JP4950144B2 - コネクタ - Google Patents
コネクタ Download PDFInfo
- Publication number
- JP4950144B2 JP4950144B2 JP2008207987A JP2008207987A JP4950144B2 JP 4950144 B2 JP4950144 B2 JP 4950144B2 JP 2008207987 A JP2008207987 A JP 2008207987A JP 2008207987 A JP2008207987 A JP 2008207987A JP 4950144 B2 JP4950144 B2 JP 4950144B2
- Authority
- JP
- Japan
- Prior art keywords
- spherical
- solder balls
- circuit board
- positioning frame
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 59
- 238000000034 method Methods 0.000 description 9
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Description
Claims (7)
- 位置決めフレームと、
この位置決めフレームに取付けられた複数のコンタクト部材からなる層と、を備え、これらのコンタクト部材のそれぞれは、受入れ部と装着用端部とを含み、この装着用端部は、前記位置決めフレームの底面の近部に配置され、更に、
複数の球状のはんだボールを備え、それぞれの球状のはんだボールは、前記コンタクト部材の1つの装着用端部の近部に配置され、これらの球状のはんだボールのそれぞれは、リフローの際のリアライメントを生じさせる力を最小とするために、回路基板への取付け前に変形された平坦化部を含むコネクタ。 - 前記球状のはんだボールは、それぞれ前記位置決めフレームから所望の距離内を延びる、請求項1に記載のコネクタ。
- 更に、前記位置決めフレームの底面に取付けられ、前記位置決めフレームをプリント回路基板から離隔する肩部を備える請求項2に記載のコネクタ。
- 底面を有する位置決めフレームと、それぞれ装着用端部を有する複数のコンタクト部材と、複数の球状のはんだボールとを準備し、前記装着用端部が前記位置決めフレームの底面の近部に配置されるように、前記複数のコンタクト部材のそれぞれを前記位置決めフレームに取付け、前記複数の球状のはんだボールのそれぞれを前記複数のコンタクト部材の装着用端部のそれぞれに取付け、前記複数の球状のはんだボールを機械的に変形して平坦化部を形成するステップから形成された電気コネクタであって、この後、回路基板に取付けられ、前記変形するステップは、この回路基板への取付けステップの際のリアライメントを生じさせる力を、最小とする、電気コネクタ。
- 前記複数の球状のはんだボールを機械的に変形するステップは、前記複数の球状のはんだボールのそれぞれの幅が、前記複数の球状のはんだボールのそれぞれの高さより大きくなるように、前記複数の球状のはんだボールを圧縮するステップを備える請求項4に記載の電気コネクタ。
- 前記回路基板に電気コネクタが取付けられる前に、前記回路基板を前記球状のはんだボールから所定距離だけ離隔して位置決めするステップを含む請求項4に記載の電気コネクタ。
- 前記複数の球状のはんだボールを機械的に変形するステップは、前記複数の球状のはんだボールのそれぞれを前記複数のコンタクト部材の装着用端部のそれぞれに取付けた後に実施される請求項4に記載の電気コネクタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/948,751 US5975921A (en) | 1997-10-10 | 1997-10-10 | High density connector system |
US948751 | 1997-10-10 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28988598A Division JP4294767B2 (ja) | 1997-10-10 | 1998-10-12 | コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008300365A JP2008300365A (ja) | 2008-12-11 |
JP4950144B2 true JP4950144B2 (ja) | 2012-06-13 |
Family
ID=25488224
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28988598A Expired - Lifetime JP4294767B2 (ja) | 1997-10-10 | 1998-10-12 | コネクタ |
JP2008207987A Expired - Lifetime JP4950144B2 (ja) | 1997-10-10 | 2008-08-12 | コネクタ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28988598A Expired - Lifetime JP4294767B2 (ja) | 1997-10-10 | 1998-10-12 | コネクタ |
Country Status (7)
Country | Link |
---|---|
US (2) | US5975921A (ja) |
EP (2) | EP0908976B1 (ja) |
JP (2) | JP4294767B2 (ja) |
CN (2) | CN1275355C (ja) |
DE (2) | DE69811307T2 (ja) |
SG (2) | SG101433A1 (ja) |
TW (1) | TW411061U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8349022B2 (en) | 2009-03-11 | 2013-01-08 | Kao Corporation | Two-part hair dye |
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US6699048B2 (en) * | 2002-01-14 | 2004-03-02 | Fci Americas Technology, Inc. | High density connector |
US6719567B2 (en) * | 2002-05-20 | 2004-04-13 | Hon Hai Precision Ind. Co., Ltd. | Contact for electrical connector |
US20040147169A1 (en) | 2003-01-28 | 2004-07-29 | Allison Jeffrey W. | Power connector with safety feature |
TWI264150B (en) * | 2003-04-22 | 2006-10-11 | Starlink Electronics Corp | High-density electrical connector |
US7458839B2 (en) | 2006-02-21 | 2008-12-02 | Fci Americas Technology, Inc. | Electrical connectors having power contacts with alignment and/or restraining features |
CN101882718B (zh) | 2003-12-31 | 2012-11-21 | Fci公司 | 电源触头及包括电源触头的连接器 |
SG122809A1 (en) * | 2003-12-31 | 2006-06-29 | Fci Asia Technology Pte Ltd | Electrical connector |
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US7384289B2 (en) | 2005-01-31 | 2008-06-10 | Fci Americas Technology, Inc. | Surface-mount connector |
US7303427B2 (en) | 2005-04-05 | 2007-12-04 | Fci Americas Technology, Inc. | Electrical connector with air-circulation features |
US7726982B2 (en) | 2006-06-15 | 2010-06-01 | Fci Americas Technology, Inc. | Electrical connectors with air-circulation features |
US7661997B2 (en) * | 2006-09-12 | 2010-02-16 | Woody Wurster | Pin to CB system |
US7497736B2 (en) | 2006-12-19 | 2009-03-03 | Fci Americas Technology, Inc. | Shieldless, high-speed, low-cross-talk electrical connector |
US7905731B2 (en) | 2007-05-21 | 2011-03-15 | Fci Americas Technology, Inc. | Electrical connector with stress-distribution features |
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US8272882B2 (en) * | 2007-12-27 | 2012-09-25 | Yamaichi Electronics Co., Ltd. | Semiconductor device socket |
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-
1997
- 1997-10-10 US US08/948,751 patent/US5975921A/en not_active Expired - Lifetime
-
1998
- 1998-09-24 TW TW087215887U patent/TW411061U/zh not_active IP Right Cessation
- 1998-10-01 SG SG200006956A patent/SG101433A1/en unknown
- 1998-10-01 SG SG1998003958A patent/SG77201A1/en unknown
- 1998-10-07 EP EP98118907A patent/EP0908976B1/en not_active Expired - Lifetime
- 1998-10-07 EP EP02007340A patent/EP1229607B1/en not_active Expired - Lifetime
- 1998-10-07 DE DE69811307T patent/DE69811307T2/de not_active Expired - Lifetime
- 1998-10-07 DE DE69823890T patent/DE69823890T2/de not_active Expired - Lifetime
- 1998-10-09 CN CN02142868.9A patent/CN1275355C/zh not_active Expired - Fee Related
- 1998-10-09 CN CNB981197957A patent/CN1155139C/zh not_active Expired - Fee Related
- 1998-10-12 JP JP28988598A patent/JP4294767B2/ja not_active Expired - Lifetime
-
1999
- 1999-08-18 US US09/376,850 patent/US6241536B1/en not_active Expired - Lifetime
-
2008
- 2008-08-12 JP JP2008207987A patent/JP4950144B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8349022B2 (en) | 2009-03-11 | 2013-01-08 | Kao Corporation | Two-part hair dye |
Also Published As
Publication number | Publication date |
---|---|
DE69811307D1 (de) | 2003-03-20 |
EP1229607A1 (en) | 2002-08-07 |
CN1503408A (zh) | 2004-06-09 |
JP4294767B2 (ja) | 2009-07-15 |
TW411061U (en) | 2000-11-01 |
CN1214557A (zh) | 1999-04-21 |
JPH11191447A (ja) | 1999-07-13 |
EP0908976B1 (en) | 2003-02-12 |
US5975921A (en) | 1999-11-02 |
EP0908976A2 (en) | 1999-04-14 |
EP0908976A3 (en) | 1999-12-01 |
CN1275355C (zh) | 2006-09-13 |
CN1155139C (zh) | 2004-06-23 |
EP1229607B1 (en) | 2004-05-12 |
US6241536B1 (en) | 2001-06-05 |
SG77201A1 (en) | 2000-12-19 |
DE69823890T2 (de) | 2005-04-21 |
DE69811307T2 (de) | 2003-11-20 |
SG101433A1 (en) | 2004-01-30 |
JP2008300365A (ja) | 2008-12-11 |
DE69823890D1 (de) | 2004-06-17 |
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