JP4889227B2 - 基板処理方法および成膜方法 - Google Patents
基板処理方法および成膜方法 Download PDFInfo
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- JP4889227B2 JP4889227B2 JP2005083764A JP2005083764A JP4889227B2 JP 4889227 B2 JP4889227 B2 JP 4889227B2 JP 2005083764 A JP2005083764 A JP 2005083764A JP 2005083764 A JP2005083764 A JP 2005083764A JP 4889227 B2 JP4889227 B2 JP 4889227B2
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- 238000000034 method Methods 0.000 title claims description 34
- 239000000758 substrate Substances 0.000 title claims description 21
- 238000003672 processing method Methods 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims description 22
- 238000005229 chemical vapour deposition Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 description 94
- 239000007789 gas Substances 0.000 description 91
- 239000010949 copper Substances 0.000 description 85
- 230000015572 biosynthetic process Effects 0.000 description 15
- 239000002994 raw material Substances 0.000 description 15
- 238000000137 annealing Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 238000002441 X-ray diffraction Methods 0.000 description 8
- 239000012528 membrane Substances 0.000 description 6
- 239000012159 carrier gas Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
- H01L21/76846—Layer combinations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0209—Pretreatment of the material to be coated by heating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
- C23C16/0281—Deposition of sub-layers, e.g. to promote the adhesion of the main coating of metallic sub-layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
- H01L21/76861—Post-treatment or after-treatment not introducing additional chemical elements into the layer
- H01L21/76864—Thermal treatment
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
CVD法の一種であるALD法(Atomic Layer Deposition)や、PEALD法((Plasma Enhanced Atomic Layer Deposition)によって行ってもよい。さらにCu膜の成膜は、上述したCVD法に限られず、スパッタ法等のPVD法、電解メッキ法等によって行うこともできる。
2;サセプタ
5;ヒーター
10;シャワーヘッド
20;ガス供給機構
21;Cu原料供給源
22;ヒーター
23;H2ガス供給源
24;Arガス供給源
W;ウエハ
Claims (2)
- 下地材料としてRuを表面に有する基板上にCVD法によりCu膜を形成するために、当該Cu膜の成膜処理前に、前記下地材料としてのRuの結晶性が、表面に(001)面または(002)面が優先配向された配向性を有するように、当該基板に加熱処理を行うことを特徴とする基板処理方法。
- (a)Cu膜を成膜するための下地材料としてRuを表面に有する基板に、前記下地材料のRuの結晶性が、表面に(001)面または(002)面が優先配向された配向性を有するように、加熱処理を行う工程と、
(b)前記基板の表面にCVD法によりCu膜を成膜する工程と、
を有することを特徴とする成膜方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005083764A JP4889227B2 (ja) | 2005-03-23 | 2005-03-23 | 基板処理方法および成膜方法 |
KR1020077021735A KR100954735B1 (ko) | 2005-03-23 | 2006-03-22 | 기판 처리 방법, 성막 방법, 성막 장치 및 컴퓨터 판독 가능한 기억 매체 |
CNB2006800010986A CN100557779C (zh) | 2005-03-23 | 2006-03-22 | 基板处理方法、成膜方法和成膜装置 |
KR1020097025010A KR20100017521A (ko) | 2005-03-23 | 2006-03-22 | 기판 처리 방법 |
PCT/JP2006/305710 WO2006101129A1 (ja) | 2005-03-23 | 2006-03-22 | 基板処理方法、成膜方法、成膜装置及びコンピュータプログラム |
US11/859,490 US7699945B2 (en) | 2005-03-23 | 2007-09-21 | Substrate treatment method and film forming method, film forming apparatus, and computer program |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005083764A JP4889227B2 (ja) | 2005-03-23 | 2005-03-23 | 基板処理方法および成膜方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006269623A JP2006269623A (ja) | 2006-10-05 |
JP4889227B2 true JP4889227B2 (ja) | 2012-03-07 |
Family
ID=37023789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005083764A Expired - Fee Related JP4889227B2 (ja) | 2005-03-23 | 2005-03-23 | 基板処理方法および成膜方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7699945B2 (ja) |
JP (1) | JP4889227B2 (ja) |
KR (2) | KR20100017521A (ja) |
CN (1) | CN100557779C (ja) |
WO (1) | WO2006101129A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8198730B2 (en) | 2007-01-10 | 2012-06-12 | Nec Corporation | Semiconductor device and method of manufacturing the same |
US8247030B2 (en) * | 2008-03-07 | 2012-08-21 | Tokyo Electron Limited | Void-free copper filling of recessed features using a smooth non-agglomerated copper seed layer |
JP2010189693A (ja) * | 2009-02-17 | 2010-09-02 | Tokyo Electron Ltd | Cu膜の成膜方法および記憶媒体 |
JP2010209410A (ja) * | 2009-03-10 | 2010-09-24 | Tokyo Electron Ltd | Cu膜の成膜方法および記憶媒体 |
JP5193913B2 (ja) * | 2009-03-12 | 2013-05-08 | 東京エレクトロン株式会社 | CVD−Ru膜の形成方法および半導体装置の製造方法 |
KR101357531B1 (ko) * | 2011-01-27 | 2014-01-29 | 도쿄엘렉트론가부시키가이샤 | Cu 배선의 형성 방법 및 Cu막의 성막 방법, 성막 시스템, 및 기억 매체 |
JP2012174765A (ja) * | 2011-02-18 | 2012-09-10 | Ibaraki Univ | 半導体集積回路装置用ルテニウムバリア膜とその作製方法及び該ルテニウムバリア膜を有する半導体集積回路装置とその製造方法 |
JP5788274B2 (ja) | 2011-09-14 | 2015-09-30 | ルネサスエレクトロニクス株式会社 | 抵抗変化型不揮発記憶装置、半導体装置及び抵抗変化型不揮発記憶装置の製造方法 |
US20180307666A1 (en) * | 2017-04-19 | 2018-10-25 | Honeywell International Inc. | Method and system for specifying customized display screens for a building automation system |
US10879115B2 (en) * | 2017-11-21 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and forming method thereof |
JP7296806B2 (ja) * | 2019-07-16 | 2023-06-23 | 東京エレクトロン株式会社 | RuSi膜の形成方法及び基板処理システム |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07176615A (ja) * | 1993-10-29 | 1995-07-14 | Sony Corp | 配線形成方法 |
JP3189788B2 (ja) * | 1998-05-29 | 2001-07-16 | 日本電気株式会社 | 銅配線の形成方法 |
JP2000183064A (ja) * | 1998-12-16 | 2000-06-30 | Matsushita Electronics Industry Corp | 半導体装置およびその製造方法 |
JP4221100B2 (ja) * | 1999-01-13 | 2009-02-12 | エルピーダメモリ株式会社 | 半導体装置 |
JP2002026015A (ja) * | 2000-07-12 | 2002-01-25 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2002075995A (ja) * | 2000-08-24 | 2002-03-15 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
KR100413481B1 (ko) | 2001-06-12 | 2003-12-31 | 주식회사 하이닉스반도체 | 반도체 소자의 구리 박막 증착 장비 |
JP3961399B2 (ja) * | 2002-10-30 | 2007-08-22 | 富士通株式会社 | 半導体装置の製造方法 |
-
2005
- 2005-03-23 JP JP2005083764A patent/JP4889227B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-22 KR KR1020097025010A patent/KR20100017521A/ko not_active Application Discontinuation
- 2006-03-22 WO PCT/JP2006/305710 patent/WO2006101129A1/ja active Application Filing
- 2006-03-22 CN CNB2006800010986A patent/CN100557779C/zh not_active Expired - Fee Related
- 2006-03-22 KR KR1020077021735A patent/KR100954735B1/ko active IP Right Grant
-
2007
- 2007-09-21 US US11/859,490 patent/US7699945B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100557779C (zh) | 2009-11-04 |
KR100954735B1 (ko) | 2010-04-23 |
CN101053072A (zh) | 2007-10-10 |
JP2006269623A (ja) | 2006-10-05 |
KR20070107144A (ko) | 2007-11-06 |
US7699945B2 (en) | 2010-04-20 |
US20080020934A1 (en) | 2008-01-24 |
KR20100017521A (ko) | 2010-02-16 |
WO2006101129A1 (ja) | 2006-09-28 |
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