JP4920288B2 - 電子部品の回路基板への取付構造及び取付方法 - Google Patents
電子部品の回路基板への取付構造及び取付方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 17
- 229920005989 resin Polymers 0.000 claims description 66
- 239000011347 resin Substances 0.000 claims description 66
- 238000000465 moulding Methods 0.000 claims description 46
- 229920003002 synthetic resin Polymers 0.000 claims description 21
- 239000000057 synthetic resin Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 238000001746 injection moulding Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 description 72
- 239000010408 film Substances 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 18
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 239000004697 Polyetherimide Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920001601 polyetherimide Polymers 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14983—Bursting or breakthrough of the insert by the injection pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
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- H01L27/144—Devices controlled by radiation
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- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
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- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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Description
〔第1実施形態〕
図1乃至図4は本発明の第1実施形態にかかる電子部品の回路基板への取付構造を示す図であり、図1は上側から見た斜視図、図2は下側から見た斜視図、図3は平面図、図4は概略側断面図(図3のA−A断面図)である。これらの図に示すように、この電子部品の回路基板への取付構造は、一対の端子接続パターン11,13を形成した回路基板(以下この実施形態では「フレキシブル回路基板」という)10と、一対の端子(以下この実施形態では「電極」という)51,53を設けてなる電子部品(以下この実施形態では「発光部品」という)50とを具備し、フレキシブル回路基板10上に発光部品50を載置するとともに、発光部品50及びこの発光部品50が載置されたフレキシブル回路基板10の周囲部分を覆って射出成形による合成樹脂製のケース80を取り付け、これによって発光部品50の電極51,53とフレキシブル回路基板10の端子接続パターン11,13とを当接させて接続する構造となっている。以下各構成部品の形状・構造・材質について、その製造方法と共に説明する。
図12は本発明の第2参考例にかかる電子部品の回路基板への取付構造の製造方法説明図であり、上記実施形態の図7に相当する図面である。同図において、前記図1〜図11に示す実施形態と同一又は相当部分には同一符号を付す(以下の他の参考例においても同様)。なお以下で説明する事項以外の事項については、前記図1〜図11に示す実施形態と同じである(以下の他の参考例においても同様)。この参考例において前記図1〜図11に示す実施形態と相違する点は、スリット17,19の形状を変更することで、両スリット17,19の対向する内側部分に舌片状の側面当接部21,23のみを設け、前記図1〜図11に示す実施形態のように、両スリット17,19の対向する外側部分に基板固定部を形成しなかった点のみである。このように構成すると、基板固定部による作用・効果は生じないが、前記図1〜図11に示す実施形態で説明したその他の全ての作用・効果は同様に生じる。
図13は本発明の第3参考例にかかる電子部品の回路基板への取付構造の製造方法説明図であり、上記実施形態の図7に相当する図面である。この参考例において前記図1〜図11に示す実施形態と相違する点は、スリット17,19の形状を変更することで、両スリット17,19の対向する外側部分に舌片状の基板固定部25,27のみを設け、前記図1〜図11に示す実施形態のように、両スリット17,19の対向する内側部分に側面当接部を形成しなかった点のみである。このように構成すると、側面当接部による作用・効果は生じないが、前記図1〜図11に示す実施形態で説明したその他の全ての作用・効果は同様に生じる。
図14は本発明の第4参考例にかかる電子部品の回路基板への取付構造の製造方法説明図であり、上記実施形態の図7に相当する図面である。この参考例において前記図1〜図11に示す実施形態と相違する点は、スリット17,19の代りにスリット17,19を設けていた部分に矩形状の上下に貫通する開口20a,20bを設けた点のみである。このように構成すると、前記図1〜図11に示す実施形態のような側面当接部と基板固定部とによる作用・効果は生じないが、前記図1〜図11に示す実施形態で説明したその他の全ての作用・効果は同様に生じる。
図15は本発明の第5実施形態にかかる電子部品の回路基板への取付構造の製造方法説明図(斜視図)であり、それに用いるフレキシブル回路基板10と発光部品50とを示している。この実施形態において前記図1〜図11に示す実施形態と相違する点は、発光部品50に設ける電極51−1,51−2,53−1,53−2を基部55の4隅の4ヶ所とし、これに対応してフレキシブル回路基板10に形成する端子接続パターン11−1,11−2,13−1,13−2も4ヶ所形成した点のみである。このように構成することで例え発光部品50の電極の数や位置が変動しても、これに容易に対応することができる。なおこの実施形態の場合、前記図1〜図11に示す実施形態で説明した全ての作用・効果を同様に生じる。
図16乃至図18は本発明の第6参考例にかかる電子部品の回路基板への取付構造を示す図であり、図16は回路基板(以下この実施形態では「フレキシブル回路基板」という)110を一方の側(正面側)から見た斜視図、図17は他方の側(裏面側)から見た斜視図、図18(a)は正面図、図18(b)は概略側断面図(図18(c)のB−B断面図)、図18(c)は裏面図である。これらの図に示すように、この電子部品の回路基板への取付構造は、一対の端子接続パターン111,113(図19参照)を形成したフレキシブル回路基板110と、一対の端子(以下この参考例では「端子板」という)151,153(図21参照)を設けてなる電子部品(以下この実施形態では「検出スイッチ」という)150とを具備し、フレキシブル回路基板110上に検出スイッチ150を載置するとともに、検出スイッチ150及びこの検出スイッチ150が載置されたフレキシブル回路基板110の周囲部分を覆って射出成形による合成樹脂製のケース180を取り付け、これによって検出スイッチ150から突出した端子板151,153とフレキシブル回路基板110の端子接続パターン111,113とを当接させて接続する構造となっている。以下各構成部品の形状・構造・材質について、その製造方法と共に説明する。
11,13 端子接続パターン
17,19 スリット
21,23 基板折り曲げ部(側面当接部)
25,27 基板固定部
29,31 開口
50 発光部品(電子部品)
51,53 電極(端子)
61 発光部
80 ケース
P1 第1金型(金型)
P13 部品当接部
P2 第2金型(金型)
P22 樹脂注入口
C1 キャビティー
110 フレキシブル回路基板(回路基板)
111,113 端子接続パターン
129 開口
150 検出スイッチ(電子部品)
151,153 端子板(端子)
155,157 押え板
180 ケース
180A 第1ケース部
180B 第2ケース部
181 位置決め部
P101 第1金型(金型)
P102 第2金型(金型)
P105 押圧部
P107 押圧部
P108 押え部
P109 押え部
C101 キャビティー
T1 当接部
T2 当接部
Claims (5)
- 端子接続パターンを形成したフレキシブル回路基板と、表面上に端子を形成してなる電子部品とを具備し、
前記フレキシブル回路基板上に電子部品を載置するとともに、前記電子部品を載置した前記フレキシブル回路基板の周囲に設けた開口を介して、フレキシブル回路基板の上下に亘って、電子部品及びこの電子部品が載置されたフレキシブル回路基板の周囲部分を覆う合成樹脂製のケースを一体成形によって取り付け、これによって電子部品の端子とフレキシブル回路基板の端子接続パターンとを当接させて接続し、
さらに前記フレキシブル回路基板の開口の周囲部分には、電子部品の側面に向けて折り曲げた状態で前記ケースに埋設される基板折り曲げ部と、電子部品を載置した面側に折り曲げた状態でケース内に埋設される基板固定部とを設けたことを特徴とする電子部品の回路基板への取付構造。 - 前記電子部品の下面に設けた端子のみが、前記フレキシブル回路基板の端子接続パターンに当接して接続していることを特徴とする請求項1に記載の電子部品の回路基板への取付構造。
- 前記電子部品は発光部を有する発光部品であり、前記ケースは前記発光部を露出した状態で成形されていることを特徴とする請求項1又は2に記載の電子部品の回路基板への取付構造。
- 端子接続パターンを形成したフレキシブル回路基板と、表面上に端子を形成してなる電子部品とを用意し、
前記フレキシブル回路基板上に電子部品を載置する工程と、前記フレキシブル回路基板及び電子部品を金型内に設置する工程と、前記金型の電子部品及びこの電子部品が載置されたフレキシブル回路基板の周囲部分を囲むように形成されるケースの形状を有するキャビティー内に溶融成形樹脂を射出成形する工程と、前記溶融成形樹脂が固化した後に前記金型を取り外す工程とによって、電子部品の端子とフレキシブル回路基板の端子接続パターンとを当接させて接続する電子部品の回路基板への取付方法であって、
前記電子部品を載置する前記フレキシブル回路基板の周囲部分に予めスリットを形成しておき、
前記金型内に設置される電子部品は、フレキシブル回路基板に載置する面の反対側の面を金型の内面に当接し、
前記溶融成形樹脂を電子部品を載置した前記フレキシブル回路基板の反対側の面に向けて射出することで、フレキシブル回路基板を電子部品に押し付けながら、前記スリット周囲部分のフレキシブル回路基板を電子部品を載置した面側に向けて押し広げて開口を形成しながらこの開口を通してフレキシブル回路基板の上下に亘って前記ケースを成形し、その際同時にフレキシブル回路基板の開口の周囲部分に、電子部品の側面に向けて折り曲げた状態で前記ケースに埋設される基板折り曲げ部と、電子部品を載置した面側に折り曲げた状態でケース内に埋設される基板固定部とを形成したことを特徴とする電子部品の回路基板への取付方法。 - 前記電子部品は発光部を有する発光部品であり、前記溶融成形樹脂を前記フレキシブル回路基板の電子部品を載置した裏面に向けて射出する際に、この発光部の面を金型の内面に当接しておくことで、この発光部をケースの表面に露出させることを特徴とする請求項4に記載の電子部品の回路基板への取付方法。
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JP2006104285A JP4920288B2 (ja) | 2005-12-23 | 2006-04-05 | 電子部品の回路基板への取付構造及び取付方法 |
CN2006800479486A CN101341805B (zh) | 2005-12-23 | 2006-12-19 | 电子部件向电路基板安装的安装结构及安装方法 |
PCT/JP2006/325252 WO2007072812A1 (ja) | 2005-12-23 | 2006-12-19 | 電子部品の回路基板への取付構造及び取付方法 |
US12/158,904 US8053684B2 (en) | 2005-12-23 | 2006-12-19 | Mounting structure and method for mounting electronic component onto circuit board |
TW095148361A TWI388255B (zh) | 2005-12-23 | 2006-12-22 | 電子零件對電路基板之安裝構造及安裝方法 |
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