CN103970318B - Sensing module encapsulating structure and its preparation method - Google Patents
Sensing module encapsulating structure and its preparation method Download PDFInfo
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- CN103970318B CN103970318B CN201310035061.7A CN201310035061A CN103970318B CN 103970318 B CN103970318 B CN 103970318B CN 201310035061 A CN201310035061 A CN 201310035061A CN 103970318 B CN103970318 B CN 103970318B
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- cladding
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- sensing circuit
- encapsulating structure
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Abstract
The invention discloses a kind of sensing module encapsulating structure and its preparation method, it is therefore an objective to the protective layer for avoiding technique high temperature from influenceing, the protection structure that can be especially formed by a kind of materials with high melting point are provided with outside the sensing circuit of contact panel.The embodiment of preparation method includes sensing circuit module inserting the first mould, and the first molten material of injection is formed the first cladding after being cooled down through first time, a part for sensing circuit module is engaged with this in this first mould；This semi-finished product is inserted into the second mould again, and injects the second molten material, shapes for forming the second cladding through second of cooling program, with another part of coating circuit module.Thereby two-stage process formation is engaged the sensing module encapsulating structure of sensing circuit module by the first cladding with the second cladding.The present invention can protect its internal circuit element in process.
Description
Technical field
The present invention relates to a kind of electronic sensing circuit structure and its preparation method, set during in particular to encapsulation sensing circuit
The preparation method for putting a surface texture for avoiding high temperature.
Background technology
When making contact panel, panel is provided with the sensing circuit of touch-control behind, during encapsulation, typically utilizes plastic cement
Back veneer material is used as Deng high molecular polymer.General manufacturing process is that sensing circuit is placed in into the molding machine with specific appearance
It is interior, and the macromolecule polymer material of molten is injected, manufacturing process, after cooling can be with sense under a specific high temperature
Slowdown monitoring circuit is collectively forming a part for electronic installation.The sensing circuit 101 described as schematically shown in Figure 1, through be placed in mould with
Macromolecule polymer material is molded together, and outside in sensing circuit 101 forms a covering material 103.
But in above-mentioned technique, the electronic component that high temperature may be damaged on general sensing circuit, or on circuit it is specific
The material that element is used can also be melted down, therefore often need the sensing circuit of particular design, therefore produce the possibility of cost increase.
Existing sensing circuit may be referred to the cross-section structure described by Fig. 2.
The touch-control sensing module coated by first polymer layer 201 with the second polymer layer 211 is shown as in figure, wherein
Primary structure has conducting wire 205 and another conductive layer 209 that sensing track is followed the trail of using touch event, between the two can be according to
Demand is separated by with insulating barrier 207,207 ', and a capacitive sensing effect, touch-control thing are produced between conducting wire 205 and conductive layer 209
Part can show that it senses track there may be the change of electric capacity.In structure, the primary structure of touch-control sensing module leads to
Cross optical cement 203 and be adhered to the layer of the first polymer outside being coated on 201.
Above-mentioned the second polymer layer 211 is the board structure of whole sensing module, and the material with first polymer layer 201 can
For a kind of polyphenyl dicarboxylate（Poly (Ethylene Terephthalate), PET）, or other high molecular polymers
Material, all probably due to the element of the high temperature injury sensing circuit of molten in above-mentioned technique.
The content of the invention
In view of prior art when making electronic installation, wherein each portion's element of sensing circuit and outer enclosure structure shape
Into when probably due to high temperature produce infringement the problem of, it is an object of the invention to propose that a kind of electronic sensing circuit structure is made with it
Make method, stage technique can be passed through, it is to avoid the problem of manufacturing process high temperature is caused.
One of according to embodiments of the present invention, when making encapsulation sensing circuit, especially set in the superficial layer of its circuit structure
A structure for avoiding high temperature is put, passes through formed protective layer and prevents high temperature influence.
The preparation method of sensing module encapsulating structure includes first purchasing the sensing circuit with contact panel sensing circuit
Module, inserts the first mould by sensing circuit module afterwards, and injects the first molten material in the first mould, through for the first time
Cooling program the first molten material of sizing, to form the first cladding of a coating circuit module part.
Afterwards, the composition of the first cladding and sensing circuit module is inserted into the second mould, reinjects the second molten
Material is shaped this second molten material, to form the another of coating circuit module through second of cooling program in the second mould
Second cladding of a part, sensing module encapsulating structure is with the second cladding to engage sensing circuit mould by the first cladding
The structure of block.
Above-mentioned sensing circuit module primary structure is two conductive layers and an insulating barrier therein, and the first molten material
Or second molten material be macromolecule polymer material, being formed at two conductive layers and surface of insulating layer structure with this can be for one
The protection structure of high temperature is blocked, such as one has dystectic material layer.
The primary structure of sensing module encapsulating structure embodiment has the structure that above-mentioned sensing circuit module is coated with it, sense
Slowdown monitoring circuit module mainly has substrate layer, the first conductive layer, insulating barrier, the second conductive layer and superficial layer.Outside this circuit module
Using two benches preparation method formation the first cladding and the second cladding, wherein the first cladding and the second cladding respectively by
The macromolecule polymer material for flowing into the first mould and the second mould is formed.
Specifically, in embodiment, the superficial layer of above-mentioned sensing circuit module can be materials with high melting point layer, or
Another protective layer is formed outside superficial layer.
The beneficial effects of the present invention are in summary, sensing module encapsulating structure proposed by the invention makes with it
Method forms two kinds of claddings in sensing circuit module respectively in particular with two-stage process, wherein being asked in processing high temperature
During topic, then using the high temperature resistants such as materials with high melting point and the material for blocking high temperature, therefore its internal circuit can be also protected in process
Element.
Brief description of the drawings
Fig. 1 is the sensing circuit encapsulation schematic diagram of prior art；
Fig. 2 is the sensing circuit structural profile schematic diagram of prior art；
Fig. 3 show sensing module primary structure schematic diagram of the present invention；
Fig. 4 show sensing module constructive embodiment schematic diagram of the present invention；
(a) and (b) show two-stage process embodiment schematic diagram of the present invention in Fig. 5；
Fig. 6 show sensing module packaging technology embodiment flow of the present invention.
Wherein, description of reference numerals is as follows：
The covering material 103 of sensing circuit 101
First polymer 201 optical cement 203 of layer
The insulating barrier 207,207 ' of conducting wire 205
The second polymer layer 211 of conductive layer 209
The conductive layer 301 of superficial layer 300 first
The conductive layer 305 of insulating barrier 303 second
The materials with high melting point of substrate layer 307 layer 401
The conducting wire 405 of double faced adhesive tape 403
The conductive layer of insulating barrier 407,407 ' 409
The sensing circuit module 501 of substrate layer 411
The cladding 505 of first cladding 503 second
Step S601~S615 sensing module packaging technologies
Embodiment
In order to make a sensing module encapsulating structure influenceed from technique high temperature, this specification proposes a kind of sensing
Module encapsulation construction and its preparation method, the outer layer using technique in sensing circuit module make protection structure, particularly Gao Rong
The material of point, makes internal circuit to be destroyed in high-temperature technology or influence element efficiency, and materials with high melting point is in itself
Material tack can more consider the characteristic of its adjacent material.
The embodiment that specification puies forward sensing module structure refers to Fig. 3.
Sensing module structure shown in schematic diagram is used in particular for the sensing circuit of contact panel, and primary structure includes two layers
Conductive layer（First conductive layer 301 and the second conductive layer 305）Insulating barrier 303 with interval, wherein the first conductive layer 301 and
The combination of two conductive layers 305 can induce the track of touch-control.Structure also includes the superficial layer 300 of substrate layer 307 and one.
Inventive embodiments according to described by this specification, when making the encapsulating structure of sensing module, are especially tied at it
The superficial layer 300 of structure is made as a high-melting-point structure for avoiding high temperature, can be to be a kind of such as pi（Kaptone）It is exhausted
Edge material, or other heat-insulated coating, thereby replace tradition such as polyphenyl dicarboxylate（PET）Superficial layer.
The encapsulating structure embodiment schematic diagram of sensing module as shown in Figure 4.
According to inventive embodiments, the main composition of sensing module encapsulating structure has the sensing circuit module of circuit part, with
The cladding of encapsulating material part.
Mainly include substrate layer 411, and in being formed with conductive layer 409 on substrate layer 411（Sensing mould shown in corresponding diagram 3
Second conductive layer 305 of block primary structure embodiment）, insulating barrier 407,407 ' re-formed on conductive layer 409, conductive layer 409
With another conducting wire 405（First conductive layer 301 of sensing module primary structure embodiment shown in corresponding diagram 3）Between to be separated with this exhausted
Edge layer 407,407 ', conductive layer 409（Second conductive layer）With conducting wire 405（First conductive layer）Set every this insulation system correspondence
Put, the design of insulating barrier 407,407 ' can be according to adjustment be actually needed, and thereby the electrical characteristic between two conductive layers, can sense
Go out the behavior of touch-control, such as the change of electric capacity, and depict touch trajectory accordingly.
In this example, the structure in surface is originally defined using the substitution of materials with high melting point layer 401, such materials with high melting point can
To prevent internal circuit blocks from being influenceed by the high temperature in technique, materials with high melting point layer 401 can utilize double faced adhesive tape 403（Such as one kind thoroughly
Bright optical cement）The structure formed with above-mentioned conducting wire 405, insulating barrier 407,407 ', conductive layer 409 with substrate layer 411 is combined.
Also, in one embodiment, the surface of materials with high melting point layer 401 can be coated with a surface modifier, with increase and outside
Tack between portion's cladding, such as the first cladding as shown in (b) in Fig. 5（503）Or second cladding（505）.In again
In one embodiment, the surface of materials with high melting point layer 401 also can be by coating one optical characteristics material increase optical characteristics.Special one carries
, in one embodiment, the material and the first cladding of materials with high melting point layer 401（503）Or second cladding（505）Can be
One high tack material, or tack preferably material.
In another implementation aspect, foregoing materials with high melting point layer 401 because with the first cladding（503）With the second cladding
（505）It is adjacent, therefore the material tack of materials with high melting point layer 401 will consider the first cladding（503）And/or second cladding
（505）Material property, particularly using preferably tack to consider.
It is noted that because general optical cement may cause softening to cause under general hot conditions because of high temperature
Deform or come off, can now select more resistant to elevated temperatures double faced adhesive tape, such as silicon materials（silicon）The double faced adhesive tape of series, can be with
Bear 250 degree of high temperature Celsius or select light curable type（UV）Or the high temperature resistant series of products such as heat curing-type liquid glue replace, double faced adhesive tape
Also the good optical cement of tool optical characteristics can be selected.Other materials with high melting point can be in material in order to increase optical characteristics or tack
Select special selection or surface coating special material.
Specifically, when forming the encapsulating structure of above-mentioned sensing module, the embodiment that specification is proposed is to utilize one
Two stage preparation method is planted, the outside cladding of cladding sensing circuit module is thereby formed, that is, by high-temperature fusion shape material
The formed clad structure of material, can be the external protector of the electronic installation using this sensor circuit.
(a) is shown in the structural representation that the first stage is realized in above-mentioned two-stage process, this example in Fig. 5, is at least wrapped
Include above-mentioned superficial layer（Such as Fig. 3,300）, conductive layer（301）, insulating barrier（303）, conductive layer（305）With substrate layer（307）Deng knot
The sensing circuit module 501 of structure, is externally formed with the first cladding 503, to coat a part for sensing circuit module 501, this
Example is the part of lower section.
Then the structure that the second stage as shown in (b) in Fig. 5 is realized, this example includes above-mentioned sensing circuit module 501 and the
The semi-finished product that one cladding 503 is formed, then re-form the second cladding 505, the remaining portion of cladding sensing circuit module 501
Point, wherein the first cladding 503 and the second cladding 505 are respectively by flowing into the macromolecule polymer material institute shapes of two kinds of modules
Into.
Fig. 6 then then describes the process example of the encapsulating structure of sensing module in this specification.
At the beginning of step starts, the above-mentioned sensing circuit module with basic sensing circuit structure is first purchased, is particularly included
There is the sensing circuit applied to contact panel.Then, such as step S601, the related elements of this module are inserted in the first mould,
Depending on first mould is particularly according to the design using the electronic installation of this sensing circuit module, external protective structures are thereby formed
A part, such as the first cladding.
For another example step S603, injects the first molten material in above-mentioned first mould, such material is specifically for macromolecule
Polymer is completely engaged in sensing circuit module, it is necessary to high temperature becomes flowable molten fluid through the first mould
A part.Then such as step S605, through first time cooling program the first molten material of sizing, to form the first cladding（Step
Rapid S607）, therefore the first cladding can engage a part for set sensing circuit module.
Afterwards by the first cladding and the composition of sensing circuit module（Semi-finished product）Insert another second mould（Step
S609）, depending on the second mould is equally the design according to related electronic device, coordinate above-mentioned first mould to form electronic installation
External protective structures.
Such as step S611, the second molten material of injection is in the second mould, and this second molten material is at high temperature
Fluid, can be tightly engaged into sensing circuit module.Again through second of cooling program the second molten material of sizing（Step
S613）, to form second cladding of the uncoated another part of above-mentioned first cladding（Step S615）.
Through above-mentioned technique, form the sensing module that sensing circuit module is engaged with the second cladding by the first cladding and encapsulate
Structure, according to design, both the first cladding and the second cladding or one can be high molecular polymer, according to design requirement
Depending on, that is, such high molecular polymer manufacturing process need in an environment of high temperature, this specification be propose have protect
The sensing circuit module of protection structure, thereby obstructs influence of the high temperature to circuit element.
In summary, the sensing module encapsulating structure that this specification is proposed is with its preparation method in particular with two benches
Technique, forms two kinds of claddings in sensing circuit module respectively, wherein when handling high temperature problem, then utilizing materials with high melting point
Etc. high temperature resistant and the material for blocking high temperature, therefore its internal circuit element can be also protected in process.
Only the foregoing is only the present invention preferable possible embodiments, it is non-thus i.e. limit to the present invention the scope of the claims, therefore
Such as with the equivalent structure change carried out by description of the invention and diagramatic content, similarly it is included within the scope of the present invention,
Chen Ming is given in conjunction.
Claims (9)
1. a kind of preparation method of sensing module encapsulating structure, it is characterised in that described method includes step：
Purchase a sensing circuit module, including the sensing circuit applied to a contact panel；
The sensing circuit module is inserted into one first mould；
One first molten material is injected in first mould；
Shaped the first molten material through first time cooling program, to form one first cladding, first cladding engagement
A part for the sensing circuit module；
The composition of first cladding and the sensing circuit module is inserted into one second mould；
One second molten material is injected in second mould；
Shaped the second molten material through second of cooling program, to form one second cladding, second cladding engagement
First cladding the uncoated sensing circuit module another part；And
Form the sensing module encapsulating structure for engaging the sensing circuit module with second cladding by first cladding；
Wherein, described sensing circuit module includes：
One substrate layer；
One the second conductive layer formed on the substrate layer；
One is formed at the insulating barrier on second conductive layer；
One is formed at the first conductive layer on the insulating barrier, and first conductive layer is with the second conductive layer interval with the insulating barrier
It is correspondingly arranged；And
One is formed at the materials with high melting point layer on first conductive layer, wherein, the surface of described materials with high melting point layer is coated with
One surface modifier is to increase the tack between first cladding or second cladding.
2. the preparation method of sensing module encapsulating structure as claimed in claim 1, it is characterised in that the first described molten
Material or the second molten material are macromolecule polymer material.
3. a kind of sensing module encapsulating structure applied made by preparation method as claimed in claim 1.
4. sensing module encapsulating structure as claimed in claim 3, including the sensing circuit module with coating sensing electricity
First cladding of road module and second cladding, wherein first cladding are with second cladding respectively by flowing into
The macromolecule polymer material of one first mould and one second mould is formed.
5. sensing module encapsulating structure as claimed in claim 3, it is characterised in that the material of the materials with high melting point layer and the
One cladding or the second cladding are a high tack material.
6. sensing module encapsulating structure as claimed in claim 3, it is characterised in that described structure is also including the use of in attaching
A double faced adhesive tape in the top layer of the sensing module encapsulating structure.
7. sensing module encapsulating structure as claimed in claim 6, it is characterised in that be additionally provided with this on the first described conductive layer
Double faced adhesive tape, the double faced adhesive tape is silicon materials, light curable type or heat curing-type liquid glue.
8. sensing module encapsulating structure as claimed in claim 6, it is characterised in that be additionally provided with this on the first described conductive layer
Double faced adhesive tape, the double faced adhesive tape is the optical cement with optical characteristics.
9. sensing module encapsulating structure as claimed in claim 3, it is characterised in that the surface of described materials with high melting point layer is applied
The optical characteristics material of cloth one increases optical characteristics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310035061.7A CN103970318B (en) | 2013-01-29 | 2013-01-29 | Sensing module encapsulating structure and its preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310035061.7A CN103970318B (en) | 2013-01-29 | 2013-01-29 | Sensing module encapsulating structure and its preparation method |
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| Publication Number | Publication Date |
|---|---|
| CN103970318A CN103970318A (en) | 2014-08-06 |
| CN103970318B true CN103970318B (en) | 2017-09-05 |
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| CN201310035061.7A Expired - Fee Related CN103970318B (en) | 2013-01-29 | 2013-01-29 | Sensing module encapsulating structure and its preparation method |
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| CN109064882B (en) * | 2018-07-18 | 2021-01-29 | 业成科技（成都）有限公司 | Display device and method for manufacturing the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009146354A (en) * | 2007-12-18 | 2009-07-02 | Nissha Printing Co Ltd | Touch panel integrated resin molding |
| CN101986115A (en) * | 2010-10-22 | 2011-03-16 | 惠州市卓耐普智能技术有限公司 | Coating structure for locating center of sensor and forming method thereof |
| CN102103430A (en) * | 2009-12-17 | 2011-06-22 | 苹果公司 | Injection molding method and touch sensitive device |
| TW201229853A (en) * | 2010-11-05 | 2012-07-16 | Fujifilm Corp | Touch panel and image display device |
| TW201239062A (en) * | 2010-12-31 | 2012-10-01 | 3M Innovative Properties Co | Double-sided adhesive tape having improved reworkability |
| TW201245725A (en) * | 2011-03-11 | 2012-11-16 | Panasonic Corp | Sensor |
-
2013
- 2013-01-29 CN CN201310035061.7A patent/CN103970318B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009146354A (en) * | 2007-12-18 | 2009-07-02 | Nissha Printing Co Ltd | Touch panel integrated resin molding |
| CN102103430A (en) * | 2009-12-17 | 2011-06-22 | 苹果公司 | Injection molding method and touch sensitive device |
| CN101986115A (en) * | 2010-10-22 | 2011-03-16 | 惠州市卓耐普智能技术有限公司 | Coating structure for locating center of sensor and forming method thereof |
| TW201229853A (en) * | 2010-11-05 | 2012-07-16 | Fujifilm Corp | Touch panel and image display device |
| TW201239062A (en) * | 2010-12-31 | 2012-10-01 | 3M Innovative Properties Co | Double-sided adhesive tape having improved reworkability |
| TW201245725A (en) * | 2011-03-11 | 2012-11-16 | Panasonic Corp | Sensor |
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| CN103970318A (en) | 2014-08-06 |
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