JP4969354B2 - Circuit board heat dissipation structure with optical connector - Google Patents

Circuit board heat dissipation structure with optical connector Download PDF

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JP4969354B2
JP4969354B2 JP2007193949A JP2007193949A JP4969354B2 JP 4969354 B2 JP4969354 B2 JP 4969354B2 JP 2007193949 A JP2007193949 A JP 2007193949A JP 2007193949 A JP2007193949 A JP 2007193949A JP 4969354 B2 JP4969354 B2 JP 4969354B2
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optical connector
circuit board
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dissipation structure
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顕人 西村
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Fujikura Ltd
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Description

この発明は、光電素子等の電子デバイスを搭載した回路基板の放熱構造、特に光コネクタを備えた回路基板の放熱構造に関する。   The present invention relates to a heat dissipation structure for a circuit board on which an electronic device such as a photoelectric element is mounted, and particularly to a heat dissipation structure for a circuit board provided with an optical connector.

回路基板に発熱素子（発熱電子部品）が搭載されている場合、通常、発熱素子の発熱を放熱することが必要となる。その場合の一般的な放熱手段としては、回路基板にヒートシンクを取り付けることが行われている。   When a heating element (heating electronic component) is mounted on a circuit board, it is usually necessary to dissipate the heat generated by the heating element. As a general heat dissipation means in that case, a heat sink is attached to a circuit board.

回路基板上に光電素子（ＬＥＤ、ＬＤやＰＤ等）や駆動ＩＣ等の電子デバイスからの発熱を放熱する手段として、例えば特許文献１（光コネクタ）に記載されたものがある。
特許文献１における放熱手段は、回路基板に設けた隣接する光モジュール間に配置された光電素子内蔵の光コネクタ（ＯＥＩＣ内蔵の光コネクタ）の発熱を放熱するものであり、かつ、光モジュールが冷却装置を備えている場合のものであるが、光コネクタ（レセプタクル１６）とこれに隣接する冷却装置の外面（伝導冷却板保持材（放熱板に相当）７）との間の隙間に熱伝導グリス４０を充填して、光コネクタから冷却装置（放熱板）への熱伝達を良好にしようとするものである。
特許文献１：特許２９９１３４６号公報 第１１図、第６頁右欄第１〜９行等 As means for radiating heat generated from electronic devices such as photoelectric elements (LED, LD, PD, etc.) and driving ICs on a circuit board, there is one described in Patent Document 1 (optical connector), for example.
The heat dissipating means in Patent Document 1 dissipates heat generated by an optical connector with a built-in photoelectric element (an optical connector with a built-in OEIC) arranged between adjacent optical modules provided on a circuit board, and the optical module is cooled. In the case where a device is provided, heat conduction grease is formed in a gap between the optical connector (receptacle 16) and the outer surface of the cooling device adjacent thereto (conduction cooling plate holding material (corresponding to a heat radiating plate) 7). 40 is filled to improve heat transfer from the optical connector to the cooling device (heat radiating plate).
Patent Document 1: Japanese Patent No. 2911346 FIG. 11, page 6, right column, lines 1-9, etc.

回路基板にヒートシンクを取り付ける一般的な放熱手段は、特にスペース上の制約がある場合には、適切な形状・大きさのヒートシンクを設置できないことがあり、充分な冷却性能が得られない場合がある。   General heat dissipating means for attaching a heat sink to a circuit board may not be able to install a heat sink of an appropriate shape and size, especially when space is limited, and may not provide sufficient cooling performance. .

また、特許文献１の放熱手段は、光コネクタと放熱板（冷却装置の外面）との間の熱伝導を良くするものであるが、特に光コネクタが樹脂製の場合、光電素子の発熱が光コネクタを介して外部に効率よく伝達されるとは言い難い。
特に光電素子（特にＬＤ等の発光素子）からの発熱量は大きいので、光電素子からの発熱を効率良く処理できる構造が求められている。 In addition, the heat radiating means of Patent Document 1 improves the heat conduction between the optical connector and the heat radiating plate (the outer surface of the cooling device). In particular, when the optical connector is made of resin, the photoelectric element generates heat. It is hard to say that it is efficiently transmitted to the outside through the connector.
In particular, since the amount of heat generated from the photoelectric element (particularly, a light emitting element such as an LD) is large, a structure capable of efficiently processing the heat generated from the photoelectric element is required.

また、特許文献１のように回路基板の発熱素子と放熱板とを熱伝導グリスを介して接触させることで効率よく放熱する放熱手段は、一般的にも行われているが、特に基板上の光電素子との光接続を行う光コネクタの場合、熱伝導グリスを用いることは、回路基板を汚染し光電素子や光コネクタ端面を汚染し光損失が増す恐れがあるので、好ましくない。   In addition, as disclosed in Patent Document 1, a heat radiating means for efficiently radiating heat by bringing a heat generating element of a circuit board and a heat radiating plate into contact with each other through heat conduction grease is generally performed. In the case of an optical connector that performs optical connection with a photoelectric element, it is not preferable to use thermal conductive grease because it may contaminate the circuit board and contaminate the photoelectric element and the optical connector end face and increase optical loss.

本発明は上記従来の欠点を解消するためになされたもので、光電素子等の電子デバイスを搭載した回路基板の発熱を効率よく放熱することができ、また、熱伝導グリスで回路基板の表面を汚染して、光コネクタ接続特性を悪化させることもない光コネクタを備えた回路基板の放熱構造を提供することを目的とする。   The present invention has been made to eliminate the above-described conventional drawbacks, and can efficiently dissipate heat generated by a circuit board on which an electronic device such as a photoelectric element is mounted, and the surface of the circuit board can be covered with heat conductive grease. An object of the present invention is to provide a heat dissipation structure for a circuit board provided with an optical connector that does not contaminate and deteriorate the optical connector connection characteristics.

上記課題を解決する本発明は、回路基板上の光電素子に対して嵌合ピン位置決め方式により位置決め固定される光コネクタを備えた回路基板の放熱構造であって、回路基板には光電素子から発生する熱を放熱するための熱伝導材を備え、
前記光コネクタにヒートシンクを装着し、
前記ヒートシンクは、光コネクタに架け渡された位置決めに用いる嵌合ピンを受容するピン受け穴が形成され、光コネクタの後端面側にコ字形の縦部を持つ態様で光コネクタを囲む断面コ字形をなしており、前記ピン受け穴が前記コ字形の縦部に形成されており、
前記嵌合ピンが熱伝導材と接触することにより、光電素子から発生する熱を光コネクタから放熱することを特徴とする。 The present invention for solving the above problems is a circuit board heat dissipation structure provided with an optical connector that is positioned and fixed to a photoelectric element on a circuit board by a fitting pin positioning method. Equipped with a heat conduction material to dissipate heat,
A heat sink is attached to the optical connector,
The heat sink is formed with a pin receiving hole for receiving a fitting pin used for positioning over the optical connector, and has a U-shaped cross section surrounding the optical connector in a mode having a U-shaped vertical portion on the rear end surface side of the optical connector. And the pin receiving hole is formed in the U-shaped vertical portion,
When the fitting pin comes into contact with the heat conducting material, heat generated from the photoelectric element is radiated from the optical connector.

請求項２の発明は、回路基板上の光電素子に対して嵌合ピン位置決め方式により位置決め固定される光コネクタを備えた回路基板の放熱構造であって、
回路基板には光電素子から発生する熱を放熱するための熱伝導材を備え、
前記光コネクタにヒートシンクを装着し、
前記ヒートシンクは、光コネクタに架け渡された位置決めに用いる嵌合ピンを受容するピン受け穴が形成され、光コネクタの前端面側にコ字形の縦部を持つ態様で光コネクタを囲む断面コ字形をなしており、前記ピン受け穴が前記コ字形の縦部に形成されており、
前記嵌合ピンが熱伝導材と接触することにより、光電素子から発生する熱を光コネクタから放熱することを特徴とする。 The invention of claim 2 is a circuit board heat dissipation structure including an optical connector positioned and fixed by a fitting pin positioning method with respect to the photoelectric element on the circuit board,
The circuit board is provided with a heat conductive material for radiating heat generated from the photoelectric element,
A heat sink is attached to the optical connector,
The heat sink has a U-shaped cross section surrounding the optical connector in a form having a U-shaped vertical portion on the front end face side of the optical connector, in which a pin receiving hole for receiving a fitting pin used for positioning spanned over the optical connector is formed. And the pin receiving hole is formed in the U-shaped vertical portion,
When the fitting pin comes into contact with the heat conducting material, heat generated from the photoelectric element is radiated from the optical connector.

請求項３は、請求項１又は２において、嵌合ピンの材質をＳＵＳよりも熱伝導率が良好な材質としたことを特徴する。 A third aspect is characterized in that, in the first or second aspect , the material of the fitting pin is a material having a thermal conductivity better than that of SUS.

請求項４は、請求項１〜３における嵌合ピンとして、銅の棒にＳＵＳ製のスリット入りスリーブを被せ、両端に銅の棒が露出した嵌合ピンを用いたことを特徴とする。 According to a fourth aspect of the present invention, as the fitting pin according to any one of the first to third aspects , a fitting pin in which a copper rod is covered with a SUS slit sleeve and the copper rod is exposed at both ends is used.

本発明において、回路基板上の光電素子等の発熱は、回路基板上の熱伝導材から放熱されると同時に、この熱伝導材に接触している嵌合ピンを伝わって光コネクタからも放熱される。嵌合ピンとして熱伝導性の高い材料を用いることで、効率よく放熱することができる。
また、熱伝導グリスで回路基板を汚染するという問題はないので、基板上の光電素子に光コネクタ端面が対面する本発明の場合に、極めて適切である。
また、光コネクタにヒートシンクを装着したことで、回路基板上の光電素子等の発熱は、さらに効率よく放熱することができる。
また、ヒートシンクを嵌合ピンに嵌合させたことで、回路基板上の光電素子等の発熱は、嵌合ピンを介してヒートシンクに効率よく伝達され、さらに効率よく放熱することができる。 In the present invention, heat generated by the photoelectric elements on the circuit board is dissipated from the heat conducting material on the circuit board, and at the same time, is also dissipated from the optical connector through the fitting pin in contact with the heat conducting material. The By using a material having high thermal conductivity as the fitting pin, heat can be efficiently radiated.
Further, since there is no problem of contaminating the circuit board with the heat conductive grease, it is extremely suitable in the case of the present invention in which the end face of the optical connector faces the photoelectric element on the board.
Further, since the heat sink is attached to the optical connector, the heat generated by the photoelectric elements on the circuit board can be radiated more efficiently.
Further, it was fitted to heatsink the mating pin, heat generation of such photoelectric element on the circuit board is efficiently transferred to the heat sink through the fitting pins, it is possible to further efficiently dissipated.

ヒートシンクを回路基板から離間させることができるので、基板面に近接した空間に余裕がない場合でも、放熱性能を確保できる形状・大きさのヒートシンクを配置することも可能となる。   Since the heat sink can be separated from the circuit board, it is possible to dispose a heat sink having a shape and size that can ensure heat dissipation performance even when there is no room in the space close to the board surface.

以下、本発明を実施した、光コネクタを備えた回路基板の放熱構造について、図面を参照して説明する。   Hereinafter, a heat dissipation structure for a circuit board equipped with an optical connector embodying the present invention will be described with reference to the drawings.

図１は本発明の、光コネクタを備えた回路基板の放熱構造（以下場合により、単に回路基板の放熱構造、あるいは単に放熱構造と呼ぶ）の一実施例を示す斜視図、図２は図１の回路基板の放熱構造を反対側（基板表面側）から見た斜視図、図３は上記回路基板の放熱構造の光コネクタ実装状態の横断面図で図４のＢ−Ｂ断面図、図４は上記回路基板の放熱構造の光コネクタ実装状態の縦断面図で図３のＡ−Ａ断面図である。
これらの図において、１は種々の電子部品とともに光電素子を搭載した光モジュールである回路基板であり、光電素子としてＬＥＤ（発光ダイオード）、ＬＤ（レーザーダイオード）２及びＰＤ（フォトダイオード）３等を搭載している。
また、回路基板１の一方の面には、光電素子２、３や受発光素子の駆動ＩＣ等（以下、光デバイスという場合がある）が発生する熱を発散させるためのパネル状の熱伝導材８が取り付けられている。
光デバイスは、熱伝導材８上に配置されている。
以下、本発明では、光デバイスから発生する熱を光電素子から発生する熱と言う場合がある。
回路基板１に実装される光コネクタ４は、概ね角形をなすフェルール５にあけた光ファイバ穴５ａの列の両側に嵌合ピン穴５ｂを有し、回路基板側の嵌合ピン穴との間に嵌合ピンを架け渡して光学的な位置決めするピン嵌合位置決め方式の光コネクタである。
光コネクタの光ファイバ穴５ａには、光ファイバテープ６の光ファイバ６ａが挿通固定され端面研磨されている。この光コネクタ４はいわゆるＭＴコネクタと称される光コネクタに相当し、JIS C 5981に規定されるＦ１２形多心光ファイバコネクタ用のフェルールに概ね相当する。
嵌合ピン７の材質としては、一般的に用いられているＳＵＳを用いることができる。
ＳＵＳよりも熱伝導性に優れた熱伝導性樹脂や、ジュラルミン、チタンを用いることができる。 FIG. 1 is a perspective view showing an embodiment of a heat dissipation structure for a circuit board (hereinafter, simply referred to as a heat dissipation structure for a circuit board or simply a heat dissipation structure) according to the present invention, and FIG. FIG. 3 is a cross-sectional view of the circuit board heat dissipation structure as viewed from the opposite side (board surface side), FIG. 3 is a cross-sectional view of the circuit board heat dissipation structure in the state where the optical connector is mounted, and FIG. These are the longitudinal cross-sectional views of the optical connector mounting state of the heat dissipation structure of the said circuit board, and AA sectional drawing of FIG.
In these drawings, reference numeral 1 denotes a circuit board which is an optical module on which photoelectric elements are mounted together with various electronic components. As the photoelectric elements, an LED (light emitting diode), an LD (laser diode) 2, a PD (photodiode) 3, etc. It is installed.
Further, on one surface of the circuit board 1, a panel-like heat conductive material for dissipating heat generated by the photoelectric elements 2 and 3 and the drive ICs of the light emitting and receiving elements (hereinafter sometimes referred to as optical devices). 8 is attached.
The optical device is disposed on the heat conductive material 8.
Hereinafter, in the present invention, heat generated from the optical device may be referred to as heat generated from the photoelectric element.
The optical connector 4 mounted on the circuit board 1 has fitting pin holes 5b on both sides of a row of optical fiber holes 5a formed in a generally square ferrule 5, and between the fitting pin holes on the circuit board side. This is an optical connector of a pin fitting positioning system in which a fitting pin is bridged over and optically positioned.
The optical fiber 6a of the optical fiber tape 6 is inserted and fixed in the optical fiber hole 5a of the optical connector, and the end face is polished. This optical connector 4 corresponds to an optical connector called a so-called MT connector, and generally corresponds to a ferrule for an F12 type multi-core optical fiber connector defined in JIS C 5981.
As a material of the fitting pin 7, generally used SUS can be used.
A heat conductive resin, duralumin, or titanium, which has better heat conductivity than SUS, can be used.

この光コネクタ４に装着されるヒートシンク１０は、光コネクタ４の後端面側にコ字形の縦部１０ａを持つ態様で光コネクタ４を囲む断面コ字形をなしており、前記縦部１０ａに、嵌合ピン７を嵌合させる（受容させる）２つのピン受け穴１０ｂが形成されている。
ただし、このピン受け穴１０ｂの精度は、ヒートシンク１０を、嵌合ピン７の先端に固定する程度であれば良く、光学素子と光ファイバ端面の位置決めをする嵌合ピン位置決め穴ほどの精度は必要無い。ヒートシンク１０は、このピン受け穴１０ｂに嵌合する嵌合ピン７を介して光コネクタ４に装着されている。また、嵌合ピン７の先端部は、熱伝導材８にあけたピン穴８ａに嵌合している。
ヒートシンク１０のコ字形の上下の横部１０ｃの外面には、放熱のための複数の突起１０ｄが形成されている。ヒートシンク１０の後端面に、光ファイバテープ保護用のゴムブーツ９を通す開口１０ｅがあけられている。
ヒートシンク１０の材質としては、熱伝導性に優れたアルミ、銅を用いることができ、また、熱伝導性に優れた樹脂等を用いることができる。
なお、図示されている光電素子２、３等とヒートシンクの構造は模式的な図である。
熱伝導材８は放熱特性が良好な金属、樹脂、その他により構成することができる。
熱伝導材８の上に、直接、光デバイスを配置しても良いし、光デバイスをブロック状の光モジュールに配置し、この光モジュールと別体の熱伝導材８を接続しても良い。 The heat sink 10 attached to the optical connector 4 has a U-shaped cross section surrounding the optical connector 4 in a form having a U-shaped vertical portion 10a on the rear end surface side of the optical connector 4, and is fitted into the vertical portion 10a. Two pin receiving holes 10b into which the mating pins 7 are fitted (received) are formed.
However, the accuracy of the pin receiving hole 10b is sufficient as long as the heat sink 10 is fixed to the tip of the fitting pin 7, and the accuracy of the fitting pin positioning hole for positioning the optical element and the optical fiber end surface is necessary. No. The heat sink 10 is attached to the optical connector 4 via a fitting pin 7 that fits into the pin receiving hole 10b. The tip of the fitting pin 7 is fitted in a pin hole 8 a formed in the heat conductive material 8.
A plurality of protrusions 10d for heat dissipation are formed on the outer surface of the upper and lower horizontal portions 10c of the U-shape of the heat sink 10. An opening 10 e through which the rubber boot 9 for protecting the optical fiber tape is passed is formed in the rear end surface of the heat sink 10.
As a material of the heat sink 10, aluminum and copper excellent in thermal conductivity can be used, and resin excellent in thermal conductivity can be used.
Note that the structure of the illustrated photoelectric elements 2 and 3 and the heat sink is a schematic diagram.
The heat conductive material 8 can be made of a metal, resin, or the like having good heat dissipation characteristics.
An optical device may be arranged directly on the heat conducting material 8, or the optical device may be arranged in a block-like optical module, and this optical module and a separate heat conducting material 8 may be connected.

上記の回路基板１の放熱構造において、嵌合ピンが挿入されていない場合、光デバイスから発生した熱は、主として熱伝導材８により放熱されるが、嵌合ピンが挿入されると、放熱ルートが増えて、近接するピン穴８ａに嵌合する嵌合ピン７を介してコネクタ本体からも放熱される。
しかし、光コネクタ本体からの放熱量が不十分な場合、光コネクタ本体に熱が蓄積する。
コネクタ本体は、通常は樹脂製である。
樹脂としては、例えば、エポキシやカーボンフィラー入りのＰＰＳ等により成形されており、熱により光コネクタ本体が膨張したり、そり返えしが発生するなどの原因で光接続特性に影響を及ぼす場合がある。
そのようなおそれが有る場合には、光コネクタ本体にヒートシンク１０を取り付けると、熱は嵌合ピン７からヒートシンク１０に伝わり、ヒートシンク１０から効率よく放熱される。したがって、光コネクタ本体への蓄熱の影響を抑えながら光デバイスの冷却を効率よく行うことができる。
つまり、単に光コネクタ本体から放熱する構成に限らず、ヒートシンク等の放熱体を取り付けることを、発熱量に応じて適宜選択することができる。
この放熱構造は、熱伝導グリスを用いないので、熱伝導グリスで基板１上の光電素子２、３や光コネクタ端面を汚染して光損失が増す問題は生じない。したがって、基板１上の光電素子２、３に、光コネクタ端面が対面して光軸合わせされる本発明の場合に、極めて適切である。
また、この実施例では、光コネクタ４を回路基板１に実装した図３、図４の状態で、ヒートシンク１０の先端面が基板面から離間しているので、基板面に近接した空間に余裕がない場合でも、放熱性能を確保できる形状・大きさのヒートシンクを配置することも可能となる。
また、基板１上に十分な面積の熱伝導材８を設置するスペースを確保することが困難な場合も考えられるが、その場合に、嵌合ピン７を介して行うヒートシンク１０からの放熱のみで、回路基板の冷却をまかなうことも考えられる。
なお、光デバイスを搭載した光モジュールブロックを基板１の表面に載置した場合でも、光モジュールブロック自体に嵌合ピン穴８ａを形成することにより、同様の作用効果を得ることができる。 In the heat dissipation structure of the circuit board 1 described above, when the fitting pin is not inserted, heat generated from the optical device is mainly dissipated by the heat conducting material 8, but when the fitting pin is inserted, the heat dissipation route is obtained. And the heat is also radiated from the connector body through the fitting pins 7 that fit into the adjacent pin holes 8a.
However, when the amount of heat released from the optical connector body is insufficient, heat accumulates in the optical connector body.
The connector body is usually made of resin.
As the resin, for example, it is molded from epoxy or PPS containing carbon filler, and the optical connector characteristics may be affected due to expansion of the optical connector body due to heat or warping. is there.
In such a case, when the heat sink 10 is attached to the optical connector body, the heat is transferred from the fitting pin 7 to the heat sink 10 and is efficiently radiated from the heat sink 10. Therefore, the optical device can be efficiently cooled while suppressing the influence of heat storage on the optical connector body.
That is, it is not limited to a configuration in which heat is radiated from the optical connector body, but it is possible to appropriately select attachment of a heat radiating body such as a heat sink according to the amount of heat generated.
Since this heat dissipation structure does not use thermal conductive grease, there is no problem of increasing optical loss due to contamination of the photoelectric elements 2 and 3 and the optical connector end face on the substrate 1 by the thermal conductive grease. Therefore, the present invention is extremely suitable in the case of the present invention in which the optical connector end faces face the photoelectric elements 2 and 3 on the substrate 1 and the optical axis is aligned.
Further, in this embodiment, in the state shown in FIGS. 3 and 4 in which the optical connector 4 is mounted on the circuit board 1, the tip surface of the heat sink 10 is separated from the board surface, so that there is a margin in the space close to the board surface. Even when there is no heat sink, it is possible to arrange a heat sink having a shape and size that can ensure heat dissipation performance.
In addition, there may be a case where it is difficult to secure a space for installing the heat conductive material 8 having a sufficient area on the substrate 1, but in that case, only heat radiation from the heat sink 10 performed via the fitting pin 7 is possible. It is also conceivable to provide cooling of the circuit board.
Even when the optical module block on which the optical device is mounted is placed on the surface of the substrate 1, the same effect can be obtained by forming the fitting pin hole 8a in the optical module block itself.

図６に示したヒートシンク２０は、光コネクタ４の前端面側にコ字形の縦部２０ａを持つ態様で光コネクタ４を囲む断面コ字形をなしており、前記縦部２０ａに、嵌合ピン７を嵌合させる２つのピン受け穴２０ｂが形成されている。ヒートシンク２０は、このピン受け穴２０ａに嵌合する嵌合ピン７を介して光コネクタ４に装着されているとともに、熱伝導材８に直接接触している。また、嵌合ピン７の先端部は、前記と同様に回路基板１の熱伝導材８にも嵌合している。
この実施例では、ヒートシンク２０が熱伝導材８に直接接触している点で、光デバイスに対する冷却効果が高い。 The heat sink 20 shown in FIG. 6 has a U-shaped cross section surrounding the optical connector 4 in a form having a U-shaped vertical portion 20a on the front end face side of the optical connector 4, and the vertical portion 20a has a fitting pin 7 Two pin receiving holes 20b for fitting the two are formed. The heat sink 20 is attached to the optical connector 4 via the fitting pin 7 fitted in the pin receiving hole 20a, and is in direct contact with the heat conductive material 8. Moreover, the front-end | tip part of the fitting pin 7 is fitted also to the heat conductive material 8 of the circuit board 1 similarly to the above.
In this embodiment, the cooling effect on the optical device is high in that the heat sink 20 is in direct contact with the heat conducting material 8.

また、図７に示すように、銅の棒１７ａにＳＵＳ製のスリット入りスリーブ１７ｂを被せてなるとともに、銅の棒１７ａの両端部１７ａ’、１７ａ”が露出した二重構造の円筒型の嵌合ピン１７を採用することができる。
ただし、スリット入りスリーブは周知の構造のものを採用できる。
この二重構造の嵌合ピン１７は、コネクタの精密位置決めと機械的な強度が、嵌合ピンの長手方向中央に延在するＳＵＳ製のスリーブ１７ｂにより確保され、熱伝導性は内部の銅の棒１７ａで確保できる。つまり、銅が露出した両端の部分１７ａ’、１７ａ”を、それぞれ熱発生側の媒体と熱発散側の媒体に接触させることにより、嵌合ピン１７による良好な放熱特性を確保することができる。複合材の組み合わせは、その他種々考えられる。 In addition, as shown in FIG. 7, a cylindrical rod-like fitting having a double structure in which both ends 17a ′ and 17a ″ of the copper rod 17a are exposed while the copper rod 17a is covered with a sleeve 17b made of SUS slit. A mating pin 17 can be employed.
However, the slit sleeve can be of a known structure.
This double-structured fitting pin 17 ensures the precision positioning and mechanical strength of the connector by the SUS sleeve 17b extending in the center in the longitudinal direction of the fitting pin, and the thermal conductivity of the internal copper. It can be secured with the rod 17a. That is, good heat dissipation characteristics by the fitting pins 17 can be ensured by bringing the portions 17a ′ and 17a ″ at both ends where the copper is exposed into contact with the medium on the heat generation side and the medium on the heat dissipation side, respectively. Various other combinations of composite materials are possible.

上記実施例では、光コネクタがいわゆるＭＴ光コネクタである場合について説明したが、コネクタはこれに限らない。
例えば、内部に鏡等の光軸変更機構を備え、主として光ファイバの配線方向が基板面にそっており、光ファイバ内を伝搬する光の光路を、内部の鏡等により回路基板上の光学素子に向けて９０°変換する光コネクタにも適用可能である。
また、各実施例では、熱伝達を目的とする嵌合ピンが２本である場合について説明したが、その本数は特に限定されない。
また、嵌合ピンとして、熱伝導性の極めて高いヒートパイプ（マイクロヒートパイプ）を採用することも考えられる。 In the above embodiment, the case where the optical connector is a so-called MT optical connector has been described, but the connector is not limited to this.
For example, an optical axis changing mechanism such as a mirror is provided inside, and the optical fiber wiring direction is mainly along the substrate surface, and the optical path of light propagating in the optical fiber is routed to the optical element on the circuit board by the internal mirror or the like. The present invention can also be applied to an optical connector that converts 90 ° toward.
Moreover, although each Example demonstrated the case where there were two fitting pins aiming at heat transfer, the number is not specifically limited.
It is also conceivable to employ a heat pipe (micro heat pipe) with extremely high thermal conductivity as the fitting pin.

本発明の、光コネクタを備えた回路基板の放熱構造の一実施例を示すもので、ヒートシンクを取り付けた光コネクタ、及びこの光コネクタを実装しようとする回路基板の斜視図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an optical connector to which a heat sink is attached, and a circuit board on which the optical connector is to be mounted, according to an embodiment of the present invention. 図１の構造を反対側（基板表面側）から見た斜視図である。It is the perspective view which looked at the structure of FIG. 1 from the other side (board | substrate surface side). 上記光コネクタを備えた回路基板の放熱構造の、光コネクタ実装状態の横断面図で、図４のＢ−Ｂ断面図である。FIG. 5 is a cross-sectional view of the circuit board heat dissipation structure including the optical connector in a state where the optical connector is mounted, and is a cross-sectional view taken along line BB in FIG. 4. 上記光コネクタを備えた回路基板の放熱構造の、光コネクタ実装状態の縦断面図で、図３のＡ−Ａ断面図である。FIG. 4 is a longitudinal cross-sectional view of the circuit board heat dissipation structure including the optical connector in a state where the optical connector is mounted, and is a cross-sectional view taken along line AA of FIG. 3. 図１におけるヒートシンク及び嵌合ピンのみを示した斜視図である。It is the perspective view which showed only the heat sink and fitting pin in FIG. 本発明の、光コネクタを備えた回路基板の放熱構造の他の実施例を示す斜視図である。It is a perspective view which shows the other Example of the thermal radiation structure of the circuit board provided with the optical connector of this invention. 本発明における嵌合ピンの他の実施例を示すもので、（イ）は嵌合ピンの正面図、（ロ）は横断面図である。The other Example of the fitting pin in this invention is shown, (A) is a front view of a fitting pin, (B) is a cross-sectional view.

符号の説明Explanation of symbols

１ 回路基板
１ａ ピン穴
２ ＬＤ（光電素子）
３ ＰＤ（光電素子）
４ 光コネクタ
５ フェルール
５ａ 光ファイバ穴
５ｂ 嵌合ピン穴
６ 光ファイバテープ
６ａ 光ファイバ
７、１７ 嵌合ピン
８、熱伝導材
８ａ ピン穴
９ ゴムブーツ
１０、２０ ヒートシンク
１０ａ、２０ａ 縦部
１０ｂ、２０ｂ ピン受け穴
１０ｃ、２０ｃ 横部
１０ｄ 突起
１０ｅ 開口 1 circuit board 1a pin hole 2 LD (photoelectric element)
3 PD (photoelectric element)
4 optical connector 5 ferrule 5a optical fiber hole 5b fitting pin hole 6 optical fiber tape 6a optical fiber 7, 17 fitting pin 8, heat conducting material 8a pin hole 9 rubber boot 10, 20 heat sink 10a, 20a vertical portion 10b, 20b pin Receiving holes 10c, 20c Lateral portion 10d Protrusion 10e Opening

Claims (4)

回路基板上の光電素子に対して嵌合ピン位置決め方式により位置決め固定される光コネクタを備えた回路基板の放熱構造であって、
回路基板には光電素子から発生する熱を放熱するための熱伝導材を備え、
前記光コネクタにヒートシンクを装着し、
前記ヒートシンクは、光コネクタに架け渡された位置決めに用いる嵌合ピンを受容するピン受け穴が形成され、光コネクタの後端面側にコ字形の縦部を持つ態様で光コネクタを囲む断面コ字形をなしており、前記ピン受け穴が前記コ字形の縦部に形成されており、
前記嵌合ピンが熱伝導材と接触することにより、光電素子から発生する熱を光コネクタから放熱することを特徴とする光コネクタを備えた回路基板の放熱構造。 A circuit board heat dissipation structure including an optical connector positioned and fixed by a fitting pin positioning method with respect to a photoelectric element on the circuit board,
The circuit board is provided with a heat conductive material for radiating heat generated from the photoelectric element,
A heat sink is attached to the optical connector,
The heat sink is formed with a pin receiving hole for receiving a fitting pin used for positioning over the optical connector, and has a U-shaped cross section surrounding the optical connector in a mode having a U-shaped vertical portion on the rear end surface side of the optical connector. And the pin receiving hole is formed in the U-shaped vertical portion,
A heat dissipation structure for a circuit board provided with an optical connector, wherein the fitting pin comes into contact with a heat conductive material to dissipate heat generated from the photoelectric element from the optical connector. 回路基板上の光電素子に対して嵌合ピン位置決め方式により位置決め固定される光コネクタを備えた回路基板の放熱構造であって、
回路基板には光電素子から発生する熱を放熱するための熱伝導材を備え、
前記光コネクタにヒートシンクを装着し、
前記ヒートシンクは、光コネクタに架け渡された位置決めに用いる嵌合ピンを受容するピン受け穴が形成され、光コネクタの前端面側にコ字形の縦部を持つ態様で光コネクタを囲む断面コ字形をなしており、前記ピン受け穴が前記コ字形の縦部に形成されており、
前記嵌合ピンが熱伝導材と接触することにより、光電素子から発生する熱を光コネクタから放熱することを特徴とする光コネクタを備えた回路基板の放熱構造。 A circuit board heat dissipation structure including an optical connector positioned and fixed by a fitting pin positioning method with respect to a photoelectric element on the circuit board,
The circuit board is provided with a heat conductive material for radiating heat generated from the photoelectric element,
A heat sink is attached to the optical connector,
The heat sink has a U-shaped cross section surrounding the optical connector in a form having a U-shaped vertical portion on the front end face side of the optical connector, in which a pin receiving hole for receiving a fitting pin used for positioning spanned over the optical connector is formed. And the pin receiving hole is formed in the U-shaped vertical portion,
A heat dissipation structure for a circuit board provided with an optical connector, wherein the fitting pin comes into contact with a heat conductive material to dissipate heat generated from the photoelectric element from the optical connector. 嵌合ピンの材質をＳＵＳよりも熱伝導率が良好な材質としたことを特徴する請求項１又は２に記載の光コネクタを備えた回路基板の放熱構造。 Heat radiation structure of a circuit board having an optical connector according to the material of the fitting pins in claim 1 or 2 thermal conductivity than SUS is characterized in that a good material. 銅の棒にＳＵＳ製のスリット入りスリーブを被せ、両端に銅の棒が露出した嵌合ピンを用いたことを特徴とする請求項１〜３のいずれか１項に記載の光コネクタを備えた回路基板の放熱構造。 Covered with a slit sleeve made of SUS on rod copper, having an optical connector according to any one of claims 1 to 3, characterized in that rods of copper with fitting pins exposed at both ends Circuit board heat dissipation structure.
JP2007193949A 2007-07-25 2007-07-25 Circuit board heat dissipation structure with optical connector Expired - Fee Related JP4969354B2 (en)

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