JP4879154B2 - Touch panel integrated resin molding - Google Patents

Touch panel integrated resin molding Download PDF

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JP4879154B2
JP4879154B2 JP2007326039A JP2007326039A JP4879154B2 JP 4879154 B2 JP4879154 B2 JP 4879154B2 JP 2007326039 A JP2007326039 A JP 2007326039A JP 2007326039 A JP2007326039 A JP 2007326039A JP 4879154 B2 JP4879154 B2 JP 4879154B2
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touch panel
reinforcing member
molded body
support substrate
resin molded
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JP2009146354A (en
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剛 西村
義宏 甲斐
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Nissha Printing Co Ltd
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本発明は、携帯電話機、スマートフォン、ＰＤＡ等の電子機器の筐体を構成する樹脂成形体の射出成形時にタッチパネルを金型内にインサートして一体成形したタッチパネル一体型樹脂成形体に関する。   The present invention relates to a touch panel integrated resin molded body in which a touch panel is inserted into a mold and integrally molded during injection molding of a resin molded body constituting a casing of an electronic device such as a mobile phone, a smartphone, and a PDA.

従来、この種のタッチパネル一体型樹脂成形体は、種々の構造のものが知られている。例えば、特許文献１（国際公開第２００６／０９５６８４号パンフレット）には、上部電極フィルムと下部電極フィルムとが互いに電極面を内側にして対向配置されたタッチパネルと、前記タッチパネルの前記上部電極フィルムの表面に、前記タッチパネルより周囲が張り出すように貼り合わされたデザインシートと、前記デザインシートで覆われかつ前記タッチパネルの側面を囲むタッチパネルユニット用筐体とを備えた構造のものが開示されている。   Conventionally, this type of touch panel integrated resin molded body has various structures. For example, Patent Document 1 (International Publication No. 2006/095684 pamphlet) discloses a touch panel in which an upper electrode film and a lower electrode film are arranged to face each other with the electrode surfaces inside, and a surface of the upper electrode film of the touch panel. In addition, there is disclosed a structure having a design sheet bonded so that a periphery projects from the touch panel, and a touch panel unit casing which is covered with the design sheet and surrounds the side surface of the touch panel.

タッチパネルは、通常、入力面（表面）とは反対側に平板状の支持基板を有する。この支持基板は、ポリカードネートなどの樹脂材料やガラス材料などで構成されている。
国際公開第２００６／０９５６８４号パンフレット The touch panel usually has a flat support substrate on the side opposite to the input surface (surface). The support substrate is made of a resin material such as polycarbonate or a glass material.
International Publication No. 2006/095684 Pamphlet

一般に樹脂は、成形時又は成形後において収縮することが知られている。このため、電子機器の筐体を構成する樹脂成形体の射出成形時にタッチパネルを金型内にインサートして一体成形するとき、タッチパネルが樹脂の射出圧力を受けると共に、タッチパネル周囲の樹脂が成形収縮するので、タッチパネルが変形（例えば、湾曲、波打ちなど）するという問題がある。特に、支持基板を樹脂材料で構成した場合には、この変形は顕著である。このため、従来の構造では構造精度が悪くなっている。   In general, it is known that a resin shrinks during molding or after molding. For this reason, when the touch panel is inserted into the mold and integrally molded during the injection molding of the resin molded body constituting the casing of the electronic device, the touch panel receives the injection pressure of the resin and the resin around the touch panel is molded and contracted. Therefore, there is a problem that the touch panel is deformed (for example, curved, wavy, etc.). In particular, when the support substrate is made of a resin material, this deformation is significant. For this reason, in the conventional structure, the structural accuracy is poor.

従って、本発明の目的は、前記問題を解決することにあって、タッチパネルの変形を抑えて構造精度を向上させたタッチパネル一体型樹脂成形体を提供することにある。   Accordingly, an object of the present invention is to solve the above-described problem and to provide a touch panel integrated resin molded body in which the deformation of the touch panel is suppressed and the structural accuracy is improved.

前記目的を達成するために、本発明は以下のように構成する。
本発明の第１態様によれば、電子機器の筐体を構成する樹脂成形体の射出成形時にタッチパネルを金型内にインサートして一体成形したタッチパネル一体型樹脂成形体であって、
前記タッチパネルは、入力面とは反対側に平板状の支持基板を有し、
前記支持基板の裏面側の周縁部には欠損部が設けられ、当該欠損部に前記支持基板より高い剛性を有する補強部材が嵌め込まれ、
前記欠損部は、前記支持基板の裏面側の外周縁部の全部を切り欠いた部分であり、
前記補強部材は、当該欠損部に嵌め込まれた枠部材であることを特徴とする、タッチパネル一体型樹脂成形体を提供する。
ここで、前記「周縁部」とは、支持基板の外周縁部、及び当該外周縁部よりやや内側の領域をいう。 In order to achieve the above object, the present invention is configured as follows.
According to the first aspect of the present invention, there is a touch panel integrated resin molded body that is integrally molded by inserting a touch panel into a mold at the time of injection molding of a resin molded body that constitutes a casing of an electronic device,
The touch panel has a flat support substrate on the side opposite to the input surface,
The peripheral portion on the back side of the support substrate is provided with a defect portion, and a reinforcing member having higher rigidity than the support substrate is fitted into the defect portion ,
The missing part is a part in which the entire outer peripheral edge part on the back side of the support substrate is cut out,
It said reinforcing member comprises a frame member der Rukoto fitted to the defect, and provides a touch panel integrated resin molding.
Here, the “peripheral part” refers to an outer peripheral part of the support substrate and a region slightly inside the outer peripheral part.

本発明の第２態様によれば、前記支持基板は、樹脂材料で構成されていることを特徴とする第１態様に記載のタッチパネル一体型樹脂成形体を提供する。   According to a second aspect of the present invention, there is provided the touch panel integrated resin molded body according to the first aspect, wherein the support substrate is made of a resin material.

本発明の第３態様によれば、前記補強部材は、前記支持基板の平面方向において前記支持基板の外周より内側に位置するように設けられていることを特徴とする第１又は２態様に記載のタッチパネル一体型樹脂成形体を提供する。 According to a third aspect of the present invention, the reinforcing member is in the first or second state like, characterized in that is provided so as to be located inside the outer periphery of the support substrate in the plane direction of the support substrate Provided is a touch panel integrated resin molding as described.

本発明の第４態様によれば、前記補強部材は、前記支持基板の裏面に対して前記支持基板の厚み方向に突出する突出部を有するように設けられていることを特徴とする第１〜３態様のいずれか１つに記載のタッチパネル一体型樹脂成形体を提供する。 According to a fourth aspect of the present invention, the reinforcing member is provided so as to have a protruding portion that protrudes in the thickness direction of the support substrate with respect to the back surface of the support substrate. A touch panel integrated resin molded body according to any one of three aspects is provided.

本発明の第５態様によれば、前記補強部材は、矩形状の枠部材であり、互いに対向するそれぞれの辺部の中央部に、前記支持基板の裏面に対して前記支持基板の厚み方向に突出する突出部を有するように設けられていることを特徴とする第１〜４態様のいずれか１つに記載のタッチパネル一体型樹脂成形体を提供する。 According to the fifth aspect of the present invention, the reinforcing member is a rectangular frame member, and in the thickness direction of the support substrate with respect to the back surface of the support substrate at the center of each side portion facing each other. Provided is a touch panel integrated resin-molded body according to any one of the first to fourth aspects , which is provided so as to have a protruding portion that protrudes.

本発明の第６態様によれば、前記補強部材は、金属材料で構成されていることを特徴とする第１〜５態様のいずれか１つに記載のタッチパネル一体型樹脂成形体を提供する。 According to a sixth aspect of the present invention, there is provided the touch panel integrated resin molded body according to any one of the first to fifth aspects, wherein the reinforcing member is made of a metal material.

本発明の第７態様によれば、前記補強部材は、ステンレス鋼で構成されていることを特徴とする第６態様に記載のタッチパネル一体型樹脂成形体を提供する。 According to a seventh aspect of the present invention, there is provided the touch panel integrated resin molded body according to the sixth aspect, wherein the reinforcing member is made of stainless steel.

本発明の第８態様によれば、前記補強部材は、セラミックスで構成されていることを特徴とする第１〜５態様のいずれか１つに記載のタッチパネル一体型樹脂成形体を提供する。 According to an eighth aspect of the present invention, there is provided the touch panel integrated resin molded body according to any one of the first to fifth aspects, wherein the reinforcing member is made of ceramics.

本発明の第９態様によれば、前記補強部材は、アルミナ又はジルコニアで構成されていることを特徴とする第８態様に記載のタッチパネル一体型樹脂成形体を提供する。 According to a ninth aspect of the present invention, there is provided the touch panel integrated resin molded body according to the eighth aspect, wherein the reinforcing member is made of alumina or zirconia.

本発明の第１０態様によれば、前記補強部材は、前記金型に設けられた固定ピンを受け入れるための受入凹部を有することを特徴とする第１〜３態様のいずれか１つに記載のタッチパネル一体型樹脂成形体を提供する。
According to a tenth aspect of the present invention, the reinforcing member has a receiving recess for receiving a fixing pin provided in the mold, according to any one of the first to third aspects. A touch panel integrated resin molding is provided.

本発明にかかるタッチパネル一体型樹脂成形体によれば、支持基板の裏面側の周縁部に設けた欠損部に前記支持基板より高い剛性を有する補強部材を嵌め込むことにより、樹脂の成形収縮に対抗することができ、タッチパネルの変形を抑えることができる。   According to the touch panel-integrated resin molded body according to the present invention, the reinforcing member having higher rigidity than the support substrate is fitted into the defect provided in the peripheral portion on the back surface side of the support substrate, thereby resisting resin molding shrinkage. And deformation of the touch panel can be suppressed.

本発明の記述を続ける前に、添付図面において同じ部品については同じ参照符号を付している。
以下、本発明の最良の実施の形態について、図面を参照しながら説明する。 Before continuing the description of the present invention, the same parts are denoted by the same reference numerals in the accompanying drawings.
The best mode for carrying out the present invention will be described below with reference to the drawings.

《第１実施形態》
図１及び図２を用いて、本発明の第１実施形態にかかるタッチパネル一体型樹脂成形体の構成について説明する。図１は、本発明の第１実施形態にかかるタッチパネル一体型樹脂成形体の断面図であり、図２は、その平面図である。 << First Embodiment >>
The structure of the touch panel integrated resin molding according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a sectional view of a touch panel integrated resin molding according to the first embodiment of the present invention, and FIG. 2 is a plan view thereof.

図１及び図２において、本発明の第１実施形態にかかるタッチパネル一体型樹脂成形体１は、携帯電話機、スマートフォン、ＰＤＡ等の電子機器の筐体を構成する樹脂成形体１０と、樹脂成形体１０の窓部１１に嵌め込まれたタッチパネル２０とを有している。   1 and 2, a touch panel integrated resin molded body 1 according to the first embodiment of the present invention includes a resin molded body 10 that forms a casing of an electronic device such as a mobile phone, a smartphone, and a PDA, and a resin molded body. 10 and a touch panel 20 fitted in the window portion 11.

樹脂成形体１０は、例えば、ＡＢＳ樹脂（アクリルニトリル−ブタジエン−スチレン共重合合成樹脂）などの樹脂材料で構成されている。   The resin molding 10 is made of a resin material such as ABS resin (acrylonitrile-butadiene-styrene copolymer synthetic resin).

タッチパネル２０は、入力面となるハードコートフィルム２１と、加飾フィルム２２と、上部電極フィルム２３と、接着材２４と、下部電極フィルム２５と、支持基板２６とを、順に積層して構成されている。   The touch panel 20 is configured by laminating a hard coat film 21 serving as an input surface, a decorative film 22, an upper electrode film 23, an adhesive 24, a lower electrode film 25, and a support substrate 26 in order. Yes.

ハードコートフィルム２１は、タッチパネル２０の表面硬度を高めるものである。ハードコートフィルム２１は、透明フィルムの表面にハードコート層を塗布形成したものであり、透明フィルムの材質としては、例えば、ポリカーボネート系、ポリアミド系、若しくは、ポリエーテルケトン系のエンジニアリングプラスチック、アクリル系、ポリエチレンテレフタレート系、若しくは、ポリブチレンテレフタレート系などを用いることができる。ハードコート層は、例えば、シロキサン系樹脂などの無機材料、アクリルエポキシ系、ウレタン系の熱硬化型樹脂やアクリレート系の光硬化型樹脂などの有機材料で構成されている。また、ハードコートフィルム２１とせず、ハードコート層を加飾フィルム２２の表面に直接形成することもできる。   The hard coat film 21 increases the surface hardness of the touch panel 20. The hard coat film 21 is formed by applying a hard coat layer on the surface of a transparent film, and examples of the material of the transparent film include polycarbonate-based, polyamide-based, or polyether ketone-based engineering plastic, acrylic-based, Polyethylene terephthalate or polybutylene terephthalate can be used. The hard coat layer is made of, for example, an inorganic material such as a siloxane-based resin, or an organic material such as an acrylic epoxy-based or urethane-based thermosetting resin or an acrylate-based photocurable resin. Further, the hard coat layer can be formed directly on the surface of the decorative film 22 without using the hard coat film 21.

加飾フィルム２２は、タッチパネル２０の操作領域１２の大きさとほぼ一致する透明窓部２２ａと、透明窓部２２ａの周囲を囲むように配置された加飾部２２ｂとを有している。加飾フィルム２２は、透明フィルムの裏面周縁部に加飾層を形成したものであり、透明フィルムに加飾層を積層してなる部分が加飾部２２ｂとなり、又、透明フィルムに加飾層を積層していない部分が透明窓部２２ａとなる。透明フィルムの材質としては、例えば、ポリカーボネート系、ポリアミド系、若しくは、ポリエーテルケトン系のエンジニアリングプラスチック、アクリル系、ポリエチレンテレフタール系、若しくは、ポリブチレンテレフタール系などを用いることができる。加飾部２２ｂは、タッチパネル２０の操作領域１２の周囲を加飾する（例えば、絵柄を形成する）ためのものであり、例えば液晶パネルの周囲に設けられている電極部分の隠蔽部として用いることができるものである。加飾層の材質としては、ポリ塩化ビニル系樹脂、ポリアミド系樹脂、ポリエステル系樹脂、ポリアクリル系樹脂、ポリウレタン系樹脂、ポリビニルアセタール系樹脂、ポリエステルウレタン系樹脂、セルロースエステル系樹脂、アルキド樹脂などのバインダーとして、適当な色の顔料又は染料を着色剤として含有する着色インキを用いることができる。   The decorative film 22 includes a transparent window portion 22a that substantially matches the size of the operation area 12 of the touch panel 20, and a decorative portion 22b that is disposed so as to surround the transparent window portion 22a. The decorative film 22 is formed by forming a decorative layer on the peripheral edge of the back surface of the transparent film, and a portion formed by laminating the decorative layer on the transparent film becomes the decorative portion 22b, and the decorative layer is formed on the transparent film. The portion where the layers are not laminated becomes the transparent window portion 22a. As the material of the transparent film, for example, polycarbonate-based, polyamide-based, or polyetherketone-based engineering plastics, acrylic-based, polyethylene terephthalal, or polybutylene terephthalal-based materials can be used. The decorating part 22b is for decorating the periphery of the operation area 12 of the touch panel 20 (for example, forming a pattern), and is used as, for example, a concealing part for the electrode portion provided around the liquid crystal panel. It is something that can be done. As the material of the decorative layer, polyvinyl chloride resin, polyamide resin, polyester resin, polyacrylic resin, polyurethane resin, polyvinyl acetal resin, polyester urethane resin, cellulose ester resin, alkyd resin, etc. As the binder, a colored ink containing a pigment or dye of an appropriate color as a colorant can be used.

上部電極フィルム２３と下部電極フィルム２５とはそれぞれ、透明絶縁性基材２３ａ，２５ａ上に透明導電膜２３ｂ，２５ｂを配置したものである。上部電極フィルム２３と下部電極フィルム２５とは、互いの透明導電膜２３ｂ，２５ｂが対向するように隙間を空けて配置され、それぞれの外周部分を、例えば透明両面テープ又は透明接着材などの接着材２４で接合されている。なお、透明導電膜２３ｂと透明導電膜２５ｂとの隙間には、多数のドットスペーサが形成されてもよい。   The upper electrode film 23 and the lower electrode film 25 are obtained by disposing transparent conductive films 23b and 25b on transparent insulating base materials 23a and 25a, respectively. The upper electrode film 23 and the lower electrode film 25 are arranged with a gap therebetween so that the transparent conductive films 23b and 25b face each other, and the outer peripheral portions of the upper electrode film 23 and the lower electrode film 25 are adhesive materials such as a transparent double-sided tape or a transparent adhesive material. 24 is joined. A number of dot spacers may be formed in the gap between the transparent conductive film 23b and the transparent conductive film 25b.

透明絶縁性基材２３ａ，２５ａはそれぞれ、ポリカーボネート系、ポリアミド系、ポリエーテルケトン系のエンジニアリングプラスチック、アクリル系、ポリエチレン系テレフタール系、又は、ポリブチレンテレフタール系などの透明フィルムで構成されている。また、上部電極フィルム２３の透明絶縁性基材２３ａは、指などで押圧すると撓む性質を有するよう可撓性の部材で構成されている。   Each of the transparent insulating base materials 23a and 25a is made of a transparent film such as polycarbonate, polyamide or polyether ketone engineering plastic, acrylic, polyethylene terephthal, or polybutylene terephthal. The transparent insulating base material 23a of the upper electrode film 23 is made of a flexible member so as to have a property of bending when pressed with a finger or the like.

透明導電膜２３ｂ，２５ｂの材質としてはそれぞれ、酸化錫、酸化インジウム、酸化アンチモン、酸化亜鉛、酸化カドミウム、若しくは、インジウムティンオキサイド（ＩＴＯ）などの金属酸化物膜、又は、これらの金属酸化物を主体とする複合膜、又は、金、銀、銅、錫、ニッケル、アルミニウム、若しくは、パラジウムなどの金属膜をそれぞれ用いることができる。   The transparent conductive films 23b and 25b are made of a metal oxide film such as tin oxide, indium oxide, antimony oxide, zinc oxide, cadmium oxide, or indium tin oxide (ITO), or these metal oxides, respectively. The main composite film or a metal film such as gold, silver, copper, tin, nickel, aluminum, or palladium can be used.

支持基板２６は、透視性に優れ且つ加工性の良い樹脂材料で構成された板状部材である。支持基板２６の裏面側の外周縁部には、補強部材３０が嵌め込まれる欠損部の一例である切欠部２６ａが設けられている。なお、支持基板２６は、樹脂成形体１０を構成する樹脂と接着性の良い材料で構成されることが好ましい。例えば、樹脂成形体１０がＡＢＳ樹脂であるとき、支持基板２６はポリカーボネート系樹脂やＰＭＭＡ（ポリメチルメタクリレート）などで構成されることが好ましい。これにより、別途接着材を使用しなくとも、樹脂成形体１０を成形するときに発生する熱を利用して、樹脂成形体１０と支持基板２６とを容易に接合することができる。   The support substrate 26 is a plate-like member made of a resin material that has excellent transparency and good workability. A cutout portion 26 a that is an example of a defective portion into which the reinforcing member 30 is fitted is provided on the outer peripheral edge portion on the back surface side of the support substrate 26. Note that the support substrate 26 is preferably made of a material having good adhesiveness to the resin constituting the resin molded body 10. For example, when the resin molded body 10 is an ABS resin, the support substrate 26 is preferably made of polycarbonate resin, PMMA (polymethyl methacrylate), or the like. As a result, the resin molded body 10 and the support substrate 26 can be easily joined using heat generated when the resin molded body 10 is molded without using a separate adhesive.

前記のようにタッチパネル２０が構成されている。なお、タッチパネル２０の構成は、前記したものに限定されるものでなく、支持基板２６を有する構成であればよい。例えば、前記では、一般に抵抗膜式と呼ばれるタッチパネルの構造としたが、静電容量式のタッチパネルにおいて支持基板２６を有する構造であってもよい。   The touch panel 20 is configured as described above. The configuration of the touch panel 20 is not limited to the above-described configuration, and any configuration having the support substrate 26 may be used. For example, in the above description, the structure of the touch panel generally referred to as a resistance film type is used. However, a structure having a support substrate 26 in a capacitive touch panel may be used.

次に、図１及び図３を用いて、支持基板２６の切欠部２６ａ及び補強部材３０の構成について詳細に説明する。図３は、支持基板２６の切欠部２６ａに補強部材３０を嵌め込む様子を示す斜視図である。   Next, the configuration of the cutout portion 26a of the support substrate 26 and the reinforcing member 30 will be described in detail with reference to FIGS. FIG. 3 is a perspective view showing a state in which the reinforcing member 30 is fitted into the notch 26 a of the support substrate 26.

図３に示すように、切欠部２６ａは、矩形板状の支持基板２６の裏面側の外周縁部の全周を、例えばルータで削ることにより形成されている。支持基板２６の厚さＬ１が例えば約１．２ｍｍで形成される場合、切欠部２６ａの高さＬ２は、例えば約０．８ｍｍ〜０．９ｍｍで形成される。また、このとき、切欠部２６ａの幅Ｗ２は、例えば約２．０ｍｍで形成される。また、切欠部２６ａは、図１に示すように、タッチパネル２０の厚み方向のハードコートフィルム２１側から見て、加飾フィルム２２の加飾部２２ｂに隠蔽される位置に形成されている。   As shown in FIG. 3, the notch 26a is formed by scraping the entire circumference of the outer peripheral edge of the back surface side of the rectangular plate-like support substrate 26 with a router, for example. When the thickness L1 of the support substrate 26 is formed with, for example, about 1.2 mm, the height L2 of the notch portion 26a is formed with, for example, about 0.8 mm to 0.9 mm. At this time, the width W2 of the notch 26a is, for example, about 2.0 mm. Moreover, the notch part 26a is formed in the position concealed by the decorating part 22b of the decorating film 22, seeing from the hard coat film 21 side of the thickness direction of the touch panel 20, as shown in FIG.

補強部材３０は、矩形枠状で且つ厚み方向の断面が矩形に形成されている。また、補強部材３０は、支持基板２６より高い剛性を有する部材、例えばアルミナやジルコニアなどのセラミックス、又はステンレス鋼などの金属材料で構成されている。この補強部材３０により、支持基板２６が補強され、タッチパネル２０全体の変形が抑制される。すなわち、補強部材３０の剛性を支持基板２６より高くすればするほど、タッチパネル２０全体の変形（例えば、撓みや折り曲げ）をより抑制することができる。なお、補強部材３０の材質としてステンレス鋼を使用した場合には、打ち抜き加工によって作製できるので、セラミックスに比べて安価に作製できる利点がある。一方、補強部材３０の材質としてセラミックスを使用した場合には、セラミックスが絶縁性に優れているので、電気信号の取り出し部付近まで補強部材３０を配置することができ、補強部材３０の高さ（図１の上下方向の長さ）を長くする確保することができる。これにより、補強部材３０の強度を高くすることができる。また、セラミックスは、電波隠蔽性もなく、硬くて軽量である利点がある。   The reinforcing member 30 has a rectangular frame shape and a rectangular cross section in the thickness direction. The reinforcing member 30 is made of a member having higher rigidity than the support substrate 26, for example, a ceramic material such as alumina or zirconia, or a metal material such as stainless steel. The reinforcing member 30 reinforces the support substrate 26 and suppresses deformation of the entire touch panel 20. That is, as the rigidity of the reinforcing member 30 is made higher than that of the support substrate 26, the deformation (for example, bending or bending) of the entire touch panel 20 can be further suppressed. Note that, when stainless steel is used as the material of the reinforcing member 30, it can be manufactured by punching, and therefore has an advantage that it can be manufactured at a lower cost than ceramics. On the other hand, when ceramic is used as the material of the reinforcing member 30, since the ceramic is excellent in insulation, the reinforcing member 30 can be disposed up to the vicinity of the electrical signal extraction portion, and the height of the reinforcing member 30 ( It is possible to ensure that the length in the vertical direction in FIG. Thereby, the strength of the reinforcing member 30 can be increased. Ceramics have the advantage of being hard and lightweight without radio wave concealment.

補強部材３０の高さは、切欠部２６ａに嵌め込まれたときに、切欠部２６ａの高さＬ２と同じ又はそれより低くなるように形成されている。また、補強部材３０の幅Ｗ３は、切欠部２６ａの幅Ｗ２と同じ又はそれよりも小さく、例えば１．５ｍｍで形成されている。
前記したように、切欠部２６ａが加飾部２２ｂに隠蔽される位置に形成されているので、切欠部２６ａに嵌合する補強部材３０も加飾部２２ｂに隠蔽される。なお、補強部材３０の幅Ｗ３が切欠部２６ａの幅Ｗ２よりも大きい場合には、樹脂成形体１０の成形時に支持基板２６より平面方向にはみ出した補強部材３０の部分にかかる樹脂圧により、タッチパネル２０が変形する恐れがある。 The height of the reinforcing member 30 is formed to be equal to or lower than the height L2 of the notch 26a when fitted into the notch 26a. Further, the width W3 of the reinforcing member 30 is the same as or smaller than the width W2 of the notch portion 26a, for example, 1.5 mm.
As described above, since the cutout portion 26a is formed at a position hidden by the decorative portion 22b, the reinforcing member 30 fitted to the cutout portion 26a is also hidden by the decorative portion 22b. When the width W3 of the reinforcing member 30 is larger than the width W2 of the notch 26a, the touch panel is touched by the resin pressure applied to the portion of the reinforcing member 30 that protrudes in the planar direction from the support substrate 26 when the resin molded body 10 is molded. 20 may be deformed.

次に、図４Ａ及び図４Ｂを用いて、タッチパネル一体型樹脂成形体１の製造方法について説明する。図４Ａ及び図４Ｂは、タッチパネル一体型樹脂成形体１の製造方法の工程図である。ただし、この製造方法で使用する図４Ａ及び図４Ｂの成形用金型及びタッチパネル２０は、説明を理解し易くするために、図面を簡略化した模式的なものとなっている。   Next, the manufacturing method of the touch panel integrated resin molding 1 is demonstrated using FIG. 4A and 4B. 4A and 4B are process diagrams of the manufacturing method of the touch panel integrated resin molded body 1. However, the molding die and the touch panel 20 shown in FIGS. 4A and 4B used in this manufacturing method are schematically simplified for easy understanding of the description.

まず、図４Ａに示すように、第１金型Ｔ１のキャビティＴ１ａ内の所定の位置に、補強部材３０を取り付けたタッチパネル２０を配置する。このとき、ハードコートフィルム２１が第１金型Ｔ１と接触するようにタッチパネル２０を配置する。   First, as shown in FIG. 4A, the touch panel 20 to which the reinforcing member 30 is attached is disposed at a predetermined position in the cavity T1a of the first mold T1. At this time, the touch panel 20 is arranged so that the hard coat film 21 is in contact with the first mold T1.

次いで、図４Ｂに示すように、キャビティＴ１ａ内にタッチパネル２０を配置した状態で、第１金型Ｔ１と第２金型Ｔ２とを型閉めする。これより、第１金型Ｔ１のキャビティＴ１ａと、第２金型Ｔ２のキャビティＴ２ａと、補強部材３０を取り付けたタッチパネル２０との間に空間が形成される。この後、第２金型Ｔ２に設けた射出ゲートＴ２ｂを通じて当該空間に、例えばＡＢＳ樹脂を流し込んだのち、冷却する。これにより、タッチパネル２０の周囲に樹脂成形体１０が一体的に成形されたタッチパネル一体型樹脂成形体１が形成される。   Next, as shown in FIG. 4B, the first mold T1 and the second mold T2 are closed with the touch panel 20 disposed in the cavity T1a. Thus, a space is formed between the cavity T1a of the first mold T1, the cavity T2a of the second mold T2, and the touch panel 20 to which the reinforcing member 30 is attached. Thereafter, for example, ABS resin is poured into the space through the injection gate T2b provided in the second mold T2, and then cooled. Thereby, the touch panel integrated resin molding 1 in which the resin molding 10 is integrally molded around the touch panel 20 is formed.

なお、タッチパネル２０への補強部材３０の取り付けは、別途接着材又は粘着材を用いてもよい。この場合に使用する接着材又は粘着材としては、樹脂成形体１０の成形時に発生する熱により溶融して、タッチパネル２０と補強部材３０とを接着可能なものが使用されることが好ましい。なお、補強部材３０と樹脂成形体１０との接合を強固にしたい場合には、補強部材３０に予め前記接着材又は粘着材を塗布する。   Note that the reinforcing member 30 may be attached to the touch panel 20 using a separate adhesive or adhesive material. As the adhesive or pressure-sensitive adhesive material used in this case, it is preferable to use a material that can be melted by heat generated during molding of the resin molded body 10 and can bond the touch panel 20 and the reinforcing member 30. In addition, when it is desired to strengthen the joining between the reinforcing member 30 and the resin molded body 10, the adhesive material or the adhesive material is applied to the reinforcing member 30 in advance.

本発明の第１実施形態にかかるタッチパネル一体型樹脂成形体によれば、支持基板２６の裏面側に設けた切欠部２６ａに、支持基板２６より高い剛性を有する補強部材３０を嵌め込んでタッチパネル２０の強度を強化するので、樹脂成形体１０を構成する樹脂の成形収縮に対抗することができる。従って、タッチパネル２０の変形を抑え、構造精度を向上させることができる。   According to the touch panel integrated resin-molded body according to the first embodiment of the present invention, the reinforcing member 30 having rigidity higher than that of the support substrate 26 is fitted into the notch portion 26a provided on the back surface side of the support substrate 26, thereby touching the touch panel 20. Since the strength of the resin is strengthened, it is possible to resist molding shrinkage of the resin constituting the resin molded body 10. Therefore, deformation of the touch panel 20 can be suppressed and the structural accuracy can be improved.

また、補強部材３０によりタッチパネル２０の強度を強化、すなわちタッチパネル２０の形状を維持できるので、支持基板２６自体に強度を持たせる必要性を無くすことができる。従って、外部端子との電気接続のための貫通穴を開ける場合などに加工性の良い樹脂材料で支持基板２６を構成することができる。すなわち、支持基板２６の材質の選択肢を広げることができる。   Further, since the strength of the touch panel 20 can be enhanced by the reinforcing member 30, that is, the shape of the touch panel 20 can be maintained, it is possible to eliminate the need for the support substrate 26 itself to have strength. Therefore, the support substrate 26 can be made of a resin material having good processability when a through hole for electrical connection with an external terminal is opened. That is, the choice of the material of the support substrate 26 can be expanded.

なお、本発明は前記実施形態に限定されるものではなく、その他種々の態様で実施できる。例えば、前記では、枠状の補強部材３０を単一の部材により構成したが、複数の部材を組み合わせて構成してもよい。例えば、４つの棒体の端部同士を連結して枠状の補強部材３０を構成してもよい。   In addition, this invention is not limited to the said embodiment, It can implement in another various aspect. For example, in the above description, the frame-shaped reinforcing member 30 is configured by a single member, but may be configured by combining a plurality of members. For example, the frame-shaped reinforcing member 30 may be configured by connecting ends of four rod bodies.

また、前記では、補強部材３０の厚み方向の断面を矩形状に形成したが、本発明はこれに限定されない。例えば、図５及び図６に示すように、支持基板２６の厚み方向の断面が円形又は扇形である補強部材３０Ａ，３０Ｂを用いてもよい。なお、補強部材３０の材質としてセラミックスを使用した場合には、支持基板２６の厚み方向の断面が、円形である補強部材３０Ａが採用されることがより好ましい。前記したように複数の棒体を連結して補強部材を構成する場合、当該各棒体の製造方法として押出成形を採用すると、当該各棒体を安価に作製できるという利点がある。しかしながら、この押出成形を採用する場合、製造した棒体がねじれやすいという不具合がある。これに対して、補強部材の断面を円形にした場合には、補強部材３０にねじれ、すなわち中心軸を軸とする偶力が加えられることによる変形が生じた場合でも、補強部材３０の形状が見かけ上変化しない。したがって、補強部材３０が支持基板２６に嵌合しやすいという利点がある。   In the above description, the cross section in the thickness direction of the reinforcing member 30 is formed in a rectangular shape, but the present invention is not limited to this. For example, as shown in FIGS. 5 and 6, reinforcing members 30 </ b> A and 30 </ b> B in which the support substrate 26 has a circular or fan-shaped cross section in the thickness direction may be used. When ceramics is used as the material of the reinforcing member 30, it is more preferable that the reinforcing member 30A having a circular cross section in the thickness direction of the support substrate 26 is employed. As described above, when a plurality of rod bodies are connected to form a reinforcing member, when extrusion molding is employed as a method for producing each rod body, there is an advantage that each rod body can be manufactured at low cost. However, when this extrusion molding is employed, there is a problem that the manufactured rod is easily twisted. On the other hand, when the cross section of the reinforcing member is circular, even if the reinforcing member 30 is twisted, that is, when deformation occurs due to application of a couple about the central axis, the shape of the reinforcing member 30 is Apparently unchanged. Therefore, there is an advantage that the reinforcing member 30 is easily fitted to the support substrate 26.

また、補強部材３０の材質としてセラミックスを使用した場合には、図５に示すように、補強部材３０Ａと支持基板２６との間に隙間４０があってもよい。この場合、樹脂成形体１０の成形時に当該隙間に樹脂を入り込ませて、補強部材３０Ａと支持基板２６との接合を強固することが可能である。   Further, when ceramic is used as the material of the reinforcing member 30, there may be a gap 40 between the reinforcing member 30A and the support substrate 26 as shown in FIG. In this case, it is possible to strengthen the bonding between the reinforcing member 30 </ b> A and the support substrate 26 by inserting the resin into the gap when the resin molded body 10 is molded.

また、前記では、支持基板２６の外周縁部に切欠部２６ａを設けたが、本発明はこれに限定されない。例えば、図７に示すように、支持基板２６の外周縁部より内側に欠損部の一例である溝部（めくら穴）２６ｂを設けて、当該溝部２６ｂに補強部材３０を嵌め込んでもよい。なお、この場合においても、加飾フィルタ２３の加飾部２３ｂで、溝部２６ｂ及び補強部材３０を隠蔽しなければならない。   In the above description, the cutout portion 26a is provided in the outer peripheral edge portion of the support substrate 26, but the present invention is not limited to this. For example, as shown in FIG. 7, a groove part (blur hole) 26b, which is an example of a defective part, may be provided inside the outer peripheral edge of the support substrate 26, and the reinforcing member 30 may be fitted into the groove part 26b. Even in this case, the groove 26b and the reinforcing member 30 must be concealed by the decorative portion 23b of the decorative filter 23.

また、支持基板２６の外周縁部の全周に切欠部２６ａを設け且つ補強部材３０を枠状に形成したが、本発明はこれに限定されない。例えば、図８に示すように、支持基板２６の外周縁部の４角をＬ字状に切り欠いて複数の切欠部２６ｃを形成し、それぞれの切欠部２６ｃに補強部材３０Ｃを取り付けるように構成してもよい。この場合、補強部材３０Ｃは、切欠部２６ａの形状に合わせて、支持基板２６の平面方向の断面がＬ字形の部材で構成すればよい。このような構成によっても、樹脂成形体１０の成形時にかかる樹脂圧に対抗して、支持基板２６の形状を維持することができる。   Moreover, although the notch part 26a was provided in the perimeter of the outer periphery part of the support substrate 26, and the reinforcement member 30 was formed in frame shape, this invention is not limited to this. For example, as shown in FIG. 8, the four corners of the outer peripheral edge of the support substrate 26 are notched in an L shape to form a plurality of notches 26c, and a reinforcing member 30C is attached to each notch 26c. May be. In this case, the reinforcing member 30C may be configured by a member having an L-shaped cross section in the plane direction of the support substrate 26 in accordance with the shape of the notch 26a. Even with such a configuration, the shape of the support substrate 26 can be maintained against the resin pressure applied when the resin molded body 10 is molded.

また、前記では、タッチパネル２０及び補強部材３０の形状を矩形としたが、本発明はこれに限定されない。例えば、タッチパネル２０及び補強部材３０の形状を他の多角形や円形、楕円形などとしてもよい。   In the above description, the touch panel 20 and the reinforcing member 30 are rectangular in shape, but the present invention is not limited to this. For example, the shapes of the touch panel 20 and the reinforcing member 30 may be other polygons, circles, ellipses, or the like.

《第２実施形態》
図９〜図１１を用いて、本発明の第２実施形態にかかるタッチパネル一体型樹脂成形体の構成について説明する。図９は、本第２実施形態のタッチパネル一体型樹脂成形体に用いる補強部材を示す斜視図であり、図１０は、その補強部材が支持基板に取り付けられた状態を示す一部拡大断面図であり、図１１は、その補強部材を取り付けたタッチパネルを金型内に配置した状態を示す一部拡大断面図である。本第２実施形態のタッチパネル一体型樹脂成形体は、補強部材３０に代えて、複数の突起部３１を有する補強部材３０Ｄを用いる点で前記第１実施形態にかかるタッチパネル一体型樹脂成形体と異なる。それ以外の点については同様であるので、重複する説明は省略し、主に相違点について説明する。 << Second Embodiment >>
The configuration of the touch panel integrated resin molded body according to the second embodiment of the present invention will be described with reference to FIGS. 9 to 11. FIG. 9 is a perspective view showing a reinforcing member used in the touch panel integrated resin-molded body of the second embodiment, and FIG. 10 is a partially enlarged sectional view showing a state in which the reinforcing member is attached to the support substrate. FIG. 11 is a partially enlarged sectional view showing a state in which the touch panel to which the reinforcing member is attached is arranged in the mold. The touch panel integrated resin molded body of the second embodiment is different from the touch panel integrated resin molded body according to the first embodiment in that a reinforcing member 30D having a plurality of protrusions 31 is used instead of the reinforcing member 30. . Since it is the same about other points, the overlapping description will be omitted and differences will be mainly described.

タッチパネル２０及び補強部材３０が例えば矩形状である場合、樹脂成形体１０の成形時の樹脂圧によって、補強部材３０の各辺部が互いに内側（互いに近づく方向）に撓む恐れがある。補強部材３０の各辺部の長さが長くなればなるほど、その撓みの可能性は高くなる。このため、前記樹脂圧に抵抗できるように、補強部材３０の剛性を十分に高くしなければならない。   When the touch panel 20 and the reinforcing member 30 are, for example, rectangular, the sides of the reinforcing member 30 may be bent inward (in a direction approaching each other) due to the resin pressure when the resin molded body 10 is molded. The longer the length of each side of the reinforcing member 30, the higher the possibility of bending. For this reason, the rigidity of the reinforcing member 30 must be sufficiently high so that the resin pressure can be resisted.

この問題を解決するために、本第２実施形態では、図９及び図１０に示すように、矩形枠状の補強部材３０Ｄの各辺部に、支持基板２６の裏面に対して支持基板２６の厚み方向に突出する突出部の一例である突出爪３１を設けている。   In order to solve this problem, in the second embodiment, as shown in FIGS. 9 and 10, the support substrate 26 is disposed on each side of the rectangular frame-shaped reinforcing member 30 </ b> D with respect to the back surface of the support substrate 26. Protruding claws 31 that are an example of protruding portions protruding in the thickness direction are provided.

また、本第２実施形態では、樹脂成形体１０を成形するとき、図１１に示すように、突出爪３１に対応する位置に凹部Ｔ２ｃを有する第２金型Ｔ２Ａを用いる。そして、当該凹部Ｔ２ｃに突出爪３１を挿入したのち、第１及び第２金型Ｔ１，Ｔ２ＡのキャビティＴ１ａ，Ｔ２ａ内に樹脂を流し込んで樹脂成形体１０を成形する。これにより、樹脂成形体１０の成形時において、補強部材３０Ｄの各辺部が互いに内側に撓む方向（互いに近づく方向）に樹脂圧がかかったとしても、突出爪３１が凹部Ｔ２ｃに挿入されることによりストッパーとなり、補強部材３０Ｄの変形が防止される。したがって、タッチパネル２０全体の変形を抑えることができる。   Moreover, in this 2nd Embodiment, when shape | molding the resin molding 10, as shown in FIG. 11, the 2nd metal mold | die T2A which has the recessed part T2c in the position corresponding to the protrusion nail | claw 31 is used. And after inserting the protrusion nail | claw 31 in the said recessed part T2c, resin is poured into cavity T1a, T2a of 1st and 2nd metal mold | die T1, T2A, and the resin molding 10 is shape | molded. As a result, when the resin molded body 10 is molded, even if the resin pressure is applied in the direction in which the side portions of the reinforcing member 30D bend inward from each other (the directions approaching each other), the protruding claws 31 are inserted into the recesses T2c. This serves as a stopper, and deformation of the reinforcing member 30D is prevented. Therefore, deformation of the entire touch panel 20 can be suppressed.

また、本第２実施形態によれば、突出爪３１を備えることで、補強部材３０Ｄ自体が補強されて、補強部材３０よりも強度が高くなるという効果も得られる。また、突出爪３１は、例えば、本第２実施形態のタッチパネル一体型樹脂成形体が液晶表示装置に用いられるとき、図１６Ａ及び図１６Ｂに示すように、液晶パネル５０のガイド部材として利用できるという効果も得られる。   In addition, according to the second embodiment, by providing the protruding claws 31, the reinforcing member 30 </ b> D itself is reinforced, and an effect that the strength is higher than that of the reinforcing member 30 is also obtained. Further, for example, when the touch panel integrated resin molded body of the second embodiment is used in a liquid crystal display device, the protruding claws 31 can be used as a guide member of the liquid crystal panel 50 as shown in FIGS. 16A and 16B. An effect is also obtained.

なお、補強部材３０Ｄは、特に各辺部の中央部が変形し易いので、図９に示すように、突出爪３１は、前記中央部付近に設けられることが好ましい。   In addition, since especially reinforcement member 30D is easy to deform | transform the center part of each side part, as shown in FIG. 9, it is preferable that the protrusion nail | claw 31 is provided in the said center part vicinity.

なお、本発明は前記実施形態に限定されるものではなく、その他種々の態様で実施できる。前記では、図９に示すように、補強部材３０Ｄの各辺部に１つ又は２つの突出爪３１を設けるように構成したが、本発明はこれに限定されない。例えば、図１２に示すように、補強部材３０Ｅの全周に突出爪３２を備えるように構成してもよい。   In addition, this invention is not limited to the said embodiment, It can implement in another various aspect. In the above, as shown in FIG. 9, one or two protruding claws 31 are provided on each side of the reinforcing member 30 </ b> D, but the present invention is not limited to this. For example, as shown in FIG. 12, you may comprise so that the protrusion nail | claw 32 may be provided in the perimeter of the reinforcement member 30E.

また、前記では、補強部材３０Ｄの厚み方向の断面がＬ字形であるように突出爪３１を構成したが、本発明はこれに限定されない。例えば、図１３に示すように、補強部材３０Ｄの厚み方向の断面を矩形状として、支持基板２６の裏面に対して支持基板２６の厚み方向に突出するように補強部材３０Ｆを構成してもよい。この場合、補強部材３０Ｆの、支持基板２６の裏面に対して支持基板２６の厚み方向に突出する部分が突出部３３となる。   Moreover, although the protrusion nail | claw 31 was comprised so that the cross section of the thickness direction of reinforcement member 30D may be L-shaped by the above, this invention is not limited to this. For example, as shown in FIG. 13, the reinforcing member 30 </ b> F may be configured to have a rectangular cross section in the thickness direction of the reinforcing member 30 </ b> D and protrude in the thickness direction of the support substrate 26 with respect to the back surface of the support substrate 26. . In this case, a portion of the reinforcing member 30F that protrudes in the thickness direction of the support substrate 26 with respect to the back surface of the support substrate 26 becomes the protrusion 33.

《第３実施形態》
図１４及び図１５を用いて、本発明の第３実施形態にかかるタッチパネル一体型樹脂成形体の構成について説明する。図１４は、本第３実施形態のタッチパネル一体型樹脂成形体に用いる補強部材を示す斜視図であり、図１５は、その補強部材を取り付けたタッチパネルを金型内に配置した状態を示す一部拡大断面図である。本第３実施形態のタッチパネル一体型樹脂成形体は、補強部材３０Ｄに代えて、突起部３１の位置に受入凹部３４を設けた補強部材３０Ｇを用いる点で前記第２実施形態にかかるタッチパネル一体型樹脂成形体と異なる。それ以外の点については同様であるので、重複する説明は省略し、主に相違点について説明する。 << Third Embodiment >>
The configuration of the touch panel integrated resin molding according to the third embodiment of the present invention will be described with reference to FIGS. 14 and 15. FIG. 14 is a perspective view showing a reinforcing member used in the touch panel integrated resin-molded body of the third embodiment, and FIG. 15 is a partial view showing a state in which the touch panel to which the reinforcing member is attached is arranged in the mold. It is an expanded sectional view. The touch panel integrated resin molded body of the third embodiment is a touch panel integrated type according to the second embodiment in that a reinforcing member 30G provided with a receiving recess 34 at the position of the protrusion 31 is used instead of the reinforcing member 30D. Different from resin molding. Since it is the same about other points, the overlapping description will be omitted and differences will be mainly described.

本第３実施形態においては、樹脂成形体１０を成形するとき、図１５に示すように、受入凹部３４に対応する位置に固定ピンＴ２ｄを有する第２金型Ｔ２Ｂを用いる。当該第２金型Ｔ２Ｂの固定ピンＴ２ｄを受入凹部３４に挿入したのち、第１及び第２金型Ｔ１，Ｔ２ＢのキャビティＴ１ａ，Ｔ２ａ内に樹脂を流し込んで樹脂成形体１０を成形する。これにより、樹脂成形体１０の成形時において、補強部材３０Ｇの各辺部が互いに内側に撓む方向（互いに近づく方向）に樹脂圧がかかったとしても、固定ピンＴ２ｄが受入凹部３４に挿入されているので、補強部材３０Ｇの変形は防止される。したがって、タッチパネル２０全体の変形が抑えられ、構造精度を向上することができる。   In the third embodiment, when the resin molded body 10 is molded, a second mold T2B having a fixing pin T2d at a position corresponding to the receiving recess 34 is used as shown in FIG. After the fixing pin T2d of the second mold T2B is inserted into the receiving recess 34, resin is poured into the cavities T1a and T2a of the first and second molds T1 and T2B to mold the resin molded body 10. As a result, when the resin molded body 10 is molded, the fixing pin T2d is inserted into the receiving recess 34 even if the resin pressure is applied in the direction in which the side portions of the reinforcing member 30G bend inwardly (the directions approaching each other). Therefore, deformation of the reinforcing member 30G is prevented. Therefore, the deformation of the entire touch panel 20 can be suppressed and the structural accuracy can be improved.

なお、前記様々な実施形態のうちの任意の実施形態を適宜組み合わせることにより、それぞれの有する効果を奏するようにすることができる。   It is to be noted that, by appropriately combining any of the various embodiments, the effects possessed by them can be produced.

本発明にかかるタッチパネル一体型樹脂成形体は、タッチパネルの変形を抑えて構造精度を向上させることができるので、携帯電話機、スマートフォン、ＰＤＡ等の電子機器の筐体を構成する樹脂成形体の射出成形時にタッチパネルを金型内にインサートして一体成形したタッチパネル一体型樹脂成形体として有用である。   Since the touch panel integrated resin molded body according to the present invention can improve the structural accuracy by suppressing the deformation of the touch panel, the injection molding of the resin molded body constituting the casing of an electronic device such as a mobile phone, a smartphone, or a PDA. It is sometimes useful as a touch panel integrated resin molding in which a touch panel is inserted into a mold and integrally molded.

本発明の第１実施形態にかかるタッチパネル一体型樹脂成形体の断面図である。It is sectional drawing of the touch-panel-integrated resin molding concerning 1st Embodiment of this invention. 本発明の第１実施形態にかかるタッチパネル一体型樹脂成形体の平面図である。It is a top view of the touch panel integrated resin molding concerning 1st Embodiment of this invention. 支持基板に補強部材を取り付ける様子を示す斜視図である。It is a perspective view which shows a mode that a reinforcement member is attached to a support substrate. 本発明の第１実施形態にかかるタッチパネル一体型樹脂成形体の製造方法の工程図である。It is process drawing of the manufacturing method of the touch panel integrated resin molding concerning 1st Embodiment of this invention. 図４Ａに続く工程図である。It is process drawing following FIG. 4A. 補強部材の第１変形例を示す断面図である。It is sectional drawing which shows the 1st modification of a reinforcement member. 補強部材の第２変形例を示す断面図である。It is sectional drawing which shows the 2nd modification of a reinforcement member. 補強部材の第３変形例を示す断面図である。It is sectional drawing which shows the 3rd modification of a reinforcement member. 補強部材の第４変形例を示す斜視図である。It is a perspective view which shows the 4th modification of a reinforcement member. 本発明の第２実施形態にかかるタッチパネル一体型樹脂成形体に用いる補強部材を示す斜視図である。It is a perspective view which shows the reinforcement member used for the touch-panel-integrated resin molding concerning 2nd Embodiment of this invention. 図９の補強部材を支持基板に取り付けた状態を示す一部拡大断面図である。It is a partially expanded sectional view which shows the state which attached the reinforcement member of FIG. 9 to the support substrate. 図９の補強部材が取り付けられたタッチパネルを金型内に配置した状態を示す一部拡大断面図である。It is a partially expanded sectional view which shows the state which has arrange | positioned the touchscreen with which the reinforcement member of FIG. 9 was attached in the metal mold | die. 補強部材の第５変形例を示す斜視図である。It is a perspective view which shows the 5th modification of a reinforcement member. 補強部材の第６変形例を示す断面図である。It is sectional drawing which shows the 6th modification of a reinforcement member. 本発明の第３実施形態にかかるタッチパネル一体型樹脂成形体に用いる補強部材を示す斜視図である。It is a perspective view which shows the reinforcement member used for the touch-panel-integrated resin molding concerning 3rd Embodiment of this invention. 図１４の補強部材が取り付けられたタッチパネルを金型内に配置した状態を示す一部拡大断面図である。It is a partially expanded sectional view which shows the state which has arrange | positioned the touchscreen with which the reinforcement member of FIG. 14 was attached in the metal mold | die. 補強部材の突出爪が液晶パネルをガイドする様子を示す断面図である。It is sectional drawing which shows a mode that the protrusion nail | claw of a reinforcement member guides a liquid crystal panel. 補強部材の突出爪が液晶パネルをガイドした後の状態を示す断面図である。It is sectional drawing which shows the state after the protrusion nail | claw of a reinforcement member has guided the liquid crystal panel.

符号の説明Explanation of symbols

１ タッチパネル一体型樹脂成形体
１０ 樹脂成形体
２０ タッチパネル
２１ ハードコートフィルム
２２ 加飾フィルム
２３ 上部電極フィルム
２４ 接着材
２５ 下部電極フィルム
２６ 支持基板
２６ａ，２６ｃ 切欠部
２６ｂ 溝部
３０，３０Ａ〜３０Ｇ 補強部材
３１ 突出爪
Ｔ１ 第１金型
Ｔ２ 第２金型 DESCRIPTION OF SYMBOLS 1 Touch panel integrated resin molding 10 Resin molding 20 Touch panel 21 Hard coat film 22 Decorating film 23 Upper electrode film 24 Adhesive material 25 Lower electrode film 26 Support substrate 26a, 26c Notch part 26b Groove part 30, 30A-30G Reinforcement member 31 Protruding claw T1 1st mold T2 2nd mold

Claims (10)

電子機器の筐体を構成する樹脂成形体の射出成形時にタッチパネルを金型内にインサートして一体成形したタッチパネル一体型樹脂成形体であって、
前記タッチパネルは、入力面とは反対側に平板状の支持基板を有し、
前記支持基板の裏面側の周縁部には欠損部が設けられ、当該欠損部に前記支持基板より高い剛性を有する補強部材が嵌め込まれ、
前記欠損部は、前記支持基板の裏面側の外周縁部の全部を切り欠いた部分であり、
前記補強部材は、当該欠損部に嵌め込まれた枠部材であることを特徴とするタッチパネル一体型樹脂成形体。 A touch panel integrated resin molded body that is integrally molded by inserting a touch panel into a mold at the time of injection molding of a resin molded body constituting a casing of an electronic device,
The touch panel has a flat support substrate on the side opposite to the input surface,
The peripheral portion on the back side of the support substrate is provided with a defect portion, and a reinforcing member having higher rigidity than the support substrate is fitted into the defect portion ,
The missing part is a part in which the entire outer peripheral edge part on the back side of the support substrate is cut out,
The reinforcement member includes a touch panel integrated resin molding, wherein the frame member der Rukoto fitted to the defect. 前記支持基板は、樹脂材料で構成されていることを特徴とする請求項１に記載のタッチパネル一体型樹脂成形体。   The touch panel integrated resin molding according to claim 1, wherein the support substrate is made of a resin material. 前記補強部材は、前記支持基板の平面方向において前記支持基板の外周より内側に位置するように設けられていることを特徴とする請求項１又は２に記載のタッチパネル一体型樹脂成形体。 The reinforcement member includes a touch panel integrated resin molded article according to claim 1 or 2, characterized in that is provided so as to be located inside the outer periphery of the support substrate in the plane direction of the supporting substrate. 前記補強部材は、前記支持基板の裏面に対して前記支持基板の厚み方向に突出する突出部を有するように設けられていることを特徴とする請求項１〜３のいずれか１つに記載のタッチパネル一体型樹脂成形体。 The reinforcing member according to any one of claims 1-3, characterized in that are provided so as to have the protrusion protruding in the thickness direction of the supporting substrate with respect to the rear surface of the support substrate Touch panel integrated resin molding. 前記補強部材は、矩形状の枠部材であり、互いに対向するそれぞれの辺部の中央部に、前記支持基板の裏面に対して前記支持基板の厚み方向に突出する突出部を有するように設けられていることを特徴とする請求項１〜４のいずれか１つに記載のタッチパネル一体型樹脂成形体。 The reinforcing member is a rectangular frame member, and is provided at a central portion of each side portion facing each other so as to have a protruding portion that protrudes in the thickness direction of the supporting substrate with respect to the back surface of the supporting substrate. The touch panel integrated resin molded body according to any one of claims 1 to 4, wherein the touch panel-integrated resin molded body is provided. 前記補強部材は、金属材料で構成されていることを特徴とする請求項１〜５のいずれか１つに記載のタッチパネル一体型樹脂成形体。 The touch panel-integrated resin molded body according to any one of claims 1 to 5 , wherein the reinforcing member is made of a metal material. 前記補強部材は、ステンレス鋼で構成されていることを特徴とする請求項６に記載のタッチパネル一体型樹脂成形体。 The touch panel-integrated resin molded body according to claim 6 , wherein the reinforcing member is made of stainless steel. 前記補強部材は、セラミックスで構成されていることを特徴とする請求項１〜５のいずれか１つに記載のタッチパネル一体型樹脂成形体。 The touch panel-integrated resin molded body according to any one of claims 1 to 5 , wherein the reinforcing member is made of ceramics. 前記補強部材は、アルミナ又はジルコニアで構成されていることを特徴とする請求項８に記載のタッチパネル一体型樹脂成形体。 The touch panel-integrated resin molded body according to claim 8 , wherein the reinforcing member is made of alumina or zirconia. 前記補強部材は、前記金型に設けられた固定ピンを受け入れるための受入凹部を有することを特徴とする請求項１〜３のいずれか１つに記載のタッチパネル一体型樹脂成形体。 The touch panel-integrated resin molded body according to any one of claims 1 to 3 , wherein the reinforcing member includes a receiving recess for receiving a fixing pin provided in the mold.
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