JP4937807B2 - Substrate holding and rotating mechanism, substrate processing apparatus - Google Patents

Substrate holding and rotating mechanism, substrate processing apparatus Download PDF

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JP4937807B2
JP4937807B2 JP2007079171A JP2007079171A JP4937807B2 JP 4937807 B2 JP4937807 B2 JP 4937807B2 JP 2007079171 A JP2007079171 A JP 2007079171A JP 2007079171 A JP2007079171 A JP 2007079171A JP 4937807 B2 JP4937807 B2 JP 4937807B2
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substrate
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rotating mechanism
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浩之 金子
貴弘 小川
謙一 杉田
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Ebara Corp
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Description

本発明は、複数のスピンドルで基板を保持し回転させる基板保持回転機構、及び該基板保持回転機構を備えた基板処理装置に関するものである。   The present invention relates to a substrate holding and rotating mechanism that holds and rotates a substrate by a plurality of spindles, and a substrate processing apparatus including the substrate holding and rotating mechanism.

従来、例えば特許文献１に示すように、半導体ウエハ等の基板の洗浄処理や研磨処理を行う際に該基板を保持し回転させる基板保持回転機構がある。図１は、この種の基板保持回転機構を上方から見た模式図である。この基板保持回転機構は、図１（ａ）に示すように、基板Ｗの両側部に各々複数本（図では各二本）のスピンドル１０１からなるスピンドル群１０２，１０２を備えている。スピンドル群１０２，１０２は、板状のベース部材１００，１００上に設置されている。ベース部材１００，１００は、該ベース部材１００，１００を基板Ｗの保持位置と退避位置との間で移動させる移動機構（図示せず）に搭載されている。この基板保持回転機構は、各スピンドル群１０２，１０２を退避位置から保持位置に向かって移動させることで、各スピンドル１０１に設けた保持回転部（コロ）１０１ａを基板Ｗの周縁部に当接させて基板Ｗを保持（クランプ）する。またその状態で保持回転部１０１ａを回転させ、保持した基板Ｗを回転させるようになっている。   2. Description of the Related Art Conventionally, as shown in Patent Document 1, for example, there is a substrate holding and rotating mechanism that holds and rotates a substrate when a substrate such as a semiconductor wafer is cleaned or polished. FIG. 1 is a schematic view of this type of substrate holding and rotating mechanism as viewed from above. As shown in FIG. 1A, the substrate holding and rotating mechanism includes spindle groups 102 and 102 each including a plurality (two in the drawing) of spindles 101 on both sides of the substrate W. The spindle groups 102 and 102 are installed on plate-like base members 100 and 100. The base members 100 and 100 are mounted on a moving mechanism (not shown) that moves the base members 100 and 100 between the holding position and the retracted position of the substrate W. This substrate holding and rotating mechanism moves each spindle group 102, 102 from the retracted position toward the holding position, thereby bringing the holding rotating portion (roller) 101a provided on each spindle 101 into contact with the peripheral portion of the substrate W. To hold (clamp) the substrate W. In this state, the holding rotation unit 101a is rotated to rotate the held substrate W.

特開平１０−１８０１９８号公報Japanese Patent Laid-Open No. 10-180198

この基板保持回転機構は、通常、基板Ｗを保持した際に、各スピンドル１０１が上方から見て同一の円周上に配置され、各スピンドル１０１の保持回転部１０１ａが互いに均等な圧力で基板Ｗの周縁部に当接するようになっている。しかしながら、ベース部材１００の設置位置のずれや、移動機構のガタなどによって、基板Ｗを保持した際に各スピンドル１０１の位置が同一円周上からずれて微小な位置の誤差が生じることがある。そうすると、基板Ｗを保持した際に、図１（ｂ）に示すように一対のスピンドル１０１，１０１の片方だけしか基板Ｗに当接しなかったり、あるいは両方が当接してもその当接力に差が出たりする。このように、各スピンドル１０１の保持回転部１０１ａが基板Ｗを保持する保持力が均等でなくなる場合があった。そうすると、保持回転部１０１ａに保持された基板Ｗの回転が安定せず、基板Ｗの洗浄等の処理効率が低下するおそれがあった。また、保持力が不均等な状態で多数の基板Ｗを処理すると、次第に各スピンドル１０１の保持回転部１０１ａの磨耗度に差が生じてしまう。そのため、保持回転部１０１ａの磨耗が進む前に部品交換を行わなければならず、部品コストが増加したり、メンテナンスの回数が増えて装置の稼働率の低下につながる、という問題があった。   In this substrate holding and rotating mechanism, normally, when the substrate W is held, the respective spindles 101 are arranged on the same circumference when viewed from above, and the holding and rotating portions 101a of the respective spindles 101 have the same pressure with respect to each other. It comes to contact | abut to the peripheral part. However, when the substrate W is held by the displacement of the installation position of the base member 100 or the movement mechanism, the positions of the spindles 101 may deviate from the same circumference and a minute position error may occur. Then, when the substrate W is held, only one of the pair of spindles 101 and 101 abuts against the substrate W as shown in FIG. 1B, or even if both abut, there is a difference in the abutting force. Go out. In this way, the holding force for holding the substrate W by the holding rotation unit 101a of each spindle 101 may not be uniform. Then, the rotation of the substrate W held by the holding rotation unit 101a is not stable, and there is a possibility that the processing efficiency such as the cleaning of the substrate W is lowered. In addition, when a large number of substrates W are processed in a state where the holding force is not uniform, a difference is gradually generated in the degree of wear of the holding rotating portion 101a of each spindle 101. For this reason, there is a problem that the parts must be replaced before the holding and rotating part 101a wears, resulting in an increase in parts cost and an increase in the number of maintenance, leading to a reduction in the operating rate of the apparatus.

本発明は上述の点に鑑みてなされたものでありその目的は、基板を保持する際に、各スピンドルの保持回転部による基板の周縁部を保持する保持力を均等にでき、基板の回転を安定させることができ、且つ多数のウエハを保持しても各スピンドルの保持回転部の磨耗度に差が生じにくい基板保持回転機構、及び該基板保持回転機構を備えた基板処理装置を提供することにある。   The present invention has been made in view of the above-described points. The purpose of the present invention is to make it possible to equalize the holding force for holding the peripheral portion of the substrate by the holding rotation portion of each spindle when holding the substrate, and to rotate the substrate. To provide a substrate holding / rotating mechanism that can be stabilized and that hardly causes a difference in the degree of wear of the holding / rotating portion of each spindle even if a large number of wafers are held, and a substrate processing apparatus including the substrate holding / rotating mechanism. It is in.

上記課題を解決するため本発明の一態様は、保持回転部を備えた３本以上のスピンドルと、前記３本以上のスピンドルの保持回転部のうち少なくとも１つを回転させる回転機構とを具備し、前記３本以上のスピンドルの保持回転部を基板の周縁部に当接させて該基板を保持し回転させる基板保持回転機構において、前記３本以上のスピンドルのうち少なくとも２本を搭載するベース部材と、前記少なくとも２本のスピンドルの中間部に位置する軸部材を中心として該ベース部材を回動自在にする回動機構と、前記ベース部材に収容された略矩形の連結部材と、基板保持位置と退避位置との間で前記ベース部材及び前記連結部材をスライドレールに沿う直線方向に往復移動させる往復移動機構とを備え、前記往復移動機構は、前記スライドレールにスライド移動自在に係合するスライダーを備えており、前記連結部材は、前記回動機構と前記スライダーとを連結しており、前記ベース部材と前記連結部材との間には水平方向のクリアランスが設けられており、前記ベース部材は前記連結部材に対して、該連結部材に接触しない範囲で自在に回動可能であり、該ベース部材が前記回動機構により回動することで、該ベース部材に搭載されたスピンドルの保持回転部による前記基板を保持する保持力が調整されるように構成したことを特徴とする。 In order to solve the above problems, one aspect of the present invention includes three or more spindles each including a holding rotation unit, and a rotation mechanism that rotates at least one of the holding rotation units of the three or more spindles. In the substrate holding and rotating mechanism for holding and rotating the substrate by rotating the holding and rotating portions of the three or more spindles against the peripheral edge of the substrate, a base member on which at least two of the three or more spindles are mounted A pivot mechanism that allows the base member to pivot about a shaft member located at an intermediate portion of the at least two spindles, a substantially rectangular connecting member housed in the base member, and a substrate holding position and a and reciprocating mechanism for the reciprocating the base member and the connecting member in a linear direction along the slide rail between a retracted position, wherein the reciprocating mechanism, the slide rail In comprises a slidably engaging the slider, the connecting member is connected between the said rotating mechanism slider, it is between the connecting member and the base member in the horizontal direction clearance The base member is freely rotatable with respect to the connecting member within a range not contacting the connecting member, and the base member is rotated by the rotating mechanism, whereby the base member is provided. The holding force for holding the substrate by the holding and rotating part of the spindle mounted on is adjusted.

上述の本発明によれば、各スピンドルの保持回転部による基板の周縁部を保持する保持力が互いに均等になるように調整することができる。すなわち基板を保持する際に、当初、各スピンドルの保持回転部が基板の周縁部に均等な圧力で当接しなくても、ベース部材上に搭載されたスピンドルの保持回転部が基板の周縁部に当接することで、当該スピンドルに掛かる力でベース部材が回動して、各スピンドルの保持回転部が互いに均等な圧力で基板の周縁部に当接するようになる。これにより保持した基板の回転が安定することで、基板の処理が滞りなく行えると共に、基板ごとの処理のばらつきを抑えることができる基板保持回転機構となる。また、多数の基板を保持し続けても各スピンドルの保持回転部の磨耗度に差が生じにくいことで、保持回転部の寿命が長くなる。したがって、部品交換を伴うメンテナンスの回数を抑えることができ、基板洗浄装置等に用いた場合に装置の稼働率を低下させずに済む。   According to the above-described present invention, the holding force for holding the peripheral edge portion of the substrate by the holding rotation portion of each spindle can be adjusted to be equal to each other. That is, when holding the substrate, the holding rotation portion of the spindle mounted on the base member does not contact the peripheral portion of the substrate even if the holding rotation portion of each spindle does not contact the peripheral portion of the substrate with equal pressure. By abutting, the base member is rotated by the force applied to the spindle, and the holding and rotating parts of the spindles abut against the peripheral edge of the substrate with equal pressure. As a result, the rotation of the held substrate is stabilized, so that the substrate can be processed without delay, and a substrate holding and rotating mechanism that can suppress variations in the processing of each substrate is obtained. In addition, even if a large number of substrates are continuously held, the difference in the degree of wear of the holding rotating portions of the respective spindles is unlikely to occur, thereby extending the life of the holding rotating portions. Therefore, the number of maintenance operations involving parts replacement can be suppressed, and when used in a substrate cleaning apparatus or the like, it is not necessary to reduce the operating rate of the apparatus.

また、上記本発明によれば、簡単な機構でスピンドルの保持回転部による基板を保持する保持力を調整できる。 In addition, according to the present invention, the holding force for holding the substrate by the holding rotating portion of the spindle can be adjusted with a simple mechanism.

また、上記本発明によれば、往復移動機構によって各スピンドルを移動させて基板を保持することができると共に、その際に回動機構によって各スピンドルによる基板の保持力を調整できる。 Further , according to the present invention, each spindle can be moved by the reciprocating mechanism to hold the substrate, and at that time, the holding force of the substrate by each spindle can be adjusted by the rotating mechanism.

本発明の好ましい態様は、前記ベース部材が複数設置されていると共に、各ベース部材に前記回動機構及び／又は前記往復移動機構が設置されていることを特徴とする。
本発明によれば、基板を保持する保持力の不均衡を是正することができ、より均等な圧力で基板を保持することが可能となる。 In a preferred aspect of the present invention, a plurality of the base members are installed, and the rotation mechanism and / or the reciprocating mechanism are installed in each base member.
According to the present invention, it is possible to correct the imbalance of the holding force for holding the substrate, and it is possible to hold the substrate with a more even pressure.

本発明の一参考例は、保持回転部を備えた３本以上のスピンドルと、前記３本以上のスピンドルの保持回転部のうち少なくとも１つを回転させる回転機構とを具備し、前記３本以上のスピンドルの保持回転部で基板の周縁部を保持し該基板を回転させる基板保持回転機構において、前記３本以上のスピンドルのうち少なくとも１本を搭載するベース部材と、前記ベース部材上に搭載されたスピンドルが、前記基板を保持する基板保持位置と該基板保持位置から退避した退避位置との間で移動するように前記ベース部材を往復移動させる往復移動機構とを備えたことを特徴とする。
本参考例によれば、簡単な構成で基板を保持することができると共に、保持した基板を安定した状態で回転させることができる。 One reference example of the present invention includes three or more spindles each having a holding rotation unit, and a rotation mechanism that rotates at least one of the holding rotation units of the three or more spindles. In the substrate holding and rotating mechanism for holding the peripheral portion of the substrate by the holding and rotating portion of the spindle and rotating the substrate, a base member for mounting at least one of the three or more spindles is mounted on the base member. The spindle includes a reciprocating mechanism for reciprocating the base member so as to move between a substrate holding position for holding the substrate and a retracted position retracted from the substrate holding position.
According to this reference example , the substrate can be held with a simple configuration, and the held substrate can be rotated in a stable state.

本参考例の好ましい態様は、前記ベース部材を一対設けそれらを前記基板保持位置の両側部に配置し、該一対のベース部材に前記往復移動機構を設置し、該往復移動機構は、前記一対のベース部材上に搭載されたスピンドルを互いに共通の直線に沿う方向に往復移動させるように構成したことを特徴とする。
本参考例によれば、各ベース部材に搭載されたスピンドルが基板を保持する際の動作が簡単な動作になると共に、その動作にガタが生じにくく基板を保持する際の各スピンドルの位置ずれを防止することができ、安定した状態で基板を保持し回転させることができる。 In a preferred embodiment of the present reference example, a pair of the base members are provided, arranged on both sides of the substrate holding position, the reciprocating mechanism is installed on the pair of base members, and the reciprocating mechanism includes the pair of base members. The spindle mounted on the base member is configured to reciprocate in a direction along a common straight line.
According to this reference example , the operation of holding the substrate by the spindle mounted on each base member becomes simple, and the position of each spindle when holding the substrate is less likely to be loose in the operation. The substrate can be held and rotated in a stable state.

本参考例の好ましい態様は、前記一対のベース部材のうち少なくとも一方に、該ベース部材を回動自在にする回動機構を備え、該ベース部材が前記回動機構により回動することで、該ベース部材に搭載されたスピンドルの保持回転部による前記基板を保持する保持力が調整されるように構成したことを特徴とする。
本参考例によれば、往復移動機構で基板を保持する際にこの回動機構によって各スピンドルによる基板の保持力を調整できる。 In a preferred aspect of the present reference example , at least one of the pair of base members includes a rotation mechanism that allows the base member to rotate, and the base member is rotated by the rotation mechanism. The holding force for holding the substrate by the holding rotation portion of the spindle mounted on the base member is adjusted.
According to the present reference example , when the substrate is held by the reciprocating mechanism, the holding force of the substrate by each spindle can be adjusted by this rotating mechanism.

本発明の他の態様は、一対の第１軸部材を中心にそれぞれ回転可能な一対の第１ベース部材と、第２軸部材を中心に回転可能な第２ベース部材と、前記一対の第１ベース部材および前記第２ベース部材に取り付けられた複数のスピンドルと、前記複数のスピンドルにそれぞれ取り付けられ、基板を保持する複数の保持回転部と、前記一対の第１ベース部材を前記一対の第１軸部材を中心に互いに反対方向に回転させる１つの駆動機構と、前記複数の保持回転部のうちの少なくとも１つを回転させる回転機構と、前記一対の第１ベース部材に設けられた少なくとも１つの基板押し出し部材とを備え、前記一対の第１ベース部材の回転に伴って、前記複数の保持回転部のうちの少なくとも２つは基板に近接および離間する方向に移動するように構成されており、前記一対の第１ベース部材の回転に伴って前記少なくとも２つの保持回転部が基板から離間する方向に移動するときに、前記基板押し出し部材が基板の周縁部に接触して前記基板を水平方向に移動させて前記基板の周縁部を前記複数の保持回転部から外すことを特徴とする基板保持回転機構である。 According to another aspect of the present invention, a pair of first base members that can rotate around a pair of first shaft members, a second base member that can rotate around a second shaft member, and the pair of first shafts, respectively. A plurality of spindles attached to the base member and the second base member, a plurality of holding rotating parts attached to the plurality of spindles and holding the substrate, and the pair of first base members to the pair of first One drive mechanism that rotates in opposite directions around the shaft member, a rotation mechanism that rotates at least one of the plurality of holding rotation parts, and at least one provided in the pair of first base members and a substrate pusher member, with the rotation of the pair of the first base member, configured such that said at least two of the plurality of holding rotating part moves in a direction toward and away from the substrate And when the at least two holding rotating parts move away from the substrate as the pair of first base members rotate, the substrate pushing member contacts the peripheral edge of the substrate and the substrate The substrate holding and rotating mechanism is characterized in that the peripheral edge of the substrate is removed from the plurality of holding and rotating portions by moving the substrate horizontally .

本発明の他の態様は、一対の第１軸部材を中心にそれぞれ回転可能な一対の第１ベース部材と、第２軸部材を中心に回転可能な第２ベース部材と、前記一対の第１ベース部材および前記第２ベース部材に取り付けられた複数のスピンドルと、前記複数のスピンドルにそれぞれ取り付けられ、基板を保持する複数の保持回転部と、前記一対の第１ベース部材を前記一対の第１軸部材を中心に互いに反対方向に回転させる１つの駆動機構と、前記複数の保持回転部のうちの少なくとも１つを回転させる回転機構とを備え、前記一対の第１ベース部材の回転に伴って、前記複数の保持回転部のうちの少なくとも２つは基板に近接および離間する方向に移動するように構成されており、前記複数の保持回転部に保持された基板の周縁部の近傍に基板ストッパーを配置し、前記基板ストッパーと前記第２ベース部材とは、前記基板の中心に関して略対称に配置されており、前記一対の第１のベース部材を回転させて前記少なくとも２つの保持回転部を前記基板から離間する方向に移動させたときに、前記ストッパーが前記基板の水平移動を止めるように構成されていることを特徴とする。
本発明の好ましい態様は、前記一対の第１ベース部材と前記第２軸部材とを連結する一対の連結部材をさらに備え、前記第２軸部材は基板の径方向に移動可能に構成されていることを特徴とする。 According to another aspect of the present invention, a pair of first base members that can rotate around a pair of first shaft members, a second base member that can rotate around a second shaft member , and the pair of first shafts, respectively. A plurality of spindles attached to the base member and the second base member, a plurality of holding rotating parts attached to the plurality of spindles and holding the substrate, and the pair of first base members to the pair of first One drive mechanism that rotates in opposite directions around a shaft member, and a rotation mechanism that rotates at least one of the plurality of holding rotation portions, and with the rotation of the pair of first base members , wherein at least two of the plurality of holding and rotating portion is configured to move in a direction toward and away from the substrate, the substrate scan in the vicinity of the periphery of the substrate held by the plurality of holding rotating part Place a wrapper, said substrate and said stopper and the second base member, wherein are disposed substantially symmetrically with respect to the center of the substrate, said by rotating the pair of the first base member at least two holding rotating part The stopper is configured to stop the horizontal movement of the substrate when moved in a direction away from the substrate .
A preferred aspect of the present invention further includes a pair of connecting members that connect the pair of first base members and the second shaft member, and the second shaft member is configured to be movable in the radial direction of the substrate. It is characterized by that.

本発明の他の態様は、基板を保持し回転させる基板保持回転機構と、前記基板に処理液を供給する処理液供給機構と、前記基板の処理を行う基板処理部とを備え、前記基板保持回転機構で基板を保持し回転させながら、前記処理液供給機構で該基板に処理液を供給し、前記基板処理部で該基板の処理を行う基板処理装置において、前記基板保持回転機構として、上述した態様の基板保持回転機構を用いたことを特徴とする。
本発明によれば、基板を処理する際の該基板の回転を安定させることができ、基板処理部による基板処理を効率良く行うことができる。 Another aspect of the present invention includes a substrate holding and rotating mechanism that holds and rotates a substrate, a processing liquid supply mechanism that supplies a processing liquid to the substrate, and a substrate processing unit that processes the substrate, and the substrate holding In the substrate processing apparatus for supplying the processing liquid to the substrate by the processing liquid supply mechanism and processing the substrate by the substrate processing unit while holding and rotating the substrate by the rotation mechanism, the substrate holding rotation mechanism is described above. The substrate holding and rotating mechanism according to the above aspect is used.
ADVANTAGE OF THE INVENTION According to this invention, the rotation of this board | substrate at the time of processing a board | substrate can be stabilized, and the board | substrate process by a board | substrate process part can be performed efficiently.

本発明の好ましい態様は、前記基板処理部で処理を行う前の基板に前処理を施す基板前処理部を具備し、該基板前処理部で前記基板の前処理を行った後、前記基板処理部で該基板の後処理を行うように構成したことを特徴とする。   In a preferred aspect of the present invention, the substrate processing unit includes a substrate preprocessing unit that performs preprocessing on the substrate before processing by the substrate processing unit, and after the substrate preprocessing is performed by the substrate preprocessing unit, the substrate processing is performed. It is characterized in that the substrate is post-processed by the part.

本発明の好ましい態様は、前記基板前処理部で行う基板の前処理は該基板の研磨処理であり、前記基板処理部で行う基板の後処理は該基板の洗浄処理であることを特徴とする。   In a preferred aspect of the present invention, the substrate pretreatment performed in the substrate pretreatment unit is a polishing process for the substrate, and the substrate posttreatment performed in the substrate treatment unit is a cleaning process for the substrate. .

上述したように、本発明によれば、保持回転部による基板の周縁部を保持する保持力を均等にでき、基板の回転を安定させることができる。さらに、多数のウエハを保持しても各スピンドルの保持回転部の磨耗度に差が生じにくい基板保持回転機構を提供することができる。   As described above, according to the present invention, the holding force for holding the peripheral edge portion of the substrate by the holding rotation portion can be made uniform, and the rotation of the substrate can be stabilized. Furthermore, it is possible to provide a substrate holding / rotating mechanism that hardly causes a difference in the degree of wear of the holding / rotating portion of each spindle even if a large number of wafers are held.

〔第１実施形態：基板保持回転機構を備えた基板洗浄装置〕
以下、本発明の実施形態を図面に基づいて詳細に説明する。図２は、本発明の一実施形態にかかる基板洗浄装置が備える基板保持回転機構の構成を示す斜視図である。また図３は、図２のＡ−Ａ矢視断面図であり、図４は、図２のＢ−Ｂ矢視図であり、図５は、図２（図４）のＣ矢視図である。また、図７は、基板洗浄装置が備える基板洗浄機構の構成を示す斜視図である。この基板洗浄装置は、図２に示す基板保持回転機構１の上部に、図７に示す基板洗浄機構２が設置されて、これらが一体に構成されているものである。 [First Embodiment: Substrate Cleaning Device with Substrate Holding and Rotating Mechanism]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 2 is a perspective view showing a configuration of a substrate holding and rotating mechanism provided in the substrate cleaning apparatus according to the embodiment of the present invention. 3 is a cross-sectional view taken along line AA in FIG. 2, FIG. 4 is a view taken along arrow BB in FIG. 2, and FIG. 5 is a view taken along arrow C in FIG. 2 (FIG. 4). is there. FIG. 7 is a perspective view showing a configuration of a substrate cleaning mechanism provided in the substrate cleaning apparatus. In this substrate cleaning apparatus, the substrate cleaning mechanism 2 shown in FIG. 7 is installed on the upper part of the substrate holding and rotating mechanism 1 shown in FIG. 2, and these are integrally configured.

まず、基板保持回転機構１を説明する。図２に示すように、基板保持回転機構１は、中央部に洗浄部材駆動機構３０が設置され、該洗浄部材駆動機構３０の対向する両側にそれぞれ図７に示す各スピンドル群５３，５４を移動させる第１移動機構１０と第２移動機構２０が設置されている。   First, the substrate holding and rotating mechanism 1 will be described. As shown in FIG. 2, the substrate holding and rotating mechanism 1 has a cleaning member driving mechanism 30 installed at the center, and moves the spindle groups 53 and 54 shown in FIG. 7 on opposite sides of the cleaning member driving mechanism 30, respectively. A first moving mechanism 10 and a second moving mechanism 20 are installed.

洗浄部材駆動機構３０は、図３に示すケース３１の内側に設置されたシリンダ３２（図３には図示せず）と、該シリンダ３２により駆動される棒状の支柱部材３３とを備えている。支柱部材３３は、シリンダ３２の上方に突出していてシリンダ３２の駆動により上下動可能になっている。また、支柱部材３３の上端には、洗浄部材６０の下部洗浄部材６２（図７参照）を取り付ける取付部３４が設けられている。一方、ケース３１の両側部には、該ケース３１を挟んで互いに平行に配置された一対の直線状のスライドレール３６，３６が配設されている。このスライドレール３６，３６の両端部に、第１移動機構１０と第２移動機構２０がスライド移動可能に取り付けられている。   The cleaning member drive mechanism 30 includes a cylinder 32 (not shown in FIG. 3) installed inside the case 31 shown in FIG. 3 and a rod-like support member 33 driven by the cylinder 32. The column member 33 protrudes above the cylinder 32 and can be moved up and down by driving the cylinder 32. A mounting portion 34 for attaching the lower cleaning member 62 (see FIG. 7) of the cleaning member 60 is provided at the upper end of the support member 33. On the other hand, on both sides of the case 31, a pair of linear slide rails 36, 36 arranged in parallel with each other with the case 31 in between are arranged. The first moving mechanism 10 and the second moving mechanism 20 are slidably attached to both ends of the slide rails 36 and 36.

ここで、第１移動機構１０の構成を説明する。図６は、第１移動機構１０を示す概略平面図である。図６と図２及び図３に示すように、スライドレール３６，３６の一端近傍の下面側に断面略コ字状の一対のスライダー１２，１２がスライド移動自在に係合している。そしてこれらスライダー１２，１２の下面に、略矩形で平板状の連結部材１３が取り付けられている。連結部材１３の中央部には上下に貫通する開口部１３ａが設けられ、該開口部１３ａの内周にベアリング１４が嵌合され、ベアリング１４の内輪１４ａ（図３参照）に略円柱状の軸部材１５が取り付けられている。軸部材１５は、連結部材１３に対して開口部１３ａ内でベアリング１４により回転自在になっている。また開口部１３ａの上部には、開口部１３ａ内に設置した軸部材１５の上面を覆うカバー１６が取り付けられている。   Here, the configuration of the first moving mechanism 10 will be described. FIG. 6 is a schematic plan view showing the first moving mechanism 10. As shown in FIGS. 6, 2, and 3, a pair of sliders 12, 12 having a substantially U-shaped cross section are slidably engaged with the lower surface near one end of the slide rails 36, 36. A substantially rectangular and flat connecting member 13 is attached to the lower surfaces of the sliders 12 and 12. An opening 13a penetrating vertically is provided in the central portion of the connecting member 13, a bearing 14 is fitted to the inner periphery of the opening 13a, and a substantially cylindrical shaft is fitted to the inner ring 14a of the bearing 14 (see FIG. 3). A member 15 is attached. The shaft member 15 is rotatable with respect to the connecting member 13 by a bearing 14 in the opening 13a. A cover 16 that covers the upper surface of the shaft member 15 installed in the opening 13a is attached to the top of the opening 13a.

一方、連結部材１３の下面側には、略矩形で平板状のベース部材１７が設置されている。ベース部材１７は、その外形が連結部材１３よりも大きく、上面中央部が軸部材１５の下端面にボルト１５ａ（図４参照）で接合されて固定されている。これにより、ベース部材１７は、図６に示すように軸部材１５を中心として該軸部材１５と一体に水平面内で回動するようになっている。またこのベース部材１７の上面には、連結部材１３の下面を収納する略矩形状の凹部１７ａが形成されている。そして凹部１７ａの内周側面と連結部材１３の外周側面との間には、僅かな寸法のクリアランス（隙間）部Ｄが設けられている（図６参照）。そのため、ベース部材１７は連結部材１３に対して、クリアランス部Ｄで連結部材１３とベース部材１７が接触しない範囲で回動することができる。なおクリアランス部Ｄの幅寸法は、本実施形態では約２ｍｍ程度に形成されている。   On the other hand, a substantially rectangular and flat base member 17 is installed on the lower surface side of the connecting member 13. The base member 17 has an outer shape larger than that of the connecting member 13, and the center portion of the upper surface is joined and fixed to the lower end surface of the shaft member 15 with a bolt 15 a (see FIG. 4). As a result, the base member 17 rotates in a horizontal plane integrally with the shaft member 15 around the shaft member 15 as shown in FIG. Further, a substantially rectangular concave portion 17 a for accommodating the lower surface of the connecting member 13 is formed on the upper surface of the base member 17. A clearance (gap) portion D having a slight size is provided between the inner peripheral side surface of the recess 17a and the outer peripheral side surface of the connecting member 13 (see FIG. 6). Therefore, the base member 17 can rotate with respect to the connecting member 13 within a range in which the connecting member 13 and the base member 17 do not contact at the clearance portion D. Note that the width of the clearance portion D is about 2 mm in this embodiment.

さらに、図４及び図５に示すように、ベース部材１７の外側（スライドレール３６，３６の延伸方向の外側）には、略Ｌ字状でその一端が下方に向かうガイド部材１８が取り付けられている。またこのガイド部材１８の内側には、下記する仕切部材３にその上端が固定された板状の係止部材１９が設置されている。係止部材１９の内側にはシリンダ２２が取り付けられ、このシリンダ２２によって進退駆動されるロッド２４の先端が、フローティングジョイント２１を介してガイド部材１８の内側に連結されている。フローティングジョイント２１は、詳細な図示は省略するがそれぞれがロッド２４側とガイド部材１８側に取り付けられる一対の連結具からなり、一方の連結具が備える球形状の突起部２１ａが、他方の連結具が備える球面状の凹部２１ｂ内に回転自在に係合して構成されている。これにより、ガイド部材１８がロッド２４に対して略全方向に揺動（回動）自在な状態で連結されているので、シリンダ２２の駆動によりベース部材１７と連結部材１３を一体にスライドレール３６，３６に沿って往復移動させることができると共に、これらベース部材１７及びガイド部材１８が、係止部材１９やシリンダ２２とは独立して水平面内で自在に回動できるようになっている。   Further, as shown in FIGS. 4 and 5, a guide member 18 is attached to the outside of the base member 17 (outside in the extending direction of the slide rails 36, 36) and is substantially L-shaped and one end thereof is directed downward. Yes. In addition, a plate-like locking member 19 whose upper end is fixed to the partition member 3 described below is installed inside the guide member 18. A cylinder 22 is attached to the inside of the locking member 19, and the tip of a rod 24 that is driven forward and backward by the cylinder 22 is connected to the inside of the guide member 18 through the floating joint 21. Although not shown in detail, the floating joint 21 is composed of a pair of couplers attached to the rod 24 side and the guide member 18 side, and a spherical protrusion 21a included in one coupler is connected to the other coupler. Is configured to be rotatably engaged in a spherical recess 21b. As a result, the guide member 18 is connected to the rod 24 in a state in which the guide member 18 can be swung (rotated) in almost all directions, so that the base member 17 and the connecting member 13 are integrated with the slide rail 36 by driving the cylinder 22. , 36, and the base member 17 and the guide member 18 can be freely rotated in a horizontal plane independently of the locking member 19 and the cylinder 22.

また、図４に示すように、ガイド部材１８の内面には、その先端部が係止部材１９の外面に当接し、ベース部材１７及び連結部材１３の移動を所定位置で規制する突起状のストッパー部材２３が取り付けられている。なお、３７はシリンダ２２に取り付けられたレギュレータである。このように、第１移動機構１０は、ベース部材１７と連結部材１３を一体にスライドレール３６，３６に沿う直線方向に往復移動させる往復移動機構と、ベース部材１７を連結部材１３に対して軸部材１５を中心に水平面内で回動自在に設置してなる回動機構とを備えている。   Further, as shown in FIG. 4, the guide member 18 has a protruding stopper on the inner surface of which the front end abuts the outer surface of the locking member 19 and restricts the movement of the base member 17 and the connecting member 13 at predetermined positions. A member 23 is attached. Reference numeral 37 denotes a regulator attached to the cylinder 22. As described above, the first moving mechanism 10 includes the reciprocating mechanism that reciprocally moves the base member 17 and the connecting member 13 in the linear direction along the slide rails 36 and 36, and the base member 17 with respect to the connecting member 13. And a rotation mechanism that is rotatably installed in a horizontal plane around the member 15.

またベース部材１７は、図３及び図６に示すように、その両側が各スライドレール３６，３６の両外側（スライドレール３６，３６の延伸方向に直交する両外側）に突出しており、この突出した部分の上面にスピンドル５０，５０が立設されている。そして、図３に示すように各スピンドル５０の中空円柱状の本体部５１内に回転自在に設置されたシャフト２６が、ベース部材１７を貫通してその下面側に突出している。またベース部材１７の一方のスピンドル５０を取り付けた位置の下面側には、断面形状が略コ字状の板状の取付部材２７を介してモータ２８が取り付けられ、該モータ２８の回転軸２８ａがシャフト２６の下端に連結されている。また図３に示すように一方のスピンドル５０内のシャフト２６と他方のスピンドル５０内のシャフト２６との間には、一方のシャフト２６の回転を他方のシャフト２６に伝達する伝達ベルト２９が掛け渡されている。また、図２に示すように各スピンドル５０の本体部５１の上端部には、保持回転部（コロ）５２（図７参照）を取り付ける取付部５１ａが設けられ、この取付部５１ａから突出するシャフト２６の上端部２６ａが、保持回転部５２に接続されていて、シャフト２６の回転が保持回転部５２に伝達されるようになっている。なお図２では、各保持回転部５２を取り外した状態を示している。   Further, as shown in FIGS. 3 and 6, both sides of the base member 17 protrude to both outer sides of the slide rails 36 and 36 (both outer sides orthogonal to the extending direction of the slide rails 36 and 36). Spindles 50 and 50 are erected on the upper surface of the part. As shown in FIG. 3, a shaft 26 that is rotatably installed in a hollow cylindrical body 51 of each spindle 50 penetrates the base member 17 and projects to the lower surface side. A motor 28 is attached to the lower surface of the base member 17 at the position where one spindle 50 is attached via a plate-like attachment member 27 having a substantially U-shaped cross section. It is connected to the lower end of the shaft 26. As shown in FIG. 3, a transmission belt 29 that transmits the rotation of one shaft 26 to the other shaft 26 is suspended between the shaft 26 in one spindle 50 and the shaft 26 in the other spindle 50. Has been. Further, as shown in FIG. 2, an attachment portion 51a for attaching a holding rotation portion (roller) 52 (see FIG. 7) is provided at the upper end portion of the main body portion 51 of each spindle 50, and a shaft protruding from the attachment portion 51a. An upper end portion 26 a of 26 is connected to the holding rotation portion 52, and the rotation of the shaft 26 is transmitted to the holding rotation portion 52. FIG. 2 shows a state in which each holding rotation unit 52 is removed.

図７に示すように、各スピンドル５０に取り付けられた保持回転部５２は、その外周側面に基板Ｗの周縁部に当接する保持溝５２ａが形成されていて、保持溝５２ａで基板Ｗの周縁部を保持し回転させるようになっている。そして図７に示すように、各スピンドル５０は、各二本のスピンドル５０からなる一対のスピンドル群５３，５４としてウエハ保持位置の対向する両側部に設置され、これら各スピンドル群５３，５４がそれぞれ第１移動機構１０と第２移動機構２０に搭載されている。   As shown in FIG. 7, the holding rotation unit 52 attached to each spindle 50 has a holding groove 52 a that abuts the peripheral edge of the substrate W on the outer peripheral side surface, and the peripheral edge of the substrate W is formed by the holding groove 52 a. Hold and rotate. As shown in FIG. 7, each spindle 50 is installed as a pair of spindle groups 53 and 54 each consisting of two spindles 50 on opposite sides of the wafer holding position. The first moving mechanism 10 and the second moving mechanism 20 are mounted.

第２移動機構２０は、上記で説明した第１移動機構１０が備えるベース部材１７に代えて、ベース部材１７と連結部材１３を一体に構成したものに相当する一枚のベース部材２５を備えたもので、その部分のみ第１移動機構１０と異なり、他の部分の構成は第１移動機構１０と共通である。したがって第２移動機構２０の図示及びその説明では、第１移動機構と共通する部分には同一の符号を付しその詳細な説明は省略する。即ち、図２に示すように第２移動機構２０では、連結部材１３及び軸部材１５に相当する部材を設けずに、スライダー１２，１２の下面をベース部材２５の上面に直接取り付けており、ベース部材２５をスライドレール３６，３６に沿う直線方向に往復移動させる往復移動機構のみを備えている。したがってベース部材２５に取り付けられた二本のスピンドル５０，５０は、当該直線方向に往復移動する動作のみが可能である。   The second moving mechanism 20 includes a single base member 25 corresponding to an integral structure of the base member 17 and the connecting member 13, instead of the base member 17 included in the first moving mechanism 10 described above. However, only that portion is different from the first moving mechanism 10, and the configuration of the other portions is the same as that of the first moving mechanism 10. Therefore, in the illustration and description of the second moving mechanism 20, the same reference numerals are given to portions common to the first moving mechanism, and detailed description thereof is omitted. That is, as shown in FIG. 2, in the second moving mechanism 20, the lower surfaces of the sliders 12 and 12 are directly attached to the upper surface of the base member 25 without providing the members corresponding to the connecting member 13 and the shaft member 15. Only a reciprocating mechanism for reciprocating the member 25 in a linear direction along the slide rails 36 and 36 is provided. Therefore, the two spindles 50 and 50 attached to the base member 25 can only move back and forth in the linear direction.

次に、基板洗浄機構２を説明する。図７に示す基板洗浄機構２は、基板Ｗの上面と下面を洗浄する上部洗浄部材６１と下部洗浄部材６２とからなる一対の洗浄部材６０と、基板Ｗの上面と下面に向けて洗浄液を供給する上部ノズル７１と下部ノズル７２とからなる洗浄液供給機構７０を備えている。また、図８に示すような、基板洗浄装置の外部で基板Ｗを受け渡しして該基板Ｗをウエハ保持位置へ搬入出するウエハ搬送機構４０が設置されている。   Next, the substrate cleaning mechanism 2 will be described. The substrate cleaning mechanism 2 shown in FIG. 7 supplies a cleaning liquid to a pair of cleaning members 60 composed of an upper cleaning member 61 and a lower cleaning member 62 for cleaning the upper and lower surfaces of the substrate W, and toward the upper and lower surfaces of the substrate W. A cleaning liquid supply mechanism 70 including an upper nozzle 71 and a lower nozzle 72 is provided. Further, as shown in FIG. 8, a wafer transfer mechanism 40 is installed for delivering the substrate W outside the substrate cleaning apparatus and carrying the substrate W in and out of the wafer holding position.

洗浄部材６１，６２は、基板Ｗの上面と下面に摺接する円柱状のロールスポンジ６３，６４と、該ロールスポンジ６３，６４を回転可能に取り付けているロールスポンジ取付部材６５，６６とを備えている。これら洗浄部材６１，６２は、その長手方向が各スピンドル群５３，５４の間に延伸して設置されている。また、各ロールスポンジ６３，６４は、基板Ｗの上下面の全面に摺接可能なようにその長さが基板Ｗの径と略同一の寸法に形成されている。また、上部洗浄部材６１は、ロールスポンジ６３を上下動させ且つ回転させる図示しない駆動機構に取り付けられている。一方、下部洗浄部材６２は、詳細な図示は省略するが、支柱部材３３の取付部３４に取り付けられている。一方、上部ノズル７１と下部ノズル７２は、図示しない洗浄液供給源に連通接続されていて、基板Ｗの上面及び下面に向けて超純水やアンモニア水あるいはフッ化水素酸（フッ酸）などの洗浄液を噴射供給するようになっている。   The cleaning members 61 and 62 include cylindrical roll sponges 63 and 64 that are in sliding contact with the upper and lower surfaces of the substrate W, and roll sponge attachment members 65 and 66 that rotatably mount the roll sponges 63 and 64. Yes. The cleaning members 61 and 62 are installed with their longitudinal directions extending between the spindle groups 53 and 54. The roll sponges 63 and 64 are formed so that the length thereof is substantially the same as the diameter of the substrate W so that the roll sponges 63 and 64 can slide on the entire upper and lower surfaces of the substrate W. The upper cleaning member 61 is attached to a drive mechanism (not shown) that moves the roll sponge 63 up and down and rotates it. On the other hand, the lower cleaning member 62 is attached to the attachment portion 34 of the column member 33, although detailed illustration is omitted. On the other hand, the upper nozzle 71 and the lower nozzle 72 are connected in communication with a cleaning liquid supply source (not shown), and cleaning liquid such as ultrapure water, ammonia water or hydrofluoric acid (hydrofluoric acid) is directed toward the upper and lower surfaces of the substrate W. It is designed to supply the spray.

図８に示すウエハ搬送機構４０は、基板Ｗを載置する平板状の支持部４１と、基板Ｗの周縁部に係合する支持部４１から上方に突出したガイド部４２，４２とを有するロボットハンド４３と、該ロボットハンド４３の後端に接続された図示しないロボット本体とを備えて構成されている。ロボットハンド４３は、両スピンドル群５３，５４の間からウエハ保持位置へ侵入・退避できるようになっている。   A wafer transfer mechanism 40 shown in FIG. 8 has a flat plate-like support portion 41 on which a substrate W is placed, and guide portions 42 and 42 that protrude upward from the support portion 41 that engages with the peripheral edge portion of the substrate W. A hand 43 and a robot body (not shown) connected to the rear end of the robot hand 43 are provided. The robot hand 43 can enter and retreat from between the spindle groups 53 and 54 to the wafer holding position.

この基板洗浄装置は、図示は省略するが全体が箱型のケーシング内に収納配置されていて、図３及び図４に示すように、スライドレール３６，３６の上面とケース３１の上面が、ケーシング内に設置された板状の仕切部材３の下面側に固定されている。この仕切部材３によって、ケーシング内が基板保持回転機構１を配置した下部空間と基板洗浄機構２を配置した上部空間に仕切られており、基板洗浄機構２で基板を洗浄する際の洗浄液等が下部空間内の基板保持回転機構１に達しないようになっている。なお、各スピンドル５０や支柱部材３３は、仕切部材３に設けた開口部３ａ等からその上面側に突出している。   Although not shown, the substrate cleaning apparatus is entirely housed and disposed in a box-shaped casing, and as shown in FIGS. 3 and 4, the upper surfaces of the slide rails 36 and 36 and the upper surface of the case 31 are the casing. It is being fixed to the lower surface side of the plate-shaped partition member 3 installed in the inside. The partition member 3 divides the inside of the casing into a lower space in which the substrate holding and rotating mechanism 1 is disposed and an upper space in which the substrate cleaning mechanism 2 is disposed. It does not reach the substrate holding and rotating mechanism 1 in the space. Each spindle 50 and the column member 33 protrude from the opening 3 a provided in the partition member 3 to the upper surface side.

次に、図９（ａ）乃至図９（ｃ）を用いて基板保持回転機構１の動作を説明する。図９（ａ）乃至図９（ｃ）は、基板保持回転機構１を上方から見た模式図である。基板保持回転機構１では、図９（ａ）に示すようにウエハ保持位置の対向する両側部に配置されたスピンドル群５３，５４を、第１移動機構１０と第２移動機構２０が備える往復移動機構により、ウエハ保持位置に向けて共通の直線Ｌ，Ｌに沿う方向に移動させ、各スピンドル５０の保持回転部５２（図７参照）を基板Ｗの周縁部に当接させて、基板Ｗを保持する。   Next, the operation of the substrate holding and rotating mechanism 1 will be described with reference to FIGS. 9A to 9C. FIG. 9A to FIG. 9C are schematic views of the substrate holding and rotating mechanism 1 as viewed from above. In the substrate holding / rotating mechanism 1, as shown in FIG. 9A, the first moving mechanism 10 and the second moving mechanism 20 are reciprocally moved by the spindle groups 53 and 54 arranged on opposite sides of the wafer holding position. The mechanism is moved in the direction along the common straight lines L and L toward the wafer holding position, and the holding rotating portion 52 (see FIG. 7) of each spindle 50 is brought into contact with the peripheral edge portion of the substrate W, whereby the substrate W is moved. Hold.

このようにして基板Ｗを保持する際に、第１移動機構１０上のスピンドル５０，５０の保持回転部５２，５２が基板Ｗの周縁部に互いに均等な圧力で当接しない場合でも、図９（ｂ）に示すように、一方の保持回転部５２が基板Ｗの周縁部に当接することでこのスピンドル５０に掛かる力で軸部材１５を中心にベース部材１７が回動する。これにより、スピンドル５０，５０が基板Ｗを保持する保持力の不均衡が是正され、図９（ｃ）に示すようにスピンドル５０，５０の保持回転部５２，５２が、互いに均等な圧力で基板Ｗの周縁部に当接した状態で基板Ｗが保持される。   Even when the holding rotation portions 52 and 52 of the spindles 50 and 50 on the first moving mechanism 10 do not contact the peripheral edge of the substrate W with equal pressure when holding the substrate W in this way, FIG. As shown in FIG. 6B, the base member 17 is rotated around the shaft member 15 by the force applied to the spindle 50 by the one holding rotating portion 52 coming into contact with the peripheral portion of the substrate W. As a result, the imbalance of the holding force with which the spindles 50 and 50 hold the substrate W is corrected, and the holding rotating portions 52 and 52 of the spindles 50 and 50 are fixed to each other with equal pressure as shown in FIG. The substrate W is held in contact with the peripheral edge of W.

このように、基板保持回転機構１によれば、ベース部材１７上のスピンドル５０，５０が水平面内で回動自在なので、基板Ｗを保持する際にこれらスピンドル５０，５０が基板Ｗの周縁部を保持する保持力が自動調整されて、互いに均等な保持力になる。したがって保持した基板Ｗの回転を安定させることが可能となる。また、多数の基板Ｗを保持しても、各スピンドル５０の保持回転部５２の摩耗度に差が生じにくいので、保持回転部５２の頻繁な部品交換が必要にならずに済む。また、部品交換を伴うメンテナンスの回数を少なく抑えることができるので、基板洗浄装置の稼働率を低下させずに済む。またこの回動機構は、二本のスピンドル５０，５０の中間部に設置した軸部材１５を中心としてベース部材１７を回動自在にしているので、簡単な機構で各スピンドル５０，５０の保持回転部５２，５２が基板Ｗを保持する保持力を互いに均等にすることを可能としている。   As described above, according to the substrate holding and rotating mechanism 1, the spindles 50 and 50 on the base member 17 are rotatable in a horizontal plane. Therefore, when the substrate W is held, the spindles 50 and 50 move the peripheral portion of the substrate W. The holding force to be held is automatically adjusted so that the holding forces are equal to each other. Therefore, the rotation of the held substrate W can be stabilized. Further, even if a large number of substrates W are held, a difference in the degree of wear of the holding and rotating portions 52 of the respective spindles 50 hardly occurs, so that frequent replacement of the holding and rotating portions 52 is not necessary. In addition, since the number of maintenance operations involving parts replacement can be reduced, it is not necessary to reduce the operating rate of the substrate cleaning apparatus. In addition, since this rotation mechanism makes the base member 17 rotatable about the shaft member 15 installed at the intermediate portion between the two spindles 50, 50, the spindle 50, 50 can be held and rotated by a simple mechanism. The portions 52 and 52 can make the holding force for holding the substrate W equal to each other.

次に、基板洗浄装置による基板Ｗの洗浄工程を説明する。まず、スピンドル群５３，５４をウエハ保持位置の両外側の退避位置に退避させておく。その状態で、基板Ｗが載置されたロボットハンド４３を移動させて、基板Ｗを洗浄部材６１，６２の長手方向と平行にウエハ保持位置まで搬送する。そこから第１移動機構１０と第２移動機構２０を駆動して、スピンドル群５３，５４をウエハ保持位置に向かって直線移動させ、基板Ｗの周縁部に各スピンドル５０の保持回転部５２を当接させて基板Ｗを保持する。ここで、基板Ｗを保持する際に、上記で説明したように第１移動機構１０の回動機構でベース部材１７上のスピンドル５０，５０が基板Ｗを保持する保持力が自動的に調整され、これらスピンドル５０，５０の保持回転部５２，５２が基板Ｗの周縁部に均等な圧力で当接する。   Next, the cleaning process of the substrate W by the substrate cleaning apparatus will be described. First, the spindle groups 53 and 54 are retracted to retracted positions on both outer sides of the wafer holding position. In this state, the robot hand 43 on which the substrate W is placed is moved to transport the substrate W to the wafer holding position in parallel with the longitudinal direction of the cleaning members 61 and 62. From there, the first moving mechanism 10 and the second moving mechanism 20 are driven to linearly move the spindle groups 53 and 54 toward the wafer holding position, and the holding rotating portion 52 of each spindle 50 is applied to the peripheral portion of the substrate W. The substrate W is held in contact therewith. Here, when holding the substrate W, the holding force with which the spindles 50 and 50 on the base member 17 hold the substrate W is automatically adjusted by the rotation mechanism of the first moving mechanism 10 as described above. The holding rotation parts 52 and 52 of the spindles 50 and 50 abut against the peripheral part of the substrate W with equal pressure.

基板Ｗが各スピンドル５０の保持回転部５２で保持されたら、ロボットハンド４３が下降して基板Ｗの下面から離間し、その後、ウエハ保持位置から退避する。なお上述の各動作の間、上部洗浄部材６１と下部洗浄部材６２は、ウエハ保持位置の上方及び下方にそれぞれ退避している。   When the substrate W is held by the holding rotation unit 52 of each spindle 50, the robot hand 43 is lowered and separated from the lower surface of the substrate W, and then retracted from the wafer holding position. During the above-described operations, the upper cleaning member 61 and the lower cleaning member 62 are retracted above and below the wafer holding position, respectively.

次に、モータ２８を駆動して各スピンドル５０の保持回転部５２を回転させ、基板Ｗを所定の回転速度で回転させる。また、洗浄液供給機構７０の上部ノズル７１及び下部ノズル７２から基板Ｗの上面及び下面に洗浄液を噴射供給する。そしてロールスポンジ６３，６４を回転させながら洗浄部材６１，６２を上下動させ、ロールスポンジ６３，６４を基板Ｗの上面及び下面に摺接させて基板Ｗの上面及び下面をスクラブ洗浄する。この洗浄工程を行っている間も、第１移動機構１０上のスピンドル５０，５０は回動自在なので、これらスピンドル５０，５０の保持回転部５２，５２が基板Ｗの周縁部を保持する保持力が常に均等になるように自動調整される。したがって、洗浄処理中の基板Ｗの回転が安定し、効率良く洗浄処理を行うことができる。   Next, the motor 28 is driven to rotate the holding rotation unit 52 of each spindle 50, and the substrate W is rotated at a predetermined rotation speed. Further, the cleaning liquid is jetted and supplied from the upper nozzle 71 and the lower nozzle 72 of the cleaning liquid supply mechanism 70 to the upper and lower surfaces of the substrate W. Then, the cleaning members 61 and 62 are moved up and down while rotating the roll sponges 63 and 64, and the roll sponges 63 and 64 are slidably brought into contact with the upper and lower surfaces of the substrate W to scrub and clean the upper and lower surfaces of the substrate W. Since the spindles 50 and 50 on the first moving mechanism 10 are rotatable even during the cleaning process, the holding rotating parts 52 and 52 of the spindles 50 and 50 hold the peripheral edge of the substrate W. Is automatically adjusted so that is always uniform. Therefore, the rotation of the substrate W during the cleaning process is stabilized, and the cleaning process can be performed efficiently.

〔第２実施形態：他の基板保持回転機構〕
次に、本発明の第２実施形態にかかる基板保持回転機構を説明する。本実施形態の説明及び図面においては、第１実施形態と共通する部分には同一の符号を付し、その詳細な説明は省略する。以下の他の実施形態においても同様とする。図１０は、本実施形態の基板保持回転機構１−２を上方から見た模式図である。この基板保持回転機構１−２が第１実施形態の基板保持回転機構１と異なるのは、ウエハ保持位置の両側に、上記で説明した回動機構を備えた第１移動機構１０，１０を配置し、それら第１移動機構１０，１０にそれぞれスピンドル群５３，５４を搭載したものである。この基板保持回転機構１−２では、各スピンドル５０で基板Ｗを保持する際に、第１移動機構１０，１０の回動機構が共に働くことで、両方のスピンドル群５３，５４の保持力の不均衡を是正することができるため、第１実施形態の基板保持回転機構１よりもさらに均等な圧力で基板Ｗを保持することが可能となる。なお、図１０では、第１移動機構１０を簡略化して示している。以下の各図でも同様とする。 [Second Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to a second embodiment of the present invention will be described. In the description of the present embodiment and the drawings, the same reference numerals are given to portions common to the first embodiment, and detailed description thereof is omitted. The same applies to other embodiments below. FIG. 10 is a schematic view of the substrate holding and rotating mechanism 1-2 according to this embodiment as viewed from above. The substrate holding and rotating mechanism 1-2 is different from the substrate holding and rotating mechanism 1 of the first embodiment in that the first moving mechanisms 10 and 10 having the rotating mechanism described above are arranged on both sides of the wafer holding position. In addition, spindle groups 53 and 54 are mounted on the first moving mechanisms 10 and 10, respectively. In the substrate holding and rotating mechanism 1-2, when the substrate W is held by each spindle 50, the rotating mechanism of the first moving mechanisms 10 and 10 works together, so that the holding force of both the spindle groups 53 and 54 is reduced. Since the imbalance can be corrected, the substrate W can be held at a pressure that is more uniform than that of the substrate holding and rotating mechanism 1 of the first embodiment. In addition, in FIG. 10, the 1st moving mechanism 10 is simplified and shown. The same applies to the following drawings.

〔第３実施形態：他の基板保持回転機構〕
次に、本発明の第３実施形態にかかる基板保持回転機構を説明する。図１１は、本実施形態の基板保持回転機構１−３を上方から見た模式図である。この基板保持回転機構１−３が第１実施形態の基板保持回転機構１と異なるのは、第１移動機構１０に対向するウエハ保持位置の他方の側部に、一本のスピンドル５０のみを設置した点である。このスピンドル５０は、設置位置で固定されていて移動しない。その一方で、第１移動機構１０に搭載されたスピンドル５０，５０が上記の往復移動機構によりウエハ保持位置に向かって移動することで、基板Ｗが保持される。 [Third Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to a third embodiment of the present invention will be described. FIG. 11 is a schematic view of the substrate holding and rotating mechanism 1-3 according to this embodiment as viewed from above. The substrate holding and rotating mechanism 1-3 differs from the substrate holding and rotating mechanism 1 of the first embodiment in that only one spindle 50 is installed on the other side of the wafer holding position facing the first moving mechanism 10. This is the point. The spindle 50 is fixed at the installation position and does not move. On the other hand, the spindles 50 and 50 mounted on the first moving mechanism 10 are moved toward the wafer holding position by the reciprocating mechanism described above, whereby the substrate W is held.

すなわちこの基板保持回転機構１−３は、合計３本のスピンドル５０で基板Ｗを保持するようになっている。この基板保持回転機構１−３でも、各スピンドル５０で基板Ｗを保持する際に第１移動機構１０の回動機構が働くことで、基板Ｗを保持する保持力の不均衡を是正できる。このように構成することで基板保持回転機構をより簡略化することができる。   That is, the substrate holding / rotating mechanism 1-3 holds the substrate W with a total of three spindles 50. Even in the substrate holding and rotating mechanism 1-3, when the substrate W is held by each spindle 50, the rotation mechanism of the first moving mechanism 10 works, so that the imbalance of the holding force for holding the substrate W can be corrected. With this configuration, the substrate holding and rotating mechanism can be further simplified.

なお、３本のスピンドル５０で基板Ｗを保持する基板保持回転機構において、特に本実施形態のように１本のスピンドル５０が不動で他の２本のスピンドル５０が動いて基板Ｗを保持する場合は、保持された基板Ｗの中心位置が各スピンドル５０の位置に追従して決まるため、毎回保持される基板Ｗの中心位置が一点に定まらないことが起こり得るが、その場合は基板搬送機構４０に、搬送する基板Ｗの中心位置が毎回若干異なっていても搬送を可能とする機構を別途設けるなどすれば良い。   In the substrate holding and rotating mechanism for holding the substrate W with the three spindles 50, particularly when one spindle 50 is not moved and the other two spindles 50 are moved to hold the substrate W as in the present embodiment. In this case, since the center position of the held substrate W is determined following the position of each spindle 50, the center position of the substrate W held each time may not be fixed at one point. In addition, a mechanism capable of transporting may be separately provided even if the center position of the substrate W to be transported is slightly different each time.

この第３実施形態の一部変形構成例を図１２に示す。同図に示す基板保持回転機構１−３´は、図１１の基板保持回転機構１−３が備える固定された一本のスピンドル５０にかえて、一本のスピンドル５０´を搭載したベース部材１７´と、該ベース部材１７´を往復移動させる往復移動機構（図示せず）を設置したものである。この往復移動機構は、ベース部材１７´に搭載されたスピンドル５０´を、第１移動機構１０のスピンドル５０，５０が往復移動する直線Ｌ，Ｌに沿う方向（直線Ｌ，Ｌと平行する直線Ｌ´の方向）に往復移動させることができる。   FIG. 12 shows a partially modified configuration example of the third embodiment. A substrate holding and rotating mechanism 1-3 ′ shown in FIG. 11 is replaced with a single spindle 50 provided in the substrate holding and rotating mechanism 1-3 of FIG. 11, and a base member 17 on which a single spindle 50 ′ is mounted. 'And a reciprocating mechanism (not shown) for reciprocating the base member 17' are installed. In this reciprocating mechanism, the spindle 50 ′ mounted on the base member 17 ′ is moved along the straight lines L and L along which the spindles 50 and 50 of the first moving mechanism 10 reciprocate (straight line L parallel to the straight lines L and L). It can be reciprocated in the direction of ′.

〔第４実施形態：他の基板保持回転機構〕
次に、本発明の第４実施形態にかかる基板保持回転機構を説明する。図１３は、本実施形態の基板保持回転機構１−４を上方から見た模式図である。この基板保持回転機構１−４が第１実施形態の基板保持回転機構１と異なるのは、ウエハ保持位置の両側部に設置した第１移動機構１０と第２移動機構２０の上に、いずれも３本のスピンドル５０を搭載した点である。即ち、各ベース部材１７，２５上に、上方から見て同一円周上に配置されるように各３本ずつのスピンドル５０を搭載している。これにより、合計６本のスピンドル５０で基板Ｗを保持することになるので、より安定した状態で基板Ｗを保持することが可能となる。なおこの場合も、各スピンドル５０で基板Ｗを保持する際に、第１移動機構１０の回動機構が働くことでその上に搭載されたスピンドル５０による保持力の不均衡を是正することができる。 [Fourth Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to a fourth embodiment of the present invention will be described. FIG. 13 is a schematic view of the substrate holding and rotating mechanism 1-4 according to this embodiment as viewed from above. The substrate holding and rotating mechanism 1-4 is different from the substrate holding and rotating mechanism 1 of the first embodiment in that both the first moving mechanism 10 and the second moving mechanism 20 installed on both sides of the wafer holding position are provided. This is the point where three spindles 50 are mounted. That is, three spindles 50 are mounted on each base member 17 and 25 so as to be arranged on the same circumference when viewed from above. Thereby, since the substrate W is held by a total of six spindles 50, the substrate W can be held in a more stable state. In this case as well, when the substrate W is held by each spindle 50, the rotation mechanism of the first moving mechanism 10 works so that the imbalance of the holding force by the spindle 50 mounted thereon can be corrected. .

〔第５実施形態：他の基板保持回転機構〕
次に、本発明の第５実施形態にかかる基板保持回転機構を説明する。図１４は、本実施形態の基板保持回転機構１−５を上方から見た模式図である。この基板保持回転機構１−５が第４実施形態の基板保持回転機構１−４と異なるのは、ウエハ保持位置の両側に配置した各３本のスピンドル５０を第１移動機構１０，１０に搭載した点である。この基板保持回転機構１−５では、各スピンドル５０で基板Ｗを保持する際に、両方の第１移動機構１０，１０の回動機構が働くことで、基板Ｗを保持する保持力の不均衡を是正することができるため、第４実施形態の基板保持回転機構１−４よりもさらに均等な圧力で基板Ｗを保持することが可能となる。 [Fifth Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to a fifth embodiment of the present invention will be described. FIG. 14 is a schematic view of the substrate holding and rotating mechanism 1-5 of this embodiment as viewed from above. The substrate holding and rotating mechanism 1-5 is different from the substrate holding and rotating mechanism 1-4 of the fourth embodiment in that three spindles 50 arranged on both sides of the wafer holding position are mounted on the first moving mechanisms 10 and 10, respectively. This is the point. In the substrate holding and rotating mechanism 1-5, when the substrates W are held by the spindles 50, the rotating mechanisms of both the first moving mechanisms 10 and 10 work, so that the holding force holding the substrates W is imbalanced. Therefore, it is possible to hold the substrate W at a pressure that is even more uniform than the substrate holding and rotating mechanism 1-4 of the fourth embodiment.

〔第６実施形態：他の基板保持回転機構〕
次に、本発明の第６実施形態にかかる基板保持回転機構を説明する。図１５は、本実施形態の基板保持回転機構１−６を上方から見た模式図である。この基板保持回転機構１−６は、ウエハ保持位置の周囲の等間隔を隔てた３箇所の位置に第１移動機構１０を設置し、それらに各２本ずつのスピンドル５０を搭載したものである。したがってこの基板保持回転機構１−６では、合計６本のスピンドル５０で基板Ｗを保持するようになっている。各第１移動機構１０上のスピンドル５０は、いずれもウエハ保持位置（ウエハ保持位置で保持される基板Ｗの中心）に向かう直線に沿う方向に往復移動可能になっている。この基板保持回転機構１−６では、各スピンドル５０で基板Ｗを保持する際に、３台の第１移動機構１０の回動機構が働くことで、基板Ｗを保持する保持力の不均衡を是正することができるため、上記各実施形態の基板保持回転機構よりもさらに均等な圧力で基板Ｗを保持することが可能となる。図中の符号５５は、ベース部材１７を往復移動させるためのシリンダである。このように往復移動機構を簡略化することもできる。なお、本実施形態では、ウエハ保持位置の周囲の３箇所のいずれにも第１移動機構１０を設置したが、これ以外にも、いずれかの第１移動機構１０を第２移動機構２０に置き換えて、その上に搭載されたスピンドル５０が往復移動のみ可能となるように構成してもよい。 [Sixth Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to a sixth embodiment of the present invention will be described. FIG. 15 is a schematic view of the substrate holding and rotating mechanism 1-6 of this embodiment as viewed from above. The substrate holding / rotating mechanism 1-6 has the first moving mechanism 10 installed at three positions at equal intervals around the wafer holding position, and two spindles 50 are mounted on each of them. . Therefore, in this substrate holding and rotating mechanism 1-6, the substrate W is held by a total of six spindles 50. Each of the spindles 50 on each first moving mechanism 10 can reciprocate in a direction along a straight line toward the wafer holding position (the center of the substrate W held at the wafer holding position). In the substrate holding / rotating mechanism 1-6, when the substrate W is held by each spindle 50, the rotation mechanisms of the three first moving mechanisms 10 work, thereby reducing the imbalance of the holding force for holding the substrate W. Since the correction can be made, it becomes possible to hold the substrate W at a pressure that is more uniform than the substrate holding and rotating mechanism of each of the above embodiments. Reference numeral 55 in the drawing is a cylinder for reciprocating the base member 17. Thus, the reciprocating mechanism can be simplified. In the present embodiment, the first moving mechanism 10 is installed at any of the three locations around the wafer holding position. However, any one of the first moving mechanisms 10 is replaced with the second moving mechanism 20. In addition, the spindle 50 mounted thereon may be configured to allow only reciprocation.

〔第７実施形態：他の基板保持回転機構〕
次に、本発明の第７実施形態にかかる基板保持回転機構を説明する。図１６は、本実施形態の基板保持回転機構１−７を上方から見た模式図である。 [Seventh Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to a seventh embodiment of the present invention will be described. FIG. 16 is a schematic view of the substrate holding and rotating mechanism 1-7 of this embodiment as viewed from above.

図１６に示すように、基板保持回転機構１−７は、一対の軸部材（第１軸部材）８０，８０を中心にそれぞれ回転可能な一対のベース部材（第１ベース部材）８１，８１と、軸部材（第２軸部材）８２を中心に回転可能なベース部材（第２ベース部材）８３とを備えている。ベース部材８１，８１には、それぞれ保持回転部（クランプローラ）８５，８５がスピンドル５０，５０（図７参照）を介して連結されている。また、ベース部材８３には２つの保持回転部８６，８６がスピンドル５０，５０を介して連結されている。なお、図１６には、スピンドル５０は図示されていないが、保持回転部８５，８５，８６，８６の下にスピンドル５０がそれぞれ配置されている。   As shown in FIG. 16, the substrate holding and rotating mechanism 1-7 includes a pair of base members (first base members) 81, 81 that can rotate around a pair of shaft members (first shaft members) 80, 80, respectively. And a base member (second base member) 83 that is rotatable about a shaft member (second shaft member) 82. Holding rotation portions (clamp rollers) 85 and 85 are connected to the base members 81 and 81 via spindles 50 and 50 (see FIG. 7), respectively. In addition, two holding rotating portions 86, 86 are connected to the base member 83 via spindles 50, 50. In FIG. 16, the spindle 50 is not shown, but the spindle 50 is disposed below the holding rotating portions 85, 85, 86, 86.

保持回転部８５，８５，８６，８６は、いずれもその軸心周りに回転可能に構成されている。保持回転部８６，８６は軸部材８２に関して対称的に配置されている。ベース部材８１，８１は連結部材８８によって互いに連結されており、この連結部材８８はエアシリンダ（駆動機構）８４に連結されている。連結部材８８はエアシリンダ８４により矢印で示す方向（ウエハ保持位置にある基板Ｗの径方向）に移動する。   Each of the holding and rotating portions 85, 85, 86, and 86 is configured to be rotatable around its axis. The holding rotation portions 86 and 86 are arranged symmetrically with respect to the shaft member 82. The base members 81 and 81 are connected to each other by a connecting member 88, and the connecting member 88 is connected to an air cylinder (drive mechanism) 84. The connecting member 88 is moved by the air cylinder 84 in the direction indicated by the arrow (the radial direction of the substrate W at the wafer holding position).

図１７は図１６に示す連結部材８８とベース部材８１との連結部の構成例を示す拡大図であり、図１８は連結部材８８の端部を示す側面図である。図１７に示すように、ベース部材８１には連結部材８８の移動方向（矢印で示す）に対して斜めに延びる長孔８１ａが形成されている。図１８に示すように、連結部材８８の端部には垂直に延びる屈曲部が形成されている。連結部材８８は２つの円形の摺動部材８９を具備しており（図１７および図１８には１つの摺動部材８９のみを示す）、連結部材８８の先端（すなわち屈曲部の先端）に摺動部材８９がそれぞれ固定されている。この摺動部材８９は、ベース部材８１の長孔８１ａに緩やかに嵌合されており、摺動部材８９は長孔８１ａ内を移動可能となっている。   FIG. 17 is an enlarged view showing a configuration example of a connecting portion between the connecting member 88 and the base member 81 shown in FIG. 16, and FIG. 18 is a side view showing an end portion of the connecting member 88. As shown in FIG. 17, the base member 81 is formed with a long hole 81 a extending obliquely with respect to the moving direction (indicated by an arrow) of the connecting member 88. As shown in FIG. 18, a bent portion extending vertically is formed at the end of the connecting member 88. The connecting member 88 includes two circular sliding members 89 (only one sliding member 89 is shown in FIGS. 17 and 18), and the connecting member 88 slides on the tip of the connecting member 88 (that is, the tip of the bent portion). Each of the moving members 89 is fixed. The sliding member 89 is loosely fitted in the long hole 81a of the base member 81, and the sliding member 89 can move in the long hole 81a.

このような構成により、エアシリンダ８４により連結部材８８を移動させると、ベース部材８１，８１がそれぞれ軸部材８０，８０を中心に互いに反対方向に回転する。なお、摺動部材８９，８９に代えて、その軸心周りに回転可能なローラを用いてもよい。   With such a configuration, when the connecting member 88 is moved by the air cylinder 84, the base members 81 and 81 rotate in opposite directions around the shaft members 80 and 80, respectively. Instead of the sliding members 89, 89, a roller that can rotate around its axis may be used.

図１９は図１６に示す連結部材８８とベース部材８１，８１との連結部の他の構成例を示す拡大図である。図１９に示すように、この例では、連結部材８８は、２本の連結バー８８ａ，８８ａと、これらの連結バー８８ａ，８８ａがスライド自在に挿入される孔８８ｃ，８８ｃを有する収容部材８８ｂとを有している。孔８８ｃ，８８ｃは収容部材８８ｂの両側部に形成されており、これらの孔８８ｃ，８８ｃは同一線上に配列されている。孔８８ｃ，８８ｃの内部にはばね８８ｄ，８８ｄがそれぞれ配置されている。なお、ばね８８ｄ，８８ｄは省略することができる。   FIG. 19 is an enlarged view showing another configuration example of the connecting portion between the connecting member 88 and the base members 81 and 81 shown in FIG. As shown in FIG. 19, in this example, the connecting member 88 includes two connecting bars 88a and 88a, and an accommodating member 88b having holes 88c and 88c into which the connecting bars 88a and 88a are slidably inserted. have. The holes 88c and 88c are formed on both sides of the housing member 88b, and these holes 88c and 88c are arranged on the same line. Springs 88d and 88d are disposed inside the holes 88c and 88c, respectively. The springs 88d and 88d can be omitted.

収容部材８８ｂはエアシリンダ８４（図１６参照）に固定されており、エアシリンダ８４によって収容部材８８ｂが連結バー８８ａ，８８ａと共に図１６および図１９に示す矢印の方向に移動する。連結バー８８ａ，８８ａの端部はベース部材８１，８１に回転自在に連結されている。なお、この例では、ベース部材８１，８１には長孔は形成されていない。このような構成によれば、上述の例と同様に、エアシリンダ８４により連結部材８８を移動させると、ベース部材８１，８１がそれぞれ軸部材８０，８０を中心に互いに反対方向に回転する。   The housing member 88b is fixed to the air cylinder 84 (see FIG. 16), and the air cylinder 84 moves the housing member 88b together with the connecting bars 88a and 88a in the direction of the arrows shown in FIGS. The ends of the connecting bars 88a, 88a are rotatably connected to the base members 81, 81. In this example, long holes are not formed in the base members 81 and 81. According to such a configuration, as in the above example, when the connecting member 88 is moved by the air cylinder 84, the base members 81 and 81 rotate in opposite directions around the shaft members 80 and 80, respectively.

図１６に示すように、エアシリンダ８４は第１ガス供給ライン１０１および第２ガス供給ライン１０２に接続されており、図示しないガス供給源からエアシリンダ８４に第１ガス供給ライン１０１および第２ガス供給ライン１０２を通じて交互に加圧気体（例えば、加圧空気や加圧不活性ガス）が供給されるようになっている。より詳しくは、第１ガス供給ライン１０１を通じて加圧気体がエアシリンダ８４に供給されると、ベース部材８１，８１は保持回転部８５，８５を基板Ｗに近づける方向に回転し、これにより基板Ｗは保持回転部８５，８５，８６，８６により保持される。一方、第２ガス供給ライン１０２を通じてエアシリンダ８４に加圧気体が供給されると、ベース部材８１，８１は保持回転部８５，８５を基板Ｗから離間させる方向に回転し、これにより基板Ｗは保持回転部８５，８５，８６，８６から解放される。   As shown in FIG. 16, the air cylinder 84 is connected to the first gas supply line 101 and the second gas supply line 102, and the first gas supply line 101 and the second gas are connected to the air cylinder 84 from a gas supply source (not shown). Pressurized gas (for example, pressurized air or pressurized inert gas) is alternately supplied through the supply line 102. More specifically, when the pressurized gas is supplied to the air cylinder 84 through the first gas supply line 101, the base members 81 and 81 rotate in a direction to bring the holding and rotating portions 85 and 85 closer to the substrate W, and thereby the substrate W Is held by holding rotation portions 85, 85, 86, 86. On the other hand, when the pressurized gas is supplied to the air cylinder 84 through the second gas supply line 102, the base members 81 and 81 rotate in a direction in which the holding rotating portions 85 and 85 are separated from the substrate W. It is released from the holding rotating parts 85, 85, 86, 86.

第１ガス供給ライン１０１にはエアシリンダ８４に供給される加圧気体の圧力を調整する電空レギュレータ（圧力調整機構）１０３が配置されている。この電空レギュレータ１０３は、図示しない圧力センサからの信号に基づき、エアシリンダ８４に供給される加圧気体が所定の圧力となるようにフィードバック制御する。ここで、基板Ｗに作用する保持回転部８５，８５，８６，８６の保持力は、第１ガス供給ライン１０１を通じてエアシリンダ８４に供給される加圧気体の圧力に依存する。したがって、電空レギュレータ１０３は保持力調整機構としても機能する。   The first gas supply line 101 is provided with an electropneumatic regulator (pressure adjusting mechanism) 103 that adjusts the pressure of the pressurized gas supplied to the air cylinder 84. The electropneumatic regulator 103 performs feedback control based on a signal from a pressure sensor (not shown) so that the pressurized gas supplied to the air cylinder 84 becomes a predetermined pressure. Here, the holding force of the holding rotating parts 85, 85, 86, 86 acting on the substrate W depends on the pressure of the pressurized gas supplied to the air cylinder 84 through the first gas supply line 101. Therefore, the electropneumatic regulator 103 also functions as a holding force adjustment mechanism.

以下、本実施形態の動作について詳細に説明する。ウエハ搬送機構４０（図８参照）により基板Ｗが搬入されると、第１ガス供給ライン１０１を通じて加圧気体がエアシリンダ８４に供給される。ベース部材８１，８１はエアシリンダ８４によって軸部材８０，８０を中心に互いに反対方向に回転し、これにより保持回転部８５，８５が基板Ｗの周縁部に接触する。保持回転部８５，８５が基板Ｗに接触すると同時またはその直後に基板Ｗの周縁部が保持回転部８６，８６に接触する。このようにして、基板Ｗは４つの保持回転部８５，８５，８６，８６により保持される。図１６は基板Ｗが保持回転部８５，８５，８６，８６により保持されている状態を示している。   Hereinafter, the operation of the present embodiment will be described in detail. When the substrate W is loaded by the wafer transfer mechanism 40 (see FIG. 8), the pressurized gas is supplied to the air cylinder 84 through the first gas supply line 101. The base members 81, 81 are rotated in opposite directions around the shaft members 80, 80 by the air cylinder 84, so that the holding rotating portions 85, 85 are in contact with the peripheral edge of the substrate W. At the same time or immediately after the holding and rotating portions 85 and 85 contact the substrate W, the peripheral edge of the substrate W contacts the holding and rotating portions 86 and 86. In this way, the substrate W is held by the four holding rotating portions 85, 85, 86, 86. FIG. 16 shows a state in which the substrate W is held by the holding rotating portions 85, 85, 86, 86.

保持回転部８５，８５，８６，８６のうちの少なくとも１つは図示しないモータ（回転機構）により回転し、これにより基板Ｗが保持回転部８５，８５，８６，８６に保持された状態で回転する。保持回転部８６，８６は、軸部材８２を中心に旋回自在に設置されているのみであるので、保持回転部８５，８５，８６，８６に保持された基板Ｗの位置はほぼ一定に維持される。基板Ｗが保持されている間は、エアシリンダ８４に供給される加圧気体の圧力は電空レギュレータ１０３によって一定に維持される。   At least one of the holding and rotating portions 85, 85, 86, and 86 is rotated by a motor (rotating mechanism) (not shown), thereby rotating the substrate W while being held by the holding and rotating portions 85, 85, 86, and 86. To do. Since the holding and rotating portions 86 and 86 are only installed so as to be rotatable about the shaft member 82, the position of the substrate W held by the holding and rotating portions 85, 85, 86 and 86 is maintained substantially constant. The While the substrate W is held, the pressure of the pressurized gas supplied to the air cylinder 84 is kept constant by the electropneumatic regulator 103.

〔第８実施形態：他の基板保持回転機構〕
次に、本発明の第８実施形態にかかる基板保持回転機構について説明する。本実施形態の基本的構成は第７実施形態と同様であるが、保持回転部の摩耗量を検出するセンサが設けられている点で第７実施形態と異なる。 [Eighth Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to an eighth embodiment of the present invention will be described. The basic configuration of the present embodiment is the same as that of the seventh embodiment, but differs from the seventh embodiment in that a sensor for detecting the wear amount of the holding rotating portion is provided.

図２０は本発明の第８実施形態にかかる基板保持回転機構１−８を示す模式図である。図２０に示すように、連結部材８８の近傍にはセンサ１１０が配置されており、基板保持時における連結部材８８の位置がセンサ１１０によって検出されるようになっている。連結部材８８の位置は保持回転部８５，８５，８６，８６の摩耗量に応じて変化するため、連結部材８８の位置の変化から、保持回転部８５，８５，８６，８６の摩耗量を検出することができる。なお、センサ１１０としては接触型または非接触型の公知の変位センサを用いることができる。   FIG. 20 is a schematic view showing a substrate holding and rotating mechanism 1-8 according to the eighth embodiment of the present invention. As shown in FIG. 20, a sensor 110 is disposed in the vicinity of the connecting member 88, and the position of the connecting member 88 when the substrate is held is detected by the sensor 110. Since the position of the connecting member 88 changes in accordance with the amount of wear of the holding rotating parts 85, 85, 86, 86, the amount of wear of the holding rotating parts 85, 85, 86, 86 is detected from the change in the position of the connecting member 88. can do. As the sensor 110, a known displacement sensor of a contact type or a non-contact type can be used.

〔第９実施形態：他の基板保持回転機構〕
次に、本発明の第９実施形態にかかる基板保持回転機構について説明する。本実施形態の基本的構成は第７実施形態と同様であるが、基板Ｗが保持回転部から解放されるときに基板Ｗを押し出す基板押し出し部材が設けられている点で第７実施形態と異なる。 [Ninth Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to a ninth embodiment of the invention will be described. The basic configuration of the present embodiment is the same as that of the seventh embodiment, but differs from the seventh embodiment in that a substrate pushing member that pushes the substrate W when the substrate W is released from the holding rotation unit is provided. .

図２１は本発明の第９実施形態にかかる基板保持回転機構１−９を示す模式図であり、基板Ｗが保持回転部により保持されている状態を示している。基板押し出し部材１１１，１１１はベース部材８１，８１にそれぞれ設けられている。図２２は基板押し出し部材を示す側面図である。図２２に示すように、基板押し出し部材１１１の一端はベース部材８１に固定され、他端は垂直に延びている。この垂直に延びる端部が基板Ｗに接触する接触部１１１ａとなっている。   FIG. 21 is a schematic view showing a substrate holding / rotating mechanism 1-9 according to the ninth embodiment of the present invention, and shows a state where the substrate W is held by the holding / rotating unit. Substrate extrusion members 111 and 111 are provided on base members 81 and 81, respectively. FIG. 22 is a side view showing the substrate pushing member. As shown in FIG. 22, one end of the substrate pushing member 111 is fixed to the base member 81, and the other end extends vertically. This vertically extending end portion is a contact portion 111 a that contacts the substrate W.

接触部１１１ａは、軸部材８０に関して保持回転部８５とは反対側に位置している。このような配置により、保持回転部８５が基板Ｗから離間する方向に移動するとき、接触部１１１ａは基板Ｗに向かって移動する。なお、接触部１１１ａに基板Ｗと接触するコロを設けてもよい。基板Ｗの周縁部との接触面積が最小となるように、接触部１１１ａは円形の断面形状を有している。図２１に示すように、基板Ｗが保持回転部８５，８５，８６，８６により保持されているときは、基板押し出し部材１１１，１１１と基板Ｗとは離間している。   The contact portion 111 a is located on the opposite side of the holding rotation portion 85 with respect to the shaft member 80. With such an arrangement, when the holding rotation unit 85 moves in a direction away from the substrate W, the contact portion 111a moves toward the substrate W. In addition, you may provide the roller which contacts the board | substrate W in the contact part 111a. The contact portion 111a has a circular cross-sectional shape so that the contact area with the peripheral portion of the substrate W is minimized. As shown in FIG. 21, when the substrate W is held by the holding rotating portions 85, 85, 86, 86, the substrate push-out members 111, 111 and the substrate W are separated from each other.

保持回転部８５，８５が基板Ｗから離間する方向にベース部材８１，８１が軸部材８０，８０を中心に回転すると、基板押し出し部材１１１，１１１の接触部１１１ａ，１１１ａは基板Ｗの周縁部に接触し、基板Ｗを水平方向に移動させる。これにより基板Ｗの周縁部が保持回転部８６，８６の保持溝（図７の符号５２ａ参照）から外れ、ウエハ搬送機構４０（図８参照）により基板Ｗをそのまま上方に持ち上げて、搬出することができる。このように、本実施形態によれば、保持回転部８５，８５が基板Ｗから離間すると同時に基板Ｗの周縁部が保持回転部８６，８６の保持溝から外れるので、基板Ｗを速やかに搬出することができる。なお、基板押し出し部材は１つでもよい。この場合は、ベース部材８１，８１のいずれか一方にのみ基板押し出し部材が設けられる。   When the base members 81, 81 rotate around the shaft members 80, 80 in the direction in which the holding rotation portions 85, 85 are separated from the substrate W, the contact portions 111 a, 111 a of the substrate push-out members 111, 111 are located on the peripheral edge of the substrate W. Touching and moving the substrate W in the horizontal direction. As a result, the peripheral edge of the substrate W is detached from the holding groove (see reference numeral 52a in FIG. 7) of the holding rotating portions 86, 86, and the wafer W is lifted upward by the wafer transfer mechanism 40 (see FIG. 8) and carried out. Can do. As described above, according to the present embodiment, since the holding and rotating portions 85 and 85 are separated from the substrate W, the peripheral portion of the substrate W is detached from the holding grooves of the holding and rotating portions 86 and 86, so that the substrate W is quickly carried out. be able to. The number of substrate pushing members may be one. In this case, the substrate pushing member is provided only on one of the base members 81 and 81.

〔第１０実施形態：他の基板保持回転機構〕
次に、本発明の第１０実施形態にかかる基板保持回転機構について説明する。なお、特に説明しない本実施形態の構成および動作は、上述した第７実施形態と同一であるので、その重複する説明を省略する。 [Tenth Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to a tenth embodiment of the present invention will be described. Note that the configuration and operation of the present embodiment that are not specifically described are the same as those of the seventh embodiment described above, and thus redundant description thereof is omitted.

図２３は本発明の第１０実施形態にかかる基板保持回転機構１−１０を示す模式図である。図２４は図２３に示す基板保持回転機構の一部を模式的に示す側面図である。図２３に示すように、保持回転部８５，８５，８６，８６によって保持された基板Ｗの周縁部の近傍には、基板ストッパー１１２が設けられている。この基板ストッパー１１２は上下に延びる部材であり、その上端は基板Ｗよりも上方に位置している。基板ストッパー１１２の位置は固定されている。基板ストッパー１１２は保持回転部８５，８５の中間に配置され、基板ストッパー１１２とベース部材８３とは、基板Ｗの中心に関して略対称に配置されている。   FIG. 23 is a schematic view showing a substrate holding and rotating mechanism 1-10 according to the tenth embodiment of the present invention. 24 is a side view schematically showing a part of the substrate holding and rotating mechanism shown in FIG. As shown in FIG. 23, a substrate stopper 112 is provided in the vicinity of the peripheral edge of the substrate W held by the holding rotation units 85, 85, 86, 86. The substrate stopper 112 is a member extending up and down, and its upper end is located above the substrate W. The position of the substrate stopper 112 is fixed. The substrate stopper 112 is disposed in the middle of the holding and rotating portions 85 and 85, and the substrate stopper 112 and the base member 83 are disposed substantially symmetrically with respect to the center of the substrate W.

図２４に示すように、基板Ｗはその周縁部が保持回転部８５，８５，８６，８６の外周面に形成された保持溝（図２４には保持回転部８５および保持溝８５ａのみを示す）に嵌合された状態でこれら保持回転部８５，８５，８６，８６に保持される。このため、ベース部材８１，８１を回転させて保持回転部８５，８５を基板Ｗから離間する方向に移動させたときに、基板Ｗが保持回転部８５，８５の保持溝８５ａ，８５ａに引きずられて保持回転部８５，８５とともに水平方向に移動することがある。本実施形態によれば、基板Ｗの周縁部の近傍に基板ストッパー１１２が配置されているので、基板Ｗの水平移動を止めることができ、その結果として基板Ｗを保持溝８５ａ，８５ａから外すことができる。   As shown in FIG. 24, the peripheral edge of the substrate W is a holding groove formed on the outer peripheral surface of the holding rotary parts 85, 85, 86, 86 (FIG. 24 shows only the holding rotary part 85 and the holding groove 85a). Are held by these holding rotating portions 85, 85, 86, 86. Therefore, when the base members 81 and 81 are rotated to move the holding rotating portions 85 and 85 away from the substrate W, the substrate W is dragged by the holding grooves 85a and 85a of the holding rotating portions 85 and 85. In some cases, it may move in the horizontal direction together with the holding and rotating portions 85 and 85. According to this embodiment, since the substrate stopper 112 is disposed in the vicinity of the peripheral edge of the substrate W, the horizontal movement of the substrate W can be stopped, and as a result, the substrate W is removed from the holding grooves 85a and 85a. Can do.

〔第１１実施形態：他の基板保持回転機構〕
次に、本発明の第１１実施形態にかかる基板保持回転機構について説明する。なお、特に説明しない本実施形態の構成および動作は、上述した第７実施形態と同一であるので、その重複する説明を省略する。 [Eleventh embodiment: other substrate holding and rotating mechanism]
Next, a substrate holding and rotating mechanism according to an eleventh embodiment of the present invention will be described. Note that the configuration and operation of the present embodiment that are not specifically described are the same as those of the seventh embodiment described above, and thus redundant description thereof is omitted.

図２５は本発明の第１１実施形態にかかる基板保持回転機構１−１１を示す模式図である。図２５に示すように、ベース部材８１，８１は第１連結部材１１４により互いに連結されている。エアシリンダ８４は第１連結部材１１４の一部を構成しており、エアシリンダ８４を駆動することにより第１連結部材１１４が伸縮するように構成されている。第１連結部材１１４の両端部はベース部材８１，８１にそれぞれ回転可能に連結されている。   FIG. 25 is a schematic view showing a substrate holding and rotating mechanism 1-11 according to the eleventh embodiment of the present invention. As shown in FIG. 25, the base members 81 and 81 are connected to each other by a first connecting member 114. The air cylinder 84 constitutes a part of the first connecting member 114, and the first connecting member 114 is configured to expand and contract by driving the air cylinder 84. Both ends of the first connecting member 114 are rotatably connected to the base members 81 and 81, respectively.

ベース部材８１，８１は、さらに軸部材（第２軸部材）８２に第２連結部材１１５，１１５を介して連結されている。各第２連結部材１１５の両端は、ベース部材８１および軸部材８２に回転自在に連結されている。第２連結部材１１５，１１５は互いに同一の長さを有している。したがって、第１連結部材１１４と第２連結部材１１５，１１５は全体として二等辺三角形を形成している。軸部材８２は図示しないガイドレール上に設けられており、基板Ｗの径方向（すなわち基板Ｗに近接および離間する方向）に移動可能となっている。   The base members 81 and 81 are further connected to a shaft member (second shaft member) 82 via second connection members 115 and 115. Both ends of each second connecting member 115 are rotatably connected to the base member 81 and the shaft member 82. The second connecting members 115 and 115 have the same length. Therefore, the first connecting member 114 and the second connecting members 115 and 115 form an isosceles triangle as a whole. The shaft member 82 is provided on a guide rail (not shown) and is movable in the radial direction of the substrate W (that is, in the direction approaching and separating from the substrate W).

図２６はベース部材８１と第１連結部材１１４と第２連結部材１１５との連結部の構成例を示す模式断面図である。図２６に示すように、ベース部材８１、第１連結部材１１４、および第２連結部材１１５を貫通する孔にはヒンジピン１１７が挿入されている。ベース部材８１、第１連結部材１１４、および第２連結部材１１５は、いずれもヒンジピン１１７を中心に回転自在となっている。   FIG. 26 is a schematic cross-sectional view illustrating a configuration example of a connecting portion of the base member 81, the first connecting member 114, and the second connecting member 115. As shown in FIG. 26, a hinge pin 117 is inserted into a hole that penetrates the base member 81, the first connecting member 114, and the second connecting member 115. The base member 81, the first connecting member 114, and the second connecting member 115 are all rotatable about the hinge pin 117.

このような構成において、エアシリンダ８４を作動させると、第１連結部材１１４の伸縮動作に伴ってベース部材８１，８１が互いに反対方向に回転する。さらに、ベース部材８３は第１連結部材１１４の伸縮動作に追随して移動する。すなわち、保持回転部８５，８５が基板Ｗに近接する方向にベース部材８１，８１が回転すると、ベース部材８３が基板Ｗに向かって移動する。一方、保持回転部８５，８５が基板Ｗから離間する方向にベース部材８１，８１が回転すると、ベース部材８３も基板Ｗから離間する方向に移動する。このように、４つの保持回転部８５，８５，８６，８６は基板Ｗに近接および離間する方向に同時に移動する。   In such a configuration, when the air cylinder 84 is operated, the base members 81 and 81 rotate in opposite directions with the expansion and contraction of the first connecting member 114. Further, the base member 83 moves following the expansion / contraction operation of the first connecting member 114. That is, the base member 83 moves toward the substrate W when the base members 81 and 81 rotate in the direction in which the holding and rotating portions 85 and 85 approach the substrate W. On the other hand, when the base members 81, 81 are rotated in the direction in which the holding rotating portions 85, 85 are separated from the substrate W, the base member 83 is also moved in a direction away from the substrate W. In this way, the four holding rotating parts 85, 85, 86, 86 move simultaneously in the direction approaching and separating from the substrate W.

〔第１２実施形態：他の基板保持回転機構〕
次に、本発明の第１２実施形態にかかる基板保持回転機構について説明する。本実施形態の基本的構成は第１１実施形態と同様であるが、保持回転部の摩耗量を検出するセンサが設けられている点で第１１実施形態と異なる。 [Twelfth Embodiment: Other Substrate Holding and Rotating Mechanism]
Next, a substrate holding and rotating mechanism according to a twelfth embodiment of the present invention will be described. The basic configuration of the present embodiment is the same as that of the eleventh embodiment, but differs from the eleventh embodiment in that a sensor for detecting the amount of wear of the holding rotating portion is provided.

図２７は本発明の第１２実施形態にかかる基板保持回転機構１−１２を示す模式図である。図２７に示すように、第１連結部材１１４にはターゲット部材１２０が固定されている。このターゲット部材１２０の近傍にはセンサ１１０が配置されており、基板保持時におけるターゲット部材１２０の位置がセンサ１１０によって検出されるようになっている。ターゲット部材１２０の位置は保持回転部８５，８５，８６，８６の摩耗量に応じて変化するため、ターゲット部材１２０の位置の変化から、保持回転部８５，８５，８６，８６の摩耗量を検出することができる。なお、第８実施形態と同様に、センサ１１０としては接触型または非接触型の公知の変位センサを用いることができる。   FIG. 27 is a schematic view showing a substrate holding and rotating mechanism 1-12 according to the twelfth embodiment of the present invention. As shown in FIG. 27, the target member 120 is fixed to the first connecting member 114. A sensor 110 is disposed in the vicinity of the target member 120, and the position of the target member 120 when the substrate is held is detected by the sensor 110. Since the position of the target member 120 changes in accordance with the amount of wear of the holding rotating parts 85, 85, 86, 86, the amount of wear of the holding rotating parts 85, 85, 86, 86 is detected from the change in the position of the target member 120. can do. Note that, as in the eighth embodiment, a known displacement sensor of a contact type or a non-contact type can be used as the sensor 110.

〔第１３実施形態：基板処理装置〕
次に、上記構成の基板洗浄装置を備えた基板処理装置について説明する。図２８は基板処理装置の構成を示す概略平面図である。同図に示す基板処理装置２００は、略矩形状のハウジング２０１を備えており、ハウジング２０１の内部が隔壁２０１ａ，２０１ｂ，２０１ｃによって、ロード／アンロード部２０２と研磨部２０３（２０３ａ，２０３ｂ）と洗浄部２０４とに区画されている。 [Thirteenth embodiment: substrate processing apparatus]
Next, a substrate processing apparatus provided with the substrate cleaning apparatus having the above configuration will be described. FIG. 28 is a schematic plan view showing the configuration of the substrate processing apparatus. A substrate processing apparatus 200 shown in the figure includes a substantially rectangular housing 201, and the inside of the housing 201 is constituted by partition walls 201a, 201b, 201c, and a load / unload unit 202 and a polishing unit 203 (203a, 203b). It is partitioned into a cleaning unit 204.

ロード／アンロード部２０２は、多数のウエハをストックするウエハカセットを載置する２個以上（本実施形態では３つ）のフロントロード部２２０を備えている。これらのフロントロード部２２０は、基板処理装置２００の幅方向（長手方向と垂直な方向）に隣接して配列されている。フロントロード部２２０には、オープンカセット、ＳＭＩＦ（Standard Manufacturing Interface）ポッド、又はＦＯＵＰ（Front Opening Unified Pod）を搭載することができる。ＳＭＩＦポッド、ＦＯＵＰは、隔壁で覆われた内部にウエハカセットを収納することで、外部空間とは独立した環境でウエハカセットを保持することができる密閉容器である。   The load / unload unit 202 includes two or more (three in this embodiment) front load units 220 on which wafer cassettes for stocking a large number of wafers are placed. These front load portions 220 are arranged adjacent to each other in the width direction (direction perpendicular to the longitudinal direction) of the substrate processing apparatus 200. The front load unit 220 can be mounted with an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). The SMIF pod and the FOUP are sealed containers that can hold the wafer cassette in an environment independent of the external space by storing the wafer cassette inside the partition wall.

またロード／アンロード部２０２には、フロントロード部２２０の並びに沿って走行機構２２１が敷設されており、この走行機構２２１上を移動可能な第１搬送ロボット２２２が設置されている。第１搬送ロボット２２２は、走行機構２２１上を移動することによってフロントロード部２２０に搭載されたウエハカセットにアクセスできるようになっている。この第１搬送ロボット２２２は、詳細な図示は省略するが上下に２つのハンドを備えており、例えば、上側のハンドをウエハカセットにウエハを戻すときに使用し、下側のハンドを研磨前のウエハを搬送するときに使用して、上下のハンドを使い分けることができるようになっている。   In the load / unload unit 202, a traveling mechanism 221 is laid along the front load unit 220, and a first transfer robot 222 that can move on the traveling mechanism 221 is installed. The first transfer robot 222 can access the wafer cassette mounted on the front load unit 220 by moving on the traveling mechanism 221. Although not shown in detail, the first transfer robot 222 has two hands up and down. For example, the upper hand is used when returning the wafer to the wafer cassette, and the lower hand is used before polishing. The upper and lower hands can be used properly when the wafer is transferred.

研磨部２０３は、ウエハの前処理としての研磨処理が行われる領域であり、第１研磨ユニット２３０Ａと第２研磨ユニット２３０Ｂとを有する第１研磨部２０３ａと、第３研磨ユニット２３０Ｃと第４研磨ユニット２３０Ｄとを有する第２研磨部２０３ｂを備えている。第１研磨ユニット２３０Ａは、研磨面を有する研磨テーブル３００Ａと、ウエハを保持し且つ研磨テーブル３００Ａに対して押圧しながら研磨するトップリング３０１Ａと、研磨テーブル３００Ａに研磨液やドレッシング液（例えば、水）を供給する研磨液供給ノズル３０２Ａと、研磨テーブル３００Ａのドレッシングを行うドレッサ３０３Ａと、液体（例えば純水）と気体（例えば窒素）の混合流体を霧状にして１又は複数のノズルから研磨面に噴射するアトマイザ３０４Ａとを備えている。この第１研磨ユニット２３０Ａでウエハを研磨するには、研磨テーブル３００Ａを回転させる一方、下端面にウエハを保持したトップリング３０１Ａを研磨テーブル３００Ａ上の研磨位置まで移動させて回転させる。そして研磨液供給ノズル３０２Ａから研磨面テーブル３００Ａの上面（研磨面）にスラリーを供給しながら、トップリング３０１Ａに保持されたウエハの被研磨面を研磨テーブル３００Ａの研磨面に押圧接触させて、被研磨面と研磨面の相対運動によってウエハの被研磨面を研磨する。   The polishing unit 203 is a region where a polishing process is performed as a pre-processing of the wafer, and includes a first polishing unit 203a having a first polishing unit 230A and a second polishing unit 230B, a third polishing unit 230C, and a fourth polishing unit. A second polishing unit 203b having a unit 230D is provided. The first polishing unit 230A includes a polishing table 300A having a polishing surface, a top ring 301A that holds the wafer and polishes it while pressing against the polishing table 300A, and a polishing liquid or a dressing liquid (for example, water) ), A dresser 303A for performing dressing of the polishing table 300A, and a mixed surface of liquid (for example, pure water) and gas (for example, nitrogen) in the form of a mist to form a polishing surface from one or a plurality of nozzles. And an atomizer 304A for injecting the gas. To polish the wafer by the first polishing unit 230A, the polishing table 300A is rotated, while the top ring 301A holding the wafer on the lower end surface is moved to the polishing position on the polishing table 300A and rotated. Then, while supplying the slurry from the polishing liquid supply nozzle 302A to the upper surface (polishing surface) of the polishing surface table 300A, the polishing surface of the wafer held by the top ring 301A is pressed and brought into contact with the polishing surface of the polishing table 300A. The surface to be polished of the wafer is polished by the relative movement of the polishing surface and the polishing surface.

第２研磨ユニット２３０Ｂは、研磨テーブル３００Ｂと、トップリング３０１Ｂと、研磨液供給ノズル３０２Ｂと、ドレッサ３０３Ｂと、アトマイザ３０４Ｂとを備えており、第３研磨ユニット２３０Ｃは、研磨テーブル３００Ｃと、トップリング３０１Ｃと、研磨液供給ノズル３０２Ｃと、ドレッサ３０３Ｃと、アトマイザ３０４Ｃとを備えており、第４研磨ユニット２３０Ｄは、研磨テーブル３００Ｄと、トップリング３０１Ｄと、研磨液供給ノズル３０２Ｄと、ドレッサ３０３Ｄと、アトマイザ３０４Ｄとを備えている。これら第２研磨ユニット２３０Ｂ、第３研磨ユニット２３０Ｃ、第４研磨ユニット２３０Ｄによる研磨も上記の第１研磨ユニット２３０Ａによる研磨と同様の手順で行われる。   The second polishing unit 230B includes a polishing table 300B, a top ring 301B, a polishing liquid supply nozzle 302B, a dresser 303B, and an atomizer 304B. The third polishing unit 230C includes a polishing table 300C and a top ring. 301C, a polishing liquid supply nozzle 302C, a dresser 303C, and an atomizer 304C. The fourth polishing unit 230D includes a polishing table 300D, a top ring 301D, a polishing liquid supply nozzle 302D, a dresser 303D, And an atomizer 304D. Polishing by the second polishing unit 230B, the third polishing unit 230C, and the fourth polishing unit 230D is performed in the same procedure as the polishing by the first polishing unit 230A.

第１研磨部２０３ａと洗浄部２０４との間には、基板処理装置２００の長手方向に沿って配置された４つの搬送位置（ロード／アンロード部２０２に近い側から順に第１搬送位置ＴＰ１、第２搬送位置ＴＰ２、第３搬送位置ＴＰ３、第４搬送位置ＴＰ４とする）の間でウエハを搬送する第１リニアトランスポータ２０５が配置されている。この第１リニアトランスポータ２０５の第１搬送位置ＴＰ１の上方には、ロード／アンロード部２０２の第１搬送ロボット２２２から受け取ったウエハを反転する反転機２３１が配置されており、その下方には上下に昇降可能なリフタ２３２が配置されている。また、第２搬送位置ＴＰ２の下方には上下に昇降可能なプッシャ２３３が、第３搬送位置ＴＰ３の下方には上下に昇降可能なプッシャ２３４が、第４搬送位置ＴＰ４の下方には上下に昇降可能なリフタ２３５がそれぞれ配置されている。   Between the first polishing unit 203a and the cleaning unit 204, four transfer positions (first transfer position TP1, sequentially from the side closer to the load / unload unit 202) arranged along the longitudinal direction of the substrate processing apparatus 200. A first linear transporter 205 for transferring the wafer is disposed between the second transfer position TP2, the third transfer position TP3, and the fourth transfer position TP4. A reversing machine 231 for reversing the wafer received from the first transport robot 222 of the load / unload unit 202 is disposed above the first transport position TP1 of the first linear transporter 205, and below it. A lifter 232 that can be moved up and down is disposed. In addition, a pusher 233 that can be moved up and down below the second transfer position TP2, a pusher 234 that can be moved up and down below the third transfer position TP3, and a pusher 234 that can move up and down below the fourth transfer position TP4. Each possible lifter 235 is arranged.

また、第２研磨部２０３ｂには、第１リニアトランスポータ２０５に隣接して、基板処理装置２００の長手方向に沿った３つの搬送位置（ロード／アンロード部２０２に近い側から順番に第５搬送位置ＴＰ５、第６搬送位置ＴＰ６、第７搬送位置ＴＰ７とする）の間でウエハを搬送する第２リニアトランスポータ２０６が配置されている。この第２リニアトランスポータ２０６の第５搬送位置ＴＰ５の下方には上下に昇降可能なリフタ２３６が、第６搬送位置ＴＰ６の下方にはプッシャ２３７が、第７搬送位置ＴＰ７の下方にはプッシャ２３８がそれぞれ配置されている。   Further, the second polishing unit 203b is adjacent to the first linear transporter 205, and has three transfer positions along the longitudinal direction of the substrate processing apparatus 200 (fifth in order from the side closer to the load / unload unit 202). A second linear transporter 206 for transferring the wafer is disposed between the transfer position TP5, the sixth transfer position TP6, and the seventh transfer position TP7. A lifter 236 that can be moved up and down below the fifth transport position TP5 of the second linear transporter 206, a pusher 237 below the sixth transport position TP6, and a pusher 238 below the seventh transport position TP7. Are arranged respectively.

次に、洗浄部２０４は、ウエハの後処理として研磨後のウエハを洗浄する領域であり、第２搬送ロボット２４０と、第２搬送ロボット２４０から受け取ったウエハを反転する反転機２４１と、研磨後のウエハを洗浄する４つの洗浄装置２４２〜２４５と、反転機２４１及び洗浄装置２４２〜２４５の間でウエハを搬送する搬送ユニット２４６とを備えている。これら第２搬送ロボット２４０、反転機２４１、及び洗浄装置２４２〜２４５は、基板処理装置２００の長手方向に沿って直列に配置されている。   Next, the cleaning unit 204 is an area for cleaning the polished wafer as a post-processing of the wafer, and includes a second transfer robot 240, a reversing device 241 for inverting the wafer received from the second transfer robot 240, and a post-polishing Four cleaning devices 242 to 245 for cleaning the wafer, and a transfer unit 246 for transferring the wafer between the reversing machine 241 and the cleaning devices 242 to 245. The second transfer robot 240, the reversing machine 241, and the cleaning apparatuses 242 to 245 are arranged in series along the longitudinal direction of the substrate processing apparatus 200.

洗浄部２０４の洗浄装置２４２〜２４５について説明する。１次洗浄装置２４２及び２次洗浄装置２４３としては、上記の第１実施形態で説明した基板洗浄装置（ロールタイプの洗浄装置）を用いることができる。また、３次洗浄装置２４４としては、例えば、半球状のスポンジを回転させながらウエハに押し付けて洗浄するいわゆるペンシルタイプの洗浄装置を用いることができる。４次洗浄装置２４５としては、例えば、ウエハの裏面はリンス洗浄することができ、ウエハの表面は半球状のスポンジを回転させながら押し付けて洗浄するペンシルタイプの洗浄装置を用いることができる。この４次洗浄装置２４５は、詳細な図示は省略するが、チャックしたウエハを高速回転させるステージを備えており、ウエハを高速回転させることで洗浄後のウエハを乾燥させる機能（スピンドライ機能）を有している。なお、各洗浄装置２４２〜２４５において、上述したロールタイプの洗浄装置やペンシルタイプの洗浄装置に加えて、洗浄液に超音波を当てて洗浄するメガソニックタイプの洗浄装置を付加的に設けてもよい。   The cleaning devices 242 to 245 of the cleaning unit 204 will be described. As the primary cleaning device 242 and the secondary cleaning device 243, the substrate cleaning device (roll type cleaning device) described in the first embodiment can be used. As the tertiary cleaning device 244, for example, a so-called pencil-type cleaning device that performs cleaning by pressing a wafer against a wafer while rotating a hemispherical sponge can be used. As the quaternary cleaning device 245, for example, a pencil type cleaning device can be used in which the back surface of the wafer can be rinsed and the front surface of the wafer can be pressed and rotated while rotating a hemispherical sponge. Although not shown in detail, the quaternary cleaning apparatus 245 includes a stage for rotating the chucked wafer at a high speed, and has a function of drying the cleaned wafer by rotating the wafer at a high speed (spin dry function). Have. In addition, in each of the cleaning devices 242-245, in addition to the roll type cleaning device and the pencil type cleaning device described above, a megasonic type cleaning device for cleaning by applying ultrasonic waves to the cleaning liquid may be additionally provided. .

次に、上記構成の基板処理装置２００によるウエハの研磨及び洗浄処理工程について説明する。以下では、ウエハをシリーズ処理する場合を例に説明する。まず、ウエハは、フロントロード部２２０のウエハカセットから、第１搬送ロボット２２２、反転機２３１、リフタ２３２、第１リニアトランスポータ２０５の搬送ステージ（図示せず）、プッシャ２３３を順に経由して、トップリング３０１Ａに渡されて研磨テーブル３００Ａで研磨される。その後、プッシャ２３３、第１リニアトランスポータ２０５の搬送ステージ、プッシャ２３４を順に経由して、トップリング３０１Ｂに渡されて研磨テーブル３００Ｂで研磨される。さらにその後、プッシャ２３４、第１リニアトランスポータ２０５の搬送ステージ、リフタ２３５、第２搬送ロボット２４０、リフタ２３６、第２リニアトランスポータ２０６の搬送ステージ（図示せず）、プッシャ２３７を順に経由して、トップリング３０１Ｃに渡されて研磨テーブル３００Ｃで研磨される。さらにその後、プッシャ２３７、第２リニアトランスポータ２０６の搬送ステージ、プッシャ２３８を順に経由して、トップリング３０１Ｄに渡されて研磨テーブル３００Ｄで研磨される。そして、プッシャ２３８、第２リニアトランスポータ２０６の搬送ステージ、リフタ２３６、第２搬送ロボット２４０、反転機２４１、搬送ユニット２４６のチャッキングユニット（図示せず）を順に経由して、１次洗浄装置２４２に搬入されて１次洗浄処理がされる。この１次洗浄処理の手順は、上記第１実施形態で説明した基板洗浄装置における洗浄手順のとおりである。その後、搬送ユニット２４６のチャッキングユニットを経由して、２次洗浄装置２４３に搬入され、２次洗浄処理がされる。さらにその後、搬送ユニット２４６のチャッキングユニットを経由して、３次洗浄装置２４４に搬入され３次洗浄がされる。さらにその後、搬送ユニット２４６のチャッキングユニットを経由して、４次洗浄装置２４５に搬入され４次洗浄がされる。その後、第１搬送ロボット２２２を経由して、フロントロード部２２０のウエハカセットに戻される。   Next, a wafer polishing and cleaning process performed by the substrate processing apparatus 200 configured as described above will be described. In the following, a case where wafers are processed in series will be described as an example. First, the wafer is sequentially passed from the wafer cassette of the front load unit 220 through the first transfer robot 222, the reversing machine 231, the lifter 232, the transfer stage (not shown) of the first linear transporter 205, and the pusher 233 in order. It is passed to the top ring 301A and polished by the polishing table 300A. After that, it passes through the pusher 233, the transfer stage of the first linear transporter 205, and the pusher 234 in this order, and is passed to the top ring 301B and polished by the polishing table 300B. Thereafter, the pusher 234, the transfer stage of the first linear transporter 205, the lifter 235, the second transfer robot 240, the lifter 236, the transfer stage (not shown) of the second linear transporter 206, and the pusher 237 are sequentially passed through. Then, it is passed to the top ring 301C and polished by the polishing table 300C. After that, it passes through the pusher 237, the transfer stage of the second linear transporter 206, and the pusher 238 in this order and is passed to the top ring 301D and polished by the polishing table 300D. The primary cleaning device sequentially passes through the pusher 238, the transfer stage of the second linear transporter 206, the lifter 236, the second transfer robot 240, the reversing machine 241, and the chucking unit (not shown) of the transfer unit 246. It is carried into 242 and a primary cleaning process is performed. The procedure of the primary cleaning process is the same as the cleaning procedure in the substrate cleaning apparatus described in the first embodiment. Thereafter, it is carried into the secondary cleaning device 243 via the chucking unit of the transport unit 246 and subjected to secondary cleaning processing. After that, it is carried into the tertiary cleaning device 244 via the chucking unit of the transport unit 246 and subjected to tertiary cleaning. Furthermore, after that, it is carried into the quaternary cleaning device 245 via the chucking unit of the transport unit 246 and subjected to quaternary cleaning. Thereafter, the wafer is returned to the wafer cassette of the front load unit 220 via the first transfer robot 222.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載のない何れの形状・構造・材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited.

例えば、第１移動機構１０が備える回動機構の具体的な構成は上記実施形態に示すものには限定されず、それ以外にも、ベース部材１７を回動自在にすることで、該ベース部材１７上に搭載されたスピンドル５０の保持回転部５２による基板Ｗを保持する保持力を調整できるものであれば、他の構成でもよい。また、スピンドル５０の保持回転部５２を回転させる回転機構は、上記実施形態に示す以外にも、いずれかのスピンドル５０の保持回転部５２のみを主動部としてモータ２８によって回転駆動し、他のスピンドル５０の保持回転部５２を従動部として基板Ｗの回転によって回転するようにしても良い。   For example, the specific configuration of the rotation mechanism included in the first moving mechanism 10 is not limited to that shown in the above embodiment, but the base member 17 can be rotated in addition to the above, so that the base member can be rotated. As long as the holding force for holding the substrate W by the holding rotation unit 52 of the spindle 50 mounted on the head 17 can be adjusted, other configurations may be used. Further, the rotation mechanism for rotating the holding rotation unit 52 of the spindle 50 is rotationally driven by the motor 28 using only the holding rotation unit 52 of any one of the spindles 50 as a main driving unit, as shown in the above embodiment, and other spindles. You may make it rotate by rotation of the board | substrate W by making 50 holding | maintenance rotation parts 52 into a driven part.

また、各スピンドル群５３，５４が備えるスピンドル５０は上記実施形態で示した本数には限定されず、スピンドル群５３，５４がそれ以外の本数（例えば４本以上）のスピンドル５０を備えていてもよい。また、基板洗浄装置の構成は、上記の実施形態には限定されず、これ以外にも、例えば上部洗浄部材６１と下部洗浄部材６２のいずれか一方のみを設置した基板洗浄装置としてもよい。   Further, the number of spindles 50 included in each of the spindle groups 53 and 54 is not limited to the number shown in the above embodiment, and the spindle groups 53 and 54 may include other numbers (for example, four or more) of spindles 50. Good. Further, the configuration of the substrate cleaning apparatus is not limited to the above-described embodiment, and other than this, for example, a substrate cleaning apparatus in which only one of the upper cleaning member 61 and the lower cleaning member 62 is installed may be used.

また、上記実施形態では、基板保持回転機構１を備えた基板処理装置として基板洗浄装置を例に説明したが、本発明にかかる基板保持回転機構１は、基板の洗浄処理を行う基板洗浄装置以外にも、基板を保持し回転させながら処理を行う基板処理装置であれば他の種類の処理を行う装置にも広く適用が可能であり、例えば、基板の研磨を行う基板研磨装置や、基板のエッチングを行う基板エッチング装置や、基板のベベル部（周縁部）の研磨を行うベベル研磨装置や、基板のベベル部のエッチングを行うベベルエッチング装置などの各種の基板処理装置にも適用することができる。   In the above-described embodiment, the substrate cleaning apparatus is described as an example of the substrate processing apparatus provided with the substrate holding and rotating mechanism 1. However, the substrate holding and rotating mechanism 1 according to the present invention is other than the substrate cleaning apparatus that performs the substrate cleaning process. In addition, any substrate processing apparatus that performs processing while holding and rotating the substrate can be widely applied to apparatuses that perform other types of processing. For example, a substrate polishing apparatus that polishes a substrate or a substrate polishing apparatus The present invention can also be applied to various substrate processing apparatuses such as a substrate etching apparatus that performs etching, a bevel polishing apparatus that polishes the bevel portion (peripheral portion) of the substrate, and a bevel etching apparatus that etches the bevel portion of the substrate. .

また、第１３実施形態の基板処理装置２００では、研磨部２０３でウエハの前処理としての研磨処理を行うと共に、本発明の基板保持回転機構を設置した１次、２次洗浄装置２４２，２４３でウエハの後処理としての洗浄処理を行う場合を説明したが、本発明の基板処理装置で行う前処理や後処理はこれらには限定されず、それ以外にも例えば前処理がウエハのエッチング処理等であっても良いし、後処理がウエハの乾燥処理等であってもよい。   Further, in the substrate processing apparatus 200 of the thirteenth embodiment, the polishing unit 203 performs a polishing process as a wafer pre-process and the primary and secondary cleaning apparatuses 242 and 243 provided with the substrate holding and rotating mechanism of the present invention. Although the case where the cleaning process is performed as the wafer post-processing has been described, the pre-processing and post-processing performed by the substrate processing apparatus of the present invention are not limited to these. The post-processing may be a wafer drying process or the like.

従来の基板保持回転機構の構成及び動作を説明するための模式図である。It is a schematic diagram for demonstrating a structure and operation | movement of the conventional board | substrate holding | maintenance rotation mechanism. 本発明の第１実施形態にかかる基板洗浄装置が備える基板保持回転機構を示す斜視図である。It is a perspective view which shows the substrate holding | maintenance rotation mechanism with which the substrate cleaning apparatus concerning 1st Embodiment of this invention is provided. 基板保持回転機構を示す図で、図２のＡ−Ａ矢視断面図である。It is a figure which shows a board | substrate holding | maintenance rotation mechanism, and is AA arrow sectional drawing of FIG. 基板保持回転機構を示す図で、図２のＢ−Ｂ矢視図である。It is a figure which shows a board | substrate holding | maintenance rotation mechanism, and is a BB arrow line view of FIG. 基板保持回転機構を示す図で、図２のＣ矢視図である。It is a figure which shows a board | substrate holding | maintenance rotation mechanism, and is C arrow directional view of FIG. 基板保持回転機構を示す図で、第１移動機構の平面図である。It is a figure which shows a board | substrate holding | maintenance rotation mechanism, and is a top view of a 1st moving mechanism. 本発明の一実施形態にかかる基板洗浄装置が備える基板洗浄機構を示す斜視図である。It is a perspective view showing a substrate cleaning mechanism with which a substrate cleaning device concerning one embodiment of the present invention is provided. 基板洗浄機構が備える搬送機構を示す図である。It is a figure which shows the conveyance mechanism with which a board | substrate cleaning mechanism is provided. 図９（ａ）乃至図９（ｃ）は、基板保持回転機構の動作を説明するための模式図である。FIG. 9A to FIG. 9C are schematic views for explaining the operation of the substrate holding and rotating mechanism. 本発明の第２実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 2nd Embodiment of this invention. 本発明の第３実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 3rd Embodiment of this invention. 本発明の第３実施形態の変形構成例にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning the modification structural example of 3rd Embodiment of this invention. 本発明の第４実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 4th Embodiment of this invention. 本発明の第５実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 5th Embodiment of this invention. 本発明の第６実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 6th Embodiment of this invention. 本発明の第７実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 7th Embodiment of this invention. 図１６に示す連結部材とベース部材との連結部の構成例を示す拡大図である。It is an enlarged view which shows the structural example of the connection part of the connection member shown in FIG. 16, and a base member. 連結部材の端部を示す側面図である。It is a side view which shows the edge part of a connection member. 図１６に示す連結部材とベース部材との連結部の他の構成例を示す拡大図である。It is an enlarged view which shows the other structural example of the connection part of the connection member shown in FIG. 16, and a base member. 本発明の第８実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 8th Embodiment of this invention. 本発明の第９実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 9th Embodiment of this invention. 基板押し出し部材を示す側面図である。It is a side view which shows a board | substrate extrusion member. 本発明の第１０実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 10th Embodiment of this invention. 図２３に示す基板保持回転機構の一部を模式的に示す側面図である。FIG. 24 is a side view schematically showing a part of the substrate holding and rotating mechanism shown in FIG. 23. 本発明の第１１実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 11th Embodiment of this invention. ベース部材と第１連結部材と第２連結部材との連結部の構成例を示す模式断面図である。It is a schematic cross section which shows the structural example of the connection part of a base member, a 1st connection member, and a 2nd connection member. 本発明の第１２実施形態にかかる基板保持回転機構を示す模式図である。It is a schematic diagram which shows the board | substrate holding | maintenance rotation mechanism concerning 12th Embodiment of this invention. 本発明の第１３実施形態にかかる基板処理装置の構成を示す概略平面図である。It is a schematic plan view which shows the structure of the substrate processing apparatus concerning 13th Embodiment of this invention.

符号の説明Explanation of symbols

１〜１−１２ 基板保持回転機構
２ 基板洗浄機構
３ 仕切部材
１０ 第１移動機構
１２ スライダー
１３ 連結部材
１３ａ 開口部
１４ ベアリング
１５ 軸部材
１５ａ ボルト
１７ ベース部材
１７ａ 凹部
１８ ガイド部材
１９ 係止部材
２０ 第２移動機構
２２ シリンダ
２３ ストッパー部材
２５ ベース部材
２６ シャフト
２８ モータ
２８ａ 回転軸
２９ 伝達ベルト
３０ 洗浄部材駆動機構
３６ スライドレール
４０ ウエハ搬送機構
５０ スピンドル
５１ 本体部
５１ａ 取付部
５２ 保持回転部
５２ａ 保持溝
５３ スピンドル群
５４ スピンドル群
６０ 洗浄部材
６１ 上部洗浄部材
６２ 下部洗浄部材
７０ 洗浄液供給機構
７１ 上部ノズル
７２ 下部ノズル
８０ 第１軸部材
８１ 第１ベース部材
８２ 第２軸部材
８３ 第２ベース部材
８４ エアシリンダ（駆動機構
８５，８６ 保持回転部
８８ 連結部材
８９ 摺動部材
１０１ 第１ガス供給ライン
１０２ 第２ガス供給ライン
１０３ 空電レギュレータ（圧力調整機構）
１１０ 摩耗量検出センサ
１１１ 基板押し出し部材
１１２ 基板ストッパー
１１４ 第１連結部材
１１５ 第２連結部材
１１７ ヒンジピン
１２０ ターゲット部材
２００ 基板処理装置
２０２ ロード／アンロード部
２０３（２０３ａ，２０３ｂ） 研磨部
２０４ 洗浄部
２４２ １次洗浄装置
２４３ ２次洗浄装置
２４４ ３次洗浄装置
２４５ ４次洗浄装置 1-1-12 Substrate holding and rotating mechanism 2 Substrate cleaning mechanism 3 Partition member 10 First moving mechanism 12 Slider 13 Connecting member 13a Opening portion 14 Bearing 15 Shaft member 15a Bolt 17 Base member 17a Recessed portion 18 Guide member 19 Locking member 20 First 2 Moving mechanism 22 Cylinder 23 Stopper member 25 Base member 26 Shaft 28 Motor 28a Rotating shaft 29 Transmission belt 30 Cleaning member drive mechanism 36 Slide rail 40 Wafer transfer mechanism 50 Spindle 51 Main body 51a Mounting portion 52 Holding rotating portion 52a Holding groove 53 Spindle Group 54 Spindle group 60 Cleaning member 61 Upper cleaning member 62 Lower cleaning member 70 Cleaning liquid supply mechanism 71 Upper nozzle 72 Lower nozzle 80 First shaft member 81 First base member 82 Second shaft member 83 Second base member 84 Air cylinder (drive) Mechanism 85, 8 6 Holding Rotating Unit 88 Connecting Member 89 Sliding Member 101 First Gas Supply Line 102 Second Gas Supply Line 103 Static Electric Regulator (Pressure Adjustment Mechanism)
110 Wear amount detection sensor 111 Substrate pushing member 112 Substrate stopper 114 First connecting member 115 Second connecting member 117 Hinge pin 120 Target member 200 Substrate processing apparatus 202 Load / unload unit 203 (203a, 203b) Polishing unit 204 Cleaning unit 242 1 Secondary cleaning device 243 Secondary cleaning device 244 Tertiary cleaning device 245 Fourth cleaning device

Claims (7)

保持回転部を備えた３本以上のスピンドルと、前記３本以上のスピンドルの保持回転部のうち少なくとも１つを回転させる回転機構とを具備し、前記３本以上のスピンドルの保持回転部を基板の周縁部に当接させて該基板を保持し回転させる基板保持回転機構において、
前記３本以上のスピンドルのうち少なくとも２本を搭載するベース部材と、
前記少なくとも２本のスピンドルの中間部に位置する軸部材を中心として該ベース部材を回動自在にする回動機構と、
前記ベース部材に収容された略矩形の連結部材と、
基板保持位置と退避位置との間で前記ベース部材及び前記連結部材をスライドレールに沿う直線方向に往復移動させる往復移動機構とを備え、
前記往復移動機構は、前記スライドレールにスライド移動自在に係合するスライダーを備えており、前記連結部材は、前記回動機構と前記スライダーとを連結しており、
前記ベース部材と前記連結部材との間には水平方向のクリアランスが設けられており、前記ベース部材は前記連結部材に対して、該連結部材に接触しない範囲で自在に回動可能であり、
該ベース部材が前記回動機構により回動することで、該ベース部材に搭載されたスピンドルの保持回転部による前記基板を保持する保持力が調整されるように構成したことを特徴とする基板保持回転機構。 And three or more spindles having holding and rotating parts, and a rotation mechanism for rotating at least one of the holding and rotating parts of the three or more spindles. In a substrate holding and rotating mechanism that holds and rotates the substrate in contact with the peripheral portion of
A base member on which at least two of the three or more spindles are mounted;
A rotation mechanism that allows the base member to rotate about a shaft member positioned at an intermediate portion of the at least two spindles;
A substantially rectangular connecting member housed in the base member;
A reciprocating mechanism for reciprocating the base member and the connecting member in a linear direction along the slide rail between a substrate holding position and a retracted position;
The reciprocating mechanism includes a slider that is slidably engaged with the slide rail, and the connecting member connects the rotating mechanism and the slider,
A horizontal clearance is provided between the base member and the connecting member, and the base member is freely rotatable with respect to the connecting member as long as it does not contact the connecting member.
Substrate holding, wherein the holding force for holding the substrate by the holding rotating portion of the spindle mounted on the base member is adjusted by rotating the base member by the rotating mechanism. Rotating mechanism. 請求項１に記載の基板保持回転機構において、
前記ベース部材が複数設置されていると共に、各ベース部材に前記回動機構及び／又は前記往復移動機構が設置されていることを特徴とする基板保持回転機構。 The substrate holding and rotating mechanism according to claim 1,
A substrate holding and rotating mechanism, wherein a plurality of the base members are installed, and the rotating mechanism and / or the reciprocating mechanism are installed in each base member. 一対の第１軸部材を中心にそれぞれ回転可能な一対の第１ベース部材と、
第２軸部材を中心に回転可能な第２ベース部材と、
前記一対の第１ベース部材および前記第２ベース部材に取り付けられた複数のスピンドルと、
前記複数のスピンドルにそれぞれ取り付けられ、基板を保持する複数の保持回転部と、
前記一対の第１ベース部材を前記一対の第１軸部材を中心に互いに反対方向に回転させる１つの駆動機構と、
前記複数の保持回転部のうちの少なくとも１つを回転させる回転機構と、
前記一対の第１ベース部材に設けられた少なくとも１つの基板押し出し部材とを備え、
前記一対の第１ベース部材の回転に伴って、前記複数の保持回転部のうちの少なくとも２つは基板に近接および離間する方向に移動するように構成されており、
前記一対の第１ベース部材の回転に伴って前記少なくとも２つの保持回転部が基板から離間する方向に移動するときに、前記基板押し出し部材が基板の周縁部に接触して前記基板を水平方向に移動させて前記基板の周縁部を前記複数の保持回転部から外すことを特徴とする基板保持回転機構。 A pair of first base members each rotatable about a pair of first shaft members;
A second base member rotatable about the second shaft member;
A plurality of spindles attached to the pair of first base members and the second base member;
A plurality of holding rotating parts that are respectively attached to the plurality of spindles and hold the substrate;
One drive mechanism for rotating the pair of first base members in opposite directions around the pair of first shaft members;
A rotation mechanism that rotates at least one of the plurality of holding rotation units;
And at least one substrate extrusion member provided on the pair of first base members,
Along with the rotation of the pair of first base members, at least two of the plurality of holding rotating portions are configured to move in directions toward and away from the substrate,
When the at least two holding rotating parts move in a direction away from the substrate as the pair of first base members rotate, the substrate pushing member contacts the peripheral edge of the substrate so that the substrate is moved horizontally. A substrate holding / rotating mechanism, wherein the substrate holding / rotating mechanism is moved to remove a peripheral edge of the substrate from the plurality of holding / rotating portions. 一対の第１軸部材を中心にそれぞれ回転可能な一対の第１ベース部材と、
第２軸部材を中心に回転可能な第２ベース部材と、
前記一対の第１ベース部材および前記第２ベース部材に取り付けられた複数のスピンドルと、
前記複数のスピンドルにそれぞれ取り付けられ、基板を保持する複数の保持回転部と、
前記一対の第１ベース部材を前記一対の第１軸部材を中心に互いに反対方向に回転させる１つの駆動機構と、
前記複数の保持回転部のうちの少なくとも１つを回転させる回転機構とを備え、
前記一対の第１ベース部材の回転に伴って、前記複数の保持回転部のうちの少なくとも２つは基板に近接および離間する方向に移動するように構成されており、
前記複数の保持回転部に保持された基板の周縁部の近傍に基板ストッパーを配置し、
前記基板ストッパーと前記第２ベース部材とは、前記基板の中心に関して略対称に配置されており、
前記一対の第１のベース部材を回転させて前記少なくとも２つの保持回転部を前記基板から離間する方向に移動させたときに、前記ストッパーが前記基板の水平移動を止めるように構成されていることを特徴とする基板保持回転機構。 A pair of first base members each rotatable about a pair of first shaft members;
A second base member rotatable about the second shaft member;
A plurality of spindles attached to the pair of first base members and the second base member;
A plurality of holding rotating parts that are respectively attached to the plurality of spindles and hold the substrate;
One drive mechanism for rotating the pair of first base members in opposite directions around the pair of first shaft members;
A rotation mechanism that rotates at least one of the plurality of holding rotation units,
Along with the rotation of the pair of first base members, at least two of the plurality of holding rotating portions are configured to move in directions toward and away from the substrate,
A substrate stopper is disposed in the vicinity of the peripheral edge of the substrate held by the plurality of holding rotation units,
The substrate stopper and the second base member are disposed substantially symmetrically with respect to the center of the substrate,
The stopper is configured to stop the horizontal movement of the substrate when the pair of first base members are rotated to move the at least two holding rotation portions in a direction away from the substrate. A substrate holding and rotating mechanism. 基板を保持し回転させる基板保持回転機構と、前記基板に処理液を供給する処理液供給機構と、前記基板の処理を行う基板処理部とを備え、前記基板保持回転機構で基板を保持し回転させながら、前記処理液供給機構で該基板に処理液を供給し、前記基板処理部で該基板の処理を行う基板処理装置において、
前記基板保持回転機構として、請求項１乃至４のいずれか１項に記載の基板保持回転機構を用いたことを特徴とする基板処理装置。 A substrate holding and rotating mechanism for holding and rotating the substrate; a processing liquid supply mechanism for supplying a processing liquid to the substrate; and a substrate processing unit for processing the substrate. The substrate holding and rotating mechanism holds and rotates the substrate. In the substrate processing apparatus for supplying the processing liquid to the substrate by the processing liquid supply mechanism and processing the substrate by the substrate processing unit,
5. A substrate processing apparatus using the substrate holding and rotating mechanism according to claim 1 as the substrate holding and rotating mechanism. 請求項５に記載の基板処理装置において、
前記基板処理部で処理を行う前の基板に前処理を施す基板前処理部を具備し、該基板前処理部で前記基板の前処理を行った後、前記基板処理部で該基板の後処理を行うように構成したことを特徴とする基板処理装置。 The substrate processing apparatus according to claim 5,
A substrate pre-processing unit that performs pre-processing on the substrate before processing by the substrate processing unit; and after the substrate pre-processing by the substrate pre-processing unit, the substrate processing unit performs post-processing of the substrate. A substrate processing apparatus configured to perform: 請求項６に記載の基板処理装置において、
前記基板前処理部で行う基板の前処理は該基板の研磨処理であり、前記基板処理部で行う基板の後処理は該基板の洗浄処理であることを特徴とする基板処理装置。 The substrate processing apparatus according to claim 6,
The substrate processing apparatus, wherein the substrate pretreatment performed in the substrate pretreatment unit is a polishing process of the substrate, and the substrate posttreatment performed in the substrate processing unit is a cleaning process of the substrate.
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