JP4906100B2 - 電流検出用抵抗器を有する回路基板 - Google Patents
電流検出用抵抗器を有する回路基板 Download PDFInfo
- Publication number
- JP4906100B2 JP4906100B2 JP2007124409A JP2007124409A JP4906100B2 JP 4906100 B2 JP4906100 B2 JP 4906100B2 JP 2007124409 A JP2007124409 A JP 2007124409A JP 2007124409 A JP2007124409 A JP 2007124409A JP 4906100 B2 JP4906100 B2 JP 4906100B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- metal plate
- circuit board
- current detection
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
12 樹脂材料からなる接着層
13 ソルダーレジスト
15 金属板
15a,15b 電極パターン
15c 回路パターン
16 抵抗体
16a 抵抗金属板
17 固定材
18 放熱材
19 凹部
21,22,23,24 電子部品
25,26 端子
Claims (3)
- ベース基板と、
接着層を介して前記基板上に形成された少なくとも一対の電極パターンを含む金属板からなる回路パターンと、
前記電極パターン間に配置された抵抗金属板からなる抵抗体と、を備え、
前記抵抗体と前記電極パターンとは、前記抵抗体を前記電極パターンに突き合わせて、溶接、クラッドまたは熱拡散により固定したものであることを特徴とする電流検出用抵抗器を有する回路基板。 - 前記ベース基板が金属ベース基板であることを特徴とする請求項1記載の電流検出用抵抗器を有する回路基板。
- 回路パターンとなる金属板に孔を形成し、
前記孔を跨いで、または前記孔内に、抵抗金属板からなる抵抗体を配置し、
前記抵抗体を前記金属板に、溶接、クラッドまたは熱拡散により固定し、
前記金属板をベース基板に接着層により接着し、
前記金属板をパターニングして回路パターンを形成することを特徴とする電流検出用抵抗器を有する回路基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007124409A JP4906100B2 (ja) | 2007-05-09 | 2007-05-09 | 電流検出用抵抗器を有する回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007124409A JP4906100B2 (ja) | 2007-05-09 | 2007-05-09 | 電流検出用抵抗器を有する回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008282910A JP2008282910A (ja) | 2008-11-20 |
JP4906100B2 true JP4906100B2 (ja) | 2012-03-28 |
Family
ID=40143497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007124409A Active JP4906100B2 (ja) | 2007-05-09 | 2007-05-09 | 電流検出用抵抗器を有する回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4906100B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5422818B2 (ja) * | 2008-12-04 | 2014-02-19 | コーア株式会社 | 電流検出用抵抗器の実装基板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2608980B2 (ja) * | 1990-09-11 | 1997-05-14 | 電気化学工業株式会社 | 金属板ベース多層回路基板 |
JPH08288605A (ja) * | 1995-04-14 | 1996-11-01 | Matsushita Electric Ind Co Ltd | 金属回路基板 |
JP2001291601A (ja) * | 2000-04-04 | 2001-10-19 | Koa Corp | 低抵抗器 |
JP2003031401A (ja) * | 2001-07-12 | 2003-01-31 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
JP2003243794A (ja) * | 2002-02-18 | 2003-08-29 | Toyo Kohan Co Ltd | 抵抗板積層材および抵抗板積層材を用いた部品 |
JP4974544B2 (ja) * | 2005-02-25 | 2012-07-11 | コーア株式会社 | 抵抗用合金材料、抵抗器および抵抗器の製造方法 |
JP2006253710A (ja) * | 2006-05-08 | 2006-09-21 | Matsushita Electric Works Ltd | プリント配線板の製造方法及びプリント配線板 |
JP4189005B2 (ja) * | 2007-01-19 | 2008-12-03 | コーア株式会社 | チップ抵抗器 |
-
2007
- 2007-05-09 JP JP2007124409A patent/JP4906100B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008282910A (ja) | 2008-11-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5001731B2 (ja) | 配線回路基板と電子部品との接続構造 | |
US20100212947A1 (en) | Circuit Board and Structure Using the Same | |
US20060147684A1 (en) | Layered board and manufacturing method of the same, electronic apparatus having the layered board | |
KR100755254B1 (ko) | 전자 부품 패키지 및 접합 조립체 | |
JP2001274556A (ja) | プリント配線板 | |
KR20060136294A (ko) | 전자 부품 패키지 및 접합 조립체 | |
TWI549582B (zh) | A method for manufacturing a part-embedded substrate, and a part-embedded substrate manufactured by using the method | |
WO2010016522A1 (ja) | プリント配線板、プリント配線板の製造方法および電子機器 | |
JP4906100B2 (ja) | 電流検出用抵抗器を有する回路基板 | |
JP2007088058A (ja) | 多層基板、及びその製造方法 | |
JP2009295877A (ja) | 抵抗器 | |
US20050266213A1 (en) | Layered board and manufacturing method of the same, electronic apparatus having the layered board | |
JP2011181629A (ja) | 配線基板およびその製造方法 | |
JP2008270599A (ja) | 金属板抵抗器 | |
JP2004342776A (ja) | 回路基板 | |
US7621042B2 (en) | Method for mounting electronic components on a substrate | |
JP2006269466A (ja) | プリント回路基板およびその製造方法 | |
JP2005072098A (ja) | 半導体装置 | |
JP2018164021A (ja) | キャビティ付き配線板 | |
JPH0422189A (ja) | 多層配線板の製造方法 | |
JP2009123757A (ja) | 配線基板およびその製造方法 | |
JP2007266379A (ja) | 部品内蔵プリント配線板、部品内蔵プリント配線板の製造方法および電子機器 | |
JP2018164023A (ja) | キャビティ付き配線板およびその製造方法 | |
JP2006186094A (ja) | 高信頼性プラスチック基板とその製造方法 | |
KR20240080787A (ko) | 홀 드릴링 패턴을 이용한 접합소재 레이저 솔더링 접합방법 및 이에 사용되는 접합물 구조체 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100426 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111003 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111011 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111209 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120104 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120106 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150120 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4906100 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |