JP4926271B2 - Light emitting element storage package and light emitting device - Google Patents

Light emitting element storage package and light emitting device Download PDF

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JP4926271B2
JP4926271B2 JP2010224855A JP2010224855A JP4926271B2 JP 4926271 B2 JP4926271 B2 JP 4926271B2 JP 2010224855 A JP2010224855 A JP 2010224855A JP 2010224855 A JP2010224855 A JP 2010224855A JP 4926271 B2 JP4926271 B2 JP 4926271B2
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light emitting
emitting element
hole
ceramic
window frame
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JP2011003937A (en
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執蔵 中島
孝雄 厚地
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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Description

本発明は、発光ダイオード等の発光素子を収容するための発光素子収納用パッケージに関するものである。   The present invention relates to a light emitting element housing package for housing a light emitting element such as a light emitting diode.

従来、発光ダイオード等の発光素子を収容するための発光素子収納用パッケージとしてセラミック製の発光素子収納用パッケージが用いられている。   Conventionally, a ceramic light emitting element housing package is used as a light emitting element housing package for housing a light emitting element such as a light emitting diode.

従来のセラミック製の発光素子収納用パッケージは、図４に断面図で示すように、上面中央部に発光素子35を搭載するための搭載部31ａを有し、この搭載部31ａおよびその周辺から下面に導出する一対のメタライズ配線導体32を有する略四角平板状のセラミック基体31と、このセラミック基体31上面に積層され、中央部に発光素子35を収容するための貫通穴33ａを有する略四角枠状のセラミック窓枠33とから構成されており、セラミック基体31の搭載部31ａ上に導出したメタライズ配線導体32の一方に発光素子35を導電性接合材を介して固着するとともに発光素子35の電極と他方のメタライズ配線導体32とをボンディングワイヤ36を介して電気的に接続し、しかる後、セラミック窓枠33の貫通穴33ａ内に図示しない透明な封止樹脂を充填して発光素子を封止することによって発光装置となる。   As shown in a cross-sectional view of FIG. 4, the conventional ceramic light-emitting element storage package has a mounting portion 31a for mounting the light-emitting element 35 at the center of the upper surface. A substantially rectangular flat plate-like ceramic base 31 having a pair of metallized wiring conductors 32 led out to the top, and a substantially rectangular frame shape having a through hole 33a stacked on the top surface of the ceramic base 31 for accommodating the light emitting element 35 at the center. The light emitting element 35 is fixed to one of the metallized wiring conductors 32 led out on the mounting portion 31a of the ceramic base 31 via a conductive bonding material, and the electrodes of the light emitting element 35 and The other metallized wiring conductor 32 is electrically connected via a bonding wire 36, and then a transparent sealing resin (not shown) is filled in the through hole 33a of the ceramic window frame 33 to seal the light emitting element. A light emitting device by.

なお、このようなセラミック製の発光素子収納用パッケージにおいては、内部に収容する発光素子が発光する光を貫通穴33ａ内で反射させて発光装置の発光効率を良好なものとするために、貫通穴33ａの内壁にニッケルめっき層や金めっき層を表面に有するメタライズ金属層34を被着させている。   In such a ceramic light emitting element storage package, in order to improve the light emission efficiency of the light emitting device by reflecting the light emitted by the light emitting element accommodated in the inside of the through hole 33a, A metallized metal layer 34 having a nickel plating layer or a gold plating layer on its surface is deposited on the inner wall of the hole 33a.

また、このような発光素子収納用パッケージは、セラミックグリーンシート積層法により製作されており、具体的には、セラミック基体31用のセラミックグリーンシートとセラミック窓枠33用のセラミックグリーンシートとを準備するとともに、これらのセラミックグリーンシートに配線導体32を導出させるための貫通孔や発光素子35を収容するための貫通穴を略垂直に打ち抜き、次にセラミック基体31用のセラミックグリーンシートの上面から下面にかけてメタライズ配線導体32用のメタライズペーストを、セラミック窓枠33用のセラミックグリーンシートの貫通穴内壁にメタライズ金属層34用のメタライズペーストをそれぞれ従来周知のスクリーン印刷法等を採用して塗布するとともにセラミック基体31用のセラミックグリーンシートとセラミック窓枠用のセラミックグリーンシートとを上下に重ねて接着し、次にこれらを高温で焼成して焼結体となした後、メタライズ配線導体32およびメタライズ金属層34の露出表面にニッケルや金・パラジウム・白金等の金属から成るめっき金属層を無電解めっき法や電解めっき法により被着させることにより製作されている。   Further, such a light emitting element storage package is manufactured by a ceramic green sheet laminating method. Specifically, a ceramic green sheet for the ceramic substrate 31 and a ceramic green sheet for the ceramic window frame 33 are prepared. At the same time, a through-hole for leading out the wiring conductor 32 to these ceramic green sheets and a through-hole for accommodating the light emitting element 35 are punched substantially vertically, and then from the upper surface to the lower surface of the ceramic green sheet for the ceramic substrate 31. The metallized paste for the metallized wiring conductor 32 is applied to the inner wall of the through hole of the ceramic green sheet for the ceramic window frame 33, and the metallized paste for the metallized metal layer 34 is applied by using a well-known screen printing method, etc. Ceramic green sheet and ceramic for 31 After the ceramic green sheets for the window frame are stacked one on top of the other and bonded, and then sintered at a high temperature to form a sintered body, nickel or gold is exposed on the exposed surfaces of the metallized wiring conductor 32 and the metallized metal layer 34. -It is manufactured by depositing a plated metal layer made of a metal such as palladium or platinum by an electroless plating method or an electrolytic plating method.

特開平１０−２１５００１号公報JP 10-215001 A

しかしながら、この従来の発光素子収納用パッケージによると、貫通穴33ａの内壁がセラミック基体31の上面に対して略垂直になっており、そのため、貫通穴33ａの内壁で反射した光が外部に均一かつ良好に放出されず、このパッケージを用いた発光装置の発光効率がそれ程高くならないという問題点を有していた。   However, according to this conventional light emitting element storage package, the inner wall of the through hole 33a is substantially perpendicular to the upper surface of the ceramic base 31, so that the light reflected by the inner wall of the through hole 33a is uniform and external to the outside. There is a problem in that the light emission efficiency is not so high and the light emission efficiency of the light emitting device using this package is not so high.

本発明は、かかる従来の問題点に鑑み案出されたものであり、その目的は、発光素子が発光する光を、この発光素子を収容するための貫通穴の内壁で良好に反射分散させて外部に均一かつ効率良く放出し、それにより発光装置の発光効率を極めて高いものとすることが可能な発光素子収納用パッケージを提供することにある。   The present invention has been devised in view of such conventional problems, and an object of the present invention is to favorably reflect and disperse the light emitted from the light emitting element on the inner wall of the through hole for accommodating the light emitting element. It is an object of the present invention to provide a package for housing a light emitting element that can be uniformly and efficiently emitted to the outside, thereby making the light emission efficiency of the light emitting device extremely high.

従来、発光ダイオード等の発光素子を収容するための発光素子収納用パッケージとしてセラミック製の発光素子収納用パッケージが用いられている。   Conventionally, a ceramic light emitting element housing package is used as a light emitting element housing package for housing a light emitting element such as a light emitting diode.

本発明は、かかる従来の問題点に鑑み案出されたものであり、その目的は、発光素子が発光する光を、この発光素子を収容するための貫通穴の内壁で良好に反射分散させて外部に均一かつ効率良く放出し、それにより発光装置の発光効率を極めて高いものとすることが可能な発光素子収納用パッケージを提供することにある。   The present invention has been devised in view of such conventional problems, and an object of the present invention is to favorably reflect and disperse the light emitted from the light emitting element on the inner wall of the through hole for accommodating the light emitting element. It is an object of the present invention to provide a package for housing a light emitting element that can be uniformly and efficiently emitted to the outside, thereby making the light emission efficiency of the light emitting device extremely high.

本発明の一つの態様に基づく発光素子収納用パッケージは、上面に発光素子を搭載する
ための搭載部を有するセラミック基体と、該セラミック基体の上面に配設され、前記発光素子を内部に収容するための貫通穴を有した窓枠部材と、該窓枠部材の内側に位置する前記セラミック基体の上面に配設され、前記発光素子と電気的に接続される配線導体と、前記窓枠部材の前記貫通穴の内壁に被着された金属層とを備えた発光素子収納用パッケージであって、前記セラミック基体と前記窓枠部材とが焼結一体化されており、前記貫通穴の内壁が、前記窓枠部材の下面側から上面側に向かって広がっており、前記金属層の下端が、前記配線導体と離隔し、且つ前記窓枠部材の前記貫通穴の内壁の下端部まで延在していることを特徴とするものである。
A light emitting element storage package according to one aspect of the present invention has a ceramic base having a mounting portion for mounting a light emitting element on an upper surface, and is disposed on the upper surface of the ceramic base, and accommodates the light emitting element therein. A window frame member having a through-hole, a wiring conductor disposed on an upper surface of the ceramic base located inside the window frame member and electrically connected to the light emitting element, and the window frame member A light emitting element storage package comprising a metal layer deposited on the inner wall of the through hole, wherein the ceramic base and the window frame member are integrated by sintering, and the inner wall of the through hole is It spreads from the lower surface side of the window frame member toward the upper surface side, and the lower end of the metal layer is separated from the wiring conductor and extends to the lower end portion of the inner wall of the through hole of the window frame member. It is characterized by being

上記の態様に基づく発光素子収納用パッケージおよび発光装置によれば、セラミック基体と窓枠部材とが焼結一体化されており、貫通穴の内壁が、窓枠部材の下面側から上面側に向かって広がっており、金属層の下端が、配線導体と離隔し、且つ窓枠部材の貫通穴の内壁の下端部まで延在していることから、金属層を貫通穴内部に収容される発光素子の発光する光を反射分散させる反射材として良好に機能させることができる。 According to the light emitting element storage package and the light emitting device based on the above aspect, the ceramic base and the window frame member are sintered and integrated, and the inner wall of the through hole extends from the lower surface side to the upper surface side of the window frame member. The lower end of the metal layer is separated from the wiring conductor and extends to the lower end of the inner wall of the through hole of the window frame member, so that the light emitting element that accommodates the metal layer inside the through hole It can function well as a reflecting material that reflects and disperses the light emitted by.

本発明の発光素子収納用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the light emitting element storage package of this invention. 図１に示す発光素子収納用パッケージを製造するための本発明の製造方法を説明するための工程毎の断面図である。It is sectional drawing for every process for demonstrating the manufacturing method of this invention for manufacturing the light emitting element storage package shown in FIG. 本発明の製造方法におけるセラミックグリーンシートの打ち抜き方法を示す断面図である。It is sectional drawing which shows the punching method of the ceramic green sheet in the manufacturing method of this invention. 従来の発光素子収納用パッケージの断面図である。It is sectional drawing of the conventional package for light emitting element accommodation.

次に、本発明の発光素子収納用パッケージを添付の図面を基に詳細に説明する。図１は、本発明の発光素子収納用パッケージの実施形態の一例を示す断面図であり、１はセラミック基体、２はセラミック窓枠であり、主としてこれらで発光素子３を収容するための本発明の発光素子収納用パッケージが構成されている。   Next, the light emitting element storage package of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting element storage package according to the present invention. Reference numeral 1 denotes a ceramic base, and reference numeral 2 denotes a ceramic window frame. The light emitting element storage package is configured.

セラミック基体１は、例えば酸化アルミニウム質焼結体や窒化アルミニウム質焼結体・ムライト質焼結体・ガラス−セラミックス等のセラミック材料から成る略四角平板であり、発光素子３を支持するための支持体として機能し、その上面に発光素子３を搭載するための搭載部１ａを有している。   The ceramic substrate 1 is a substantially rectangular flat plate made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic, and is a support for supporting the light emitting element 3. It functions as a body and has a mounting portion 1a for mounting the light emitting element 3 on its upper surface.

また、セラミック基体１は、その搭載部１ａから下面にかけて導出するメタライズ配線
導体４ａおよび搭載部１ａの周辺から下面にかけて導出するメタライズ配線導体４ｂが被着形成されている。メタライズ配線導体４ａ・４ｂはタングステンやモリブデン・銅・銀等の金属粉末メタライズから成り、パッケージ内部に収容する発光素子３を外部に電気的に接続するための導電路として機能する。そして、メタライズ配線導体４ａの搭載部１ａ部位には発光ダイオード等の発光素子３が金−シリコン合金や銀−エポキシ樹脂等の導電性接合材により固着されるとともにメタライズ配線導体４ｂの搭載部１ａ周辺部位には発光素子３の電極がボンディングワイヤ５を介して電気的に接続される。 Further, the ceramic base 1 is formed with a metallized wiring conductor 4a derived from the mounting portion 1a to the lower surface and a metallized wiring conductor 4b derived from the periphery of the mounting portion 1a to the lower surface. The metallized wiring conductors 4a and 4b are made of metal powder metallized such as tungsten, molybdenum, copper, or silver, and function as a conductive path for electrically connecting the light emitting element 3 accommodated in the package to the outside. The light emitting element 3 such as a light emitting diode is fixed to the mounting portion 1a portion of the metallized wiring conductor 4a by a conductive bonding material such as gold-silicon alloy or silver-epoxy resin, and the periphery of the mounting portion 1a of the metallized wiring conductor 4b. The electrode of the light emitting element 3 is electrically connected to the part via the bonding wire 5.

なお、メタライズ配線導体４ａ・４ｂの露出する表面にニッケルや金等の耐蝕性に優れる金属を１〜20μｍ程度の厚みに被着させておくと、メタライズ配線導体４ａ・４ｂが酸化腐蝕するのを有効に防止することができるとともに、メタライズ配線導体４ａと発光素子３との接合およびメタライズ配線導体４ｂとボンディングワイヤ５との接合を強固なものとすることができる。したがって、メタライズ配線導体４ａ・４ｂの露出表面には、通常であれば、１〜10μｍ程度のニッケルめっき層と0.1〜３μｍ程度の金メッキ層とが電
解めっき法や無電解めっき法により順次被着されている。 If a metal having excellent corrosion resistance such as nickel or gold is applied to the exposed surface of the metallized wiring conductors 4a and 4b to a thickness of about 1 to 20 μm, the metallized wiring conductors 4a and 4b are oxidized and corroded. While being able to prevent effectively, the joining of the metallized wiring conductor 4a and the light emitting element 3 and the joining of the metallized wiring conductor 4b and the bonding wire 5 can be strengthened. Therefore, normally, a nickel plating layer of about 1 to 10 μm and a gold plating layer of about 0.1 to 3 μm are sequentially deposited on the exposed surfaces of the metallized wiring conductors 4a and 4b by an electrolytic plating method or an electroless plating method. ing.

他方、セラミック窓枠２は、セラミック基体１と実質的に同一組成のセラミック材料から成り、セラミック基体１上面に積層されて焼結一体化されている。セラミック窓枠２は、その中央部に発光素子３を収容するための略円形や略四角形の貫通穴２ａを有しており、この貫通穴２ａ内に搭載部１ａに搭載された発光素子３が収容される。   On the other hand, the ceramic window frame 2 is made of a ceramic material having substantially the same composition as that of the ceramic substrate 1 and is laminated on the upper surface of the ceramic substrate 1 and integrated by sintering. The ceramic window frame 2 has a substantially circular or substantially rectangular through hole 2a for accommodating the light emitting element 3 in the center thereof, and the light emitting element 3 mounted on the mounting portion 1a is installed in the through hole 2a. Be contained.

また、セラミック窓枠２の貫通穴２ａの内壁にはタングステンやモリブデン・銅・銀等の金属粉末メタライズから成るメタライズ金属層上にニッケルや金等のめっき金属層を被覆させて成る金属層６が略全面に被着されている。そして、この金属層６におけるめっき金属層が貫通穴２ａ内部に収容する発光素子３の発光する光を反射分散させる反射材として機能する。   Further, on the inner wall of the through hole 2a of the ceramic window frame 2, there is a metal layer 6 formed by coating a metallized metal layer made of metal powder metallized such as tungsten, molybdenum, copper, or silver on a plated metal layer such as nickel or gold. It is deposited on almost the entire surface. The plated metal layer in the metal layer 6 functions as a reflector that reflects and disperses the light emitted from the light emitting element 3 accommodated in the through hole 2a.

なお、本発明の発光素子収納用パッケージにおいては、セラミック窓枠２の貫通穴２ａ内壁がセラミック基体１の上面に対して55〜70度の角度θで外側に広がるように形成されており、この貫通穴２ａの内壁に被着された金属層６表面のめっき金属層はその中心線平均粗さＲａが１〜３μｍであり、さらに貫通穴２ａ内に収容される発光素子３が発光する光に対する反射率が80％以上となっている。このように、セラミック窓枠２の貫通穴２ａ内壁がセラミック基体１の上面に対して55〜70度の角度θで外側に広がるように形成されており、この貫通穴２ａの内壁に被着された金属層６表面のめっき金属層の中心線平均粗さが１〜３μｍであり、かつ貫通穴２ａ内に収容される発光素子３が発光する光に対する反射率が80％以上となっていることにより、貫通穴２ａ内に収容された発光素子３が発光する光を傾斜した貫通穴２ａ内壁の金属層６表面で良好に反射分散させて外部に対して均一かつ良好に放出することができ、このパッケージを使用した発光装置の発光効率を極めて高いものとすることができる。   In the light emitting element storage package of the present invention, the inner wall of the through hole 2a of the ceramic window frame 2 is formed so as to spread outward at an angle θ of 55 to 70 degrees with respect to the upper surface of the ceramic substrate 1, and this The plated metal layer on the surface of the metal layer 6 deposited on the inner wall of the through hole 2a has a center line average roughness Ra of 1 to 3 μm, and further against the light emitted by the light emitting element 3 accommodated in the through hole 2a. The reflectance is 80% or more. Thus, the inner wall of the through hole 2a of the ceramic window frame 2 is formed so as to spread outward at an angle θ of 55 to 70 degrees with respect to the upper surface of the ceramic substrate 1, and is attached to the inner wall of the through hole 2a. The center line average roughness of the plated metal layer on the surface of the metal layer 6 is 1 to 3 μm, and the reflectance with respect to the light emitted by the light emitting element 3 accommodated in the through hole 2a is 80% or more. Thus, the light emitted from the light emitting element 3 accommodated in the through hole 2a can be favorably reflected and dispersed on the surface of the metal layer 6 on the inner wall of the inclined through hole 2a and can be uniformly and satisfactorily emitted to the outside. The light emission efficiency of the light emitting device using this package can be made extremely high.

なお、セラミック窓枠２の貫通孔２ａの内壁がセラミック基体１の上面となす角度θが70度を越えると貫通穴２ａ内に収容する発光素子３が発光する光を外部に対して良好に反射することが困難となる傾向にあり、他方角度θが55度未満であると、貫通穴２ａの内壁をそのような角度で安定かつ効率良く形成することが困難となる傾向にある。したがって、セラミック窓枠２の貫通孔２ａ内壁がセラミック基体１の上面となす角度θは、55〜70度の範囲に特定される。   When the angle θ formed by the inner wall of the through hole 2a of the ceramic window frame 2 and the upper surface of the ceramic substrate 1 exceeds 70 degrees, the light emitted from the light emitting element 3 accommodated in the through hole 2a is reflected well to the outside. On the other hand, if the angle θ is less than 55 degrees, it tends to be difficult to stably and efficiently form the inner wall of the through hole 2a at such an angle. Therefore, the angle θ between the inner wall of the through hole 2a of the ceramic window frame 2 and the upper surface of the ceramic substrate 1 is specified in the range of 55 to 70 degrees.

また、貫通穴２ａの内壁に被着された金属層６表面のめっき金属層は、その中心線平均粗さＲａが１μｍ未満であると、貫通穴２ａ内に収容される発光素子３が発光する光を均一に反射分散させることができずに、反射する光の強さに偏りが発生しやすくなる傾向に
あり、他方３μｍを超えると、そのような粗い面を安定かつ効率良く形成することが困難となる傾向にある。したがって、貫通穴２ａの内壁に被着された金属層６表面のめっき金属層の中心線平均粗さＲａは、１〜３μｍの範囲に特定される。 Further, if the center line average roughness Ra of the plated metal layer on the surface of the metal layer 6 deposited on the inner wall of the through hole 2a is less than 1 μm, the light emitting element 3 accommodated in the through hole 2a emits light. Since light cannot be uniformly reflected and dispersed, the intensity of the reflected light tends to be biased. On the other hand, when the thickness exceeds 3 μm, such a rough surface can be formed stably and efficiently. It tends to be difficult. Therefore, the center line average roughness Ra of the plated metal layer on the surface of the metal layer 6 deposited on the inner wall of the through hole 2a is specified in the range of 1 to 3 μm.

さらに、貫通穴２ａの内壁に被着された金属層６表面のめっき金属層は、貫通穴２ａ内に収容される発光素子３が発光する光に対する反射率が80％未満であると、貫通穴２ａ内に収容する発光素子３が発光する光を良好に反射することが困難となる傾向にある。したがって、貫通穴２ａの内壁に被着された金属層６表面のめっき金属層は、貫通穴２ａ内に収容される発光素子３が発光する光に対する反射率が80％以上に特定される。   Furthermore, the plated metal layer on the surface of the metal layer 6 deposited on the inner wall of the through hole 2a has a reflectivity with respect to light emitted from the light emitting element 3 accommodated in the through hole 2a of less than 80%. It tends to be difficult to satisfactorily reflect the light emitted by the light emitting element 3 housed in 2a. Accordingly, the plating metal layer on the surface of the metal layer 6 deposited on the inner wall of the through hole 2a is specified to have a reflectance of 80% or more with respect to light emitted from the light emitting element 3 accommodated in the through hole 2a.

また、貫通穴２ａはその形状を略円形としておくと、貫通穴２ａ内に収容される発光素子３が発光する光を略円形の貫通穴２ａ内壁で全方向に満遍なく反射させて外部に極めて均一に放出することができる。したがって、貫通穴２ａは、その形状を略円形としておくことが好ましい。   If the shape of the through hole 2a is substantially circular, the light emitted from the light emitting element 3 accommodated in the through hole 2a is uniformly reflected in all directions by the inner wall of the substantially circular through hole 2a and is extremely uniform to the outside. Can be released. Therefore, it is preferable that the through hole 2a has a substantially circular shape.

かくして、本発明の発光素子収納用パッケージによれば、セラミック基体１の搭載部１ａ上のメタライズ配線導体４ａに発光素子３を搭載するとともに発光素子の電極とメタライズ配線導体４ｂとをボンディングワイヤ５を介して電気的に接続し、しかる後、発光素子３が収容された貫通穴２ａ内に透明な封止樹脂を充填して発光素子３を封止することによって発光装置となる。   Thus, according to the light emitting element storage package of the present invention, the light emitting element 3 is mounted on the metallized wiring conductor 4a on the mounting portion 1a of the ceramic substrate 1, and the bonding wire 5 is connected between the electrode of the light emitting element and the metallized wiring conductor 4b. Then, the light emitting device is obtained by filling the through hole 2a in which the light emitting element 3 is accommodated with a transparent sealing resin and sealing the light emitting element 3.

次に、本発明の発光素子収納用パッケージの製造方法について、添付の図面を基に説明する。図２（ａ）〜（ｄ）は図１に示した発光素子収納用パッケージを製造する製造方法を示す工程毎の断面図である。   Next, the manufacturing method of the light emitting element storage package of this invention is demonstrated based on attached drawing. 2A to 2D are cross-sectional views for each process showing a manufacturing method for manufacturing the light emitting element storage package shown in FIG.

まず、図２（ａ）に示すように、セラミック基体１用のセラミックグリーンシート11とセラミック窓枠２用のセラミックグリーンシート12とを準備する。   First, as shown in FIG. 2A, a ceramic green sheet 11 for the ceramic substrate 1 and a ceramic green sheet 12 for the ceramic window frame 2 are prepared.

このようなセラミックグリーンシート11・12は、例えばセラミック基体１およびセラミック窓枠２が酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウム・酸化珪素・酸化カルシウム・酸化マグネシウム等のセラミック原料粉末に適当な有機バインダーおよび溶剤・可塑剤・分散剤等を添加混合して泥漿状となすとともにこれを公知のドクターブレード法等のシート成形技術を採用して所定厚みのシート状とすることにより製作される。   Such ceramic green sheets 11 and 12 are made of ceramic raw material powder such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide if the ceramic substrate 1 and the ceramic window frame 2 are made of an aluminum oxide sintered body. A suitable organic binder and solvent / plasticizer / dispersant are added and mixed to make a slurry, and this is made by using a sheet forming technique such as a known doctor blade method to form a sheet with a predetermined thickness. Is done.

次に、図２（ｂ）に示すように、セラミック基体１用のセラミックグリーンシート11にメタライズ配線導体４ａ・４ｂをセラミック基体１の上面から下面に導出させるための導出路となる貫通孔11ａを打ち抜き金型を用いて打ち抜くとともに、セラミック窓枠２用のセラミックグリーンシート12に貫通穴２ａ用の貫通穴12ａを打ち抜き金型を用いて打ち抜く。   Next, as shown in FIG. 2 (b), through holes 11 a serving as lead-out paths for leading the metallized wiring conductors 4 a and 4 b from the upper surface to the lower surface of the ceramic substrate 1 are formed in the ceramic green sheet 11 for the ceramic substrate 1. Punching is performed using a punching die, and a through hole 12a for the through hole 2a is punched into the ceramic green sheet 12 for the ceramic window frame 2 using the punching die.

このとき、セラミック窓枠２用のセラミックグリーンシート12に形成される貫通穴12ａの内壁がセラミックグリーンシート12の一方の主面から他方の主面に向けて55〜70度の角度θで広がるように形成する。このように貫通穴12ａの内壁がセラミックグリーンシート12の一方の主面から他方の主面に向けて55〜70度の角度θで広がるように形成することにより、セラミック窓枠２の貫通穴２ａ内壁がセラミック基体１の上面に対して55〜70度の角度θで外側に広がるように形成することができる。   At this time, the inner wall of the through hole 12a formed in the ceramic green sheet 12 for the ceramic window frame 2 spreads from one main surface of the ceramic green sheet 12 to the other main surface at an angle θ of 55 to 70 degrees. To form. In this way, by forming the inner wall of the through hole 12a so as to spread at an angle θ of 55 to 70 degrees from one main surface of the ceramic green sheet 12 to the other main surface, the through hole 2a of the ceramic window frame 2 is formed. The inner wall can be formed to spread outward at an angle θ of 55 to 70 degrees with respect to the upper surface of the ceramic substrate 1.

このように貫通穴12ａの内壁がセラミックグリーンシート12の一方の主面から他方の主面に向けて55〜70度の角度θで広がるように形成するには、図３に貫通穴12の打ち抜き方
法を説明するための断面図で示すように、打ち抜き金型のパンチ21とダイス22との間のクリアランスＣを広く設定すればよい。例えばセラミックグリーンシート12の厚みが0.5ｍ
ｍ程度の場合であれば、金型のクリアランスＣを0.2〜0.5ｍｍ程度とすればよい。そうすることにより角度θを55〜70度とすることができる。なお、角度θが55度未満であると、貫通穴12ａの内壁をそのような角度θで安定かつ効率良く形成することが困難となる傾向にある。 In order to form the inner wall of the through hole 12a so as to spread at an angle θ of 55 to 70 degrees from one main surface of the ceramic green sheet 12 to the other main surface in this way, FIG. As shown in the cross-sectional view for explaining the method, the clearance C between the punch 21 and the die 22 of the punching die may be set wide. For example, the thickness of the ceramic green sheet 12 is 0.5m
In the case of about m, the mold clearance C may be about 0.2 to 0.5 mm. By doing so, the angle θ can be set to 55 to 70 degrees. If the angle θ is less than 55 degrees, it tends to be difficult to stably and efficiently form the inner wall of the through hole 12a at such an angle θ.

また、このように打ち抜き金型のクリアランスＣを広く設定してセラミックグリーンシート12を打ち抜くことにより貫通穴12ａの内壁の粗度が極めて大きなものとなる。そして、これにより得られる発光素子収納用パッケージの貫通穴２ａ内壁の中心線平均粗さＲａが４〜10μｍ程度の極めて粗いものとなり、それによりこの貫通穴２ａ内壁に被着された金属層６の中心線平均粗さＲａを１〜３μｍ程度の粗いものとすることが可能となる。   Moreover, the roughness of the inner wall of the through hole 12a becomes extremely large by punching the ceramic green sheet 12 with the clearance C of the punching die set wide as described above. Then, the center line average roughness Ra of the inner wall of the through hole 2a of the light emitting element storage package obtained thereby becomes extremely rough, about 4 to 10 μm, thereby the metal layer 6 deposited on the inner wall of the through hole 2a. The center line average roughness Ra can be made as rough as about 1 to 3 μm.

次に、図２（ｃ）に示すように、セラミック基体１用のセラミックグリーンシート11の上下面および貫通孔11ａ内にメタライズ配線導体４ａ・４ｂ用のメタライズペースト14ａ・14ｂをスクリーン印刷法を採用して所定のパターンに印刷塗布するとともに、セラミック窓枠２用のセラミックグリーンシート12の貫通穴12ａ内壁に金属層６用のメタライズペースト16を同じくスクリーン印刷法を採用して印刷塗布する。なお、貫通孔11ａ内や貫通穴12ａの内壁にメタライズペースト14ａ・14ｂや16を塗布する際は、印刷面の反対側からメタライズペースト14ａ・14ｂや16を吸引しながら印刷する方法が採用される。このとき、メタライズペースト16の粘度を30〜200Ｐａ・Ｓ程度としておくとともに厚みが10〜25
μｍ程度となるように印刷することにより、発光素子収納用パッケージの金属層６表面の中心線平均粗さＲａを１〜３μｍ程度とすることが可能となる。 Next, as shown in FIG. 2C, metallized pastes 14a and 14b for the metallized wiring conductors 4a and 4b are applied to the upper and lower surfaces of the ceramic green sheet 11 for the ceramic substrate 1 and the through holes 11a by screen printing. Then, a predetermined pattern is printed and applied, and the metallized paste 16 for the metal layer 6 is also printed and applied to the inner wall of the through hole 12a of the ceramic green sheet 12 for the ceramic window frame 2 by the same screen printing method. In addition, when applying the metallized pastes 14a, 14b and 16 in the through holes 11a and the inner walls of the through holes 12a, a method of printing while sucking the metallized pastes 14a, 14b and 16 from the opposite side of the printing surface is adopted. . At this time, the metallized paste 16 has a viscosity of about 30 to 200 Pa · S and a thickness of 10 to 25.
By printing so as to be about μm, the center line average roughness Ra of the surface of the metal layer 6 of the light emitting element storage package can be set to about 1 to 3 μm.

次に、図２（ｄ）に示すように、セラミック基体１用のセラミックグリーンシート11の上面にセラミック窓枠２用のセラミックグリーンシート12を貫通穴12ａの内壁がセラミックグリーンシート11の上面に対して外側に広がる向きに接着する。このような接着はセラミックグリーンシート12の下面に有機バインダーおよび溶剤を含む接着剤を塗布するとともにこのセラミックグリーンシート12をセラミックグリーンシート11の上面に重ねてこれらを約40〜60℃の温度で加熱しながら２〜６ＭＰａの圧力で圧着する方法が採用される。   Next, as shown in FIG. 2 (d), the ceramic green sheet 12 for the ceramic window frame 2 is placed on the upper surface of the ceramic green sheet 11 for the ceramic substrate 1, and the inner wall of the through hole 12 a is against the upper surface of the ceramic green sheet 11. Adhere in a direction that spreads outward. For such bonding, an adhesive containing an organic binder and a solvent is applied to the lower surface of the ceramic green sheet 12, and the ceramic green sheet 12 is stacked on the upper surface of the ceramic green sheet 11 and heated at a temperature of about 40 to 60 ° C. However, a method of pressure bonding at a pressure of 2 to 6 MPa is employed.

そして最後に、積層されたセラミックグリーンシート11・12およびこれらに塗布されたメタライズペースト14・6を高温で焼成することによってセラミック基体１とセラミック
窓枠２とが焼結一体化された焼結体を得るとともに、この焼結体の導電部の露出面に電解めっき法や無電解めっき法によりニッケルや金・白金・パラジウム等のめっき金属層を被着させることにより図１に示した発光素子収納用パッケージが完成する。 Finally, the sintered ceramic body 1 and the ceramic window frame 2 are sintered and integrated by firing the laminated ceramic green sheets 11 and 12 and the metallized paste 14 and 6 applied thereto at a high temperature. 1 and by depositing a plated metal layer of nickel, gold, platinum, palladium, or the like on the exposed surface of the conductive portion of the sintered body by an electrolytic plating method or an electroless plating method. The package for is completed.

なお、このとき、金属層６は、その表面のめっき金属層上における中心線平均粗さＲａを１〜３μｍとしておくとともに発光素子３が発光する光に対するめっき金属層の反射率を80％以上としておく。金属層６表面のめっき金属層の中心線平均粗さＲａを１〜３μｍとするとともに発光素子３が発光する光に対するめっき金属層の反射率を80％以上とするには、金属層６におけるメタライズ金属層の中心線平均粗さＲａを３〜６μｍとしておくとともにこのメタライズ金属層の表面に１〜13μｍの厚みのめっき金属層を被着させればよい。   At this time, the metal layer 6 has a center line average roughness Ra on the plated metal layer on the surface of 1 to 3 μm, and the reflectance of the plated metal layer with respect to light emitted from the light emitting element 3 is 80% or more. deep. In order to set the center line average roughness Ra of the plated metal layer on the surface of the metal layer 6 to 1 to 3 μm and to set the reflectance of the plated metal layer with respect to the light emitted from the light emitting element 3 to 80% or more, the metallization in the metal layer 6 is performed. The center line average roughness Ra of the metal layer is set to 3 to 6 μm, and a plated metal layer having a thickness of 1 to 13 μm may be deposited on the surface of the metallized metal layer.

かくして本発明の発光素子収納用パッケージによれば、発光素子３を収容するための貫通穴２ａの内壁がセラミック基体１の上面に対して55〜70度の角度で外側に広がっているとともにこの内壁の表面に中心線平均粗さＲａが１〜３μｍでかつ発光素子３が発光する光に対する反射率が80％以上の金属層が被着された本発明の発光素子収納用パッケージを得ることができる。   Thus, according to the light emitting element storage package of the present invention, the inner wall of the through hole 2a for accommodating the light emitting element 3 extends outward at an angle of 55 to 70 degrees with respect to the upper surface of the ceramic substrate 1, and this inner wall. The light emitting element storage package of the present invention can be obtained in which a metal layer having a center line average roughness Ra of 1 to 3 μm and a reflectance of 80% or more with respect to light emitted from the light emitting element 3 is deposited on the surface of the light emitting element. .

なお、本発明は、上述の実施の形態例に限定されるものではなく、種々の変更が可能であることは言うまでもない。   Needless to say, the present invention is not limited to the above-described embodiments, and various modifications can be made.

１・・・・セラミック基体
１ａ・・・搭載部
２・・・・セラミック窓枠
２ａ・・・発光素子３を収容するための貫通穴
３・・・・発光素子
６・・・・金属層
11・・・・セラミック基体１用のセラミックグリーンシート
12・・・・セラミック窓枠２用のセラミックグリーンシート
12ａ・・・貫通穴２ａ用の貫通穴
16・・・・メタライズペースト
DESCRIPTION OF SYMBOLS 1 ... Ceramic base 1a ... Mounting part 2 ... Ceramic window frame 2a ... Through-hole 3 for accommodating the light emitting element 3 ... Light emitting element 6 ... Metal layer
11. Ceramic green sheet for ceramic substrate 1
12 ・ ・ ・ ・ Ceramic green sheet for ceramic window frame 2
12a ... Through hole for through hole 2a
16 ... Metalized paste

Claims (5)

上面に発光素子を搭載するための搭載部を有するセラミック基体と、
該セラミック基体の上面に配設され、前記発光素子を内部に収容するための貫通穴を有した窓枠部材と、
該窓枠部材の内側に位置する前記セラミック基体の上面に配設され、前記発光素子と電気的に接続される配線導体と、
前記窓枠部材の前記貫通穴の内壁に被着された金属層とを備えた発光素子収納用パッケージであって、
前記セラミック基体と前記窓枠部材とが焼結一体化されており、
前記貫通穴の内壁が、前記窓枠部材の下面側から上面側に向かって広がっており、
前記金属層の下端が、前記配線導体と離隔し、且つ前記窓枠部材の前記貫通穴の内壁の下端部まで延在していることを特徴とする発光素子収納用パッケージ。 A ceramic substrate having a mounting portion for mounting the light emitting element on the upper surface;
A window frame member disposed on an upper surface of the ceramic substrate and having a through hole for accommodating the light emitting element therein;
A wiring conductor disposed on an upper surface of the ceramic base located inside the window frame member and electrically connected to the light emitting element;
A light emitting element storage package comprising a metal layer attached to an inner wall of the through hole of the window frame member,
The ceramic base and the window frame member are integrally sintered.
The inner wall of the through hole extends from the lower surface side of the window frame member toward the upper surface side,
A light emitting element storage package, wherein a lower end of the metal layer is separated from the wiring conductor and extends to a lower end portion of an inner wall of the through hole of the window frame member . 前記金属層は、前記窓枠部材の前記貫通穴の内壁の略全面に被着されていることを特徴とする請求項１に記載の発光素子収納用パッケージ。   The light emitting element storage package according to claim 1, wherein the metal layer is attached to substantially the entire inner wall of the through hole of the window frame member. 前記配線導体は、前記搭載部または前記搭載部の周辺から前記セラミック基体の下面にかけて導出されていることを特徴とする請求項１に記載の発光素子収納用パッケージ。   The light-emitting element storage package according to claim 1, wherein the wiring conductor is led out from the mounting portion or a periphery of the mounting portion to a lower surface of the ceramic base. 前記貫通穴内壁は、その表面の中心線平均粗さＲａが４〜１０μｍであり、前記金属層は、その表面に中心線平均粗さＲａが、１〜３μｍであって前記貫通穴内壁の表面の中心線平均粗さよりも小さいことを特徴とする請求項１に記載の発光素子収納用パッケージ。   The inner wall of the through hole has a center line average roughness Ra of 4 to 10 μm, and the metal layer has a center line average roughness Ra of 1 to 3 μm on the surface thereof, and the surface of the inner wall of the through hole The light emitting element storage package according to claim 1, wherein the package is smaller than the center line average roughness. 請求項１乃至請求項４のいずれかに記載の発光素子収納用パッケージと、該発光素子収納用パッケージの前記搭載部に搭載されているとともに前記配線導体に電気的に接続された発光素子とを具備していることを特徴とする発光装置。   The light emitting element storage package according to any one of claims 1 to 4, and a light emitting element mounted on the mounting portion of the light emitting element storage package and electrically connected to the wiring conductor. A light emitting device comprising the light emitting device.
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