JP4966243B2 - メモリ集積化を用いる高感度光走査 - Google Patents
メモリ集積化を用いる高感度光走査 Download PDFInfo
- Publication number
- JP4966243B2 JP4966243B2 JP2008106115A JP2008106115A JP4966243B2 JP 4966243 B2 JP4966243 B2 JP 4966243B2 JP 2008106115 A JP2008106115 A JP 2008106115A JP 2008106115 A JP2008106115 A JP 2008106115A JP 4966243 B2 JP4966243 B2 JP 4966243B2
- Authority
- JP
- Japan
- Prior art keywords
- dimensional image
- image frames
- pixels
- array
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000010354 integration Effects 0.000 title description 17
- 230000003287 optical effect Effects 0.000 title description 12
- 238000007689 inspection Methods 0.000 claims abstract description 20
- 230000007547 defect Effects 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 14
- 238000005286 illumination Methods 0.000 claims description 7
- 230000001360 synchronised effect Effects 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000003384 imaging method Methods 0.000 description 46
- 238000010586 diagram Methods 0.000 description 29
- 239000000758 substrate Substances 0.000 description 29
- 239000002131 composite material Substances 0.000 description 26
- 239000003086 colorant Substances 0.000 description 6
- 238000007792 addition Methods 0.000 description 4
- 239000000872 buffer Substances 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000023004 detection of visible light Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
- H04N3/10—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
- H04N3/14—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
- H04N3/15—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
- H04N3/155—Control of the image-sensor operation, e.g. image processing within the image-sensor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8901—Optical details; Scanning details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/768—Addressed sensors, e.g. MOS or CMOS sensors for time delay and integration [TDI]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Multimedia (AREA)
- Power Engineering (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Textile Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Image Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Input (AREA)
- Image Analysis (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
22 プリント回路基板
24 カメラ
26 画像化素子
28 対物レンズ
30 カメラ制御部
32 平行移動ステージ
34 プロセッサ
36 ディスプレイ
Claims (14)
- 非連続的な照明を提供する光源と、
あるフレーム速度で、検査すべき対象物の複数の二次元画像フレームであって、該複数の二次元画像フレームの各々が前記対象物の同じ部分に対応する画像を含み、部分的に重なり合う複数の二次元画像フレームを順次取得するように動作する二次元の光センサアレイを有し、前記非連続の照明と、前記フレーム速度とが、概ね同期しており、
さらに、前記複数の二次元画像フレームを受信し、前記複数の二次元画像フレームの各々が含む前記画像における前記対象物の実質的に同じ部分の対応するピクセルが一致するように前記複数の二次元画像フレームを結合して、検査すべき前記対象物の表象を生成し、前記表象を検査して、検査すべき前記対象物上の欠陥の報告を提供するよう動作する欠陥分析器、を備える検査システム。 - 前記二次元の光センサアレイがCMOS集積回路上に配置されている請求項1に記載の検査システム。
- 前記二次元の光センサアレイが、複数のディジタル画像を提供し、各ディジタル画像は、複数のピクセルにより構成される、請求項1に記載の検査システム。
- 前記対象物の前記表象が複数のピクセルで構成されたディジタル表象を含み、前記表象が、異なる二次元画像フレームにおける前記対象物の同じ部分に対応するピクセルを結合することにより形成される、請求項3に記載の検査システム。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、前記複数の二次元画像フレームのうちの別の二次元画像フレームと少なくとも部分的に、少なくともピクセルの単一の列において重なり合う、請求項1に記載の検査システム。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、実質的に、前記複数の画像フレームのうちの別の二次元画像フレームと重なり合う、請求項5に記載の検査システム。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、
実質的に前記複数の二次元画像フレームのうちの別の二次元画像フレームと重なり合うが、少なくともピクセルの単一の列は重ならない、請求項6に記載の検査システム。 - 対象物を検査する方法であって、
非連続的な照明で検査すべき対象物を照射することと、
あるフレーム速度で、前記検査すべき対象物の複数の二次元画像フレームであって、該複数の二次元画像フレームの各々が前記対象物の同じ部分に対応する画像を含み、部分的に重なり合う複数の二次元画像フレームを順次取得することと、
前記複数の二次元画像フレームの各々が含む前記画像における前記対象物の実質的に同じ部分の対応するピクセルが一致するように、前記複数の二次元画像フレームを結合することにより、前記検査すべき対象の表象を生成することと、
前記表象の検査に基づいて検査すべき前記対象物上の欠陥を報告することと、
を含み、
前記非連続な照明と前記フレーム速度での取得とが、概ね同期している、方法。 - 取得することが、CMOS集積回路上に配置された二次元の光センサアレイを用いて行われる、請求項8に記載の方法。
- 前記二次元画像フレームを取得することは、複数のディジタル画像を取得することを含み、各ディジタル画像が複数のピクセルにより構成されている、請求項8に記載の方法。
- 前記対象物の表象を生成することが、複数のピクセルで構成されたディジタル表象を生成することを含み、前記表象が、異なる二次元画像フレームにおける前記対象物の同じ部分に対応するピクセルを結合することにより生成される、請求項10に記載の方法。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、前記複数の二次元画像フレームのうちの別の二次元画像フレームと、少なくとも部分的に、少なくともピクセルの単一の列において、重なり合う、請求項8に記載の方法。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、前記複数の画像フレームのなかの別の二次元画像フレームとほぼ重なり合う、請求項12に記載の方法。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、前記複数の二次元画像フレームのうちの別の二次元画像フレームとほぼ重なり合うが、少なくともピクセルの単一の列では重ならない、請求項13に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29976601P | 2001-06-22 | 2001-06-22 | |
US60/299,766 | 2001-06-22 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003507534A Division JP2005520123A (ja) | 2001-06-22 | 2002-06-23 | メモリ集積化を用いる高感度光走査 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008241718A JP2008241718A (ja) | 2008-10-09 |
JP4966243B2 true JP4966243B2 (ja) | 2012-07-04 |
Family
ID=23156205
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003507534A Pending JP2005520123A (ja) | 2001-06-22 | 2002-06-23 | メモリ集積化を用いる高感度光走査 |
JP2008106115A Expired - Fee Related JP4966243B2 (ja) | 2001-06-22 | 2008-04-15 | メモリ集積化を用いる高感度光走査 |
JP2008106077A Expired - Fee Related JP4966242B2 (ja) | 2001-06-22 | 2008-04-15 | メモリ集積化を用いる高感度光走査 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003507534A Pending JP2005520123A (ja) | 2001-06-22 | 2002-06-23 | メモリ集積化を用いる高感度光走査 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008106077A Expired - Fee Related JP4966242B2 (ja) | 2001-06-22 | 2008-04-15 | メモリ集積化を用いる高感度光走査 |
Country Status (5)
Country | Link |
---|---|
US (8) | US7009163B2 (ja) |
JP (3) | JP2005520123A (ja) |
IL (1) | IL159200A0 (ja) |
TW (1) | TW583868B (ja) |
WO (1) | WO2003001189A1 (ja) |
Families Citing this family (104)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7009163B2 (en) * | 2001-06-22 | 2006-03-07 | Orbotech Ltd. | High-sensitivity optical scanning using memory integration |
JP2003098112A (ja) * | 2001-09-25 | 2003-04-03 | Hitachi Ltd | 薄膜デバイスの表面画像の検出・出力方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその製造装置 |
TWI298097B (en) * | 2003-01-09 | 2008-06-21 | Orbotech Ltd | Method and apparatus for simultaneous 2-d and topographical inspection |
WO2005096219A1 (en) * | 2004-04-02 | 2005-10-13 | Silverbrook Research Pty Ltd | Surface having disposed therein or thereon coded data |
JP2008064624A (ja) * | 2006-09-07 | 2008-03-21 | Toyo Inspections Kk | 撮像装置及び撮像方法 |
FR2906080B1 (fr) * | 2006-09-19 | 2008-11-28 | E2V Semiconductors Soc Par Act | Capteur d'image en defilement par integrations successives et sommation, a pixels cmos actifs |
US7813013B2 (en) * | 2006-11-21 | 2010-10-12 | Illumina, Inc. | Hexagonal site line scanning method and system |
EP3543357A1 (en) | 2007-05-08 | 2019-09-25 | Trustees of Boston University | Chemical functionalization of solid-state nanopores and nanopore arrays and applications thereof |
IL188825A0 (en) * | 2008-01-16 | 2008-11-03 | Orbotech Ltd | Inspection of a substrate using multiple cameras |
JP5175600B2 (ja) | 2008-04-09 | 2013-04-03 | 株式会社日立ハイテクノロジーズ | 検査装置 |
GB0806427D0 (en) | 2008-04-09 | 2008-05-14 | Cmosis Nv | Parallel analog-to-digital conversion in pixel arrays |
EP2119596B1 (en) * | 2008-05-16 | 2012-01-04 | SMR Patents S.à.r.l. | Imaging system for a vehicle and mirror assembly comprising such an imaging system |
CN102119328B (zh) * | 2008-08-07 | 2013-01-23 | 凯德易株式会社 | 检查*** |
JP5392533B2 (ja) * | 2008-10-10 | 2014-01-22 | ソニー株式会社 | 固体撮像素子、光学装置、信号処理装置及び信号処理システム |
US20100123077A1 (en) * | 2008-11-18 | 2010-05-20 | Gatan, Inc. | Passive pixel direct detection sensor |
JP2010147614A (ja) * | 2008-12-16 | 2010-07-01 | Panasonic Corp | 固体撮像装置およびその駆動方法、撮像装置 |
JP4891308B2 (ja) * | 2008-12-17 | 2012-03-07 | キヤノン株式会社 | 固体撮像装置及び固体撮像装置を用いた撮像システム |
US8624971B2 (en) | 2009-01-23 | 2014-01-07 | Kla-Tencor Corporation | TDI sensor modules with localized driving and signal processing circuitry for high speed inspection |
JP5257134B2 (ja) * | 2009-02-25 | 2013-08-07 | コニカミノルタビジネステクノロジーズ株式会社 | 固体撮像素子およびそれを備えた撮像装置 |
US8144973B2 (en) * | 2009-03-24 | 2012-03-27 | Orbotech Ltd. | Multi-modal imaging |
WO2011040996A1 (en) | 2009-09-30 | 2011-04-07 | Quantapore, Inc. | Ultrafast sequencing of biological polymers using a labeled nanopore |
JP5441651B2 (ja) * | 2009-12-07 | 2014-03-12 | キヤノン株式会社 | 光電変換装置 |
US9035673B2 (en) * | 2010-01-25 | 2015-05-19 | Palo Alto Research Center Incorporated | Method of in-process intralayer yield detection, interlayer shunt detection and correction |
FR2959901B1 (fr) * | 2010-05-04 | 2015-07-24 | E2V Semiconductors | Capteur d'image a matrice d'echantillonneurs |
WO2011142082A1 (ja) | 2010-05-13 | 2011-11-17 | コニカミノルタビジネステクノロジーズ株式会社 | 固体撮像装置、撮像装置、及び駆動方法 |
EP2408194B1 (fr) * | 2010-05-17 | 2014-12-24 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Capteur d'image en technologie CMOS à forte cadence vidéo |
FR2961019B1 (fr) * | 2010-06-03 | 2013-04-12 | Commissariat Energie Atomique | Capteur d'image lineaire en technologie cmos |
FR2960096B1 (fr) * | 2010-05-17 | 2013-04-26 | Commissariat Energie Atomique | Capteur d'image lineaire en technologie cmos a contraintes temporelles relachees |
US8451354B2 (en) | 2010-05-17 | 2013-05-28 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | TDI image sensor in CMOS technology with high video capture rate |
WO2012095582A1 (fr) * | 2011-01-10 | 2012-07-19 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Capteur d'image lineaire en technologie cmos a compensation d'effet de file |
US8629387B2 (en) * | 2010-07-07 | 2014-01-14 | Raytheon Company | Multi-layer sensor chip assembly and method for imaging generating image data with a frame-sum mode and a time-delay integration mode |
WO2012121756A1 (en) * | 2011-03-04 | 2012-09-13 | Quantapore, Inc. | Apparatus and methods for performing optical nanopore detection or sequencing |
US9442012B2 (en) * | 2011-04-25 | 2016-09-13 | Skybox Imaging, Inc. | Systems and methods for overhead imaging and video |
JP5753020B2 (ja) * | 2011-08-03 | 2015-07-22 | ヤマハ発動機株式会社 | 部品実装装置 |
US8736924B2 (en) | 2011-09-28 | 2014-05-27 | Truesense Imaging, Inc. | Time-delay-and-integrate image sensors having variable integration times |
JP5764457B2 (ja) * | 2011-10-13 | 2015-08-19 | 東レエンジニアリング株式会社 | 膜厚むら検査装置 |
US9223138B2 (en) | 2011-12-23 | 2015-12-29 | Microsoft Technology Licensing, Llc | Pixel opacity for augmented reality |
US8917453B2 (en) | 2011-12-23 | 2014-12-23 | Microsoft Corporation | Reflective array waveguide |
US8638498B2 (en) | 2012-01-04 | 2014-01-28 | David D. Bohn | Eyebox adjustment for interpupillary distance |
US9606586B2 (en) | 2012-01-23 | 2017-03-28 | Microsoft Technology Licensing, Llc | Heat transfer device |
US9297996B2 (en) | 2012-02-15 | 2016-03-29 | Microsoft Technology Licensing, Llc | Laser illumination scanning |
US9779643B2 (en) * | 2012-02-15 | 2017-10-03 | Microsoft Technology Licensing, Llc | Imaging structure emitter configurations |
US9726887B2 (en) | 2012-02-15 | 2017-08-08 | Microsoft Technology Licensing, Llc | Imaging structure color conversion |
US9368546B2 (en) | 2012-02-15 | 2016-06-14 | Microsoft Technology Licensing, Llc | Imaging structure with embedded light sources |
CN102595066B (zh) * | 2012-03-05 | 2013-07-24 | 天津大学 | 低功耗数字域累加cmos-tdi图像传感器 |
US9578318B2 (en) | 2012-03-14 | 2017-02-21 | Microsoft Technology Licensing, Llc | Imaging structure emitter calibration |
US11068049B2 (en) | 2012-03-23 | 2021-07-20 | Microsoft Technology Licensing, Llc | Light guide display and field of view |
US9558590B2 (en) | 2012-03-28 | 2017-01-31 | Microsoft Technology Licensing, Llc | Augmented reality light guide display |
US10191515B2 (en) | 2012-03-28 | 2019-01-29 | Microsoft Technology Licensing, Llc | Mobile device light guide display |
US9717981B2 (en) | 2012-04-05 | 2017-08-01 | Microsoft Technology Licensing, Llc | Augmented reality and physical games |
JP5927010B2 (ja) * | 2012-04-09 | 2016-05-25 | 株式会社日立ハイテクノロジーズ | 検査装置 |
US10502876B2 (en) | 2012-05-22 | 2019-12-10 | Microsoft Technology Licensing, Llc | Waveguide optics focus elements |
US8989535B2 (en) | 2012-06-04 | 2015-03-24 | Microsoft Technology Licensing, Llc | Multiple waveguide imaging structure |
US8901514B2 (en) * | 2012-06-28 | 2014-12-02 | Molecular Devices, Llc | Sample analysis system with spotlight illumination |
EP2904770B1 (en) | 2012-10-05 | 2018-01-10 | Rambus Inc. | Conditional-reset, multi-bit read-out image sensor |
WO2014055280A2 (en) * | 2012-10-05 | 2014-04-10 | Rambus Inc. | Image sensor architecture with multi-bit sampling |
CN109547714B (zh) * | 2012-10-12 | 2021-03-02 | 统雷有限公司 | 采用ccd成像仪的时间延迟与积分扫描 |
US9651539B2 (en) | 2012-10-28 | 2017-05-16 | Quantapore, Inc. | Reducing background fluorescence in MEMS materials by low energy ion beam treatment |
WO2014082660A1 (en) | 2012-11-27 | 2014-06-05 | Sabanci Üniversitesi | Pixel level digital implementation of time delay integration algorithm for low noise, high dynamic range and low power readout integrated circuits |
US10192358B2 (en) | 2012-12-20 | 2019-01-29 | Microsoft Technology Licensing, Llc | Auto-stereoscopic augmented reality display |
BR112015017115B1 (pt) | 2013-02-13 | 2022-05-10 | Philip Morris Products S.A | Método para avaliar a distribuição de porosidade dentro de um artigo poroso, para controlar um processo de fabricação e a porosidade de um artigo poroso e seus usos, dispositivo para avaliar a distribuição de porosidade |
US9625995B2 (en) | 2013-03-15 | 2017-04-18 | Leap Motion, Inc. | Identifying an object in a field of view |
BR112015022884A2 (pt) * | 2013-03-15 | 2017-07-18 | Olive Medical Corp | minimizar o sensor de imagem i/o e as contagens do condutor em aplicações de endoscópio |
US10225483B1 (en) | 2013-05-01 | 2019-03-05 | Pierce Biotechnology, Inc. | Method and system for projecting image with differing exposure times |
US10115034B2 (en) | 2013-05-01 | 2018-10-30 | Life Technologies Holdings Pte Limited | Method and system for projecting image with differing exposure times |
CN103323468A (zh) * | 2013-05-20 | 2013-09-25 | 晟光科技股份有限公司 | 一种单面多点非接触式图案的测试方法 |
CA2910019A1 (en) | 2013-05-24 | 2014-11-27 | Quantapore, Inc. | Nanopore-based nucleic acid analysis with mixed fret detection |
EP3598731A1 (en) * | 2014-04-28 | 2020-01-22 | Lynx System Developers, Inc. | Systems and methods for processing event timing images |
US10375300B2 (en) | 2014-04-28 | 2019-08-06 | Lynx System Developers, Inc. | Methods for processing event timing data |
WO2015192056A1 (en) | 2014-06-13 | 2015-12-17 | Urthecast Corp. | Systems and methods for processing and providing terrestrial and/or space-based earth observation video |
US9357145B2 (en) | 2014-07-11 | 2016-05-31 | Imperx, Inc. | Area scan interline transfer CCD imaging device and apparatus with TDI scanning mode |
US9304235B2 (en) | 2014-07-30 | 2016-04-05 | Microsoft Technology Licensing, Llc | Microfabrication |
US10254942B2 (en) | 2014-07-31 | 2019-04-09 | Microsoft Technology Licensing, Llc | Adaptive sizing and positioning of application windows |
US10592080B2 (en) | 2014-07-31 | 2020-03-17 | Microsoft Technology Licensing, Llc | Assisted presentation of application windows |
US10678412B2 (en) | 2014-07-31 | 2020-06-09 | Microsoft Technology Licensing, Llc | Dynamic joint dividers for application windows |
WO2016057829A1 (en) | 2014-10-10 | 2016-04-14 | Quantapore, Inc. | Nanopore-based polymer analysis with mutually-quenching fluorescent labels |
CN107002126B (zh) | 2014-10-24 | 2021-05-25 | 昆塔波尔公司 | 使用纳米结构阵列的聚合物的高效光学分析 |
US9827209B2 (en) | 2015-02-09 | 2017-11-28 | Microsoft Technology Licensing, Llc | Display system |
US11086216B2 (en) | 2015-02-09 | 2021-08-10 | Microsoft Technology Licensing, Llc | Generating electronic components |
US10317677B2 (en) | 2015-02-09 | 2019-06-11 | Microsoft Technology Licensing, Llc | Display system |
US9535253B2 (en) | 2015-02-09 | 2017-01-03 | Microsoft Technology Licensing, Llc | Display system |
US10018844B2 (en) | 2015-02-09 | 2018-07-10 | Microsoft Technology Licensing, Llc | Wearable image display system |
US9372347B1 (en) | 2015-02-09 | 2016-06-21 | Microsoft Technology Licensing, Llc | Display system |
US9513480B2 (en) | 2015-02-09 | 2016-12-06 | Microsoft Technology Licensing, Llc | Waveguide |
US9429692B1 (en) | 2015-02-09 | 2016-08-30 | Microsoft Technology Licensing, Llc | Optical components |
US9423360B1 (en) | 2015-02-09 | 2016-08-23 | Microsoft Technology Licensing, Llc | Optical components |
US10871561B2 (en) | 2015-03-25 | 2020-12-22 | Urthecast Corp. | Apparatus and methods for synthetic aperture radar with digital beamforming |
US9860466B2 (en) | 2015-05-14 | 2018-01-02 | Kla-Tencor Corporation | Sensor with electrically controllable aperture for inspection and metrology systems |
DE102015107730B4 (de) * | 2015-05-18 | 2020-07-23 | Hmgeb Holding B.V. | Blisterband-Inspektionsvorrichtung |
WO2017044168A2 (en) | 2015-06-16 | 2017-03-16 | King Abdulaziz City Of Science And Technology | Efficient planar phased array antenna assembly |
CN105184795A (zh) * | 2015-09-09 | 2015-12-23 | 苏州威盛视信息科技有限公司 | 单摄像头aoi设备对于led背板线路板的扫描检测方法 |
JP6849371B2 (ja) * | 2015-10-08 | 2021-03-24 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 側面発光レーザ光源、及びそれを含む三次元映像取得装置 |
EP3380864A4 (en) | 2015-11-25 | 2019-07-03 | Urthecast Corp. | APPARATUS AND METHODS FOR OPEN SYNTHESIS RADAR IMAGING |
US10313622B2 (en) | 2016-04-06 | 2019-06-04 | Kla-Tencor Corporation | Dual-column-parallel CCD sensor and inspection systems using a sensor |
US10778925B2 (en) | 2016-04-06 | 2020-09-15 | Kla-Tencor Corporation | Multiple column per channel CCD sensor architecture for inspection and metrology |
DE102016211310B3 (de) * | 2016-06-23 | 2017-07-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur messung einer aberration, abbildungssysteme und verfahren zur messung einer aberration |
CN109477813A (zh) | 2016-07-05 | 2019-03-15 | 昆塔波尔公司 | 基于光学的纳米孔测序 |
US10429321B2 (en) | 2016-08-29 | 2019-10-01 | Kla-Tencor Corporation | Apparatus for high-speed imaging sensor data transfer |
CA3064735C (en) | 2017-05-23 | 2022-06-21 | Urthecast Corp. | Synthetic aperture radar imaging apparatus and methods |
US11378682B2 (en) | 2017-05-23 | 2022-07-05 | Spacealpha Insights Corp. | Synthetic aperture radar imaging apparatus and methods for moving targets |
US11525910B2 (en) | 2017-11-22 | 2022-12-13 | Spacealpha Insights Corp. | Synthetic aperture radar apparatus and methods |
CN108124484B (zh) * | 2017-12-30 | 2023-04-18 | 柳州梓博科技有限公司 | 感光装置的光感测方法 |
FR3079707B1 (fr) | 2018-03-29 | 2020-02-28 | Thales | Capteur d'images aeroporte realisant des prises de vue matricielle par decalage temporel et sommation multi-spectrales |
US10831446B2 (en) * | 2018-09-28 | 2020-11-10 | Intel Corporation | Digital bit-serial multi-multiply-and-accumulate compute in memory |
Family Cites Families (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US36047A (en) * | 1862-07-29 | Improvement in harvesting-machines | ||
JPS5934772A (ja) | 1982-08-20 | 1984-02-25 | Olympus Optical Co Ltd | 画像信号処理装置 |
US5131755A (en) * | 1988-02-19 | 1992-07-21 | Chadwick Curt H | Automatic high speed optical inspection system |
GB2220319B (en) | 1988-07-01 | 1992-11-04 | Plessey Co Plc | Improvements in or relating to image stabilisation |
JPH0238956A (ja) * | 1988-07-29 | 1990-02-08 | Kawasaki Steel Corp | 表面疵検査装置 |
US5040057A (en) | 1990-08-13 | 1991-08-13 | Picker International, Inc. | Multi-mode TDI/raster-scan television camera system |
USRE36047E (en) | 1988-09-26 | 1999-01-19 | Picker International, Inc. | Multi-mode TDI/raster-scan television camera system |
US4949172A (en) | 1988-09-26 | 1990-08-14 | Picker International, Inc. | Dual-mode TDI/raster-scan television camera system |
JP2886278B2 (ja) * | 1990-06-25 | 1999-04-26 | 株式会社日立製作所 | 回路パターンの画像検出方法およびその装置 |
US5365084A (en) * | 1991-02-20 | 1994-11-15 | Pressco Technology, Inc. | Video inspection system employing multiple spectrum LED illumination |
US5172005A (en) * | 1991-02-20 | 1992-12-15 | Pressco Technology, Inc. | Engineered lighting system for tdi inspection comprising means for controlling lighting elements in accordance with specimen displacement |
US5585942A (en) * | 1991-06-20 | 1996-12-17 | Canon Kabushiki Kaisha | Image pickup apparatus |
JPH0552767A (ja) * | 1991-08-28 | 1993-03-02 | Matsushita Electric Ind Co Ltd | 画像検査装置 |
US5440648A (en) | 1991-11-19 | 1995-08-08 | Dalsa, Inc. | High speed defect detection apparatus having defect detection circuits mounted in the camera housing |
JP2756386B2 (ja) * | 1991-12-27 | 1998-05-25 | 日本たばこ産業株式会社 | 円筒形物体の外観検査装置 |
US5264912A (en) | 1992-02-07 | 1993-11-23 | Tencor Instruments | Speckle reduction track filter apparatus for optical inspection of patterned substrates |
US5668887A (en) | 1992-05-29 | 1997-09-16 | Eastman Kodak Company | Coating density analyzer and method using non-synchronous TDI camera |
US5488415A (en) | 1993-07-09 | 1996-01-30 | Olympus Optical Co., Ltd. | Solid-state image pickup device having a photoelectric conversion detection cell with high sensitivity |
JP3297950B2 (ja) * | 1993-07-13 | 2002-07-02 | シャープ株式会社 | 平面型表示パネル検査装置 |
US5841126A (en) | 1994-01-28 | 1998-11-24 | California Institute Of Technology | CMOS active pixel sensor type imaging system on a chip |
US5471515A (en) | 1994-01-28 | 1995-11-28 | California Institute Of Technology | Active pixel sensor with intra-pixel charge transfer |
US5461425A (en) * | 1994-02-15 | 1995-10-24 | Stanford University | CMOS image sensor with pixel level A/D conversion |
US5812704A (en) * | 1994-11-29 | 1998-09-22 | Focus Automation Systems Inc. | Method and apparatus for image overlap processing |
FR2733111B1 (fr) | 1995-04-11 | 1997-05-23 | Thomson Csf | Procede de detection a cycles d'integration et de lecture repartis pour camera a balayage, et barrette de detection correspondante |
JPH0921724A (ja) * | 1995-07-06 | 1997-01-21 | Dainippon Printing Co Ltd | ビューファインダー用カラーフイルターの検査方法 |
JPH0937040A (ja) | 1995-07-24 | 1997-02-07 | Canon Inc | 画像走査装置 |
KR100188116B1 (ko) * | 1995-12-28 | 1999-06-01 | 김광호 | 손떨림 영상 안정화 회로 |
WO1997033159A1 (de) | 1996-03-08 | 1997-09-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und vorrichtung zur radioskopischen lötstelleninspektion von elektronischen baugruppen |
JPH09247545A (ja) | 1996-03-11 | 1997-09-19 | Matsushita Electric Ind Co Ltd | スキャナ型電子カメラ |
JP3349037B2 (ja) * | 1996-04-19 | 2002-11-20 | 株式会社ニレコ | 移動体画像の取込方法と装置 |
US5909026A (en) | 1996-11-12 | 1999-06-01 | California Institute Of Technology | Integrated sensor with frame memory and programmable resolution for light adaptive imaging |
JPH10176997A (ja) * | 1996-12-19 | 1998-06-30 | Nkk Corp | 周期疵検出方法及び装置 |
DE19714221A1 (de) | 1997-04-07 | 1998-10-08 | Zeiss Carl Fa | Konfokales Mikroskop mit einem motorischen Scanningtisch |
US6115066A (en) * | 1997-06-12 | 2000-09-05 | International Business Machines Corporation | Image sensor with direct digital correlated sampling |
JP2850902B2 (ja) * | 1997-06-20 | 1999-01-27 | 日本電気株式会社 | 画像入力装置 |
US6069365A (en) * | 1997-11-25 | 2000-05-30 | Alan Y. Chow | Optical processor based imaging system |
US6433822B1 (en) * | 1998-03-31 | 2002-08-13 | Intel Corporation | Method and apparatus for self-calibration and fixed-pattern noise removal in imager integrated circuits |
US6020957A (en) * | 1998-04-30 | 2000-02-01 | Kla-Tencor Corporation | System and method for inspecting semiconductor wafers |
US6324298B1 (en) * | 1998-07-15 | 2001-11-27 | August Technology Corp. | Automated wafer defect inspection system and a process of performing such inspection |
JP2000033800A (ja) | 1998-07-17 | 2000-02-02 | Katou Art Studio Tokyo:Kk | 記念版画およびその製造方法 |
JP2000201250A (ja) * | 1998-11-05 | 2000-07-18 | Dainippon Printing Co Ltd | 走行物体撮像方法及びラインスキャナ装置 |
US6169600B1 (en) | 1998-11-20 | 2001-01-02 | Acuity Imaging, Llc | Cylindrical object surface inspection system |
SE514859C2 (sv) * | 1999-01-18 | 2001-05-07 | Mydata Automation Ab | Förfarande och anordning för undersökning av objekt på ett substrat genom att ta bilder av substratet och analysera dessa |
JP2000224470A (ja) | 1999-02-02 | 2000-08-11 | Minolta Co Ltd | カメラシステム |
JP3755375B2 (ja) * | 1999-03-23 | 2006-03-15 | 株式会社日立製作所 | 電子ディスプレイ装置の画素欠陥検査方法 |
US6831995B1 (en) | 1999-03-23 | 2004-12-14 | Hitachi, Ltd. | Method for detecting a defect in a pixel of an electrical display unit and a method for manufacturing an electrical display unit |
KR100434806B1 (ko) * | 1999-10-05 | 2004-06-07 | 캘리포니아 인스티튜트 오브 테크놀로지 | 액티브 화소 센서를 갖는 시간 지연 적분 촬상 장치 및 방법 |
JP3643745B2 (ja) | 2000-02-21 | 2005-04-27 | 株式会社モリタ製作所 | X線撮影用検出器及びx線撮影装置 |
US6635872B2 (en) * | 2001-04-05 | 2003-10-21 | Applied Materials, Inc. | Defect inspection efficiency improvement with in-situ statistical analysis of defect data during inspection |
IL149587A (en) * | 2001-05-11 | 2005-11-20 | Orbotech Ltd | Optical inspection system employing a staring array scanner |
US20020186878A1 (en) * | 2001-06-07 | 2002-12-12 | Hoon Tan Seow | System and method for multiple image analysis |
US7009163B2 (en) * | 2001-06-22 | 2006-03-07 | Orbotech Ltd. | High-sensitivity optical scanning using memory integration |
US7159509B2 (en) * | 2003-05-31 | 2007-01-09 | Roy Welcome Starkey | Outdoor cooking machine |
US7352390B2 (en) * | 2003-10-08 | 2008-04-01 | Hewlett-Packard Development Company, L.P. | Digital camera for capturing image data with rapid response between activating a capture trigger and capturing image data |
US7825971B2 (en) * | 2003-10-10 | 2010-11-02 | Texas Instruments Incorporated | Low noise image sensing system and method for use with sensors with very small pixel size |
US7676113B2 (en) * | 2004-11-19 | 2010-03-09 | Hewlett-Packard Development Company, L.P. | Generating and displaying spatially offset sub-frames using a sharpening factor |
-
2002
- 2002-06-21 US US10/176,003 patent/US7009163B2/en not_active Expired - Fee Related
- 2002-06-23 JP JP2003507534A patent/JP2005520123A/ja active Pending
- 2002-06-23 WO PCT/IL2002/000501 patent/WO2003001189A1/en active Application Filing
- 2002-06-23 IL IL15920002A patent/IL159200A0/xx unknown
- 2002-06-24 TW TW091113751A patent/TW583868B/zh not_active IP Right Cessation
-
2005
- 2005-09-14 US US11/225,041 patent/US7129509B2/en not_active Expired - Fee Related
-
2006
- 2006-09-18 US US11/532,549 patent/US7417243B2/en not_active Expired - Fee Related
-
2008
- 2008-04-15 JP JP2008106115A patent/JP4966243B2/ja not_active Expired - Fee Related
- 2008-04-15 JP JP2008106077A patent/JP4966242B2/ja not_active Expired - Fee Related
- 2008-07-24 US US12/179,033 patent/US7897902B2/en not_active Expired - Fee Related
-
2011
- 2011-01-26 US US13/013,967 patent/US8119969B2/en not_active Expired - Fee Related
-
2012
- 2012-01-17 US US13/351,542 patent/US8536506B2/en not_active Expired - Fee Related
-
2013
- 2013-08-14 US US13/966,672 patent/US9232114B2/en not_active Expired - Fee Related
-
2015
- 2015-12-10 US US14/964,781 patent/US20160094760A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2003001189A1 (en) | 2003-01-03 |
US20120206634A1 (en) | 2012-08-16 |
US7009163B2 (en) | 2006-03-07 |
IL159200A0 (en) | 2004-06-01 |
TW583868B (en) | 2004-04-11 |
US20070012865A1 (en) | 2007-01-18 |
US20110114823A1 (en) | 2011-05-19 |
US7897902B2 (en) | 2011-03-01 |
US8119969B2 (en) | 2012-02-21 |
US9232114B2 (en) | 2016-01-05 |
US20030006364A1 (en) | 2003-01-09 |
JP2008241718A (ja) | 2008-10-09 |
JP2005520123A (ja) | 2005-07-07 |
US8536506B2 (en) | 2013-09-17 |
US20130329103A1 (en) | 2013-12-12 |
JP2008275611A (ja) | 2008-11-13 |
US7417243B2 (en) | 2008-08-26 |
US20060006311A1 (en) | 2006-01-12 |
US20080278775A1 (en) | 2008-11-13 |
JP4966242B2 (ja) | 2012-07-04 |
US20160094760A1 (en) | 2016-03-31 |
US7129509B2 (en) | 2006-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4966243B2 (ja) | メモリ集積化を用いる高感度光走査 | |
CN108989717A (zh) | 包括相位检测像素的图像传感器 | |
WO2003103275A1 (en) | Method and apparatus for real time identification and correction of pixel defects for image sensor arrays | |
US6885400B1 (en) | CCD imaging device and method for high speed profiling | |
JP2004313523A (ja) | 固体撮像素子、電子内視鏡 | |
EP3278167B1 (en) | High resolution pathology scanner with improved signal to noise ratio | |
JP3152203B2 (ja) | 外観検査装置 | |
JP2002330336A (ja) | 画像捕捉装置および方法 | |
JP2000092398A (ja) | イメージセンサ | |
US7782370B2 (en) | Imaging unit | |
US7705910B2 (en) | Photographic device for obtaining a plurality of images at a time by rolling shutter method | |
CN113824906B (zh) | 图像感测装置 | |
US7155119B2 (en) | Multi-processing of a picture to speed up mathematics and calculation for one picture | |
JP2004328737A (ja) | 画像センサアレイ | |
JP4332906B2 (ja) | ラインセンサカメラ | |
JP4320780B2 (ja) | 撮像装置 | |
JP2007310202A (ja) | 共焦点顕微鏡 | |
JP5094248B2 (ja) | 光電変換装置の駆動方法及び撮像システム | |
JPH06224762A (ja) | 画像入力装置 | |
JP2003061106A (ja) | Rgbフィルタを有するエリアセンサ付き光学像読取装置 | |
JPH07111621A (ja) | 撮像装置 | |
JP2002048678A (ja) | レンズ性能評価装置 | |
JPH0695055A (ja) | 液晶表示装置の検査装置及び検査方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100824 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20101111 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20101116 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20101213 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20101216 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110111 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110114 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110224 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110901 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111228 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20120106 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120316 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120330 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4966243 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150406 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |