The bypass wiring part is that the previous SL protected partition wall or the bottom side support portion while avoiding the pressure side of the substrate for pressing the substrate, is provided routed on the opposite side of the main surface of said substrate In-vehicle electronic equipment circuit module characterized by the above.

車載用電子機器の回路部品と該回路部品が構成する機器回路の入出力用のコネクタとが基板の第一主表面上に実装された基板モジュールと、前記基板モジュールを収容する筐体とを備え、
前記基板モジュールは、前記基板の第一主表面上の予め定められた基準方向における一方の端部に前記コネクタが実装され、該コネクタへの端子接続口が前記筐体の周壁部に形成された切欠内に露出する一方、
前記筐体は、前記基板の第一主表面側を覆う第一本体と、同じく第二主表面側を覆う第二本体とに分割形成され、前記第二本体の底部内面には、前記基板との間に底部空間を形成する形で該基板を第二主表面側にて支持する底部側支持部が形成されるとともに、前記回路部品に含まれる保護対象部品の配置領域として、前記基板の第一主表面上にて前記コネクタの配置領域とは排他的に保護領域が定められ、当該保護領域の上方空間を結露保護空間として区画する保護区画壁が前記第一本体の天面部内面から前記基板の前記第一主表面に向けて突出形成され、
さらに、前記基板を前記底部側支持部にて第二主表面側から支持しつつ、前記保護区画壁の先端面を第一主表面に直接的に密着圧接させた状態にて、前記第一本体と前記第二本体とを結合する本体結合部を備えてなり、
前記基板は基板内部にも内部配線層を有するものであり、前記機器回路に含まれる配線部は、前記保護区画壁又は前記底部側支持部との当接位置において前記内部配線層を引き回される迂回配線部を有し、
前記第一本体は前記天面部周縁から立ち下がるとともに、前記基板の第一主表面の周縁部に先端面が直接的に密着圧接される第一側周壁部と、前記基板の第一主表面上にて前記第一側周壁部から内側に張り出す形で前記コネクタの周囲に沿うように配置されるコネクタ周囲空間区画壁と、該コネクタ周囲空間区画壁と、前記第一側周壁部のうち、当該コネクタ周囲空間区画壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とに囲まれた主空間を、前記基板の第一主表面の区画分割に対応した複数の空間に仕切る補助仕切壁が設けられていて、
前記補助仕切壁は、前記基準方向と交差する向きにおいて前記第一側周壁部の片側から、その反対側にまたがる形で前記主空間を分割するように形成されてなり、該補助仕切壁の先端面が前記基板の第一主表面に密着圧接されるとともに、該補助仕切壁と、前記第一側周壁部のうち、当該補助仕切壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とを前記保護区画壁として、その内部が前記結露保護空間とされていて、
前記迂回配線部は、前記保護区画壁又は前記底部側支持部が前記基板を圧接する前記基板の圧接位置を避けて、前記基板内部に前記内部配線層が引き回されるように設けられていることを特徴とする車載用電子機器回路モジュール。 A board module in which a circuit component of an in-vehicle electronic device and a connector for input / output of a device circuit formed by the circuit component are mounted on a first main surface of the board, and a housing that houses the board module ,
In the board module, the connector is mounted at one end in a predetermined reference direction on the first main surface of the board, and a terminal connection port to the connector is formed in the peripheral wall of the casing. While exposed in the notch,
The housing is divided and formed into a first main body that covers the first main surface side of the substrate and a second main body that also covers the second main surface side. A bottom-side support portion for supporting the substrate on the second main surface side so as to form a bottom space therebetween, and as a placement region for the protection target component included in the circuit component, A protective area is defined exclusively on the main surface from the connector arrangement area, and a protective partition wall that divides an upper space of the protective area as a dew condensation protective space from the inner surface of the top surface of the first main body to the substrate. Projecting toward the first main surface of the
Further, the first main body in a state where the front end surface of the protective partition wall is in direct contact pressure contact with the first main surface while the substrate is supported from the second main surface side by the bottom side support portion. And a main body coupling portion that couples the second main body,
The substrate also has an internal wiring layer inside the substrate, and the wiring portion included in the device circuit is routed around the internal wiring layer at a contact position with the protective partition wall or the bottom side support portion. Have a detour wiring section
The first body falls from the periphery of the top surface portion, and a first side peripheral wall portion whose tip surface is in close contact pressure contact with the peripheral portion of the first main surface of the substrate, and on the first main surface of the substrate Connector surrounding space partition wall arranged so as to extend inward from the first side peripheral wall portion at the periphery of the connector, the connector peripheral space partition wall, and the first side peripheral wall portion, Auxiliary partitioning of the main space surrounded by the connector surrounding space partition wall and the portion along the peripheral edge of the board area on the side where the connector does not exist into a plurality of spaces corresponding to the division of the first main surface of the board There is a partition wall,
The auxiliary partition wall is formed so as to divide the main space so as to extend from one side of the first side peripheral wall portion to the opposite side in a direction intersecting the reference direction. The surface is in close contact pressure contact with the first main surface of the substrate and, along the auxiliary partition wall and the first side peripheral wall portion, along the peripheral edge of the substrate region on the side where the connector does not exist with the auxiliary partition wall as a boundary With the part as the protective partition wall, the inside is the condensation protection space,
The bypass wiring part, avoiding the pressure contact position of the substrate before Symbol protective partition wall or the bottom side support part is pressed against the substrate, wherein provided as the internal wiring layers are routed within said substrate An in-vehicle electronic device circuit module characterized by comprising:

前記第一本体は前記天面部周縁から立ち下がる第一側周壁部を有する一方、前記第二本体は前記底部周縁から立ち上がる第二側周壁部を有し、前記底部側支持部は、前記第二側周壁部よりも小さな高さにて前記基板の第二主表面の周方向に沿って環状に形成されるとともに、突出方向先端面が前記基板の第二主表面に密着圧接されてなり、前記底部空間の前記環状の底部側支持部に囲まれた部分が底部側副保護空間とされている請求項１又は請求項２記載の車載用電子機器回路モジュール。 The first main body has a first side peripheral wall portion that falls from the peripheral edge of the top surface portion, while the second main body has a second side peripheral wall portion that rises from the peripheral edge of the bottom portion, and the bottom side support portion is The ring is formed annularly along the circumferential direction of the second main surface of the substrate at a height smaller than the side peripheral wall portion, and the front end surface in the protruding direction is in close contact pressure contact with the second main surface of the substrate, The in-vehicle electronic device circuit module according to claim 1 or 2, wherein a portion of the bottom space surrounded by the annular bottom side support portion is a bottom side sub-protection space.

前記第一本体は前記天面部周縁から立ち下がる第一側周壁部を有する一方、前記第二本体は前記底部周縁から立ち上がる第二側周壁部を有し、前記本体結合部は、前記第一側周壁部と前記第二側周壁部との一方に形成される係合受け部と、他方に形成されるとともに、前記第一本体が前記第二本体から離脱する向きへの前記係合受け部の自身に対する相対移動を阻止するように該係合受け部と係合する係合部とを有し、
前記第一本体と前記第二本体との間に前記基板を配置して、前記保護区画壁の先端面を前記基板の第一主表面に圧接しながら前記第一本体と前記第二本体とを相対的に接近させることにより、前記係合部が弾性変形しつつ前記係合受け部を乗り超え、その後弾性復帰して該係合受け部と係合することにより、前記保護区画壁の前記基板への圧接状態を維持しつつ、前記第一本体と前記第二本体とを抜け止め結合するようにした請求項１ないし請求項３のいずれか１項に記載の車載用電子機器回路モジュール。 The first main body has a first side peripheral wall portion that falls from the peripheral edge of the top surface portion, while the second main body has a second side peripheral wall portion that rises from the peripheral edge of the bottom portion, and the main body coupling portion is the first side An engagement receiving portion formed on one of the peripheral wall portion and the second side peripheral wall portion, and an engagement receiving portion formed on the other and in a direction in which the first main body is detached from the second main body. An engagement portion that engages with the engagement receiving portion so as to prevent relative movement with respect to itself;
The substrate is disposed between the first main body and the second main body, and the first main body and the second main body are placed while pressing the front end surface of the protective partition wall against the first main surface of the substrate. By being relatively approached, the engagement portion gets over the engagement receiving portion while being elastically deformed, and then elastically recovers and engages with the engagement receiving portion, whereby the substrate of the protective partition wall The in-vehicle electronic device circuit module according to any one of claims 1 to 3, wherein the first main body and the second main body are connected to each other while being kept in pressure contact with each other.

前記コネクタと前記結露保護空間内の結露保護対象部品とを接続する配線部を横切る形で前記保護区画壁が配置されてなり、前記配線部は、前記コネクタから前記保護領域外にてビアを介して第一主表面側から前記迂回配線部に導かれた後、前記保護区画壁を通過して前記保護領域内に侵入する位置まで該迂回配線部として引き回され、該位置にて再びビアを介して第一主表面側の配線部に戻される請求項１ないし請求項４のいずれか１項に記載の車載用電子機器回路モジュール。 The protective partition wall is disposed across a wiring portion that connects the connector and a condensation protection target component in the condensation protection space, and the wiring portion is connected to the connector outside the protection region via a via. Then, after being led from the first main surface side to the detour wiring section, it is routed as the detour wiring section to a position where it passes through the protection partition wall and enters the protection area, and the via is again routed at the position. 5. The in-vehicle electronic device circuit module according to claim 1, which is returned to the wiring portion on the first main surface side via the wiring.

前記機器回路に含まれる配線部は、前記保護区画壁又は前記底部側支持部との当接位置を含む部分が、残余の部分よりも配線幅が広くされた補強配線部とされている請求項１ないし請求項５のいずれか１項に記載の車載用電子機器回路モジュール。 The wiring part included in the device circuit is a reinforcing wiring part in which a part including a contact position with the protective partition wall or the bottom side support part is a wiring part wider than a remaining part. The vehicle-mounted electronic device circuit module of any one of Claim 1 thru | or 5.

前記保護区画壁の先端面には、前記機器回路に含まれる配線部との当接位置に、圧接力逃がし用のスリットが形成されている請求項１ないし請求項６のいずれか１項に記載の車載用電子機器回路モジュール。 The slit for pressure-contact force relief is formed in the front end surface of the said protection partition wall in the contact position with the wiring part contained in the said apparatus circuit, The any one of Claim 1 thru | or 6 is formed. In-vehicle electronic device circuit module.

前記第一本体は前記天面部周縁から立ち下がるとともに、前記基板の第一主表面の周縁部に先端面が直接的に密着圧接される第一側周壁部と、前記基板の第一主表面上にて前記第一側周壁部から内側に張り出す形で前記コネクタの周囲に沿うように配置されるコネクタ周囲空間区画壁とを有し、該コネクタ周囲空間区画壁と、前記第一側周壁部のうち、当該コネクタ周囲空間区画壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とが前記保護区画壁を形成している請求項１ないし請求項７のいずれか１項に記載の車載用電子機器回路モジュール。 The first body falls from the periphery of the top surface portion, and a first side peripheral wall portion whose tip surface is in close contact pressure contact with the peripheral portion of the first main surface of the substrate, and on the first main surface of the substrate And a connector surrounding space partition wall arranged along the periphery of the connector so as to protrude inward from the first side peripheral wall portion, and the connector surrounding space partition wall and the first side peripheral wall portion 8. The protective partition wall according to claim 1, wherein a portion of the connector surrounding space partition wall along the peripheral edge of the board region on the side where the connector does not exist forms the protective partition wall. In-vehicle electronic device circuit module.

前記コネクタ周囲空間区画壁と前記補助仕切壁と前記第一側周壁部のそれらコネクタ周囲空間区画壁及び補助仕切壁の間に位置する部分とを前記保護区画壁として、その内部が第二の前記結露保護空間とされている請求項１ないし請求項８のいずれか１項に記載の車載用電子機器回路モジュール。 The portion surrounding the connector surrounding space partition wall, the auxiliary partition wall, and the first side peripheral wall portion located between the connector surrounding space partition wall and the auxiliary partition wall as the protective partition wall, The in-vehicle electronic device circuit module according to any one of claims 1 to 8, wherein the circuit module is a dew condensation protection space.

前記コネクタ周囲空間区画壁の先端面と前記基板の第一主表面との間には、前記コネクタ周囲空間区画壁と前記補助仕切壁と前記第一側周壁部のそれらコネクタ周囲空間区画壁及び補助仕切壁の間に位置する部分とが区画する補助空間と、前記コネクタ周囲空間とを連通させる連通隙間が形成されている請求項９記載の車載用電子機器回路モジュール。 Between the front end surface of the connector surrounding space partition wall and the first main surface of the substrate, the connector surrounding space partition wall, the auxiliary partition wall, and the connector surrounding space partition wall and the auxiliary of the first side peripheral wall portion are provided. The in-vehicle electronic device circuit module according to claim 9, wherein a communication gap is formed to connect the auxiliary space defined by the portion located between the partition walls and the connector surrounding space.

前記補助仕切壁は、前記コネクタ周囲空間区画壁及び前記第一側周壁部のいずれよりも内側において、前記基板の第一主表面上に定められた閉領域に沿う周回仕切壁とされ、当該周回仕切壁を前記保護区画壁としてその内側空間が前記結露保護空間とされている請求項１ないし請求項１０のいずれか１項に記載の車載用電子機器回路モジュール。 The auxiliary partition wall is a circulation partition wall along a closed region defined on the first main surface of the substrate, inside the connector surrounding space partition wall and the first side peripheral wall portion, and The vehicle-mounted electronic device circuit module according to claim 1, wherein a partition wall is used as the protection partition wall and an inner space thereof is the condensation protection space.

前記コネクタ周囲空間区画壁と、前記第一側周壁部のうち、当該コネクタ周囲空間区画壁を境界として前記コネクタが存在しない側の基板領域周縁に沿う部分とが前記周回仕切壁とは別の第二の前記保護区画壁を形成し、該第二の前記保護区画壁と前記周回仕切壁との間に位置する空間が第二の前記結露保護空間とされている請求項１１記載の車載用電子機器回路モジュール。 The peripheral space partition wall and a portion of the first side peripheral wall portion along the peripheral edge of the board region on the side where the connector does not exist with the connector peripheral space partition wall as a boundary are different from the peripheral partition wall. The in-vehicle electronic device according to claim 11, wherein a space formed between the second protective partition wall and the second partition wall is the second dew condensation protective space. Equipment circuit module.