JP4940731B2 - 固体撮像装置および携帯用撮像機器 - Google Patents
固体撮像装置および携帯用撮像機器 Download PDFInfo
- Publication number
- JP4940731B2 JP4940731B2 JP2006098881A JP2006098881A JP4940731B2 JP 4940731 B2 JP4940731 B2 JP 4940731B2 JP 2006098881 A JP2006098881 A JP 2006098881A JP 2006098881 A JP2006098881 A JP 2006098881A JP 4940731 B2 JP4940731 B2 JP 4940731B2
- Authority
- JP
- Japan
- Prior art keywords
- imaging device
- solid
- state imaging
- glass substrate
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Description
2 端子
3 固体撮像素子
4 バンプ
5 マイクロレンズ
6 封止樹脂層
7 密封空間
8 エア保持層
9 貫通穴
10 フィルム
11 シール剤
12 端子
Claims (2)
- 所要の端子が設けられたガラス基板と、該ガラス基板に対して撮像面のマイクロレンズが所定の間隔をあけて対向するよう配置されかつ前記ガラス基板の端子に接続された固体撮像素子とを備え、前記マイクロレンズを除く前記固体撮像素子と前記ガラス基板との間に絶縁性部材を充填して前記マイクロレンズを密封空間内に封止した固体撮像装置であって、
前記絶縁性部材には前記密封空間内のエアの膨張、収縮にともない該エアが出入りする開口が設けられ、前記ガラス基板から前記固体撮像素子には前記開口を跨いで架設された弾性を有する膜が設けられ、該膜により前記密封空間内のエアを密封していることを特徴とする固体撮像装置。 - 請求項1に記載の固体撮像装置を備えた携帯用撮像機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006098881A JP4940731B2 (ja) | 2006-03-31 | 2006-03-31 | 固体撮像装置および携帯用撮像機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006098881A JP4940731B2 (ja) | 2006-03-31 | 2006-03-31 | 固体撮像装置および携帯用撮像機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007273822A JP2007273822A (ja) | 2007-10-18 |
JP4940731B2 true JP4940731B2 (ja) | 2012-05-30 |
Family
ID=38676293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006098881A Expired - Fee Related JP4940731B2 (ja) | 2006-03-31 | 2006-03-31 | 固体撮像装置および携帯用撮像機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4940731B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6149502B2 (ja) * | 2013-05-16 | 2017-06-21 | 株式会社ニコン | 撮像ユニット及び撮像装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3207319B2 (ja) * | 1993-05-28 | 2001-09-10 | 株式会社東芝 | 光電変換装置及びその製造方法 |
JP3502756B2 (ja) * | 1997-12-24 | 2004-03-02 | 京セラ株式会社 | 光半導体素子収納用パッケージ |
JP2004342992A (ja) * | 2003-05-19 | 2004-12-02 | Seiko Epson Corp | 光デバイス及びその製造方法、光モジュール並びに電子機器 |
JP3981348B2 (ja) * | 2003-05-30 | 2007-09-26 | 松下電器産業株式会社 | 撮像装置およびその製造方法 |
JP2006080181A (ja) * | 2004-09-08 | 2006-03-23 | Seiko Epson Corp | 半導体装置及びその製造方法 |
JP2006086672A (ja) * | 2004-09-15 | 2006-03-30 | Nidec Copal Corp | 撮像モジュール |
-
2006
- 2006-03-31 JP JP2006098881A patent/JP4940731B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2007273822A (ja) | 2007-10-18 |
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