JP4914697B2 - 互いに平行に接続されたコンデンサを有するパワー半導体モジュール - Google Patents
互いに平行に接続されたコンデンサを有するパワー半導体モジュール Download PDFInfo
- Publication number
- JP4914697B2 JP4914697B2 JP2006314274A JP2006314274A JP4914697B2 JP 4914697 B2 JP4914697 B2 JP 4914697B2 JP 2006314274 A JP2006314274 A JP 2006314274A JP 2006314274 A JP2006314274 A JP 2006314274A JP 4914697 B2 JP4914697 B2 JP 4914697B2
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- semiconductor module
- pressing
- pressure receiving
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 37
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 238000003825 pressing Methods 0.000 claims abstract description 63
- 238000001816 cooling Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002984 plastic foam Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
- H01R25/161—Details
- H01R25/162—Electrical connections between or with rails or bus-bars
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
- Measuring Fluid Pressure (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Power Conversion In General (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
12 (10の)コンデンサ
14 (12に関して10の)第1のバスバー
16 (12に関して10の)第2のバスバー
18 (14と16との間に設けられた)絶縁素子
20 (12の)第1の接続要素
22 (12の)第2の接続要素
24 (12に関して10の)押圧装置
26 (24の)押圧体
28 (24の)受圧体
30 (24の)ねじ要素
32 (10の)冷却体
34 (20に関して26の)押圧要素
36 (22に関して28の)押圧部
38 (34に関して26の)第1のアーム
40 (42に関して26の)第2のアーム
42 (40に設けられた)押圧機構
44 (36の)溝
46 (28の)主面
48 (44に設けられた)弾性要素
50 (52に関して26の)保持機構
52 (12に関して50に設けられた)クッション要素
54 (12に関して28の)配置要素
58 (54の)リブの輪郭
Claims (8)
- 互いに平行に接続されたコンデンサ(12)を有するパワー半導体モジュールであって、前記コンデンサの第1の接続要素(20)が第1のバスバー(14)に接触し、前記コンデンサの第2の接続要素(22)が第2のバスバー(16)に接触し、前記第1のバスバー(14)と前記第2のバスバー(16)との間に絶縁素子(18)が設けられ、かつ当該絶縁素子を押圧装置(24)が備えるパワー半導体モジュールであって、
前記押圧装置(24)が、少なくとも1つの押圧体(26)と、割り当てられた受圧体(28)とを備え、前記押圧装置(24)によって、前記第1および第2の接続要素(20と22)が前記割り当てられたバスバー(14、16)と共に圧力を加えられて、電気的に接触させられ、
前記第1の接続要素(20)に圧力を加えるための前記少なくとも1つの押圧体(26)が、弾性的に形成されたアーム(38)を備え、かつ前記割り当てられた受圧体(28)が固定して形成されること、および
前記第2の接続要素(22)に圧力を加えるための前記少なくとも1つの押圧体(26)が、固定して形成された第2のアーム(40)を備え、かつ前記割り当てられた受圧体(28)が、弾性的に形成された部分(36、48)を備えることを特徴とするパワー半導体モジュール。 - 前記受圧体(28)の前記弾性的に形成された部分が任意のベースとして形成されることを特徴とする請求項1に記載のパワー半導体モジュール。
- 前記第1および第2のアーム(38と40)が密接して設けられ、かつ前記押圧体(26)から平行に突出することを特徴とする請求項2に記載のパワー半導体モジュール。
- 前記第1および第2のアーム(38と40)が前記押圧体(26)から同じ長さで突出することを特徴とする請求項2に記載のパワー半導体モジュール。
- 前記受圧体(28)の前記弾性的に形成された部分(36、48)が、前記少なくとも1つの押圧体(26)の前記第2のアーム(40)と完全に一致して設けられることを特徴とする請求項1に記載のパワー半導体モジュール。
- 前記コンデンサ(12)が、前記押圧装置(24)の前記押圧体(26)と前記受圧体(28)との間で画定してしなやかに固定されることを特徴とする請求項1〜5のいずれか一項に記載のパワー半導体モジュール。
- 前記押圧体(26)から、前記第1および第2のバスバー(14、16)に対して平行に配向された縦長の保持機構(50)が突出し、該保持機構がクッション要素(52)を備えること、および
前記受圧体(28)に前記コンデンサ(12)用の配置要素(54)が形成されることを特徴とする請求項6に記載のパワー半導体モジュール。 - 前記コンデンサ(12)が、前記第1および第2のバスバー(14、16)に互いに平行に並んで一列に配置され、少なくとも、前記第1および第2のバスバー(14、16)のほぼ平面に位置することを特徴とする請求項1〜7のいずれか一項に記載のパワー半導体モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005055608A DE102005055608B3 (de) | 2005-11-22 | 2005-11-22 | Leistungshalbleitermodul mit zueinander parallel geschalteten Kondensatoren |
DE102005055608.6 | 2005-11-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007142438A JP2007142438A (ja) | 2007-06-07 |
JP4914697B2 true JP4914697B2 (ja) | 2012-04-11 |
Family
ID=37763871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006314274A Expired - Fee Related JP4914697B2 (ja) | 2005-11-22 | 2006-11-21 | 互いに平行に接続されたコンデンサを有するパワー半導体モジュール |
Country Status (7)
Country | Link |
---|---|
US (1) | US7613008B2 (ja) |
EP (1) | EP1788625B1 (ja) |
JP (1) | JP4914697B2 (ja) |
AT (1) | ATE470238T1 (ja) |
DE (2) | DE102005055608B3 (ja) |
DK (1) | DK1788625T3 (ja) |
ES (1) | ES2345349T3 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009046403B4 (de) | 2009-11-04 | 2015-05-28 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul in Druckkontakttechnik |
DE102012202539A1 (de) * | 2012-02-20 | 2013-08-22 | Siemens Aktiengesellschaft | Montagebaugruppe für elektrische oder elektronische Bauelemente |
DE102013209431B4 (de) | 2013-05-22 | 2018-04-05 | Siemens Aktiengesellschaft | Leistungshalbleitermodul |
DE102013209444A1 (de) | 2013-05-22 | 2014-11-27 | Siemens Aktiengesellschaft | Leistungshalbleitermodul, Verfahren zum Betrieb eines Leistungshalbleitermoduls und Verfahren zur Herstellung eines Leistungshalbleitermoduls |
DE102014208594A1 (de) * | 2014-05-08 | 2015-11-12 | Zf Friedrichshafen Ag | Leistungselektronikanordnung |
DE102016100617B4 (de) * | 2016-01-15 | 2019-05-16 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Gehäuse und einem Kondensator |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4111401A1 (de) * | 1991-04-09 | 1992-10-15 | Abb Patent Gmbh | Kondensationsanordnung |
DE9403108U1 (de) * | 1994-02-24 | 1994-04-14 | Siemens AG, 80333 München | Niederinduktive Hochstromverschienung für Stromrichtermodule |
JP3228021B2 (ja) * | 1994-09-13 | 2001-11-12 | 富士電機株式会社 | インバータユニット及びインバータ装置 |
DE19519538A1 (de) * | 1995-05-27 | 1996-11-28 | Export Contor Ausenhandelsgese | Induktivitätsarme Schaltungsanordnung |
JPH098224A (ja) * | 1995-06-23 | 1997-01-10 | Hitachi Ltd | 半導体モジュールと電力変換装置 |
EP0782216B1 (en) * | 1995-12-14 | 2002-04-17 | Sumitomo Wiring Systems, Ltd. | An electrical connection box, a connection construction, a bus bar fixing construction and a connection terminal |
FR2777109B1 (fr) * | 1998-04-06 | 2000-08-04 | Gec Alsthom Transport Sa | Batterie de condensateurs, dispositif electronique de puissance comportant une telle batterie et ensemble electronique de puissance comportant un tel dispositif |
DE19847029A1 (de) * | 1998-10-13 | 2000-04-27 | Semikron Elektronik Gmbh | Umrichter mit niederinduktivem Kondensator im Zwischenkreis |
JP4044265B2 (ja) * | 2000-05-16 | 2008-02-06 | 三菱電機株式会社 | パワーモジュール |
DE10057140A1 (de) * | 2000-11-17 | 2002-06-06 | Siemens Ag | Hochstromverbindung |
JP4770083B2 (ja) * | 2001-08-03 | 2011-09-07 | 日産自動車株式会社 | 電力変換装置 |
DE10306643B4 (de) * | 2003-02-18 | 2005-08-25 | Semikron Elektronik Gmbh | Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul |
JP2007281127A (ja) * | 2006-04-05 | 2007-10-25 | Shindengen Electric Mfg Co Ltd | コンデンサを備える回路装置及びコンデンサモジュール |
-
2005
- 2005-11-22 DE DE102005055608A patent/DE102005055608B3/de not_active Expired - Fee Related
-
2006
- 2006-11-06 ES ES06023026T patent/ES2345349T3/es active Active
- 2006-11-06 DK DK06023026.5T patent/DK1788625T3/da active
- 2006-11-06 AT AT06023026T patent/ATE470238T1/de active
- 2006-11-06 DE DE502006007077T patent/DE502006007077D1/de active Active
- 2006-11-06 EP EP06023026A patent/EP1788625B1/de not_active Not-in-force
- 2006-11-21 JP JP2006314274A patent/JP4914697B2/ja not_active Expired - Fee Related
- 2006-11-22 US US11/603,606 patent/US7613008B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DK1788625T3 (da) | 2010-09-20 |
ATE470238T1 (de) | 2010-06-15 |
EP1788625A1 (de) | 2007-05-23 |
US7613008B2 (en) | 2009-11-03 |
DE102005055608B3 (de) | 2007-05-10 |
JP2007142438A (ja) | 2007-06-07 |
ES2345349T3 (es) | 2010-09-21 |
DE502006007077D1 (de) | 2010-07-15 |
US20070117421A1 (en) | 2007-05-24 |
EP1788625B1 (de) | 2010-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4914697B2 (ja) | 互いに平行に接続されたコンデンサを有するパワー半導体モジュール | |
KR101688663B1 (ko) | 전력 반도체 모듈 | |
JP5108586B2 (ja) | 電力半導体モジュール及びプリント回路基板の配置、及び電力半導体モジュール | |
JP4799665B2 (ja) | 押付け部材を使用した端子板回路 | |
US8284563B2 (en) | Circuit structure that connects an electronic part to a conducting path | |
US10576912B2 (en) | Circuit assembly and electrical junction box | |
US10021788B2 (en) | High-current electrical circuit having a circuit board and a busbar | |
JP4570092B2 (ja) | 半導体モジュール | |
KR20180007340A (ko) | 전력 반도체 디바이스 | |
CN106486439B (zh) | 包括两部分式壳体的功率电子子模块 | |
JP2010034557A (ja) | パワー半導体モジュールと接続装置とを有する装置 | |
CN210745686U (zh) | 电路结构 | |
CN107180806B (zh) | 具有壳体的功率半导体模块 | |
JP6260566B2 (ja) | 回路構成体 | |
CN114071874A (zh) | 电路载体布置和制造这种电路载体布置的方法 | |
KR20110004309U (ko) | 클립형 단자 | |
EP1397947B1 (en) | Electric connection arrangement for electronic devices | |
KR101988143B1 (ko) | Smd 컴포넌트 및 연관된 연결 컴포넌트를 구비한 전기 모터 | |
AU2002315588A1 (en) | Electric connection arrangement for electronic devices | |
JP5767932B2 (ja) | 半導体装置 | |
JP4651090B2 (ja) | スイッチングユニット | |
WO2020017468A1 (ja) | 回路基板 | |
GB2284713A (en) | Mounting of an intergrated circuit package on a circuit board | |
US20080182433A1 (en) | Electrical connector | |
JP2000252606A (ja) | 電子部品および電子部品の実装構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090819 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110721 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110802 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111024 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120110 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120123 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150127 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |