JP4862142B2 - 増幅器用の放熱機構及び増幅器 - Google Patents
増幅器用の放熱機構及び増幅器 Download PDFInfo
- Publication number
- JP4862142B2 JP4862142B2 JP2007114171A JP2007114171A JP4862142B2 JP 4862142 B2 JP4862142 B2 JP 4862142B2 JP 2007114171 A JP2007114171 A JP 2007114171A JP 2007114171 A JP2007114171 A JP 2007114171A JP 4862142 B2 JP4862142 B2 JP 4862142B2
- Authority
- JP
- Japan
- Prior art keywords
- radiator
- heat
- channel
- amplifier
- connecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Amplifiers (AREA)
Description
Claims (3)
- 主に左チャンネル用の部品が発する熱を放散させる左放熱器、
主に右チャンネル用の部品が発する熱を放散させる右放熱器、並びに
前記左放熱器及び右放熱器を熱的に接続する接続部材を備え、
前記左放熱器及び前記右放熱器のうちの一方の放熱器が熱を放散させる部品の発熱量は、他方の放熱器が熱を放散させる部品の発熱量よりも大きく、
前記一方の放熱器が熱を放散させる部品は、左チャンネル用の部品又は右チャンネル用の部品と共に、左チャンネルと右チャンネルとのいずれにも該当しないチャンネル用の部品を含むことを特徴とする増幅器用の放熱機構。 - 前記接続部材は、前記一方の放熱器側において、前記他方の放熱器側よりも熱容量が大きいことを特徴とする請求項1記載の放熱機構。
- 請求項1又は2記載の放熱機構を備え、これにより装置が備える増幅器における各チャンネルの部品が発する熱を放散させるようにしたことを特徴とする音響装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007114171A JP4862142B2 (ja) | 2007-04-24 | 2007-04-24 | 増幅器用の放熱機構及び増幅器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007114171A JP4862142B2 (ja) | 2007-04-24 | 2007-04-24 | 増幅器用の放熱機構及び増幅器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008270651A JP2008270651A (ja) | 2008-11-06 |
JP4862142B2 true JP4862142B2 (ja) | 2012-01-25 |
Family
ID=40049735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007114171A Expired - Fee Related JP4862142B2 (ja) | 2007-04-24 | 2007-04-24 | 増幅器用の放熱機構及び増幅器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4862142B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5312690B2 (ja) * | 2010-06-07 | 2013-10-09 | 三菱電機株式会社 | ヒートシンクおよびその製造方法 |
CN103269572B (zh) * | 2013-04-28 | 2015-12-23 | 深圳市英威腾电气股份有限公司 | 一种组合式散热器 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53100807A (en) * | 1977-02-15 | 1978-09-02 | Matsushita Electric Ind Co Ltd | Optical recording and reproducing system |
JPS619913A (ja) * | 1984-06-27 | 1986-01-17 | Nippon Steel Corp | 多段圧延機のロ−ルセツトアツプ方法 |
JPH10256766A (ja) * | 1997-03-06 | 1998-09-25 | Hitachi Ltd | 電子機器の強制空冷構造 |
JP2001119247A (ja) * | 1999-10-20 | 2001-04-27 | Time Domain:Kk | 増幅装置 |
-
2007
- 2007-04-24 JP JP2007114171A patent/JP4862142B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008270651A (ja) | 2008-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2011096218A1 (ja) | 放熱装置およびそれを用いた電子機器 | |
US7967059B2 (en) | Heat dissipation device | |
WO2017010536A1 (ja) | 冷却装置 | |
US8120917B2 (en) | Heat dissipation device | |
US20080101035A1 (en) | Heat-dissipating assembly structure | |
JP6036894B2 (ja) | 冷却装置および装置 | |
US7365978B2 (en) | Heat dissipating device | |
US10921066B2 (en) | Enhanced heat dissipation module, cooling fin structure and stamping method thereof | |
JP6645915B2 (ja) | ヒートシンク | |
JP4862142B2 (ja) | 増幅器用の放熱機構及び増幅器 | |
JP6397714B2 (ja) | コイル装置 | |
JP2014017412A (ja) | 熱拡散装置 | |
JP4438526B2 (ja) | パワー部品冷却装置 | |
JP5920356B2 (ja) | 水冷装置、水冷装置を有する電子機器、及び水冷方法 | |
US10537043B2 (en) | Electronic apparatus | |
US20110240256A1 (en) | Heat dissipater mounting structure | |
JP2006140390A (ja) | パワー半導体装置 | |
JP4229738B2 (ja) | ヒートパイプ式放熱ユニット | |
TWI514120B (zh) | 散熱模組 | |
KR101505908B1 (ko) | 열교환기 | |
US9214408B2 (en) | Fluid cooled thermal management technique for a high-density composite focal plane array | |
KR101013666B1 (ko) | 컴퓨터용 방열장치 | |
JP6044157B2 (ja) | 冷却部品 | |
JP2011003690A (ja) | 冷却装置 | |
KR200373156Y1 (ko) | 전기,전자제품용 히트싱크 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100401 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110315 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110707 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110712 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110905 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111004 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20111012 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111012 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141118 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |